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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1993)
Minneapolis, MN, USA
Apr. 27, 1993 to Apr. 30, 1993
ISBN: 0-7803-0946-4
TABLE OF CONTENTS
A. Schlereth , Univ., Erlangen-Nurnberg, Erlangen, Germany
pp. 5-8
D. Pal , AT&T Bell Labs., Holmdel, NJ, USA
pp. 9-12
I. Brodetsky , Electr. Comput. & Syst. Eng. Dept., Rensselaer Polytech. Inst., Troy, NY, USA
M. Savic , Electr. Comput. & Syst. Eng. Dept., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 17-20
M. Kahrs , Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
C. Zimmer , Electr. Comput. & Syst. Eng. Dept., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 21-24
Y.-C. Lai , Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
Y.-C. Lai , Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
pp. 25-28
A.G. Dabak , Dept. Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
D.H. Johnson , Dept. Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 33-36
B.F. Rice , Lockheed Missiles & Space Co. Inc., Sunnyvale, CA, USA
M.E. Wilhoyte , Lockheed Missiles & Space Co. Inc., Sunnyvale, CA, USA
pp. 37-40
J. Picone , Texas Instruments, Tsukuba, Ibaraki, Japan
pp. 41-44
D. Desmet , EDC-Mentor Graphics Corp, Leuven, Belgium
D. Genin , EDC-Mentor Graphics Corp, Leuven, Belgium
pp. 45-48
Z. Wang , Dept. of Comput. Sci. & Electr. Eng. Vermont Univ., Burlington, VT, USA
G. Mirchandani , Dept. of Comput. Sci. & Electr. Eng. Vermont Univ., Burlington, VT, USA
G. Mirchandani , Dept. of Comput. Sci. & Electr. Eng. Vermont Univ., Burlington, VT, USA
pp. 49-52
J. Kim , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
W.G. Bliss , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 53-56
M. Lang , Univ. of Erlangen, Germany
J. Bamberger , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 57-60
W.-S. Lu , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
Y. Cui , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
R.L. Kirlin , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 61-64
M. Barret , Supelec, Metz, France
M. Benidir , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 65-68
R. Majidi-Ahy , Varian Research Center, Palo Alto, CA, USA
H. Hill , Varian Research Center, Palo Alto, CA, USA
G. Zdasiuk , Varian Research Center, Palo Alto, CA, USA
A. Zander , Varian Research Center, Palo Alto, CA, USA
S. Bandy , Varian Research Center, Palo Alto, CA, USA
pp. 69-72
K.J.R. Liu , Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
C.T. Chiu , Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
R.K. Kolagotla , Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
J.F. JaJa , Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
pp. 73-76
T.I. Laakso , NOKIA Research Center, Espoo, Finland
T.Q. Nguyen , Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
R.D. Koilpillai , Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
pp. 77-80
D. Burnside , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
T.W. Parks , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 81-84
R.L. Reng , Univ., Erlangen-Nuernberg, Erlangen, Germany
K. Schwarz , Univ., Erlangen-Nuernberg, Erlangen, Germany
H.W. Schuessler , Univ., Erlangen-Nuernberg, Erlangen, Germany
pp. 85-88
W.K. Jenkins , Dept. of Electr. & Comput. Eng., The Coordinated Sci. Lab., Urbana, IL, USA
A.J. Mansen , Dept. of Electr. & Comput. Eng., The Coordinated Sci. Lab., Urbana, IL, USA
pp. 89-92
R. Suoranta , Tech. Res. Centre of Finland, Tampere, Finland
K.-P. Estola , Dept. of Electr. & Comput. Eng., The Coordinated Sci. Lab., Urbana, IL, USA
pp. 93-96
W.-P. Zhu , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.O. Ahmad , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.N.S. Swamy , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
pp. 97-100
T. Ciloglu , Electr. & Electron. Eng. Dept., Middle East Tech. Univ., Ankara, Turkey
Z. Unver , Electr. & Electron. Eng. Dept., Middle East Tech. Univ., Ankara, Turkey
pp. 101-104
E. Angelidis , Tech. Univ. of Athens, Greece
J.E. Diamessis , Tech. Univ. of Athens, Greece
pp. 105-108
T. Oliveira e Silva , Dept. de Electronica, Aveiro Univ., Portugal
pp. 109-112
C.-M. Wu , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M. Vishwanath , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
R.M. Owens , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M.J. Irwin , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 113-116
H.C. Papadopoulos , MIT, Cambridge, MA, USA
G.W. Wornell , MIT, Cambridge, MA, USA
pp. 117-120
F.M. Aparicio Acosta , Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 121-124
D.F. Drake , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
D.B. Williams , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 125-128
J.M. Vesin , Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 129-132
G.C. Freeland , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
T.S. Durrani , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 133-136
K.M. Cuomo , MIT, Cambridge, MA, USA
A.V. Oppenheim , MIT, Cambridge, MA, USA
pp. 137-140
M.D. Richard , MIT, Cambridge, MA, USA
pp. 141-144
R.B. Dunn , MIT Lincoln Lab., Lexington, MA, USA
T.F. Quatieri , MIT Lincoln Lab., Lexington, MA, USA
J.F. Kaiser , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 145-148
J.F. Kaiser , Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
pp. 149-152
A.C. Bovik , Texas Univ. Austin, TX, USA
J.P. Havlicek , Texas Univ. Austin, TX, USA
M.D. Desai , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 153-156
V. Nuri , Washington State Univ., Pullman, WA, USA
R.H. Bamberger , Washington State Univ., Pullman, WA, USA
pp. 161-164
S.-M. Phoong , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 165-168
R.A. Gopinath , Dept. of ECE, Rice Univ., Houston, TX, USA
C.S. Burrus , Dept. of ECE, Rice Univ., Houston, TX, USA
pp. 169-172
R.A. Haddad , Polytech. Univ., Brooklyn, NY, USA
N. Uzun , Polytech. Univ., Brooklyn, NY, USA
pp. 173-176
N. Uzun , Dept. of ECE, Rutgers Univ., Piscataway, NJ, USA
pp. 177-180
D.B. Chester , Harris Corp., Melbourne, FL, USA
pp. 181-184
M.R.K. Khansari , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
A. Leon-Garcia , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 185-188
S.C. Chan , Dept. of Electron Eng., Hong Kong City Polytech., Kowloon Tong, Hong Kong
C.W. Kok , Dept. of Electron Eng., Hong Kong City Polytech., Kowloon Tong, Hong Kong
pp. 189-192
N.J. Fliege , Hamburg Univ. of Technol., Germany
U. Zolzer , Hamburg Univ. of Technol., Germany
pp. 193-196
P.L. Ainsleigh , Naval Res. Lab., Orlando, FL, USA
C.K. Chui , Hamburg Univ. of Technol., Germany
pp. 197-200
I. Sodagar , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 201-204
C. Herley , Columbia Univ., New York, NY, USA
J. Kovacevic , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
K. Ramchandran , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M. Vetterli , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 205-208
A.K. Soman , EE Dept., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan , EE Dept., California Inst. of Technol., Pasadena, CA, USA
T.Q. Nguyen , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 209-212
T. Blu , France Telecom, Issy-Les-Moulineaux, France
O. Rioul , France Telecom, Issy-Les-Moulineaux, France
pp. 213-216
R.L. de Queiroz , Electr. Eng. Dept., Texas Univ., Arlington, TX, USA
K.R. Rao , Electr. Eng. Dept., Texas Univ., Arlington, TX, USA
pp. 217-220
M. Poize , France Telecom, Meylan, France
M. Renaudin , Electr. Eng. Dept., Texas Univ., Arlington, TX, USA
P. Venier , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 221-224
P.N. Heller , Aware Inc., Cambridge, MA, USA
H.L. Resnikoff , Aware Inc., Cambridge, MA, USA
pp. 229-232
H.L. Resnikoff , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 233-236
P. Abry , URA CNRS, Ecole Normale Superieure de Lyon, France
P. Goncalves , URA CNRS, Ecole Normale Superieure de Lyon, France
P. Flandrin , URA CNRS, Ecole Normale Superieure de Lyon, France
pp. 237-240
S. Mallat , New York Univ., NY, USA
Z. Zhang , New York Univ., NY, USA
pp. 241-244
F. Hlawatsch , Tech. Univ., Vienna, Austria
A. Papandreou , New York Univ., NY, USA
G.F. Boudreaux-Bartels , URA CNRS, Ecole Normale Superieure de Lyon, France
pp. 245-248
E. Dorken , ECS Dept., Boston Univ., MA, USA
S.H. Nawab , ECS Dept., Boston Univ., MA, USA
pp. 249-252
M.G. Amin , Dept. of Electr. Eng., Villanova Univ., PA, USA
W.J. Williams , ECS Dept., Boston Univ., MA, USA
pp. 253-256
L.B. Almeida , INESC/IST, Lisboa, Portugal
pp. 257-260
Y. Liu , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
A.N. Akansu , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 261-264
J. Sweeney , Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
R. Orr , Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
R. Balart , Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
D. Buchanan , Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
A. Humen , Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
pp. 265-268
P.Z. Lee , Inst. of Inf. Sci., Acad. Sinica, Taipei, Taiwan
F.-Y. Huang , Inst. of Inf. Sci., Acad. Sinica, Taipei, Taiwan
pp. 269-272
A. Saidi , Motorola Applied Research, Boynton Beach, FL, USA
pp. 273-276
Y.-H. Chan , Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
W.-C. Siu , Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
pp. 277-280
C. Lu , Dept. of Comput. Sci., Towson State Univ., Baltimore, MD, USA
M. An , Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
Z. Qian , Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
R. Tolimieri , Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
pp. 281-284
R.D. Roberts , Harris Corp., Melbourne, FL, USA
N. Tepedenlengilou , Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
pp. 285-287
I.W. Selesnick , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 288-291
J.-J. Hsue , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 292-295
J. Gotze , Tech. Univ. Munich, Germany
S. Paul , Tech. Univ. Munich, Germany
M. Sauer , Tech. Univ. Munich, Germany
pp. 296-299
X.-G. Xia , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Z. Zhang , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 300-303
J.J. Benedetto , Dept. of Math., Maryland Univ., College Park, MD, USA
S. Li , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 304-307
P. Jorgensen , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 308-311
H. Zou , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
W. Xu , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 312-315
C. van den Branden Lambrecht , Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Karrakchou , Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 316-319
R.G. Baraniuk , URA CNRS, Ecole Normale Superieure de Lyon, France
D.L. Jones , Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 320-323
J.R. O'Hair , Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
B.W. Suter , Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 324-327
M.J. Werter , Electr. Eng., Dept., California Univ., Los Angeles, CA, USA
pp. 328-331
J.M. Paez-Borrallo , Univ. Politecnica de Madrid, Spain
I.A. Perez Alvarez , Univ. Politecnica de Madrid, Spain
pp. 332-335
L. Wang , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 336-339
R. Swaminathan , Dept. of Electr. Eng., Auburn Univ., AL, USA
J.K. Tugnait , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 340-343
V. Filimon , Vienna Univ. of Technol., Austria
W. Kozek , Vienna Univ. of Technol., Austria
W. Kreuzer , Vienna Univ. of Technol., Austria
G. Kubin , Vienna Univ. of Technol., Austria
pp. 348-351
A.S. Munshi , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
D.A. Johns , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 356-359
J.V. White , TASC, Reading, MA, USA
B. Broder , TASC, Reading, MA, USA
pp. 360-363
D.C. Shin , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
C.L. Nikias , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 364-367
P. Tichavsky , Acad. of Sci. of Czech Republic, Prague, Czech Republic
P. Handel , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 368-371
Y. Bar-Ness , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
H. Messer , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
G. Silvian , Vienna Univ. of Technol., Austria
pp. 372-375
A. Dinc , Corporate Computer Systems, Holmdel, NJ, USA
Y. Bar-Ness , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 376-379
A. Gatherer , Stanford Univ., CA, USA
T.H.-Y. Meng , Stanford Univ., CA, USA
pp. 380-383
T. Soni , Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
J.R. Zeidler , Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
W.H. Ku , Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
pp. 384-387
Z. Fejzo , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
H. Lev-Ari , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 388-391
M.L.R. de Campos , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
P.S.R. Diniz , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
A. Antoniou , Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
pp. 392-395
N.I. Cho , Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
S.U. Lee , Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
pp. 396-399
S. Nishimura , Dept. of Comput. Sci., Shimane Univ., Matsue, Japan
pp. 400-403
F. Desbouvries , Inst. Nat. des Telecommun., Evry, France
pp. 404-407
H. Sakai , Kyoto Univ., Japan
M. Kuroda , Kyoto Univ., Japan
S. Ohno , Kyoto Univ., Japan
pp. 408-411
M. Montazeri , CNET, Issy-les-Moulineaux, France
P. Duhamel , CNET, Issy-les-Moulineaux, France
pp. 412-415
K. Zhao , DSP Software Engineering Inc., Bedford, MA, USA
H. Lev-Ari , CNET, Issy-les-Moulineaux, France
J.G. Proakis , Kyoto Univ., Japan
pp. 416-419
P.M. Clarkson , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
M.V. Dokic , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 420-423
D. Panescu , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Y.H. Hu , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
W.J. Tompkins , Kyoto Univ., Japan
pp. 424-427
J. Lee , Ind. Technol. Res. Inst., Chutung, Hsinchu, Taiwan
V.J. Mathews , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 428-431
M.M. Chansarkar , Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
U.B. Desai , Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
pp. 432-435
H.M. Ahmed , Nonlinear Modelling Lab., Boston, MA, USA
F. Rauf , Nonlinear Modelling Lab., Boston, MA, USA
M.U. Khurram , Nonlinear Modelling Lab., Boston, MA, USA
pp. 436-439
K.M. Perry , Dept. of Electr. Eng., Auburn Univ., AL, USA
S.J. Reeves , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 440-443
S.J. Reeves , Dept. of Electr. Eng., Auburn Univ., AL, USA
L.P. Heck , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 444-447
J.T. Yuan , Missouri Univ., Rolla, MO, USA
pp. 448-451
F. Champagnat , Lab. des Signaux et Systemes, Ecole Superieure d'Electricite, Gif-sur-Yvette, France
J. Idier , Lab. des Signaux et Systemes, Ecole Superieure d'Electricite, Gif-sur-Yvette, France
G. Demoment , Lab. des Signaux et Systemes, Ecole Superieure d'Electricite, Gif-sur-Yvette, France
pp. 452-455
I.F. Gorodnitsky , Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
B.D. Rao , Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
pp. 456-459
J. Murakami , Dept. of Inf. & Comput. Sci., Toyohashi Univ. of Technol., Japan
Y. Tadokoro , Dept. of Inf. & Comput. Sci., Toyohashi Univ. of Technol., Japan
pp. 460-463
M.J. Grimble , Strathclyde Univ., Glasgow, UK
pp. 464-467
M.J. Grimble , Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
M. Vetterli , Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 468-471
J.A. Bucklew , Dept. of Electr. & Comput. Eng. Wisconsin Univ., Madison, WI, USA
W.A. Sethares , Dept. of Electr. & Comput. Eng. Wisconsin Univ., Madison, WI, USA
pp. 472-475
H. Dedieu , Dept. of Electr. Eng., Swiss Federal Inst. of Technol., Lausanne, Switzerland
O. Chetelat , Dept. of Electr. Eng., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 476-479
S.T. Alexander , Electr. & Comput. Eng. Dept., North Carolina State Univ., Raleigh, NC, USA
V.L. Stonick , Dept. of Electr. Eng., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 480-483
J.B. Evans , Dept. of Electr. & Comput. Eng., Kansas Univ., Lawrence, KS, USA
pp. 484-487
M. Doroslovacki , Cincinnati Univ., OH, USA
H. Fan , Cincinnati Univ., OH, USA
pp. 488-491
H. Fan , Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
Q. Li , Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 492-495
P. Duhamel , CNET, Issy-les-Moulineaux, France
M. Montazeri , CNET, Issy-les-Moulineaux, France
K. Hilal , CNET, Issy-les-Moulineaux, France
pp. 496-499
N. Erdol , Electr. Eng. Dept., Florida Atlantic Univ., Boca Raton, FL, USA
F. Basbug , Electr. Eng. Dept., Florida Atlantic Univ., Boca Raton, FL, USA
pp. 500-503
E.M. Dowling , Univ. of Texas at Dallas, Richardson, TX, USA
R.D. DeGroat , Univ. of Texas at Dallas, Richardson, TX, USA
pp. 504-507
S. Hosur , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 508-510
E. Bjarnason , Tech. Hochschule Darmstadt, Germany
pp. 511-514
F. Laichi , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
W. Steenaart , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 515-518
S.C. Douglas , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 519-522
N.L. Freire , SRI Int., Menlo Park, CA, USA
S.C. Douglas , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 523-526
M. Rupp , Inst. fuer Netzwerk and Signaltheorie, Darmstadt, Germany
pp. 527-530
G. Kubin , Vienna Univ. of Technol., Austria
G. Kubin , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
B. Egardt , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 531-534
L.S.L. Hsieh , National Semiconductor Corp., Santa Clara, CA, USA
S.L. Wood , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 535-538
A. Sugiyama , NEC Corp., Miyamae-ku, Kawasaki, Japan
pp. 539-542
G.A. Williamson , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 543-546
Y. Fu , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
G.A. Williams , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 547-550
Z. Gu , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
W.A. Sethares , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 551-554
M. Sternad , Uppsala Univ., Sweden
A. Ahlen , Uppsala Univ., Sweden
E. Lindskog , Uppsala Univ., Sweden
pp. 555-558
A.H. Sayed , Stanford Univ., CA, USA
T. Kailath , Stanford Univ., CA, USA
pp. 559-562
F. Rauf , Nonlinear Modeling Lab., Boston, MA, USA
H.M. Ahmed , Nonlinear Modeling Lab., Boston, MA, USA
pp. 563-566
Y.C. Park , Yonsei Univ., Seoul, South Korea
W.K. Kim , Yonsei Univ., Seoul, South Korea
D.H. Youn , Yonsei Univ., Seoul, South Korea
pp. 567-570
R.J. Plemmons , Comput. Sci. Dept., Wake Forest Univ., Winston-Salem, NC, USA
pp. 571-574
S. Banerjee , Dept. of ECE, California Univ., San Diego, La Jolla, CA, USA
P.M. Chau , Dept. of ECE, California Univ., San Diego, La Jolla, CA, USA
pp. 575-578
F. Perez , Vigo Univ., Spain
D. Docampo , Vigo Univ., Spain
A. Artes , Vigo Univ., Spain
C. Abdallah , Vienna Univ. of Technol., Austria
pp. 579-582
M. Sun , Pittsburgh Univ., PA, USA
G.S. Burg , Pittsburgh Univ., PA, USA
R.J. Sclabassi , Pittsburgh Univ., PA, USA
pp. 583-586
S.H. Nawab , ECS Dept., Boston Univ., MA, USA
E. Dorken , ECS Dept., Boston Univ., MA, USA
pp. 587-590
H. Soltanian-Zadeh , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 591-594
S. Dharanipragada , Illinois Univ., Urbana, IL, USA
K.S. Arun , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 595-598
G. Matsopoulos , Strathclyde Univ., Glasgow, UK
S. Marshall , Strathclyde Univ., Glasgow, UK
pp. 599-602
Y.-T. Kim , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
G.R. Arce , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 603-606
13 ms
(Ver 2.0)

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