The Community for Technology Leaders
RSS Icon
Subscribe
Acoustics, Speech, and Signal Processing, IEEE International Conference on (1994)
Adelaide, SA, Australia
Apr. 19, 1994 to Apr. 22, 1994
ISBN: 0-7803-1775-0
TABLE OF CONTENTS
S. Nandkumar , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.H.L. Hansen , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 1-4
G. Whipple , Dept. of Defense, Fort Meade, MD, USA
pp. 5-8
A.P. Petropulu , Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
S. Subramaniam , Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 9-I12
K. Kondo , Tsukuba Res. & Dev. Center, Ibaraki, Japan
J. Picone , Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 101-104
E.R. Buhrke , AT&T Bell Labs., Murray Hill, NJ, USA
R. Cardin , Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 105-108
P.J. Moreno , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 109-112
J.S. Garofolo , Nat. Inst. of Stand. & Technol., USA
T. Robinson , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 113-116
Y.H. Kao , Texas Instrum. Inc., Dallas, TX, USA
C.T. Hemphill , Texas Instrum. Inc., Dallas, TX, USA
B.J. Wheatley , Texas Instrum. Inc., Dallas, TX, USA
P.K. Rajasekaran , Texas Instrum. Inc., Dallas, TX, USA
pp. 117-120
O. Anderson , Center for PersonKommunikation, Aalborg Univ., Denmark
P. Dalsgaard , Center for PersonKommunikation, Aalborg Univ., Denmark
W. Barry , Texas Instrum. Inc., Dallas, TX, USA
pp. 121-124
T. Matsui , NTT Human Interface Labs., Tokyo, Japan
S. Furui , NTT Human Interface Labs., Tokyo, Japan
pp. 125-128
K.T. Assaleh , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
pp. 129-132
H. Sheikhzadeh , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
H. Sameti , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
L. Deng , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
R.L. Brennan , Texas Instrum. Inc., Dallas, TX, USA
pp. 13-16
J.P. Eatock , Univ. Coll. of Swansea, UK
J.S. Mason , Univ. Coll. of Swansea, UK
pp. 133-136
S. Hayakawa , Sch. of Eng., Nagoya Univ., Japan
F. Itakura , Sch. of Eng., Nagoya Univ., Japan
pp. 137-140
M.A. Lund , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
Chung-Tshuy Lee , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
Chung-Chieh Lee , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
R.W. Bossemeyer , Texas Instrum. Inc., Dallas, TX, USA
pp. 141-144
H. Gish , BBN Syst. & Technol. Corp., Cambridge, MA, USA
M. Schmidt , BBN Syst. & Technol. Corp., Cambridge, MA, USA
A. Mielke , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 145-148
J.-L. Le Floch , Univ. Pierre et Marie Curie, Paris, France
C. Montacie , Univ. Pierre et Marie Curie, Paris, France
M.-J. Caraty , Univ. Pierre et Marie Curie, Paris, France
pp. 149-152
J.M. Naik , NYNEX Sci. & Technol. Inc., White Plains, NY, USA
D.M. Lubensky , NYNEX Sci. & Technol. Inc., White Plains, NY, USA
pp. 153-156
J. Sorensen , Dictaphone Corp., Stratford, CT, USA
M. Savic , NYNEX Sci. & Technol. Inc., White Plains, NY, USA
pp. 157-160
L. Wilcox , Xerox PARC, Palo Alto, CA, USA
F. Chen , Xerox PARC, Palo Alto, CA, USA
D. Kimber , Xerox PARC, Palo Alto, CA, USA
V. Balasubramanian , Xerox PARC, Palo Alto, CA, USA
pp. 161-164
K.R. Farrell , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 165-168
J. Schalkwyk , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
E. Barnard , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
J.R. Sachs , Xerox PARC, Palo Alto, CA, USA
pp. 169-172
A. Teolis , Inst. for Syst. Res., Maryland Univ., College Park, MD, USA
J.J. Benedetto , Inst. for Syst. Res., Maryland Univ., College Park, MD, USA
pp. 17-20
Y. Tanaka , Fujitsu Labs. Ltd., Kawasaki, Japan
H. Kimura , Inst. for Syst. Res., Maryland Univ., College Park, MD, USA
pp. 173-176
V.E. Sanchez , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
J.L. Perez , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
J.M. Lopez , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
A.J. Rubio , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 177-180
Gao Yang , Lemout & Hauspie Speech Products, Belgium
H. Leich , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 181-184
J. Thyssen , Tele Danmark Res., Horsholm, Denmark
H. Nielsen , Tele Danmark Res., Horsholm, Denmark
S.D. Hansen , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 185-188
C.R. Watkins , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
S. Crisafulli , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.R. Bitmead , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.J. Orsi , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 189-192
R. Lefebvre , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
R. Salami , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
C. Laflamme , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
J.-P. Adoul , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
pp. 193-196
K. Tokuda , Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
H. Matsumura , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
T. Kobayashi , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
S. Imai , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
pp. 197-200
S.A. McClellan , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
J.D. Gibson , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 201-204
W.R. Gardner , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
B.D. Rao , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 205-208
Sun-Won Park , Dept. of Electr. Eng. & Comput. Sci., Texas A&M Univ., Kingsville, TX, USA
pp. 209-212
S. Das , Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
A. Nadas , Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Picheny , Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 21-24
J.E. Diaz , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
J.C. Segura-Luna , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
P. Garcia-Teodoro , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
A.J. Rubio-Ayuso , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 213-216
I. Rogina , Karlsruhe Univ., Germany
A. Waibel , Karlsruhe Univ., Germany
pp. 217-220
Qing Huo , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Chorkin Chan , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Chin-Hui Lee , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 221-224
F.T. Johansen , Dept of Telecommun., Inst. of Technol., Trondheim, Norway
M.H. Johnsen , Dept of Telecommun., Inst. of Technol., Trondheim, Norway
pp. 225-228
Y. Gotoh , Div. of Eng., Brown Univ., Providence, RI, USA
M.M. Hochberg , Dept of Telecommun., Inst. of Technol., Trondheim, Norway
H.F. Silverman , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 229-232
A. Mellouk , Lab. de Recherche en Inf., Univ. de Paris-Sud, Orsay, France
P. Gallinari , Dept of Telecommun., Inst. of Technol., Trondheim, Norway
pp. 233-236
B. Wheatley , Central Res. Labs., Texas Instrum. Inc., Dallas, TX, USA
K. Kondo , Dept of Telecommun., Inst. of Technol., Trondheim, Norway
W. Anderson , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
Y. Muthusamy , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 237-240
S. Okawa , Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
T. Kobayashi , Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
K. Shirai , Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
pp. 241-244
T. Kosaka , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
S. Sagayama , Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
pp. 245-248
Y. Miyazawa , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
J.-I. Takami , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
S. Sagayama , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
S. Matsunaga , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
pp. 249-252
M. Savic , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
Huiqin Gao , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.S. Sorensen , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 25-28
Y. Ariki , Ryukoku Univ., Ohtsu, Japan
K. Doi , Ryukoku Univ., Ohtsu, Japan
pp. 253-256
J.-M. Muller , ANT Nachrichtentech. GmbH, Backnang, Germany
B. Wachter , ANT Nachrichtentech. GmbH, Backnang, Germany
pp. 257-260
M. Mauc , ESIEE, Noisy-le-Grand, France
G. Baudoin , ESIEE, Noisy-le-Grand, France
M. Jelinek , ESIEE, Noisy-le-Grand, France
pp. 261-264
K. Swaminathan , Hughes Network Syst. Inc., Germantown, MD, USA
K. Ganesan , Hughes Network Syst. Inc., Germantown, MD, USA
Yi-Sheng Wang , Hughes Network Syst. Inc., Germantown, MD, USA
P.K. Gupta , Hughes Network Syst. Inc., Germantown, MD, USA
pp. 265-268
K. Ozawa , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
M. Serizawa , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
T. Miyano , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
T. Nomura , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 269-272
S. Yim , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
D. Sen , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
W.H. Holmes , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
pp. 273-276
Y. Asakawa , Central Res. Lab., Hitachi Ltd., Tokyo, Japan
H. Sekine , Central Res. Lab., Hitachi Ltd., Tokyo, Japan
M. Takashima , Central Res. Lab., Hitachi Ltd., Tokyo, Japan
N. Ishikawa , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 277-280
L. Cellario , CSELT, Torino, Italy
D. Sereno , CSELT, Torino, Italy
M. Giani , Central Res. Lab., Hitachi Ltd., Tokyo, Japan
P. Blocher , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 281-284
D.E. Ray , U.S. Dept. of Defense, USA
D.J. Rahikka , U.S. Dept. of Defense, USA
pp. 285-288
K.M. Berkling , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
T. Arai , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
E. Barnard , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 289-292
M.A. Ramalho , Bellcore, Red Bank, NJ, USA
R.J. Mammone , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 29-32
L.F. Lamel , LIMSI-CNRS, Orsay, France
J.L. Gauvain , LIMSI-CNRS, Orsay, France
pp. 293-296
Kung-Pu Li , ITT Aerosp. Commun. Div., San Diego, CA, USA
pp. 297-300
R.C.F. Tucker , Ensigma Ltd., Chepstow, UK
M.J. Carey , Ensigma Ltd., Chepstow, UK
E.S. Parris , Ensigma Ltd., Chepstow, UK
pp. 301-304
M.A. Zissman , Lincoln Lab., MIT, Lexington, MA, USA
E. Singer , Lincoln Lab., MIT, Lexington, MA, USA
pp. 305-308
C. Griffin , NTT Human Interface Labs., Tokyo, Japan
T. Matsui , NTT Human Interface Labs., Tokyo, Japan
S. Furui , NTT Human Interface Labs., Tokyo, Japan
pp. 309-312
M.E. Forsyth , Centre for Speech Technol. Res., Edinburgh, UK
M.A. Jack , Centre for Speech Technol. Res., Edinburgh, UK
pp. 313-316
J.T. Foote , Dept. of Eng., Cambridge Univ., UK
H.F. Silverman , Centre for Speech Technol. Res., Edinburgh, UK
pp. 317-320
L.G. Bahler , ITT Aerosp./Commun. Div, San Diego, CA, USA
J.E. Porter , ITT Aerosp./Commun. Div, San Diego, CA, USA
A.L. Higgins , ITT Aerosp./Commun. Div, San Diego, CA, USA
pp. 321-323
Chi-Shi Liu , AT&T Bell Labs., Murray Hill, NJ, USA
Chin-Hui Lee , AT&T Bell Labs., Murray Hill, NJ, USA
Biing-Hwang Juang , AT&T Bell Labs., Murray Hill, NJ, USA
A.E. Rosenberg , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 325-328
R. Ricart , Booz, Allen & Hamilton Inc., McLean, VA, USA
J. Cupples , AT&T Bell Labs., Murray Hill, NJ, USA
L. Fenstermacher , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 329-332
L.T. Niles , Xerox Palo Alto Res. Center, CA, USA
pp. 33-36
Y.K. Muthusamy , Comput. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
N. Jain , AT&T Bell Labs., Murray Hill, NJ, USA
R.A. Cole , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 333-336
S. Issar , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Ward , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 341-344
M. Woszczyna , Carnegie Mellon Univ., Pittsburgh, PA, USA
N. Aoki-Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F.D. Buo , AT&T Bell Labs., Murray Hill, NJ, USA
N. Coccaro , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 345-348
D. O'Shaughnessy , INRS Telecommun., Verdun, Que., Canada
pp. 349-352
H. Lucke , ATR Interpreting Telecommun Res. Labs., Kyoto, Japan
pp. 353-356
T. Kuhn , Erlangen-Nurnberg Univ., Germany
H. Niemann , Erlangen-Nurnberg Univ., Germany
E.G. Schukat-Talamazzini , Erlangen-Nurnberg Univ., Germany
pp. 357-360
J.H. Wright , Centre for Commun. Res., Bristol Univ., UK
G.J.F. Jones , Erlangen-Nurnberg Univ., Germany
H. Lloyd-Thomas , Erlangen-Nurnberg Univ., Germany
pp. 361-364
F.D. Buo , Karlsruhe Univ., Germany
T.S. Polzin , Erlangen-Nurnberg Univ., Germany
A. Waibel , Erlangen-Nurnberg Univ., Germany
pp. 365-368
Y. Itoh , Real World Comput. Partnership, Tsukaba, Japan
J. Kiyama , Real World Comput. Partnership, Tsukaba, Japan
R. Oka , Real World Comput. Partnership, Tsukaba, Japan
pp. 369-372
T. Robinson , Dept. of Eng., Cambridge Univ., UK
M. Hochberg , Dept. of Eng., Cambridge Univ., UK
S. Renals , Dept. of Eng., Cambridge Univ., UK
pp. 37-40
H. Bourlard , L&H Speech Products, Ieper, Belgium
B. D'hoore , L&H Speech Products, Ieper, Belgium
J.-M. Boite , L&H Speech Products, Ieper, Belgium
pp. 373-376
D.A. James , Dept. of Eng., Cambridge Univ., UK
S.J. Young , Dept. of Eng., Cambridge Univ., UK
pp. 377-380
P. Jeanrenaud , BNN Syst. & Technol., Cambridge, MA, USA
M. Siu , BNN Syst. & Technol., Cambridge, MA, USA
J.R. Rohlicek , BNN Syst. & Technol., Cambridge, MA, USA
M. Meteer , BNN Syst. & Technol., Cambridge, MA, USA
H. Gish , BNN Syst. & Technol., Cambridge, MA, USA
pp. 381-384
J. McDonough , BNN Syst. & Technol., Cambridge, MA, USA
K. Ng , BNN Syst. & Technol., Cambridge, MA, USA
P. Jeanrenaud , BNN Syst. & Technol., Cambridge, MA, USA
H. Gish , BNN Syst. & Technol., Cambridge, MA, USA
J.R. Rohlicek , BNN Syst. & Technol., Cambridge, MA, USA
pp. 385-388
R.P. Lippmann , Lincoln Lab., MIT, Lexington, MA, USA
E.I. Chang , Lincoln Lab., MIT, Lexington, MA, USA
C.R. Jankowski , Lincoln Lab., MIT, Lexington, MA, USA
pp. 389-392
R.A. Sukkar , AT&T Bell Labs., Naperville, IL, USA
pp. 393-396
T. Otsuki , Fac. of Eng., Yamagata Univ., Yonezawa, Japan
A. Ito , Lincoln Lab., MIT, Lexington, MA, USA
S. Makino , Lincoln Lab., MIT, Lexington, MA, USA
T. Otomo , BNN Syst. & Technol., Cambridge, MA, USA
pp. 397-400
K. Torkkola , Inst. Dalle Molle d'Intelligence Artificielle Perceptive, Martigny, Switzerland
pp. 401-404
Jianmin Li , Dept. of Comput. Sci., Tsinghua Univ., Beijing, China
Ditang Fang , Dept. of Comput. Sci., Tsinghua Univ., Beijing, China
pp. 405-408
J.A.N. Flores , Dept. of Eng., Cambridge Univ., UK
S.J. Young , Dept. of Eng., Cambridge Univ., UK
pp. 409-412
R.N.V. Sitaram , Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
T.V. Sreenivas , Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
pp. 41-44
S.E. Bou-Ghazale , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.H.L. Hansen , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 413-416
L. Neumeyer , Speech Res. & Technol. Program, SRI Int., Menlo Park, CA, USA
M. Weintraub , Speech Res. & Technol. Program, SRI Int., Menlo Park, CA, USA
pp. 417-420
J. Koehler , California Univ., Berkeley, CA, USA
N. Morgan , California Univ., Berkeley, CA, USA
H. Hermansky , California Univ., Berkeley, CA, USA
H.G. Hirsch , BNN Syst. & Technol., Cambridge, MA, USA
G. Tong , BNN Syst. & Technol., Cambridge, MA, USA
pp. 421-424
H. Kobatake , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
Y. Matsunoo , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
pp. 425-428
J. Smolders , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
T. Claes , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
G. Sablon , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
D. Van Compernolle , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 429-432
A. Anastasakos , Northeastern Univ., Boston, MA, USA
F. Kubala , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
J. Makhoul , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
R. Schwartz , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 433-436
W.C. Treurniet , Communication Res. Centre, Ottawa, Ont., Canada
Y. Gong , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 437-440
P. Lockwood , Speech Process. Group, Matra Commun., Bois d'Arcy, France
P. Alexandre , Speech Process. Group, Matra Commun., Bois d'Arcy, France
pp. 441-444
M.G. Rahim , AT&T Bell Labs., Murray Hill, NJ, USA
Biing-Hwang Juang , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 445-448
Y. Takebayashi , Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
H. Kanazawa , Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
pp. 449-452
L. Deng , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
D. Sun , Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
pp. 45-48
G. Kubin , Inf. Principles Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA
W.B. Kleijn , Inf. Principles Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 453-456
W.B. Kleijn , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
W.B. Kleijn , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
Souguil Ann , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 457-460
N. Iwahashi , Sony Corp. Res. Labs, Tokyo, Japan
Y. Sagisaka , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 461-464
S.-H. Luo , Dept. of Electr. Eng., Sydney Univ., NSW, Australia
R.W. King , Dept. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 465-468
H. Mizuno , NTT Human Interface Labs., Kanagawa, Japan
M. Abe , NTT Human Interface Labs., Kanagawa, Japan
pp. 469-472
C.S. Ramalingam , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
R. Kumaresan , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 473-476
H. Yehia , Sch. of Eng., Nagoya Univ., Japan
F. Itakura , Sch. of Eng., Nagoya Univ., Japan
pp. 477-480
J.S. Erkelens , Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
P.M.T. Broersen , Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
pp. 481-484
A. Biem , ATR Human Inf. Process. Labs., Japan
S. Katagiri , ATR Human Inf. Process. Labs., Japan
pp. 485-488
M. Kohata , Fac. of Eng., Tohoku Univ., Sendai, Japan
T. Takagi , Fac. of Eng., Tohoku Univ., Sendai, Japan
pp. 489-492
S. Krishnan , Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
P.V. Rao , Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
pp. 49-52
Kwok-Wah Law , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
Cheung-Fat Chan , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 493-496
H. Skinnemoen , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
A. Perkis , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 497-500
S. Bruhn , Inst. fur Telecommun., Tech. Univ. Berlin, Germany
pp. 501-504
P.A. Chou , Xerox Palo Alto Res. Center, CA, USA
T. Lookabaugh , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 505-508
R. Hagen , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 509-512
Jianping Pan , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
T.R. Fischer , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 513-516
T. Svendsen , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 517-520
Wai-Yip Chan , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
D. Chemla , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 521-524
P. Hedelin , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 525-528
T.G. Champion , Rome Lab., Hanscom AFB, MA, USA
R.J. McAuley , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
T.F. Quatieri , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 529-532
B.I. Pawate , Tsukuba Res. & Dev. Center, Texas Instrum., Ibaraki, Japan
E. Dowling , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 53-56
L.R. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 533-536
R.K. Moore , Speech Res. Unit, DRA Malvern, UK
M.J. Russell , Speech Res. Unit, DRA Malvern, UK
P. Nowell , Speech Res. Unit, DRA Malvern, UK
S.N. Downey , Speech Res. Unit, DRA Malvern, UK
S.R. Browning , Speech Res. Unit, DRA Malvern, UK
pp. 541-544
Hsiao-Wuen Hon , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Baosheng Yuan , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Yen-Lu Chow , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
S. Narayan , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Kai-Fu Lee , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
pp. 545-548
M. Hwamg , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. Rosenfeld , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
E. Theyer , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. Mosur , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
L. Chase , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. Weide , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
X. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F. Alleva , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 549-552
P. Kenny , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
P. Labute , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
Z. Li , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
D. O'Shaughnessy , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 553-556
J.L. Gauvain , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
L.F. Lamel , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
G. Adda , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
M. Adda-Decker , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 557-560
F. Kubala , IBM Syst. & Technol., Cambridge, MA, USA
A. Anastasakos , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
J. Makhoul , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
L. Nguyen , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
R. Schwartz , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
E. Zavaliagkos , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 561-564
T. Dutoit , Faculte Polytech. de Mons, Belgium
pp. 565-568
H. Kawa , KDD Kamifukuoka R&D Labs., Saitama, Japan
N. Higuchi , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
T. Simizu , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
S. Yamamoto , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 569-572
Yifan Gong , CRIN/CNRS, Inst. Nat. de Recherche en Inf. et Autom., Vandoeuvre, France
J.-P. Haton , CRIN/CNRS, Inst. Nat. de Recherche en Inf. et Autom., Vandoeuvre, France
pp. 57-60
F.M. Gimenez de los Galanes , Dept. Ingenieria Electron., Univ. Politecnica de Madrid, Spain
M.H. Savoji , CRIN/CNRS, Inst. Nat. de Recherche en Inf. et Autom., Vandoeuvre, France
J.M. Pardo , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 573-576
K. Itoh , NTT Human Interface Labs., Kanagawa, Japan
S. Nakajima , NTT Human Interface Labs., Kanagawa, Japan
T. Hirokawa , NTT Human Interface Labs., Kanagawa, Japan
pp. 577-580
G. Fries , Forschungs und Technol., Deutsche Bundespost Telekom, Darmstadt, Germany
pp. 581-584
V. Valimaki , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
M. Karjalainen , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
T. Kuisma , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 585-588
E. Lopez-Gonzalo , ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
L.A. Hernandez-Gomez , ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
pp. 589-592
Y. Yamashita , Inst. of Sci. & Ind. Res., Osaka Univ., Japan
R. Miroguchi , Inst. of Sci. & Ind. Res., Osaka Univ., Japan
pp. 593-596
H. Noda , Commun. Res. Lab., Japan Ministry of Posts & Telecommun., Kobe, Japan
M.N. Shirazi , Inst. of Sci. & Ind. Res., Osaka Univ., Japan
pp. 597-600
B.P. Milner , Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
S.V. Vaseghi , Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
pp. 601-604
Weon-Goo Kim , Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
Jeung-Yoon Choi , Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
Jeung-Yoon Choi , Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
pp. 605-608
P. Le Cerf , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
K. Demuynck , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
J. Duchateau , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
D. Van Compernolle , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 609-612
A.M. Peinado , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
J.C. Segura , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
A.J. Rubio , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
M.C. Benitez , Dept. de Electron. y Tecnologia de Computadores, Granada Univ., Spain
pp. 61-64
Y. Zhang , Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
M. Alder , Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
R. Togneri , Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
pp. 613-616
J.-M. Boite , L&H Speech Products, Ieper, Belgium
H. Bourlard , L&H Speech Products, Ieper, Belgium
B. D'hoore , L&H Speech Products, Ieper, Belgium
S. Accaino , L&H Speech Products, Ieper, Belgium
J. Vantieghem , L&H Speech Products, Ieper, Belgium
pp. 617-620
S. Euler , TELENORMA, Bosch Telecom, Frankfurt, Germany
J. Zinke , TELENORMA, Bosch Telecom, Frankfurt, Germany
pp. 621-624
Jung-Kuei Chen , Telecommun. Lab., Minist. of Commun., Chung-Li, Taiwan
F.K. Soong , TELENORMA, Bosch Telecom, Frankfurt, Germany
pp. 625-628
P. Laface , Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
L. Fissore , TELENORMA, Bosch Telecom, Frankfurt, Germany
pp. 629-632
J. Di Martino , CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
J.F. Mari , CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
B. Mathieu , L&H Speech Products, Ieper, Belgium
K. Perot , L&H Speech Products, Ieper, Belgium
K. Smaili , L&H Speech Products, Ieper, Belgium
pp. 633-635
E. Tsuboka , Central Res. Labs., Matsushita Electr. Ind. Co. Ltd., Kyoto, Japan
J. Nakahashi , Central Res. Labs., Matsushita Electr. Ind. Co. Ltd., Kyoto, Japan
pp. 637-640
T. Yoshimura , Electrotech. Lab., Ibaraki, Japan
S. Hayamizu , Electrotech. Lab., Ibaraki, Japan
K. Tanalia , Electrotech. Lab., Ibaraki, Japan
pp. 69-72
D.B. Grayden , Melbourne Univ., Parkville, Vic., Australia
M.S. Scordilis , Melbourne Univ., Parkville, Vic., Australia
pp. 73-76
A. Samouelian , Dept. of Electr. & Comput. Eng., Wollongong Univ., NSW, Australia
pp. 77-80
J. Bernstein , Speech Res. & Technol Program, SRI Int., Menlo Park, CA, USA
K. Taussig , Speech Res. & Technol Program, SRI Int., Menlo Park, CA, USA
J. Godfrey , Speech Res. & Technol Program, SRI Int., Menlo Park, CA, USA
pp. 81-84
M. Weintraub , Speech Res. & Technol. Program, SRI Int., Menlo Park, CA, USA
L. Neumeyer , Speech Res. & Technol. Program, SRI Int., Menlo Park, CA, USA
pp. 85-88
T. Staples , Comput. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
J. Picone , Comput. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
N. Arai , Comput. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 89-92
R.A. Cole , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
D.G. Novick , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
D. Burnett , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
B. Hansen , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
S. Sutton , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Fant , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 93-96
J.B. Millar , Comput. Sci. Lab., Australian Nat. Univ., Canberra, ACT, Australia
J.P. Vonwiller , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
J.M. Harrington , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
P.J. Dermody , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 97-I100
17 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool