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Acoustics, Speech, and Signal Processing, 1994. ICASSP-94 Vol 2., 1994 IEEE International Conference on
Adelaide, SA, Australia
April 19-April 22
ISBN: 0-7803-1775-0
Table of Contents
J.-M. Boucher, Groupe Traitement d'Images, Ecole Nat. Superieure des Telecommun. de Bretagne, Brest, France
S. Pleihers, Groupe Traitement d'Images, Ecole Nat. Superieure des Telecommun. de Bretagne, Brest, France
pp. 1-4
P. Jackway, Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
W.W. Boles, Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
M. Deriche, Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
pp. 5-8
Ying Wang, Center for Autom. Res., Maryland Univ., College Park, MD, USA
R. Chellappa, Center for Autom. Res., Maryland Univ., College Park, MD, USA
Qinfen Zheng, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 9-V12
G. Marcu, Graphica Comput. Corp., Tokyo, Japan
K. Iwata, Graphica Comput. Corp., Tokyo, Japan
pp. 101-104
N. Kobayashi, Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
H. Saito, Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
pp. 105-108
G.S.D. Farrow, Dept. of Electr. Eng., Manchester Univ., UK
C.S. Xydeas, Dept. of Electr. Eng., Manchester Univ., UK
J.P. Oakley, Dept. of Electr. Eng., Manchester Univ., UK
pp. 109-112
N. Nikolaidis, Dept. of Electr. Eng., Thessaloniki Univ., Greece
I. Pitas, Dept. of Electr. Eng., Thessaloniki Univ., Greece
pp. 121-124
T. Starner, BBN Syst. & Technol. Corp., Cambridge, MA, USA
J. Makhoul, BBN Syst. & Technol. Corp., Cambridge, MA, USA
R. Schwartz, BBN Syst. & Technol. Corp., Cambridge, MA, USA
G. Chou, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 125-128
R.W. Picard, Media Lab., MIT, Cambridge, MA, USA
Fang Liu, Media Lab., MIT, Cambridge, MA, USA
pp. 129-132
S. Krishnamachari, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. Chellappa, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 13-16
H. Cherifi, TSI, CNRS, Saint Etienne, France
R. Grisel, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 133-136
R. Grisel, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
W.W. Boles, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 137-140
S. Lee, Dept. of Electr. & Comput. Eng., Queensland Univ., Qld., Australia
B. Lovell, Dept. of Electr. & Comput. Eng., Queensland Univ., Qld., Australia
pp. 141-144
A.C. Kam, Caliper Corp., USA
G.E. Kopec, Dept. of Electr. & Comput. Eng., Queensland Univ., Qld., Australia
pp. 145-148
J.R. Bellegarda, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
K.S. Nathan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
E.J. Bellegarda, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 149-152
C. Boni, Alenia S.p.A, Rome, Italy
M. Richard, Alenia S.p.A, Rome, Italy
S. Barbarossa, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 157-160
H. Choi, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
H. Choi, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 161-164
Z. Belhadj, Lab. S2HF IRESTE, Systemes et Signaux Hautes Frequences, Nantes, France
A. Saad, Lab. S2HF IRESTE, Systemes et Signaux Hautes Frequences, Nantes, France
S. El Assad, Lab. S2HF IRESTE, Systemes et Signaux Hautes Frequences, Nantes, France
J. Saillard, Lab. S2HF IRESTE, Systemes et Signaux Hautes Frequences, Nantes, France
pp. 165-168
M. Soumekh, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
M. Pollock, Lab. S2HF IRESTE, Systemes et Signaux Hautes Frequences, Nantes, France
R. Dinger, Lab. S2HF IRESTE, Systemes et Signaux Hautes Frequences, Nantes, France
pp. 169-172
T. Aydin, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
Y. Yemez, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
B. Sankur, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
E. Anarim, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
O. Alkin, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
pp. 17-20
A. Wang, Inst. of Electron., Acad. Sinica, Beijing, China
Y. Mao, Inst. of Electron., Acad. Sinica, Beijing, China
Z. Chen, Inst. of Electron., Acad. Sinica, Beijing, China
pp. 173-176
B. Haywood, Microwave Radar Div., Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
R. Kyprianou, Microwave Radar Div., Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
A. Zyweck, Microwave Radar Div., Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
pp. 177-180
Jiang Hui, Inst. of Acoust., Acad. Sinica, Beijing, China
Hou Chao-Huan, Inst. of Acoust., Acad. Sinica, Beijing, China
pp. 185-188
J.M. Moureaux, UNSA, CNRS, Valbonne, France
P. Gauthier, UNSA, CNRS, Valbonne, France
M. Barlaud, UNSA, CNRS, Valbonne, France
P. Bellemain, CERFACS, Toulouse, France
pp. 189-192
N.J.S. Stacy, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
D. Burgess, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
J.J. Douglass, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
M.R. Muller, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
M. Robinson, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 193-196
Y. Aoki, Dept. of Inf. Eng., Hokkaido Univ., Sapporo, Japan
S. Tanahashi, Dept. of Inf. Eng., Hokkaido Univ., Sapporo, Japan
J. Xu, Dept. of Inf. Eng., Hokkaido Univ., Sapporo, Japan
pp. 197-200
S. Simmons, Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
R. Evans, Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 201-204
J. Nieweglowski, Signal Process. Lab., Tampere Univ. of Technol., Finland
T. Moisala, Signal Process. Lab., Tampere Univ. of Technol., Finland
P. Haavisto, Dept. of Inf. Eng., Hokkaido Univ., Sapporo, Japan
pp. 205-208
K. Aizawa, Dept. of Electr. Eng., Tokyo Univ., Japan
K. Iwata, Dept. of Electr. Eng., Tokyo Univ., Japan
T. Saito, Dept. of Inf. Eng., Hokkaido Univ., Sapporo, Japan
M. Hatori, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 209-212
A. Laine, Florida Univ., Gainesville, FL, USA
M. Lewis, Dept. of Electr. Eng., Tokyo Univ., Japan
F. Taylor, Dept. of Inf. Eng., Hokkaido Univ., Sapporo, Japan
pp. 21-24
M. Covell, Interval Res. Corp., Palo Alto, CA, USA
M. Withgott, Interval Res. Corp., Palo Alto, CA, USA
pp. 213-216
S. Kozu, Semiconductor Appl. Eng. Div., NEC Corp., Kawasaki, Japan
S. Kulkarni, Interval Res. Corp., Palo Alto, CA, USA
pp. 217-220
M.M. Chang, Dept. of Electr. Eng., Rochester Univ., NY, USA
M.I. Sezan, Interval Res. Corp., Palo Alto, CA, USA
A.M. Tekalp, Dept. of Inf. Eng., Hokkaido Univ., Sapporo, Japan
pp. 221-224
A.J. Patti, Dept. of Electr. Eng., Rochester Univ., NY, USA
M.I. Sezan, Dept. of Electr. Eng., Rochester Univ., NY, USA
A.M. Tekalp, Dept. of Inf. Eng., Hokkaido Univ., Sapporo, Japan
pp. 225-228
N.M. Namazi, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
P. Penafiel, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
C.M. Fan, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 229-232
C. Bussiere, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
D. Hatzinakos, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 233-236
J.C. Brailean, Digital Technol. Res. Lab., Motorola Inc., Schaumburg, IL, USA
T. Ozcelik, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
A.K. Katsaggelos, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 237-240
R.J. Crinon, Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
W.J. Kolodziej, Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
pp. 241-244
J. Princen, AT&T Bell Labs., Murray Hill, NJ, USA
M.H. Chan, Dept. of Eng., Cambridge Univ., UK
pp. 249-252
Jianxin Hou, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
R.H. Bamberger, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 25-28
G.P. Abousleman, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 253-256
E.A. Gifford, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 257-260
D. Miller, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
K. Rose, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
P.A. Chou, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 261-264
A. Woolf, Div. of Radiophysics, CSIRO, Sydney, NSW, Australia
G. Rogers, Div. of Radiophysics, CSIRO, Sydney, NSW, Australia
pp. 269-272
C. Stiller, Inst. fur Elektrische Nachrichentech., Tech. Hochschule Aachen, Germany
pp. 273-276
C. Gu, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 277-280
J.M. Lervik, Dept. of Telecomm., Norwegian Inst. of Technol., Trondheim, Norway
T.A. Ramstad, Dept. of Telecomm., Norwegian Inst. of Technol., Trondheim, Norway
pp. 281-284
M. Cermelli, Dept. of Comput. Sci., Genoa Univ., Italy
F. Lavagetto, Dept. of Comput. Sci., Genoa Univ., Italy
M. Pampolini, Dept. of Comput. Sci., Genoa Univ., Italy
pp. 285-288
Lai-Man Po, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
Wen-Tao Tan, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
Chi-Ho Chan, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 289-292
P.S. Lewis, Eng. Sci. and Appl. Div., Los Alamos Nat. Lab., NM, USA
J.C. Mosher, Eng. Sci. and Appl. Div., Los Alamos Nat. Lab., NM, USA
pp. 293-296
K. Faez, Amirkabir Univ. of Technol., Tehran, Iran
M. Kamel, Eng. Sci. and Appl. Div., Los Alamos Nat. Lab., NM, USA
pp. 297-300
K.-K.R. Yu, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
Sze-Fong Yau, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 301-304
L. Blanc-Feraud, CNRS, Nice, France
P. Charbonnier, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
P. Lobel, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
M. Barlaud, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 305-308
M. Barlaud, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
M. Barlaud, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 309-312
A. Malinverno, Schlumberger-Doll Res., Ridgefield, CT, USA
D.J. Rossi, Schlumberger-Doll Res., Ridgefield, CT, USA
M. Daniel, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 313-316
Yong Zhang, Bio-Eng. Program, Michigan Univ., Ann Arbor, MI, USA
Yong Zhang, Schlumberger-Doll Res., Ridgefield, CT, USA
W.L. Rogers, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 317-320
T.M. Habashy, Schlumberger-Doll Res., Ridgefield, CT, USA
E.J. Bellegarda, Schlumberger-Doll Res., Ridgefield, CT, USA
pp. 321-324
I. Pitas, Dept. of Electr. Eng., Thessaloniki Univ., Greece
A. Karasaridis, Dept. of Electr. Eng., Thessaloniki Univ., Greece
pp. 325-328
J.D. McDonnell, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
R.N. Shorten, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
A.D. Fagan, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 329-332
P.R. Hsu, Dept. of Electron. Eng., Tokyo Univ., Japan
H. Harashima, Dept. of Electron. Eng., Tokyo Univ., Japan
pp. 33-36
Jianzhong Huang, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
S. Liu, Dept. of Electron. Eng., Tokyo Univ., Japan
pp. 333-336
A. Palau, Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
G. Mirchandani, Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
pp. 337-340
Jiebo Luo, Dept. of Electr. Eng., Rochester Univ., NY, USA
Jiebo Luo, Dept. of Electr. Eng., Rochester Univ., NY, USA
K.J. Parker, Dept. of Electr. Eng., Rochester Univ., NY, USA
T.S. Huang, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 341-344
W. Philips, ELIS, Ghent Univ., Belgium
C. Christopoulos, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 345-348
M. Iwahashi, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan
K. Ohyama, Dept. of Electr. Eng., Rochester Univ., NY, USA
N. Kambayashi, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 349-352
P. Waldemar, Dept. of Telecommun., Inst. of Technol., Trondheim, Norway
T.A. Ramstad, Dept. of Telecommun., Inst. of Technol., Trondheim, Norway
pp. 353-356
M. Nikolova, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
A. Mohammad-Djafari, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
J. Idier, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
pp. 357-360
D.D. Giusto, Istituto di Elettrotecnica, Cagliari Univ., Italy
S. Fioravanti, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
pp. 361-364
T. Eude, Inst. Nat. des Sci. Appliquees, Mont Saint Aignan, France
R. Grisel, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
H. Cherifi, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
R. Debrie, Microwave Radar Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 365-368
T. Naemura, Dept. of Electr. Eng., Tokyo Univ., Japan
H. Harashima, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 369-372
M.Y. Jaisimha, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
J.R. Goldschneider, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
A.E. Mohr, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
E.A. Riskin, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 37-40
R.R. Schultz, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
R.L. Stevenson, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 373-376
K. Popat, Media Lab., MIT, Cambridge, MA, USA
R.W. Picard, Media Lab., MIT, Cambridge, MA, USA
pp. 381-384
P.J. Whitbread, Div. of Inf. Technol., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 385-388
Hsi-Jung Wu, Apple Comput. Inc., Cupertino, CA, USA
D. Ponceleon, Apple Comput. Inc., Cupertino, CA, USA
K. Wang, Apple Comput. Inc., Cupertino, CA, USA
J. Normile, Apple Comput. Inc., Cupertino, CA, USA
pp. 389-392
J. You, Sch. of Comput. & Inf. Sci., Univ. South Australia, The Levels, SA, Australia
H.A. Cohen, Apple Comput. Inc., Cupertino, CA, USA
pp. 393-396
D. Tretter, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
K. Khawaja, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
C.A. Bouman, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
A.A. Maciejewski, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 397-400
Tsann-Shyong Liu, Inst. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
N. Jayant, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 401-404
W.L. Chooi, Dept. of Electr. & Comput. Syst. Eng., Monash Univ., Clayton, Vic., Australia
K.N. Ngan, Dept. of Electr. & Comput. Syst. Eng., Monash Univ., Clayton, Vic., Australia
pp. 405-408
M. Bennamoun, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 41-44
G. Bozdagi, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
A.M. Tekalp, CSELT, Torino, Italy
L. Onural, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 413-416
L.C. de Silva, Dept. of Electr. Eng., Tokyo Univ., Japan
K. Aizawa, Dept. of Electr. Eng., Tokyo Univ., Japan
M. Hatori, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 421-424
M. Hatori, Video Lab., Samsung Electron. Co., Suwon, South Korea
M. Hatori, Video Lab., Samsung Electron. Co., Suwon, South Korea
pp. 425-428
B. DeCleene, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
H. Sorensen, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 433-436
G.W. Cook, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 437-440
R.P. Millane, Whistler Center for Carbohydrate Res., Purdue Univ., West Lafayette, IN, USA
P.J. Bones, Hewlett-Packard Co., Palo Alto, CA, USA
H. Jiang, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 445-448
H. Jiang, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
B.D. Jeffs, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 449-452
T. Saito, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Komatsu, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
K. Aizawa, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 45-48
R. Whatmough, Div. of Inf. Technol., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 453-456
C.-F. Westin, Dept. of Electr. Eng., Linkoping Univ., Sweden
K. Nordberg, Dept. of Electr. Eng., Linkoping Univ., Sweden
H. Knutsson, Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 457-460
A.L. Harvey, Dept. of Electr. Eng., R. Melbourne Inst. of Technol., Vic., Australia
H.A. Cohen, Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 461-464
C.R. Parker, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
B.L. Satherley, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
P.J. Bones, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
pp. 465-468
M. Gunsay, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
B.D. Jeffs, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 469-472
P.L. Combettes, Dept. of Electr. Eng., City Univ. of New York, NY, USA
H. Puh, Dept. of Electr. Eng., City Univ. of New York, NY, USA
pp. 473-476
A.W. Johnson, Telecom Australia Res. Labs., Australia
J. Princen, Dept. of Electr. Eng., City Univ. of New York, NY, USA
M.H. Chan, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
pp. 477-480
Feng-Ming Wang, C-Cube Microsyst., Milpitas, CA, USA
S. Liu, Dept. of Electr. Eng., City Univ. of New York, NY, USA
pp. 481-484
F.G.B. De Natale, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G.S. Desoli, Dept. of Electr. Eng., City Univ. of New York, NY, USA
D.D. Guisto, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
pp. 485-488
N. Vasconcelos, Media Lab., MIT, Cambridge, MA, USA
A. Lippman, Media Lab., MIT, Cambridge, MA, USA
pp. 489-492
D. Taubman, California Univ., Berkeley, CA, USA
A. Zakhor, California Univ., Berkeley, CA, USA
pp. 493-496
Jungwoo Lee, Dept. of Electr. Eng., Princeton Univ., NJ, USA
B.W. Dickinson, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 497-500
A. Kaup, Inst. for Commun. Eng., Tech. Hochschule Aachen, Germany
T. Aach, Inst. for Commun. Eng., Tech. Hochschule Aachen, Germany
pp. 501-504
D.L. Wilson, Sch. of Electron. & Electr. Eng., Bath Univ., UK
J.A. Nicholls, Sch. of Electron. & Electr. Eng., Bath Univ., UK
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 505-508
P. Musumeci, Dept. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia
pp. 509-512
Hyun-Soo Kang, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Jong-Hun Kim, Sch. of Electron. & Electr. Eng., Bath Univ., UK
Jung-Hee Lee, Sch. of Electron. & Electr. Eng., Bath Univ., UK
Seong-Dae Kim, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 513-516
Wentao Zheng, Dept. of Electr. Eng., Tokyo Univ., Japan
H. Harashima, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 517-520
H. Knutsson, Comput. Vision Lab., Linkoping Univ., Sweden
M. Andersson, Comput. Vision Lab., Linkoping Univ., Sweden
pp. 529-532
B. Macq, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
M. Mattavelli, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
O. Van Calster, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
E. Van der Plancke, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
S. Comes, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
W. Li, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
pp. 53-56
J.-M. Laferte, IRISA/INRIA/CNR, Rennes, France
P. Perez, IRISA/INRIA/CNR, Rennes, France
F. Heitz, IRISA/INRIA/CNR, Rennes, France
pp. 533-536
C.A. Bouman, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
K. Sauer, IRISA/INRIA/CNR, Rennes, France
pp. 537-540
J.A. O'Sullivan, Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 541-544
N. Merlet, Inst. of Comput. Sci., Hebrew Univ., Jerusalem, Israel
J. Zerubia, IRISA/INRIA/CNR, Rennes, France
pp. 545-548
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
D. DeKruger, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 549-552
J.R. Casas, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
L. Torres, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 553-556
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK
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H.R. Rabiee, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
R.L. Kashyap, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
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