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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1993)
Minneapolis, MN, USA
Apr. 27, 1993 to Apr. 30, 1993
ISBN: 0-7803-0946-4
TABLE OF CONTENTS
F.R. Chen , Xerox Palo Alto Res. Center, CA, USA
L.D. Wilcox , Xerox Palo Alto Res. Center, CA, USA
D.S. Bloomberg , Xerox Palo Alto Res. Center, CA, USA
pp. 1-4vol.5
I.B. Kerfoot , Beckman Inst., Illinois Univ., Urbana, IL, USA
Y. Bresler , Beckman Inst., Illinois Univ., Urbana, IL, USA
pp. 5-8vol.5
P.-K. Ser , Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
W.-C. Siu , Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
pp. 9-12vol.5
B. Wang , Eng. Math. & Comput. Sci. Dept., Louisville Univ., KY, USA
D.M. Rose , Eng. Math. & Comput. Sci. Dept., Louisville Univ., KY, USA
A.A. Farag , Eng. Math. & Comput. Sci. Dept., Louisville Univ., KY, USA
pp. 13-16vol.5
F. Marques , Dept. Teoria de la Senal y Commun., E.T.S.E.T.B.-U.P.C., Barcelona, Spain
J. Cunillera , Dept. Teoria de la Senal y Commun., E.T.S.E.T.B.-U.P.C., Barcelona, Spain
A. Gasull , Dept. Teoria de la Senal y Commun., E.T.S.E.T.B.-U.P.C., Barcelona, Spain
pp. 17-20vol.5
J.-L. Chen , Dept. of Biophys. Sci., State Univ. of New York, Buffalo, NY, USA
A. Kundu , Dept. Teoria de la Senal y Commun., E.T.S.E.T.B.-U.P.C., Barcelona, Spain
pp. 21-24vol.5
P. Migliorati , CEFRIEL, Milano, Italy
F. Pedersini , Dept. Teoria de la Senal y Commun., E.T.S.E.T.B.-U.P.C., Barcelona, Spain
L. Sorcinelli , Dept. Teoria de la Senal y Commun., E.T.S.E.T.B.-U.P.C., Barcelona, Spain
pp. 25-28vol.5
C. Kotropoulos , Dept. of Electr. Eng., Thessaloniki Univ., Greece
I. Pitas , Dept. of Electr. Eng., Thessaloniki Univ., Greece
A. Maglara , Dept. of Electr. Eng., Thessaloniki Univ., Greece
pp. 29-32vol.5
M.M. Chang , Electr. Eng. Dept., Rochester Univ., NY, USA
A.M. Tekalp , Electr. Eng. Dept., Rochester Univ., NY, USA
M.I. Sezan , Dept. of Electr. Eng., Thessaloniki Univ., Greece
pp. 33-36vol.5
D.F. Dunn , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
W.E. Higgins , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 37-40vol.5
M.R. Luettgen , MIT Lab. for Inf. & Decision Syst., Cambridge, MA, USA
W.C. Karl , MIT Lab. for Inf. & Decision Syst., Cambridge, MA, USA
A.S. Willsky , MIT Lab. for Inf. & Decision Syst., Cambridge, MA, USA
pp. 41-44vol.5
P. Salembier , Dept. of Signal Theory & Com., Univ. of Politecnica de Catalunya, Barcelona, Spain
J. Serra , MIT Lab. for Inf. & Decision Syst., Cambridge, MA, USA
J.A. Bangham , MIT Lab. for Inf. & Decision Syst., Cambridge, MA, USA
pp. 45-48vol.5
P.A. Kelly , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
G. Chen , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 49-52vol.5
S. Hoefer , Kaiserslautern Univ., Germany
F. Heil , Kaiserslautern Univ., Germany
M. Pandit , Kaiserslautern Univ., Germany
pp. 53-56vol.5
M.A. Schulze , Dept. of Electr. Eng., Texas Univ., Austin, TX, USA
J.A. Pearce , Dept. of Electr. Eng., Texas Univ., Austin, TX, USA
pp. 57-60vol.5
Gaofeng Wang , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
J. Zhang , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
G.W. Pan , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
pp. 61-64vol.5
S.A. Martucci , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 65-68vol.5
L. Akarun , Electr. Eng. Dept., Bogazici Univ., Istanbul, Turkey
R.A. Haddad , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 69-72vol.5
A.I. El-Fallah , Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
G.E. Ford , Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
pp. 73-76vol.5
M.R. Zaman , Fac. of Eng. & Appl. Sci., Memorial Univ. of Newfoundland, St. John's, Nfld., Canada
C.R. Moloney , Fac. of Eng. & Appl. Sci., Memorial Univ. of Newfoundland, St. John's, Nfld., Canada
pp. 77-80vol.5
S.-s. Kuo , AT&T Bell Lab., Murray Hill, NJ, USA
O.E. Agazzi , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 81-84vol.5
G.E. Kopec , Xerox Palo Alto Res. Center, CA, USA
P.A. Chou , Xerox Palo Alto Res. Center, CA, USA
pp. 85-88vol.5
H.K. Aghajan , Dept. of Electr. Eng., Stanford Univ., CA, USA
T. Kailath , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 89-92vol.5
K.A. Bartels , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
A.C. Bovik , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 93-96vol.5
P.-F. Yang , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
P. Maragos , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
pp. 97-100vol.5
C.W. Chen , Dept. of Electr. Eng., Rochester Univ., NY, USA
J. Luo , Dept. of Electr. Eng., Rochester Univ., NY, USA
T.S. Huang , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
pp. 101-104vol.5
M.-Y. Chen , CEDAR, State Univ. of New York, Amherst, NY, USA
A. Kundu , Dept. of Electr. Eng., Rochester Univ., NY, USA
S.N. Srihari , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
pp. 105-108vol.5
O.E. Agazzi , AT&T Bell Lab., Murray Hill, NJ, USA
S.-S. Kuo , AT&T Bell Lab., Murray Hill, NJ, USA
E. Levin , AT&T Bell Lab., Murray Hill, NJ, USA
R. Pieraccini , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 113-116vol.5
A.K. Muhamad , Dept. of Electr. & Electron. Eng., Univ. of Wales, Swansea, UK
F. Deravi , Dept. of Electr. & Electron. Eng., Univ. of Wales, Swansea, UK
pp. 117-120vol.5
K.S. Nathan , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
J.R. Bellegarda , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
E.J. Bellegarda , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 121-124vol.5
J.M. Reinhardt , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
W.E. Higgins , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 125-128vol.5
T. Greiner , Dept. of Electr. Eng., Kaiserslautern Univ., Germany
J.P. Casel , Dept. of Electr. Eng., Kaiserslautern Univ., Germany
M. Pandit , Dept. of Electr. Eng., Kaiserslautern Univ., Germany
pp. 129-132vol.5
K. Aizawa , Dept. of Electr. Eng., Tokyo Univ., Bunkyo-ku, Tokyo, Japan
T. Komatsu , Dept. of Electr. Eng., Kaiserslautern Univ., Germany
T. Saito , Dept. of Electr. Eng., Kaiserslautern Univ., Germany
M. Hatori , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 133-136vol.5
Z. Kato , INRIA, Sophia Antipolis, France
M. Berthod , INRIA, Sophia Antipolis, France
J. Zerubia , INRIA, Sophia Antipolis, France
pp. 137-140vol.5
F.G.B. De Natale , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G.S. Desoli , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
D.D. Giusto , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G. Vernazza , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 141-144vol.5
J. Ben-Arie , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
K.R. Rao , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 145-148vol.5
M. Unser , Nat. Inst. of Health, Bethesda, MD, USA
pp. 149-152vol.5
S.P. Kim , Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
W.Y. Su , Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
pp. 153-156vol.5
Y.S. Yao , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. Chellappa , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 157-160vol.5
R.W. Picard , Media Lab., MIT, Cambridge, MA, USA
T. Kabir , Media Lab., MIT, Cambridge, MA, USA
pp. 161-164vol.5
R. Lenz , Auditory & Visuual Perception Lab., Adv. Telecommun. Res. Inst., Soraku-gun, Kyoto, Japan
pp. 165-168vol.5
D.M. Monro , Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 169-172vol.5
H. Cha , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
L.F. Chaparro , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 173-176vol.5
S.W. Lee , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
J.K. Paik , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 177-180vol.5
J. Zhong , Beckman Inst., Illinois Univ., Urbana, IL, USA
R.J. Adrian , Beckman Inst., Illinois Univ., Urbana, IL, USA
T.S. Huang , Beckman Inst., Illinois Univ., Urbana, IL, USA
pp. 181-184vol.5
R. Bernardini , Dipartimento di Elettronica e Inf., Padova, Italy
G.M. Cortelazzo , Dipartimento di Elettronica e Inf., Padova, Italy
G.A. Mian , Dipartimento di Elettronica e Inf., Padova, Italy
pp. 185-188vol.5
P. Moulin , Bell Commun. Res., Morristown, NJ, USA
pp. 189-192vol.5
C. Stiller , Inst. for Commun. Eng., Aachen Univ. of Technol., Germany
pp. 193-196vol.5
J. Zhang , Electr. Eng. & Comput. Sci. Dept., Wisconsin Univ., Milwaukee, WI, USA
J. Hanauer , Electr. Eng. & Comput. Sci. Dept., Wisconsin Univ., Milwaukee, WI, USA
pp. 197-200vol.5
Q. Zheng , Maryland Univ., College Park, MD, USA
R. Chellappa , Maryland Univ., College Park, MD, USA
pp. 201-204vol.5
S.L. Iu , Panasonic Adv. TV-Video Lab., Inc., Burlington, NJ, USA
E.C. Wu , Panasonic Adv. TV-Video Lab., Inc., Burlington, NJ, USA
pp. 205-208vol.5
I.M. Abdelqader , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S.A. Rajala , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
W.E. Snyder , Dipartimento di Elettronica e Inf., Padova, Italy
pp. 209-212vol.5
A. Kojima , NTT Network Inf. Syst. Lab., Take, Yokosuka, Japan
N. Sakurai , NTT Network Inf. Syst. Lab., Take, Yokosuka, Japan
J.I. Kishigami , Dipartimento di Elettronica e Inf., Padova, Italy
pp. 213-216vol.5
C.K. Cheong , Dept. of Electr. Eng., Tokyo Univ., Bunkyo-Ku, Tokyo, Japan
K. Alizawa , Dept. of Electr. Eng., Tokyo Univ., Bunkyo-Ku, Tokyo, Japan
T. Saito , Dipartimento di Elettronica e Inf., Padova, Italy
M. Hatori , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 217-220vol.5
J.Y.A. Wang , Media Lab., MIT, Cambridge, MA, USA
E.H. Adelson , Media Lab., MIT, Cambridge, MA, USA
pp. 221-224vol.5
E.H. Adelson , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J.L. Prince , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 225-228vol.5
A. Nosratinia , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
M.T. Orchard , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 229-232vol.5
R.Y. Wang , Washington Univ., Seattle, WA, USA
E.A. Riskin , Washington Univ., Seattle, WA, USA
R. Ladner , Washington Univ., Seattle, WA, USA
pp. 233-236vol.5
L. Torres , ETSIT-U Univ. Politecnica de Catalunya, Barcelona, Spain
J. Salillas , ETSIT-U Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 237-240vol.5
K.L. Oehler , Dept. of Electr. Eng., Stanford Univ., CA, USA
R.M. Gray , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 241-244vol.5
N. Mohsenian , Dept. of Electr. Eng., Princeton Univ., NJ, USA
N.M. Nasrabadi , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 245-248vol.5
P. D'Alessandro , Contraves Italiana SpA, Roma, Italy
P. Formenti , Dept. of Electr. Eng., Stanford Univ., CA, USA
R. Lancini , Washington Univ., Seattle, WA, USA
pp. 249-252vol.5
L. Lu , ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
W.A. Pearlman , ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 253-256vol.5
L.M. Po , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 257-260vol.5
A.J. Patti , Electr. Eng. Dept., Rochester Univ., NY, USA
M.K. Ozkan , ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
A.M. Tekalp , Washington Univ., Seattle, WA, USA
M.I. Sezan , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 261-264vol.5
M.I. Sezan , Eastman Kodak Co., Rochester, NY, USA
A.T. Erdem , Eastman Kodak Co., Rochester, NY, USA
pp. 265-268vol.5
N.K. Bose , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
H.C. Kim , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
H.M. Valenzuela , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 269-272vol.5
J.C. Brailean , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 273-276vol.5
P. Nasiopoulos , Dept. of Electr. Eng., British Columbia Univ., Vancouver, BC, Canada
R.K. Ward , Dept. of Electr. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 277-280vol.5
M.R. Banham , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
H. Gonzalez , Dept. of Electr. Eng., British Columbia Univ., Vancouver, BC, Canada
N.P. Galatsanos , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
A.K. Katsaggelos , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 281-284vol.5
Y.L. You , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M. Kaveh , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 285-288vol.5
M.E. Zervakis , Dept. of Comput. Eng., Minnesota Univ., Duluth, MN, USA
T.M. Kwon , Dept. of Comput. Eng., Minnesota Univ., Duluth, MN, USA
pp. 289-292vol.5
R.P. Kleihorst , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
R.L. Lagendijk , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biemond , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 293-296vol.5
P.L. Combettes , Dept. of Electr. Eng., City Univ. of New York, NY, USA
H. Puh , Dept. of Electr. Eng., City Univ. of New York, NY, USA
pp. 297-300vol.5
T. Mitsa , Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
K.L. Varkur , Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 301-304vol.5
R. Soininen , Signal Process Lab., Tampere Univ. of Technol., Finland
I. Defee , Signal Process Lab., Tampere Univ. of Technol., Finland
Y. Neuvo , Signal Process Lab., Tampere Univ. of Technol., Finland
pp. 305-308vol.5
S. Hein , Siemens AG, Munchen, Germany
A. Zakhor , Signal Process Lab., Tampere Univ. of Technol., Finland
pp. 309-312vol.5
M.J. Vrhel , Electr. & Comput. Eng. Dept., North Carolina State Univ., Raleigh, NC, USA
H.J. Trussell , Electr. & Comput. Eng. Dept., North Carolina State Univ., Raleigh, NC, USA
pp. 313-316vol.5
V.S. Iverson , Washington Univ., Seattle, WA, USA
E.A. Riskin , Washington Univ., Seattle, WA, USA
pp. 317-320vol.5
Z. Fan , Xerox Corp., Webster, NY, USA
pp. 321-324vol.5
Y. Chen , Merck & Co., Rahway, NJ, USA
H. Peterson , Washington Univ., Seattle, WA, USA
W. Bender , Signal Process Lab., Tampere Univ. of Technol., Finland
pp. 325-328vol.5
A. Bist , Dept. of Electr. Eng., Hawaii Univ., HI, USA
A. Jacquin , Washington Univ., Seattle, WA, USA
C. Podilchuk , Signal Process Lab., Tampere Univ. of Technol., Finland
pp. 329-332vol.5
T.N. Pappas , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 333-336vol.5
S. Lepsoy , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
G.E. Oien , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
T.A. Ramstad , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 337-340vol.5
L. Thomas , Dept. of Electr. & Electron. Eng., Univ. of Wales, Swansea, UK
F. Deravi , Dept. of Electr. & Electron. Eng., Univ. of Wales, Swansea, UK
pp. 341-344vol.5
M. Gharavi-Alkhansari , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
T.S. Huang , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 345-348vol.5
G. Vines , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
G. Vines , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 349-352vol.5
F.J. Malassenet , Georgia Tech Lorraine, Metz, France
pp. 353-356vol.5
W. Li , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
F.X. Mateo , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 357-360vol.5
D. Tretter , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
C. Bouman , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 361-364vol.5
P. Su , Dept. of Electr. Eng., Imperial Coll. of Sci. Technol. & Med., London, UK
A.G. Constantinides , Dept. of Electr. Eng., Imperial Coll. of Sci. Technol. & Med., London, UK
pp. 365-368vol.5
S.L. Eddins , EECS Dept., Illinois Univ., Chicago, IL, USA
pp. 369-372vol.5
D. Shah , Dept. of EEE, Strathclyde Univ., Glasgow, UK
S. Marshall , Dept. of EEE, Strathclyde Univ., Glasgow, UK
W.J. Welsh , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 373-376vol.5
A. Zaccarin , Dept. de Genie Electr., Laval Univ., Quebec, Que., Canada
B. Liu , Dept. of EEE, Strathclyde Univ., Glasgow, UK
pp. 377-380vol.5
K. Ramchandran , Dept. of Electr. Eng., Columbia Univ., NY, USA
A. Ortega , Dept. of Electr. Eng., Columbia Univ., NY, USA
M. Vetterli , Dept. of Electr. Eng., Columbia Univ., NY, USA
pp. 381-384vol.5
K.M. Uz , David Sarnoff Res. Center, Princeton, NJ, USA
J.M. Shapiro , David Sarnoff Res. Center, Princeton, NJ, USA
M. Czigler , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 385-388vol.5
S.W. Wu , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 389-392vol.5
B. Zeng , Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowlooon, Hong Kong
A.N. Venetsanopoulos , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 393-396vol.5
N. Farvardin , Electr. Eng. Dept., Maryland Univ. College Park, MD, USA
X. Ran , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
C.C. Lee , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 397-400vol.5
R.L. Stevenson , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 401-404vol.5
Y. Yang , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
N.P. Galatsanos , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
A.K. Katsaggelos , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 405-408vol.5
F.G.B. De Natale , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G.S. Desoli , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
S. Fioravanti , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
D.D. Giusto , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 409-412vol.5
B. DeCleene , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
H. Sorensen , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 413-416vol.5
W.M. Lam , Dept. of Electr. Eng., Princeton Univ., NJ, USA
A.R. Reibman , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
B. Liu , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 417-420vol.5
S.F. Chang , Dept. of EECS, California Univ., Berkeley, CA, USA
D.G. Messerschmitt , Dept. of EECS, California Univ., Berkeley, CA, USA
pp. 421-424vol.5
L.W. Lee , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
J.F. Wang , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
J.Y. Lee , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
C.C. Chen , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 425-428vol.5
S. Liu , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M. Hayes , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 429-432vol.5
J. Huang , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 433-436vol.5
G. Sullivan , PictureTel Corp., Danvers, MA, USA
pp. 437-440vol.5
H. Li , Dept. of Electr. Eng., Linkoping Univ., Sweden
R. Forchheimer , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 441-444vol.5
B.L. Douglas , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
H. Lee , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 445-448vol.5
B.L. Robertson , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
B.L. Robertson , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 449-452vol.5
M.S. D'Errico , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
B.L. Douglas , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
H. Lee , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 453-456vol.5
G.E. Mailloux , Inst. de Genie Biomed., Ecole Polytech. de Montreal, Que., Canada
R. Noumeir , Inst. de Genie Biomed., Ecole Polytech. de Montreal, Que., Canada
R. Lemieux , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 457-460vol.5
M.F. Griffin , Syst. Sci. Dept., Tokyo Inst. of Technol., Yokohama, Japan
E.C. Boman , Inst. de Genie Biomed., Ecole Polytech. de Montreal, Que., Canada
I. Metal , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
L.P. Orwig , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 461-464vol.5
M. Soumekh , Dept. of Electr. & Comput. Eng., State Univ. of New York at Buffalo, Amherst, NY, USA
S. Nugroho , Dept. of Electr. & Comput. Eng., State Univ. of New York at Buffalo, Amherst, NY, USA
S. Jones , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
R. Rysdyk , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
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R. Noumeir , Inst. de Genie Biomed., Ecole Polytech. de Montreal, Que., Canada
G.E. Mailloux , Inst. de Genie Biomed., Ecole Polytech. de Montreal, Que., Canada
R. Lemieux , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 469-472vol.5
F.A. Baqai , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
Y. Hua , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 473-476vol.5
J. Hui , Inst. of Acoust., Acad. Sinica, Beijing, China
H.C. Huan , Inst. of Acoust., Acad. Sinica, Beijing, China
pp. 477-480vol.5
A.C. Segal , Illinois Univ., Chicago, IL, USA
M. Walther , Illinois Univ., Chicago, IL, USA
W.-M. Boerner , Illinois Univ., Chicago, IL, USA
H.-J. Eom , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 481-482vol.5
J.L. Prince , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 483-486vol.5
Y. Bresler , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
N.P. Willis , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 487-490vol.5
P. Charbonnier , Univ. de Nice-Sophia Antipolis, Valbonne, France
L. Blanc-Feraud , Univ. de Nice-Sophia Antipolis, Valbonne, France
M. Barlaud , Univ. de Nice-Sophia Antipolis, Valbonne, France
pp. 491-494vol.5
A. Mohammad-Djafari , Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
pp. 495-498vol.5
C. Klifa , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
K. Sauer , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 499-502vol.5
X.-L. Xu , Dept. of Radiol., Minnesota Univ., Minneapolis, MN, USA
J.-S. Liow , Dept. of Radiol., Minnesota Univ., Minneapolis, MN, USA
S.C. Strother , Dept. of Radiol., Minnesota Univ., Minneapolis, MN, USA
pp. 503-506vol.5
A.H. Tewfik , Minnesota Univ., Minneapolis, MN, USA
X. Hu , Minnesota Univ., Minneapolis, MN, USA
H.H. Garnaoui , Minnesota Univ., Minneapolis, MN, USA
pp. 507-510vol.5
J.K. Riek , Rochester Univ., NY, USA
A.M. Tekalp , Rochester Univ., NY, USA
W.E. Smith , Rochester Univ., NY, USA
pp. 511-514vol.5
A.S. Belmont , Beckman Inst., Illinois Univ., Urbana, IL, USA
I.B. Kerfoot , Beckman Inst., Illinois Univ., Urbana, IL, USA
pp. 515-518vol.5
G. Potamianos , Dept. of Electr. & Comput. Eng., John Hopkins Univ., Baltimore, MD, USA
J. Goutsias , Dept. of Electr. & Comput. Eng., John Hopkins Univ., Baltimore, MD, USA
pp. 519-522vol.5
B.H. Khalaj , Inf. Syst. Lab., Stanford Univ., CA, USA
A.H. Sayed , Inf. Syst. Lab., Stanford Univ., CA, USA
T. Kailath , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 523-526vol.5
T. Chen , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 527-530vol.5
N.D. Sinha , Sch. of Electr. Eng. & Comput. Sci., Polytech. Univ., Brooklyn, NY, USA
R.A. Haddad , Sch. of Electr. Eng. & Comput. Sci., Polytech. Univ., Brooklyn, NY, USA
pp. 531-534vol.5
T. Hinamoto , Fac. of Eng., Hiroshima Univ., Higashi-Hiroshima, Japan
pp. 535-538vol.5
H.-C. Lu , Dept. of Electr. Eng., Tatung Inst. of Technol., Taipei, Taiwan
K.-S. Yeh , Dept. of Electr. Eng., Tatung Inst. of Technol., Taipei, Taiwan
pp. 539-542vol.5
T.L. Marzetta , Nichols Res. Corp., Wakefield, MA, USA
pp. 543-545vol.5
Z. Xiong , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
N.P. Galatsanos , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
M.T. Orchard , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 546-549vol.5
O. Rioul , France Telecom. Issy-Les-Moulineaux, France
pp. 550-553vol.5
P. Sriram , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 554-557vol.5
J.M. Shapiro , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 558-561vol.5
A. Baskurt , URA CNRS, Villeurbanne, France
F. Peyrin , URA CNRS, Villeurbanne, France
H. Benoit-Cattin , URA CNRS, Villeurbanne, France
R. Goutte , URA CNRS, Villeurbanne, France
pp. 562-565vol.5
S.O. Aase , Div. of Telecommun., Norwegian Inst. Technol., Trondheim, Norway
T.A. Ramstad , Div. of Telecommun., Norwegian Inst. Technol., Trondheim, Norway
pp. 566-569vol.5
W.C. Chung , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 570-573vol.5
E. Chang , California Univ., Berkeley, CA, USA
A. Zahkor , California Univ., Berkeley, CA, USA
pp. 574-577vol.5
E. Ramirez , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
V. Vaishampayan , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 578-581vol.5
J.W. Woods , ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
T. Naveen , ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 582-585vol.5
G. Poggi , Dipartimento di Ingegneria Elettronica, Napoli Univ., Italy
E. Sasso , Dipartimento di Ingegneria Elettronica, Napoli Univ., Italy
pp. 586-589vol.5
M. Barlaud , Univ. de Nice-Sophia Antipolis, Valbonne, France
P. Sole , Univ. de Nice-Sophia Antipolis, Valbonne, France
J.M. Moureaux , Univ. de Nice-Sophia Antipolis, Valbonne, France
M. Antonini , Univ. de Nice-Sophia Antipolis, Valbonne, France
P. Gauthier , Univ. de Nice-Sophia Antipolis, Valbonne, France
pp. 590-593vol.5
W.J. Zeng , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
Y.F. Huang , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
S.C. Huang , Univ. de Nice-Sophia Antipolis, Valbonne, France
pp. 594-597vol.5
F. Kossentini , Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith , Georgia Inst. of Technol., Atlanta, GA, USA
C.F. Barnes , Georgia Inst. of Technol., Atlanta, GA, USA
pp. 598-601vol.5
D.F. Lyons , Mitre Corp., McLean, VA, USA
D.L. Neuhoff , Georgia Inst. of Technol., Atlanta, GA, USA
D. Hui , Georgia Inst. of Technol., Atlanta, GA, USA
pp. 602-605vol.5
C. Lo , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 606-608vol.5
W. Li , EECS Dept., Lehigh Univ., Bethlehem, PA, USA
Y.-Q. Zhang , Georgia Inst. of Technol., Atlanta, GA, USA
pp. 609-612vol.5
T. Naveen , ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
J.W. Woods , ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 613-616vol.5
D. Chiang , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
L.C. Potter , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 617-620vol.5
N. Balram , IBM Corp., Boca Raton, FL, USA
J.M.F. Moura , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 621-624vol.5
G.H. Wakefield , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
B.J. Feng , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
K.R. Raghavan , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
M.A. Blommer , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 626-629vol.5
J.F. Abbott , SIR Int., Menlo Park, CA, USA
pp. 630-633vol.5
H.H. Bothe , Dept. of Electron. Tech. Univ. of Berlin, Germany
F. Rieger , Dept. of Electron. Tech. Univ. of Berlin, Germany
pp. 634-637vol.5
C. Banga , Groupe Image, Inst. Nat. des Telecommun., Villeneuve d'Ascq, France
F. Ghorbel , Groupe Image, Inst. Nat. des Telecommun., Villeneuve d'Ascq, France
pp. 638-641vol.5
A.O. Asadi , NYNEX Sci. & Technol., Inc., White Plains, NY, USA
H.C. Leung , NYNEX Sci. & Technol., Inc., White Plains, NY, USA
pp. 642-645vol.5
M.K. Asi , The Higher Inst. for Appl. Sci. & Technol., Damascus, Syria
M. Mrayati , The Higher Inst. for Appl. Sci. & Technol., Damascus, Syria
pp. 646-649vol.5
M.S. Tawfik , ANACAD Comput. Syst., Meylan, France
A. Wittmann , ANACAD Comput. Syst., Meylan, France
P. Senn , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 650-653vol.5
D.T.M. Slock , Inst. EURECOM, Valbonne, France
pp. 654-657vol.5
S.G. Bakamidis , Dept. of Electr. Eng., Nat. Tech. Univ. of Athens, Greece
pp. 658-661vol.5
Z. Berman , Electr. Eng. Dept., Maryland Univ., College Park, MD, USA
J.S. Baras , Electr. Eng. Dept., Maryland Univ., College Park, MD, USA
pp. 662-665vol.5
N. Takai , Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci. Technol. & Med., London, UK
A. Manikas , Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci. Technol. & Med., London, UK
pp. 666-669vol.5
A. Souloumiac , Thomson-CSF/RGS/STS, Gennevilliers, France
P. Chevalier , Thomson-CSF/RGS/STS, Gennevilliers, France
C. Demeure , Thomson-CSF/RGS/STS, Gennevilliers, France
pp. 670-673vol.5
F. Bosveld , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
R.L. Lagendijk , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biemond , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 674-677vol.5
N. Niki , Tokushima Univ., Minami-josanjima-cho, Japan
T. Hayashida , Tokushima Univ., Minami-josanjima-cho, Japan
F. Masakiyo , Tokushima Univ., Minami-josanjima-cho, Japan
H. Nishitani , Tokushima Univ., Minami-josanjima-cho, Japan
I. Tamura , Univ. de Nice-Sophia Antipolis, Valbonne, France
pp. 678-681vol.5
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