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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1993)
Minneapolis, MN, USA
Apr. 27, 1993 to Apr. 30, 1993
ISBN: 0-7803-0946-4
TABLE OF CONTENTS
J.A. Fessler , Michigan Univ., Lansing, MI, USA
A.O. Hero , Michigan Univ., Lansing, MI, USA
pp. 1-4
A.M. Zoubir , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 5-8
I. Ziskind , Rafael, Haifa, Israel
D. Hertz , Rafael, Haifa, Israel
pp. 9-12
W. Du , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
R.L. Kirlin , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 13-16
L.P. Heck , SRI International, Menlo Park, CA, USA
J.H. McClellan , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 17-20
B.C. Ng , Defence Sci. Organization, Singapore
A. Nehorai , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 21-24
B. Hochwald , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
A. Nehorai , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 25-28
P. Strobach , Siemens AG, Munchen, Germany
D. Goryn , Siemens AG, Munchen, Germany
pp. 29-32
P. Stoica , Syst. & Control Group, Uppsala Univ., Sweden
A. Eriksson , Syst. & Control Group, Uppsala Univ., Sweden
T. Soderstrom , Syst. & Control Group, Uppsala Univ., Sweden
pp. 33-36
K.J.R. Liu , Maryland Univ., College Park, MD, USA
D.P. O'Leary , Maryland Univ., College Park, MD, USA
G.W. Stewart , Maryland Univ., College Park, MD, USA
Y.-J.J. Wu , Maryland Univ., College Park, MD, USA
pp. 37-40
S. Bose , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
A.O. Steinhardt , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 41-44
D.P. Michal , Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
D.R. Fuhrmann , Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 45-48
M. Ketel , Polytech. Univ., Brooklyn, NY, USA
L. Kurz , Polytech. Univ., Brooklyn, NY, USA
pp. 49-52
P.M. Djuric , Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 53-56
C.-M. Cho , Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
P.M. Djuric , Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 57-60
B. Champagne , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 61-64
F. Baldit , IRISA/CNRS, Rennes, France
J.-P. Le Cadre , IRISA/CNRS, Rennes, France
pp. 69-72
R.S. Blum , Electr. Eng. & Comput. Sci. Dept., Lehigh Univ., Bethlehem, PA, USA
pp. 77-80
Y. Li , Dept. of Electr. Eng., Auburn Univ., AL, USA
Z. Ding , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 81-84
M.K. Tsatsanis , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
G.B. Giannakis , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 85-88
L.M. Kaplan , Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
C.-C.J. Kuo , Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
pp. 89-92
V.V. Digalakis , SRI International, Menlo Park, CA, USA
K.C. Chou , SRI International, Menlo Park, CA, USA
pp. 93-96
A. Swami , Unocal Corp., Los Angeles, CA, USA
pp. 97-100
G. Frazer , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
B. Boashash , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 101-104
L. Cohen , Rutgers Univ., Piscataway, NJ, USA
pp. 105-108
D.L. Jones , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
R.G. Bariniuk , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 109-112
H. Alnajjar , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
D.M. Wilkes , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
pp. 113-116
M.D. Zoltowski , Sch. of Electr. Eng., Purdue Univ., West Layafette, IN, USA
C.P. Mathews , Sch. of Electr. Eng., Purdue Univ., West Layafette, IN, USA
pp. 117-120
M. Ali , Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
J. Gotze , Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
R. Pauli , Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
pp. 121-124
P. Larzabal , URA CNRS, Ecole Normale Superieure, Cachan, France
H. Clergeot , URA CNRS, Ecole Normale Superieure, Cachan, France
pp. 125-128
L.C. Godara , Dept. of Electr. Eng., New South Wales Univ., Canberra, ACT, Australia
P.M. Schultheiss , URA CNRS, Ecole Normale Superieure, Cachan, France
pp. 129-132
J.T. Reinking , Kansas Univ., Lawrence, KS, USA
G.E. Prescott , Kansas Univ., Lawrence, KS, USA
pp. 133-136
J.-F. Giovannelli , Lab. des Signaux et Syst., Gif-sur-Yvette, France
G. Demoment , Lab. des Signaux et Syst., Gif-sur-Yvette, France
pp. 137-140
J.J.K. Rooney , Dept. of Eng., Cambridge Univ., UK
W.J. Fitzgerald , Dept. of Eng., Cambridge Univ., UK
pp. 141-144
B. Yang , Dept. of Electr. Eng., Ruhr Univ., Bochum, Germany
pp. 145-148
J.M.B. Dias , Dept. de Eng. Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
J.M.N. Leitao , Dept. de Eng. Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
pp. 149-152
B. Suard , Lab. of Inf. & Decision Syst., MIT, Cambridge, MA, USA
A.F. Naguib , Dept. de Eng. Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
G. Xu , Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
A. Paulraj , Maryland Univ., College Park, MD, USA
pp. 153-156
J.W. Lechleider , Lab. of Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 157-159
K. Giridhar , Dept. of Electr. & Comput. Eng;, California Univ., Santa Barbara, CA, USA
S. Chari , Dept. de Eng. Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
J.J. Shynk , Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
R.P. Gooch , Maryland Univ., College Park, MD, USA
pp. 160-163
L.B. White , Commun. Div., Electron. Res. Lab., Salisbury, SA, Australia
J.D. Ross , Commun. Div., Electron. Res. Lab., Salisbury, SA, Australia
pp. 164-167
S.P. Belanger , IBM Federal Systems Co., Owego, NY, USA
pp. 168-171
S.R. Kim , Signal/Image Res. Lab., Illinois Univ., Chicago, IL, USA
A. Efron , Signal/Image Res. Lab., Illinois Univ., Chicago, IL, USA
pp. 172-175
J.J. Nicolas , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 176-179
T.-C. Liu , Toshiba Comm. Syst. & Technol. Lab., Tokyo, Japan
pp. 180-183
Q. Zhu , Dept. of Electr., & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
M. Kam , Dept. of Electr., & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
R. Yeager , Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
pp. 184-187
A.T. Erdem , Eastman Kodak Co., Rochester, NY, USA
pp. 188-191
W.-T. Chen , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
C.-Y. Chi , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 192-195
G.B. Giannakis , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
S. Shamsunder , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 196-199
Y. Zhang , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
D. Hatzinakos , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
A.N. Venetsanopoulos , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 200-203
B.M. Sadler , Army Res. Lab., Adelphi, MD, USA
G.B. Giannakis , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 204-207
L.M. Garth , Techno-Sciences, Inc., Urbana, IL, USA
Y. Bresler , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 208-211
P. Bondon , Lab. des Signaux et Syst., Univ., Paris-Sud, Gif-sur-Yvette, France
P.L. Combettes , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
B. Picinbono , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 212-215
R. Kakarala , Dept. of Electr. & Electron. Eng., Auckland Univ., New Zealand
B.M. Bennett , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
G.J. Iverson , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
M. D'Zmura , Maryland Univ., College Park, MD, USA
pp. 216-219
H.M. Stellakis , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
E.S. Manolakos , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 220-223
R. Kumaresan , Dept. of Electr. Eng., Univ. of Rhode Island, Kingston, RI, USA
C.S. Ramalingam , Dept. of Electr. Eng., Univ. of Rhode Island, Kingston, RI, USA
pp. 224-227
J. Jachner , Atlantic Aerospace Electronics Corp., Waltham, MA, USA
H. Lee , Atlantic Aerospace Electronics Corp., Waltham, MA, USA
pp. 228-231
S. Kay , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
V. Nagesha , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 232-235
D.W. Tufts , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
A.A. Shah , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 236-239
V. Nagesha , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
S. Kay , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 240-243
K. Nishikawa , Nippon Steel Co., Kanagawa, Japan
K. Miyazaki , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
H. Kiya , Dept. of Electr. & Comput. Eng., Toronto Univ., Toronto, Ont., Canada
pp. 244-247
C. Berenguer , Lab. d'Inf. Signaux & Syst., Nice Univ., France
C. Theys , Lab. d'Inf. Signaux & Syst., Nice Univ., France
A. Ferrari , Lab. d'Inf. Signaux & Syst., Nice Univ., France
G. Alengrin , Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 248-251
H. Ge , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
D.W. Tufts , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 252-255
T.H. Li , Dept. of Math., Maryland, Univ. College Park, MD, USA
B. Kedem , Dept. of Math., Maryland, Univ. College Park, MD, USA
pp. 256-259
P.J. Sherman , Iowa State Univ., Ames, IA, USA
L.B. White , Dept. of Math., Maryland, Univ. College Park, MD, USA
R.R. Bitmead , Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 260-263
S. Prakriya , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
D. Hatzinakos , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 264-267
J.R. Fonollosa , Signal & Image Process, Inst., Univ. of Southern California, Los Angeles, CA, USA
J.A.R. Fonollosa , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 268-271
L. Tong , Dept. of Electr. Comput. Eng., West Virgina Univ. Morgantown, VA, USA
G. Xu , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
T. Kailaith , Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 272-275
S. Shamsunder , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 280-283
L. Castedo , DSSR, ETSI Telecommun., Ciudad Univ., Madrid, Spain
C.-Y. Tseng , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
L.J. Griffiths , Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 284-287
K.D. Mauck , MITRE Corp., Bedford, MA, USA
pp. 288-291
S.V. Schell , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
W.A. Gardner , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 292-295
Y.-H. Chen , Inst. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Y.-S. Lin , Inst. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
pp. 296-299
J.J. Fuchs , IRISA, Rennes I Univ., France
pp. 300-303
A. Marsal , Lab. des Signaux et Syst., CNRS-ESE, Gif-sur-Yvette, France
S. Marcos , Lab. des Signaux et Syst., CNRS-ESE, Gif-sur-Yvette, France
pp. 304-307
S. Marcos , Dept. of Math. & Stat., Maryland Univ., Baltimore, MD, USA
J.T.-H. Lo , Dept. of Math. & Stat., Maryland Univ., Baltimore, MD, USA
pp. 308-311
Y. Yardimci , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
J.A. Cadzow , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
pp. 312-315
S. Talwar , Stanford Univ., CA, USA
A. Paulraj , Stanford Univ., CA, USA
G.H. Golub , Stanford Univ., CA, USA
pp. 316-319
J. Li , Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
pp. 320-323
A. Swindlehurst , Dept. of Electr. Comput Eng., Brigham Young Univ., Provo, UT, USA
M. Viberg , Stanford Univ., CA, USA
pp. 324-327
W. Xu , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M. Kaveh , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 328-331
R. Hamza , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K. Buckley , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 332-335
M. Najar , TSC Dept., ETSI. de Telecommun., Barcelona, Spain
M.A. Lagunas , TSC Dept., ETSI. de Telecommun., Barcelona, Spain
A.I. Perez-Neira , TSC Dept., ETSI. de Telecommun., Barcelona, Spain
pp. 336-339
M.A. Koerber , Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
D.R. Fuhrmann , Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 340-343
E.J. Baranoski , MIT Lincoln Lab., Lexington, MA, USA
A. Steinhardt , Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 344-347
R. DeLap , Dept. of EENG, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
A. Hero , Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 348-351
K.V.S. Hari , Dept. of ECE, Indian Inst. of Sci., Bangalore, India
U. Gummadavelli , Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 352-354
D. Maiwald , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
D.V. Sidorovitch , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
J.F. Bohme , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 356-359
A. Nehorai , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
E. Paldi , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 360-363
G.H. Niezgoda , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
J.L. Krolik , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 364-367
R.J. Vaccaro , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
Y. Ding , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 368-371
M. Viberg , Inf. Syst. Lab., Stanford Univ., CA, USA
A.L. Swindlehurst , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 372-375
F. Li , Dept. of Electr. Eng., Portland State Univ., OR, USA
Y. Lu , Dept. of Electr. Eng., Portland State Univ., OR, USA
pp. 376-379
J.-F. Cardoso , Telecom Paris, France
E. Moulines , Telecom Paris, France
pp. 384-387
W.M. Steedly , Analytic Sciences Corp., Reston, VA, USA
C.-H.J. Ying , Telecom Paris, France
R.L. Moses , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 388-391
R.D. Fierro , California Univ., Los Angeles, CA, USA
K. Yao , California Univ., Los Angeles, CA, USA
pp. 392-395
T.G. Xydis , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 396-399
G.S. Cuningham , Los Alamos Nat. Lab., NM, USA
W.J. Williams , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 400-403
R.N. Czerwinski , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
D.L. Jones , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 404-407
B. Boashash , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
B. Ristich , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 408-411
P.W. Wu , Centre for Commun. & Digital Signal Process., Northeastern Univ., Boston, MA, USA
H. Lev-Ari , Centre for Commun. & Digital Signal Process., Northeastern Univ., Boston, MA, USA
pp. 416-419
M.D. Ladd , Appl. Res. Lab., Texas Univ., Austin, TX, USA
G.R. Wilson , Appl. Res. Lab., Texas Univ., Austin, TX, USA
pp. 420-423
S. Peleg , Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
B. Friedlander , Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
pp. 424-427
W. Kozek , TU, INTHFT, Vienna, Austria
pp. 428-431
K.S. Riedel , Courant Inst. of Math. Sci., New York, NY, USA
A. Sidorenko , Courant Inst. of Math. Sci., New York, NY, USA
pp. 432-435
J.W. Pitton , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
P.J. Loughlin , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
L.E. Atlas , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 436-439
M. Krob , Lab. des Signaux et Syst., CNRS-ESE, Gif-sur-Yvette, France
M. Benidir , Lab. des Signaux et Syst., CNRS-ESE, Gif-sur-Yvette, France
pp. 440-443
Y. Chen , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
C.L. Nikias , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 444-447
M.I. Gurelli , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
C.L. Nikias , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 448-451
Y. Ye , Dept. of Electr. Eng., Auburn Univ., AL, USA
J.K. Tugnait , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 452-455
R.D. Nowak , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
B.D. Van Veen , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 456-459
A. Sano , Dept. of Electr. Eng., Keio Univ., Kohoku-ku, Yokohama, Japan
H. Tsuji , Dept. of Electr. Eng., Keio Univ., Kohoku-ku, Yokohama, Japan
pp. 460-463
E.A. Heredia , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
G.R. Arce , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 464-467
C.E. Davila , Electr. Eng. Dept., Southern Methodist Univ., Dallas, TX, USA
pp. 468-471
M. Nayeri , Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
M.S. Liu , Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
J.R. Deller , Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 472-475
W. Lui , Dept. of Electr. Eng., New Brunswick Univ., Fredericton, NB, Canada
R. Doraiswami , Dept. of Electr. Eng., New Brunswick Univ., Fredericton, NB, Canada
pp. 476-479
Y.K. Lee , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
D.H. Johnson , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 480-483
S. Im , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
S.B. Kim , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
E.J. Powers , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 484-487
R. Fulchiero , Active Noise & Vibration Technologies, Phoenix, AZ, USA
A.S. Spanias , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 488-491
J. Wilbur , US Navel Surface Warfare Centre, Panama City, FL, USA
S.G. Kargl , US Navel Surface Warfare Centre, Panama City, FL, USA
pp. 492-495
C.S. Detka , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
A. El-Jaroudi , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
L.F. Chaparro , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 496-499
T.S. Durrani , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
A.R. Leyman , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
J.J. Soraghan , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 500-503
A.V. Dandawate , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 504-507
S. Mo , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
B. Shafai , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 508-511
C.-H. Tseng , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
E.J. Powers , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 512-515
V. Zivojnovic , Inst. for Integrated Syst. in Signal Process., Aachen Univ. of Technol., Germany
pp. 516-519
J.S. Goldstein , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 520-523
S.F. Yau , Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci & Technol., Kowloon, Hong Kong
pp. 524-527
F. Qian , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
B.D. Van Veen , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 528-531
A. Satish , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
R.L. Kashyap , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
pp. 532-535
C.-Y. Tseng , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
L.J. Griffiths , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 536-539
D.D. Feldman , Univ. of Southern California, Los Angeles, CA, USA
L.J. Griffiths , Univ. of Southern California, Los Angeles, CA, USA
pp. 540-543
A.J. Weiss , Electr. Eng. Dept., Tel-Aviv Univ., Israel
B. Friedlander , Univ. of Southern California, Los Angeles, CA, USA
pp. 544-547
D.A. Linebarger , Prog. in Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
R.D. DeGroat , Prog. in Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
E.M. Dowling , Prog. in Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
P. Stoica , Lab. d'Inf. Signaux & Syst., Nice Univ., France
pp. 548-551
B. Friedlander , Dept. Electr. & Comput. Eng., California Univ., Davis, CA, USA
A.J. Weiss , Prog. in Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
pp. 552-555
A. Eriksson , Syst. & Control Group, Uppsala Univ., Sweden
P. Stoica , Syst. & Control Group, Uppsala Univ., Sweden
T. Soderstrom , Syst. & Control Group, Uppsala Univ., Sweden
pp. 556-559
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