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Acoustics, Speech, and Signal Processing, 1994. ICASSP-94 Vol 1., 1994 IEEE International Conference on
Adelaide, SA, Australia
April 19-April 22
ISBN: 0-7803-1775-0
Table of Contents
S. Nandkumar, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.H.L. Hansen, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 1-4
A.P. Petropulu, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
S. Subramaniam, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 9-I12
K. Kondo, Tsukuba Res. & Dev. Center, Ibaraki, Japan
J. Picone, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 101-104
P.J. Moreno, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 109-112
J.S. Garofolo, Nat. Inst. of Stand. & Technol., USA
T. Robinson, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 113-116
Y.H. Kao, Texas Instrum. Inc., Dallas, TX, USA
C.T. Hemphill, Texas Instrum. Inc., Dallas, TX, USA
B.J. Wheatley, Texas Instrum. Inc., Dallas, TX, USA
P.K. Rajasekaran, Texas Instrum. Inc., Dallas, TX, USA
pp. 117-120
O. Anderson, Center for PersonKommunikation, Aalborg Univ., Denmark
P. Dalsgaard, Center for PersonKommunikation, Aalborg Univ., Denmark
W. Barry, Texas Instrum. Inc., Dallas, TX, USA
pp. 121-124
T. Matsui, NTT Human Interface Labs., Tokyo, Japan
S. Furui, NTT Human Interface Labs., Tokyo, Japan
pp. 125-128
K.T. Assaleh, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
pp. 129-132
H. Sheikhzadeh, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
H. Sameti, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
L. Deng, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
R.L. Brennan, Texas Instrum. Inc., Dallas, TX, USA
pp. 13-16
M.A. Lund, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
Chung-Tshuy Lee, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
Chung-Chieh Lee, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
R.W. Bossemeyer, Texas Instrum. Inc., Dallas, TX, USA
pp. 141-144
H. Gish, BBN Syst. & Technol. Corp., Cambridge, MA, USA
M. Schmidt, BBN Syst. & Technol. Corp., Cambridge, MA, USA
A. Mielke, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 145-148
J.-L. Le Floch, Univ. Pierre et Marie Curie, Paris, France
C. Montacie, Univ. Pierre et Marie Curie, Paris, France
M.-J. Caraty, Univ. Pierre et Marie Curie, Paris, France
pp. 149-152
J.M. Naik, NYNEX Sci. & Technol. Inc., White Plains, NY, USA
D.M. Lubensky, NYNEX Sci. & Technol. Inc., White Plains, NY, USA
pp. 153-156
J. Sorensen, Dictaphone Corp., Stratford, CT, USA
M. Savic, NYNEX Sci. & Technol. Inc., White Plains, NY, USA
pp. 157-160
L. Wilcox, Xerox PARC, Palo Alto, CA, USA
F. Chen, Xerox PARC, Palo Alto, CA, USA
D. Kimber, Xerox PARC, Palo Alto, CA, USA
V. Balasubramanian, Xerox PARC, Palo Alto, CA, USA
pp. 161-164
K.R. Farrell, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 165-168
J. Schalkwyk, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
E. Barnard, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
J.R. Sachs, Xerox PARC, Palo Alto, CA, USA
pp. 169-172
A. Teolis, Inst. for Syst. Res., Maryland Univ., College Park, MD, USA
J.J. Benedetto, Inst. for Syst. Res., Maryland Univ., College Park, MD, USA
pp. 17-20
Y. Tanaka, Fujitsu Labs. Ltd., Kawasaki, Japan
H. Kimura, Inst. for Syst. Res., Maryland Univ., College Park, MD, USA
pp. 173-176
V.E. Sanchez, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
J.L. Perez, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
J.M. Lopez, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
A.J. Rubio, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 177-180
Gao Yang, Lemout & Hauspie Speech Products, Belgium
H. Leich, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 181-184
J. Thyssen, Tele Danmark Res., Horsholm, Denmark
H. Nielsen, Tele Danmark Res., Horsholm, Denmark
S.D. Hansen, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 185-188
C.R. Watkins, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
S. Crisafulli, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.R. Bitmead, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.J. Orsi, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 189-192
R. Lefebvre, Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
R. Salami, Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
C. Laflamme, Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
J.-P. Adoul, Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
pp. 193-196
K. Tokuda, Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
H. Matsumura, Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
T. Kobayashi, Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
S. Imai, Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
pp. 197-200
S.A. McClellan, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
J.D. Gibson, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 201-204
W.R. Gardner, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
B.D. Rao, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 205-208
Sun-Won Park, Dept. of Electr. Eng. & Comput. Sci., Texas A&M Univ., Kingsville, TX, USA
pp. 209-212
S. Das, Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
A. Nadas, Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Picheny, Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 21-24
J.E. Diaz, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
J.C. Segura-Luna, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
P. Garcia-Teodoro, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
A.J. Rubio-Ayuso, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 213-216
Qing Huo, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Chorkin Chan, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Chin-Hui Lee, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 221-224
F.T. Johansen, Dept of Telecommun., Inst. of Technol., Trondheim, Norway
M.H. Johnsen, Dept of Telecommun., Inst. of Technol., Trondheim, Norway
pp. 225-228
Y. Gotoh, Div. of Eng., Brown Univ., Providence, RI, USA
M.M. Hochberg, Dept of Telecommun., Inst. of Technol., Trondheim, Norway
H.F. Silverman, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 229-232
A. Mellouk, Lab. de Recherche en Inf., Univ. de Paris-Sud, Orsay, France
P. Gallinari, Dept of Telecommun., Inst. of Technol., Trondheim, Norway
pp. 233-236
B. Wheatley, Central Res. Labs., Texas Instrum. Inc., Dallas, TX, USA
K. Kondo, Dept of Telecommun., Inst. of Technol., Trondheim, Norway
W. Anderson, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
Y. Muthusamy, Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 237-240
S. Okawa, Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
T. Kobayashi, Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
K. Shirai, Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
pp. 241-244
T. Kosaka, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
S. Sagayama, Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
pp. 245-248
Y. Miyazawa, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
J.-I. Takami, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
S. Sagayama, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
S. Matsunaga, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
pp. 249-252
M. Savic, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
Huiqin Gao, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.S. Sorensen, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 25-28
J.-M. Muller, ANT Nachrichtentech. GmbH, Backnang, Germany
B. Wachter, ANT Nachrichtentech. GmbH, Backnang, Germany
pp. 257-260
M. Mauc, ESIEE, Noisy-le-Grand, France
G. Baudoin, ESIEE, Noisy-le-Grand, France
M. Jelinek, ESIEE, Noisy-le-Grand, France
pp. 261-264
K. Swaminathan, Hughes Network Syst. Inc., Germantown, MD, USA
K. Ganesan, Hughes Network Syst. Inc., Germantown, MD, USA
Yi-Sheng Wang, Hughes Network Syst. Inc., Germantown, MD, USA
P.K. Gupta, Hughes Network Syst. Inc., Germantown, MD, USA
pp. 265-268
K. Ozawa, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
M. Serizawa, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
T. Miyano, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
T. Nomura, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 269-272
S. Yim, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
D. Sen, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
W.H. Holmes, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
pp. 273-276
Y. Asakawa, Central Res. Lab., Hitachi Ltd., Tokyo, Japan
H. Sekine, Central Res. Lab., Hitachi Ltd., Tokyo, Japan
M. Takashima, Central Res. Lab., Hitachi Ltd., Tokyo, Japan
N. Ishikawa, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 277-280
L. Cellario, CSELT, Torino, Italy
D. Sereno, CSELT, Torino, Italy
M. Giani, Central Res. Lab., Hitachi Ltd., Tokyo, Japan
P. Blocher, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 281-284
K.M. Berkling, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
T. Arai, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
E. Barnard, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 289-292
M.A. Ramalho, Bellcore, Red Bank, NJ, USA
R.J. Mammone, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 29-32
R.C.F. Tucker, Ensigma Ltd., Chepstow, UK
M.J. Carey, Ensigma Ltd., Chepstow, UK
E.S. Parris, Ensigma Ltd., Chepstow, UK
pp. 301-304
C. Griffin, NTT Human Interface Labs., Tokyo, Japan
T. Matsui, NTT Human Interface Labs., Tokyo, Japan
S. Furui, NTT Human Interface Labs., Tokyo, Japan
pp. 309-312
M.E. Forsyth, Centre for Speech Technol. Res., Edinburgh, UK
M.A. Jack, Centre for Speech Technol. Res., Edinburgh, UK
pp. 313-316
J.T. Foote, Dept. of Eng., Cambridge Univ., UK
H.F. Silverman, Centre for Speech Technol. Res., Edinburgh, UK
pp. 317-320
L.G. Bahler, ITT Aerosp./Commun. Div, San Diego, CA, USA
J.E. Porter, ITT Aerosp./Commun. Div, San Diego, CA, USA
A.L. Higgins, ITT Aerosp./Commun. Div, San Diego, CA, USA
pp. 321-323
Chi-Shi Liu, AT&T Bell Labs., Murray Hill, NJ, USA
Chin-Hui Lee, AT&T Bell Labs., Murray Hill, NJ, USA
Biing-Hwang Juang, AT&T Bell Labs., Murray Hill, NJ, USA
A.E. Rosenberg, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 325-328
R. Ricart, Booz, Allen & Hamilton Inc., McLean, VA, USA
J. Cupples, AT&T Bell Labs., Murray Hill, NJ, USA
L. Fenstermacher, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 329-332
Y.K. Muthusamy, Comput. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
N. Jain, AT&T Bell Labs., Murray Hill, NJ, USA
R.A. Cole, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 333-336
S. Issar, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Ward, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 341-344
M. Woszczyna, Carnegie Mellon Univ., Pittsburgh, PA, USA
N. Aoki-Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F.D. Buo, AT&T Bell Labs., Murray Hill, NJ, USA
N. Coccaro, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 345-348
T. Kuhn, Erlangen-Nurnberg Univ., Germany
H. Niemann, Erlangen-Nurnberg Univ., Germany
E.G. Schukat-Talamazzini, Erlangen-Nurnberg Univ., Germany
pp. 357-360
J.H. Wright, Centre for Commun. Res., Bristol Univ., UK
G.J.F. Jones, Erlangen-Nurnberg Univ., Germany
H. Lloyd-Thomas, Erlangen-Nurnberg Univ., Germany
pp. 361-364
F.D. Buo, Karlsruhe Univ., Germany
T.S. Polzin, Erlangen-Nurnberg Univ., Germany
A. Waibel, Erlangen-Nurnberg Univ., Germany
pp. 365-368
Y. Itoh, Real World Comput. Partnership, Tsukaba, Japan
J. Kiyama, Real World Comput. Partnership, Tsukaba, Japan
R. Oka, Real World Comput. Partnership, Tsukaba, Japan
pp. 369-372
T. Robinson, Dept. of Eng., Cambridge Univ., UK
M. Hochberg, Dept. of Eng., Cambridge Univ., UK
S. Renals, Dept. of Eng., Cambridge Univ., UK
pp. 37-40
H. Bourlard, L&H Speech Products, Ieper, Belgium
B. D'hoore, L&H Speech Products, Ieper, Belgium
J.-M. Boite, L&H Speech Products, Ieper, Belgium
pp. 373-376
D.A. James, Dept. of Eng., Cambridge Univ., UK
S.J. Young, Dept. of Eng., Cambridge Univ., UK
pp. 377-380
P. Jeanrenaud, BNN Syst. & Technol., Cambridge, MA, USA
M. Siu, BNN Syst. & Technol., Cambridge, MA, USA
J.R. Rohlicek, BNN Syst. & Technol., Cambridge, MA, USA
M. Meteer, BNN Syst. & Technol., Cambridge, MA, USA
H. Gish, BNN Syst. & Technol., Cambridge, MA, USA
pp. 381-384
J. McDonough, BNN Syst. & Technol., Cambridge, MA, USA
K. Ng, BNN Syst. & Technol., Cambridge, MA, USA
P. Jeanrenaud, BNN Syst. & Technol., Cambridge, MA, USA
H. Gish, BNN Syst. & Technol., Cambridge, MA, USA
J.R. Rohlicek, BNN Syst. & Technol., Cambridge, MA, USA
pp. 385-388
R.P. Lippmann, Lincoln Lab., MIT, Lexington, MA, USA
E.I. Chang, Lincoln Lab., MIT, Lexington, MA, USA
C.R. Jankowski, Lincoln Lab., MIT, Lexington, MA, USA
pp. 389-392
T. Otsuki, Fac. of Eng., Yamagata Univ., Yonezawa, Japan
A. Ito, Lincoln Lab., MIT, Lexington, MA, USA
S. Makino, Lincoln Lab., MIT, Lexington, MA, USA
T. Otomo, BNN Syst. & Technol., Cambridge, MA, USA
pp. 397-400
K. Torkkola, Inst. Dalle Molle d'Intelligence Artificielle Perceptive, Martigny, Switzerland
pp. 401-404
Jianmin Li, Dept. of Comput. Sci., Tsinghua Univ., Beijing, China
Ditang Fang, Dept. of Comput. Sci., Tsinghua Univ., Beijing, China
pp. 405-408
R.N.V. Sitaram, Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
T.V. Sreenivas, Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
pp. 41-44
S.E. Bou-Ghazale, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.H.L. Hansen, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 413-416
L. Neumeyer, Speech Res. & Technol. Program, SRI Int., Menlo Park, CA, USA
M. Weintraub, Speech Res. & Technol. Program, SRI Int., Menlo Park, CA, USA
pp. 417-420
J. Koehler, California Univ., Berkeley, CA, USA
N. Morgan, California Univ., Berkeley, CA, USA
H. Hermansky, California Univ., Berkeley, CA, USA
H.G. Hirsch, BNN Syst. & Technol., Cambridge, MA, USA
G. Tong, BNN Syst. & Technol., Cambridge, MA, USA
pp. 421-424
H. Kobatake, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
Y. Matsunoo, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
pp. 425-428
J. Smolders, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
T. Claes, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
G. Sablon, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
D. Van Compernolle, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 429-432
A. Anastasakos, Northeastern Univ., Boston, MA, USA
F. Kubala, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
J. Makhoul, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
R. Schwartz, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 433-436
W.C. Treurniet, Communication Res. Centre, Ottawa, Ont., Canada
Y. Gong, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 437-440
P. Lockwood, Speech Process. Group, Matra Commun., Bois d'Arcy, France
P. Alexandre, Speech Process. Group, Matra Commun., Bois d'Arcy, France
pp. 441-444
Y. Takebayashi, Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
H. Kanazawa, Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
pp. 449-452
L. Deng, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
D. Sun, Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
pp. 45-48
G. Kubin, Inf. Principles Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA
W.B. Kleijn, Inf. Principles Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 453-456
W.B. Kleijn, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
W.B. Kleijn, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
Souguil Ann, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 457-460
N. Iwahashi, Sony Corp. Res. Labs, Tokyo, Japan
Y. Sagisaka, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 461-464
S.-H. Luo, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
R.W. King, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 465-468
H. Mizuno, NTT Human Interface Labs., Kanagawa, Japan
M. Abe, NTT Human Interface Labs., Kanagawa, Japan
pp. 469-472
C.S. Ramalingam, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
R. Kumaresan, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 473-476
J.S. Erkelens, Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
P.M.T. Broersen, Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
pp. 481-484
A. Biem, ATR Human Inf. Process. Labs., Japan
S. Katagiri, ATR Human Inf. Process. Labs., Japan
pp. 485-488
M. Kohata, Fac. of Eng., Tohoku Univ., Sendai, Japan
T. Takagi, Fac. of Eng., Tohoku Univ., Sendai, Japan
pp. 489-492
S. Krishnan, Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
P.V. Rao, Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
pp. 49-52
Kwok-Wah Law, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
Cheung-Fat Chan, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 493-496
H. Skinnemoen, Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
A. Perkis, Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 497-500
P.A. Chou, Xerox Palo Alto Res. Center, CA, USA
T. Lookabaugh, Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 505-508
R. Hagen, Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 509-512
Jianping Pan, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
T.R. Fischer, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 513-516
T. Svendsen, Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 517-520
Wai-Yip Chan, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
D. Chemla, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 521-524
P. Hedelin, Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 525-528
T.G. Champion, Rome Lab., Hanscom AFB, MA, USA
R.J. McAuley, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
T.F. Quatieri, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 529-532
B.I. Pawate, Tsukuba Res. & Dev. Center, Texas Instrum., Ibaraki, Japan
E. Dowling, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 53-56
L.R. Bahl, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 533-536
R.K. Moore, Speech Res. Unit, DRA Malvern, UK
M.J. Russell, Speech Res. Unit, DRA Malvern, UK
P. Nowell, Speech Res. Unit, DRA Malvern, UK
S.N. Downey, Speech Res. Unit, DRA Malvern, UK
S.R. Browning, Speech Res. Unit, DRA Malvern, UK
pp. 541-544
Hsiao-Wuen Hon, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Baosheng Yuan, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Yen-Lu Chow, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
S. Narayan, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Kai-Fu Lee, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
pp. 545-548
M. Hwamg, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. Rosenfeld, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
E. Theyer, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. Mosur, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
L. Chase, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. Weide, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
X. Huang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F. Alleva, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 549-552
P. Kenny, INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
P. Labute, INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
Z. Li, INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
D. O'Shaughnessy, INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 553-556
J.L. Gauvain, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
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