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Acoustics, Speech, and Signal Processing, 1993. ICASSP-93 Vol 4., 1993 IEEE International Conference on
Minneapolis, MN, USA
April 27-April 30
ISBN: 0-7803-0946-4
Table of Contents
J.A. Fessler, Michigan Univ., Lansing, MI, USA
A.O. Hero, Michigan Univ., Lansing, MI, USA
pp. 1-4
A.M. Zoubir, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 5-8
W. Du, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
R.L. Kirlin, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 13-16
L.P. Heck, SRI International, Menlo Park, CA, USA
J.H. McClellan, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 17-20
B.C. Ng, Defence Sci. Organization, Singapore
A. Nehorai, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 21-24
B. Hochwald, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
A. Nehorai, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 25-28
P. Stoica, Syst. & Control Group, Uppsala Univ., Sweden
A. Eriksson, Syst. & Control Group, Uppsala Univ., Sweden
T. Soderstrom, Syst. & Control Group, Uppsala Univ., Sweden
pp. 33-36
K.J.R. Liu, Maryland Univ., College Park, MD, USA
D.P. O'Leary, Maryland Univ., College Park, MD, USA
G.W. Stewart, Maryland Univ., College Park, MD, USA
Y.-J.J. Wu, Maryland Univ., College Park, MD, USA
pp. 37-40
S. Bose, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
A.O. Steinhardt, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 41-44
D.P. Michal, Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
D.R. Fuhrmann, Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 45-48
M. Ketel, Polytech. Univ., Brooklyn, NY, USA
L. Kurz, Polytech. Univ., Brooklyn, NY, USA
pp. 49-52
P.M. Djuric, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 53-56
C.-M. Cho, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
P.M. Djuric, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 57-60
R.S. Blum, Electr. Eng. & Comput. Sci. Dept., Lehigh Univ., Bethlehem, PA, USA
pp. 77-80
Y. Li, Dept. of Electr. Eng., Auburn Univ., AL, USA
Z. Ding, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 81-84
M.K. Tsatsanis, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
G.B. Giannakis, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 85-88
L.M. Kaplan, Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
C.-C.J. Kuo, Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
pp. 89-92
A. Swami, Unocal Corp., Los Angeles, CA, USA
pp. 97-100
G. Frazer, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
B. Boashash, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 101-104
L. Cohen, Rutgers Univ., Piscataway, NJ, USA
pp. 105-108
D.L. Jones, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
R.G. Bariniuk, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 109-112
H. Alnajjar, Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
D.M. Wilkes, Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
pp. 113-116
M.D. Zoltowski, Sch. of Electr. Eng., Purdue Univ., West Layafette, IN, USA
C.P. Mathews, Sch. of Electr. Eng., Purdue Univ., West Layafette, IN, USA
pp. 117-120
M. Ali, Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
J. Gotze, Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
R. Pauli, Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
pp. 121-124
P. Larzabal, URA CNRS, Ecole Normale Superieure, Cachan, France
H. Clergeot, URA CNRS, Ecole Normale Superieure, Cachan, France
pp. 125-128
L.C. Godara, Dept. of Electr. Eng., New South Wales Univ., Canberra, ACT, Australia
P.M. Schultheiss, URA CNRS, Ecole Normale Superieure, Cachan, France
pp. 129-132
J.-F. Giovannelli, Lab. des Signaux et Syst., Gif-sur-Yvette, France
G. Demoment, Lab. des Signaux et Syst., Gif-sur-Yvette, France
pp. 137-140
J.M.B. Dias, Dept. de Eng. Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
J.M.N. Leitao, Dept. de Eng. Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
pp. 149-152
B. Suard, Lab. of Inf. & Decision Syst., MIT, Cambridge, MA, USA
A.F. Naguib, Dept. de Eng. Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
G. Xu, Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
A. Paulraj, Maryland Univ., College Park, MD, USA
pp. 153-156
K. Giridhar, Dept. of Electr. & Comput. Eng;, California Univ., Santa Barbara, CA, USA
S. Chari, Dept. de Eng. Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
J.J. Shynk, Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
R.P. Gooch, Maryland Univ., College Park, MD, USA
pp. 160-163
L.B. White, Commun. Div., Electron. Res. Lab., Salisbury, SA, Australia
J.D. Ross, Commun. Div., Electron. Res. Lab., Salisbury, SA, Australia
pp. 164-167
S.R. Kim, Signal/Image Res. Lab., Illinois Univ., Chicago, IL, USA
A. Efron, Signal/Image Res. Lab., Illinois Univ., Chicago, IL, USA
pp. 172-175
J.J. Nicolas, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 176-179
Q. Zhu, Dept. of Electr., & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
M. Kam, Dept. of Electr., & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
R. Yeager, Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
pp. 184-187
W.-T. Chen, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
C.-Y. Chi, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 192-195
G.B. Giannakis, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
S. Shamsunder, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 196-199
Y. Zhang, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
D. Hatzinakos, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
A.N. Venetsanopoulos, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 200-203
B.M. Sadler, Army Res. Lab., Adelphi, MD, USA
G.B. Giannakis, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 204-207
L.M. Garth, Techno-Sciences, Inc., Urbana, IL, USA
Y. Bresler, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 208-211
P. Bondon, Lab. des Signaux et Syst., Univ., Paris-Sud, Gif-sur-Yvette, France
P.L. Combettes, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
B. Picinbono, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 212-215
R. Kakarala, Dept. of Electr. & Electron. Eng., Auckland Univ., New Zealand
B.M. Bennett, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
G.J. Iverson, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
M. D'Zmura, Maryland Univ., College Park, MD, USA
pp. 216-219
H.M. Stellakis, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
E.S. Manolakos, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 220-223
R. Kumaresan, Dept. of Electr. Eng., Univ. of Rhode Island, Kingston, RI, USA
C.S. Ramalingam, Dept. of Electr. Eng., Univ. of Rhode Island, Kingston, RI, USA
pp. 224-227
J. Jachner, Atlantic Aerospace Electronics Corp., Waltham, MA, USA
H. Lee, Atlantic Aerospace Electronics Corp., Waltham, MA, USA
pp. 228-231
S. Kay, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
V. Nagesha, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 232-235
D.W. Tufts, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
A.A. Shah, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 236-239
V. Nagesha, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
S. Kay, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 240-243
K. Nishikawa, Nippon Steel Co., Kanagawa, Japan
K. Miyazaki, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
H. Kiya, Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 244-247
C. Berenguer, Lab. d'Inf. Signaux & Syst., Nice Univ., France
C. Theys, Lab. d'Inf. Signaux & Syst., Nice Univ., France
A. Ferrari, Lab. d'Inf. Signaux & Syst., Nice Univ., France
G. Alengrin, Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 248-251
H. Ge, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
D.W. Tufts, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 252-255
T.H. Li, Dept. of Math., Maryland, Univ. College Park, MD, USA
B. Kedem, Dept. of Math., Maryland, Univ. College Park, MD, USA
pp. 256-259
P.J. Sherman, Iowa State Univ., Ames, IA, USA
L.B. White, Dept. of Math., Maryland, Univ. College Park, MD, USA
R.R. Bitmead, Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 260-263
S. Prakriya, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
D. Hatzinakos, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 264-267
J.R. Fonollosa, Signal & Image Process, Inst., Univ. of Southern California, Los Angeles, CA, USA
J.A.R. Fonollosa, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 268-271
L. Tong, Dept. of Electr. Comput. Eng., West Virgina Univ. Morgantown, VA, USA
G. Xu, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
T. Kailaith, Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 272-275
S. Shamsunder, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 280-283
L. Castedo, DSSR, ETSI Telecommun., Ciudad Univ., Madrid, Spain
C.-Y. Tseng, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
L.J. Griffiths, Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 284-287
K.D. Mauck, MITRE Corp., Bedford, MA, USA
pp. 288-291
S.V. Schell, Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
W.A. Gardner, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 292-295
Y.-H. Chen, Inst. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Y.-S. Lin, Inst. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
pp. 296-299
A. Marsal, Lab. des Signaux et Syst., CNRS-ESE, Gif-sur-Yvette, France
S. Marcos, Lab. des Signaux et Syst., CNRS-ESE, Gif-sur-Yvette, France
pp. 304-307
S. Marcos, Dept. of Math. & Stat., Maryland Univ., Baltimore, MD, USA
J.T.-H. Lo, Dept. of Math. & Stat., Maryland Univ., Baltimore, MD, USA
pp. 308-311
Y. Yardimci, Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
J.A. Cadzow, Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
pp. 312-315
S. Talwar, Stanford Univ., CA, USA
A. Paulraj, Stanford Univ., CA, USA
G.H. Golub, Stanford Univ., CA, USA
pp. 316-319
J. Li, Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
pp. 320-323
A. Swindlehurst, Dept. of Electr. Comput Eng., Brigham Young Univ., Provo, UT, USA
M. Viberg, Stanford Univ., CA, USA
pp. 324-327
W. Xu, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M. Kaveh, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 328-331
R. Hamza, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K. Buckley, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 332-335
M. Najar, TSC Dept., ETSI. de Telecommun., Barcelona, Spain
M.A. Lagunas, TSC Dept., ETSI. de Telecommun., Barcelona, Spain
A.I. Perez-Neira, TSC Dept., ETSI. de Telecommun., Barcelona, Spain
pp. 336-339
M.A. Koerber, Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
D.R. Fuhrmann, Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 340-343
E.J. Baranoski, MIT Lincoln Lab., Lexington, MA, USA
A. Steinhardt, Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 344-347
R. DeLap, Dept. of EENG, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
A. Hero, Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 348-351
K.V.S. Hari, Dept. of ECE, Indian Inst. of Sci., Bangalore, India
U. Gummadavelli, Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 352-354
D. Maiwald, Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
D.V. Sidorovitch, Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
J.F. Bohme, Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 356-359
A. Nehorai, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
E. Paldi, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 360-363
G.H. Niezgoda, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
J.L. Krolik, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 364-367
R.J. Vaccaro, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
Y. Ding, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 368-371
M. Viberg, Inf. Syst. Lab., Stanford Univ., CA, USA
A.L. Swindlehurst, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 372-375
F. Li, Dept. of Electr. Eng., Portland State Univ., OR, USA
Y. Lu, Dept. of Electr. Eng., Portland State Univ., OR, USA
pp. 376-379
W.M. Steedly, Analytic Sciences Corp., Reston, VA, USA
C.-H.J. Ying, Telecom Paris, France
R.L. Moses, Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 388-391
T.G. Xydis, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 396-399
G.S. Cuningham, Los Alamos Nat. Lab., NM, USA
W.J. Williams, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 400-403
R.N. Czerwinski, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
D.L. Jones, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 404-407
B. Boashash, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
B. Ristich, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 408-411
P.W. Wu, Centre for Commun. & Digital Signal Process., Northeastern Univ., Boston, MA, USA
H. Lev-Ari, Centre for Commun. & Digital Signal Process., Northeastern Univ., Boston, MA, USA
pp. 416-419
M.D. Ladd, Appl. Res. Lab., Texas Univ., Austin, TX, USA
G.R. Wilson, Appl. Res. Lab., Texas Univ., Austin, TX, USA
pp. 420-423
S. Peleg, Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
B. Friedlander, Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
pp. 424-427
K.S. Riedel, Courant Inst. of Math. Sci., New York, NY, USA
A. Sidorenko, Courant Inst. of Math. Sci., New York, NY, USA
pp. 432-435
J.W. Pitton, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
P.J. Loughlin, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
L.E. Atlas, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 436-439
M. Krob, Lab. des Signaux et Syst., CNRS-ESE, Gif-sur-Yvette, France
M. Benidir, Lab. des Signaux et Syst., CNRS-ESE, Gif-sur-Yvette, France
pp. 440-443
Y. Chen, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
C.L. Nikias, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 444-447
M.I. Gurelli, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
C.L. Nikias, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 448-451
Y. Ye, Dept. of Electr. Eng., Auburn Univ., AL, USA
J.K. Tugnait, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 452-455
R.D. Nowak, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
B.D. Van Veen, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 456-459
A. Sano, Dept. of Electr. Eng., Keio Univ., Kohoku-ku, Yokohama, Japan
H. Tsuji, Dept. of Electr. Eng., Keio Univ., Kohoku-ku, Yokohama, Japan
pp. 460-463
E.A. Heredia, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
G.R. Arce, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 464-467
M. Nayeri, Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
M.S. Liu, Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
J.R. Deller, Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 472-475
W. Lui, Dept. of Electr. Eng., New Brunswick Univ., Fredericton, NB, Canada
R. Doraiswami, Dept. of Electr. Eng., New Brunswick Univ., Fredericton, NB, Canada
pp. 476-479
Y.K. Lee, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
D.H. Johnson, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 480-483
S. Im, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
S.B. Kim, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
E.J. Powers, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 484-487
R. Fulchiero, Active Noise & Vibration Technologies, Phoenix, AZ, USA
A.S. Spanias, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 488-491
J. Wilbur, US Navel Surface Warfare Centre, Panama City, FL, USA
S.G. Kargl, US Navel Surface Warfare Centre, Panama City, FL, USA
pp. 492-495
C.S. Detka, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
A. El-Jaroudi, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
L.F. Chaparro, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 496-499
T.S. Durrani, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
A.R. Leyman, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
J.J. Soraghan, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 500-503
S. Mo, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
B. Shafai, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 508-511
C.-H. Tseng, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
E.J. Powers, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 512-515
V. Zivojnovic, Inst. for Integrated Syst. in Signal Process., Aachen Univ. of Technol., Germany
pp. 516-519
S.F. Yau, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci & Technol., Kowloon, Hong Kong
pp. 524-527
F. Qian, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
B.D. Van Veen, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 528-531
A. Satish, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
R.L. Kashyap, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
pp. 532-535
C.-Y. Tseng, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
L.J. Griffiths, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 536-539
D.D. Feldman, Univ. of Southern California, Los Angeles, CA, USA
L.J. Griffiths, Univ. of Southern California, Los Angeles, CA, USA
pp. 540-543
A.J. Weiss, Electr. Eng. Dept., Tel-Aviv Univ., Israel
B. Friedlander, Univ. of Southern California, Los Angeles, CA, USA
pp. 544-547
D.A. Linebarger, Prog. in Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
R.D. DeGroat, Prog. in Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
E.M. Dowling, Prog. in Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
P. Stoica, Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 548-551
B. Friedlander, Dept. Electr. & Comput. Eng., California Univ., Davis, CA, USA
A.J. Weiss, Prog. in Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
pp. 552-555
A. Eriksson, Syst. & Control Group, Uppsala Univ., Sweden
P. Stoica, Syst. & Control Group, Uppsala Univ., Sweden
T. Soderstrom, Syst. & Control Group, Uppsala Univ., Sweden
pp. 556-559
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