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  • Acoustics, Speech, and Signal Processing, 1993. ICASSP-93 Vol 3., 1993 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 1993. ICASSP-93 Vol 3., 1993 IEEE International Conference on
Minneapolis, MN, USA
April 27-April 30
ISBN: 0-7803-0946-4
Table of Contents
I. Brodetsky, Electr. Comput. & Syst. Eng. Dept., Rensselaer Polytech. Inst., Troy, NY, USA
M. Savic, Electr. Comput. & Syst. Eng. Dept., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 17-20
M. Kahrs, Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
C. Zimmer, Electr. Comput. & Syst. Eng. Dept., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 21-24
Y.-C. Lai, Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
Y.-C. Lai, Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
pp. 25-28
A.G. Dabak, Dept. Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
D.H. Johnson, Dept. Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 33-36
B.F. Rice, Lockheed Missiles & Space Co. Inc., Sunnyvale, CA, USA
M.E. Wilhoyte, Lockheed Missiles & Space Co. Inc., Sunnyvale, CA, USA
pp. 37-40
Z. Wang, Dept. of Comput. Sci. & Electr. Eng. Vermont Univ., Burlington, VT, USA
G. Mirchandani, Dept. of Comput. Sci. & Electr. Eng. Vermont Univ., Burlington, VT, USA
G. Mirchandani, Dept. of Comput. Sci. & Electr. Eng. Vermont Univ., Burlington, VT, USA
pp. 49-52
J. Kim, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
W.G. Bliss, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 53-56
M. Lang, Univ. of Erlangen, Germany
J. Bamberger, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 57-60
W.-S. Lu, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
Y. Cui, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
R.L. Kirlin, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 61-64
R. Majidi-Ahy, Varian Research Center, Palo Alto, CA, USA
H. Hill, Varian Research Center, Palo Alto, CA, USA
G. Zdasiuk, Varian Research Center, Palo Alto, CA, USA
A. Zander, Varian Research Center, Palo Alto, CA, USA
S. Bandy, Varian Research Center, Palo Alto, CA, USA
pp. 69-72
K.J.R. Liu, Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
C.T. Chiu, Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
R.K. Kolagotla, Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
J.F. JaJa, Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
pp. 73-76
T.I. Laakso, NOKIA Research Center, Espoo, Finland
T.Q. Nguyen, Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
R.D. Koilpillai, Electr. Eng. Dept., Univ. of Maryland, College Part, MD, USA
pp. 77-80
D. Burnside, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
T.W. Parks, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 81-84
R.L. Reng, Univ., Erlangen-Nuernberg, Erlangen, Germany
K. Schwarz, Univ., Erlangen-Nuernberg, Erlangen, Germany
H.W. Schuessler, Univ., Erlangen-Nuernberg, Erlangen, Germany
pp. 85-88
W.K. Jenkins, Dept. of Electr. & Comput. Eng., The Coordinated Sci. Lab., Urbana, IL, USA
A.J. Mansen, Dept. of Electr. & Comput. Eng., The Coordinated Sci. Lab., Urbana, IL, USA
pp. 89-92
R. Suoranta, Tech. Res. Centre of Finland, Tampere, Finland
K.-P. Estola, Dept. of Electr. & Comput. Eng., The Coordinated Sci. Lab., Urbana, IL, USA
pp. 93-96
W.-P. Zhu, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.O. Ahmad, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.N.S. Swamy, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
pp. 97-100
T. Ciloglu, Electr. & Electron. Eng. Dept., Middle East Tech. Univ., Ankara, Turkey
Z. Unver, Electr. & Electron. Eng. Dept., Middle East Tech. Univ., Ankara, Turkey
pp. 101-104
C.-M. Wu, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M. Vishwanath, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
R.M. Owens, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M.J. Irwin, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 113-116
D.F. Drake, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
D.B. Williams, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 125-128
G.C. Freeland, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
T.S. Durrani, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 133-136
R.B. Dunn, MIT Lincoln Lab., Lexington, MA, USA
T.F. Quatieri, MIT Lincoln Lab., Lexington, MA, USA
J.F. Kaiser, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 145-148
J.F. Kaiser, Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
pp. 149-152
A.C. Bovik, Texas Univ. Austin, TX, USA
J.P. Havlicek, Texas Univ. Austin, TX, USA
M.D. Desai, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 153-156
V. Nuri, Washington State Univ., Pullman, WA, USA
R.H. Bamberger, Washington State Univ., Pullman, WA, USA
pp. 161-164
S.-M. Phoong, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 165-168
R.A. Gopinath, Dept. of ECE, Rice Univ., Houston, TX, USA
C.S. Burrus, Dept. of ECE, Rice Univ., Houston, TX, USA
pp. 169-172
M.R.K. Khansari, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
A. Leon-Garcia, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 185-188
S.C. Chan, Dept. of Electron Eng., Hong Kong City Polytech., Kowloon Tong, Hong Kong
C.W. Kok, Dept. of Electron Eng., Hong Kong City Polytech., Kowloon Tong, Hong Kong
pp. 189-192
N.J. Fliege, Hamburg Univ. of Technol., Germany
U. Zolzer, Hamburg Univ. of Technol., Germany
pp. 193-196
P.L. Ainsleigh, Naval Res. Lab., Orlando, FL, USA
C.K. Chui, Hamburg Univ. of Technol., Germany
pp. 197-200
I. Sodagar, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 201-204
C. Herley, Columbia Univ., New York, NY, USA
J. Kovacevic, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
K. Ramchandran, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M. Vetterli, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 205-208
A.K. Soman, EE Dept., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan, EE Dept., California Inst. of Technol., Pasadena, CA, USA
T.Q. Nguyen, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 209-212
T. Blu, France Telecom, Issy-Les-Moulineaux, France
O. Rioul, France Telecom, Issy-Les-Moulineaux, France
pp. 213-216
R.L. de Queiroz, Electr. Eng. Dept., Texas Univ., Arlington, TX, USA
K.R. Rao, Electr. Eng. Dept., Texas Univ., Arlington, TX, USA
pp. 217-220
M. Poize, France Telecom, Meylan, France
M. Renaudin, Electr. Eng. Dept., Texas Univ., Arlington, TX, USA
P. Venier, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 221-224
P.N. Heller, Aware Inc., Cambridge, MA, USA
H.L. Resnikoff, Aware Inc., Cambridge, MA, USA
pp. 229-232
H.L. Resnikoff, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 233-236
P. Abry, URA CNRS, Ecole Normale Superieure de Lyon, France
P. Goncalves, URA CNRS, Ecole Normale Superieure de Lyon, France
P. Flandrin, URA CNRS, Ecole Normale Superieure de Lyon, France
pp. 237-240
S. Mallat, New York Univ., NY, USA
Z. Zhang, New York Univ., NY, USA
pp. 241-244
F. Hlawatsch, Tech. Univ., Vienna, Austria
A. Papandreou, New York Univ., NY, USA
G.F. Boudreaux-Bartels, URA CNRS, Ecole Normale Superieure de Lyon, France
pp. 245-248
E. Dorken, ECS Dept., Boston Univ., MA, USA
S.H. Nawab, ECS Dept., Boston Univ., MA, USA
pp. 249-252
Y. Liu, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
A.N. Akansu, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 261-264
J. Sweeney, Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
R. Orr, Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
R. Balart, Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
D. Buchanan, Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
A. Humen, Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
pp. 265-268
P.Z. Lee, Inst. of Inf. Sci., Acad. Sinica, Taipei, Taiwan
F.-Y. Huang, Inst. of Inf. Sci., Acad. Sinica, Taipei, Taiwan
pp. 269-272
Y.-H. Chan, Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
W.-C. Siu, Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
pp. 277-280
C. Lu, Dept. of Comput. Sci., Towson State Univ., Baltimore, MD, USA
M. An, Dept. of Electron. Eng., Hong Kong Polytech., Hong Kong
Z. Qian, Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
R. Tolimieri, Atlantic Aerospace Electronics Corp., Greenbelt, MD, USA
pp. 281-284
I.W. Selesnick, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 288-291
J.-J. Hsue, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 292-295
J. Gotze, Tech. Univ. Munich, Germany
S. Paul, Tech. Univ. Munich, Germany
M. Sauer, Tech. Univ. Munich, Germany
pp. 296-299
X.-G. Xia, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Z. Zhang, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 300-303
J.J. Benedetto, Dept. of Math., Maryland Univ., College Park, MD, USA
S. Li, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 304-307
H. Zou, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
W. Xu, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 312-315
C. van den Branden Lambrecht, Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Karrakchou, Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 316-319
R.G. Baraniuk, URA CNRS, Ecole Normale Superieure de Lyon, France
D.L. Jones, Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 320-323
J.R. O'Hair, Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
B.W. Suter, Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 324-327
M.J. Werter, Electr. Eng., Dept., California Univ., Los Angeles, CA, USA
pp. 328-331
L. Wang, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 336-339
R. Swaminathan, Dept. of Electr. Eng., Auburn Univ., AL, USA
J.K. Tugnait, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 340-343
V. Filimon, Vienna Univ. of Technol., Austria
W. Kozek, Vienna Univ. of Technol., Austria
W. Kreuzer, Vienna Univ. of Technol., Austria
G. Kubin, Vienna Univ. of Technol., Austria
pp. 348-351
A.S. Munshi, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
D.A. Johns, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 356-359
D.C. Shin, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
C.L. Nikias, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 364-367
P. Tichavsky, Acad. of Sci. of Czech Republic, Prague, Czech Republic
P. Handel, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 368-371
Y. Bar-Ness, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
H. Messer, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
G. Silvian, Vienna Univ. of Technol., Austria
pp. 372-375
A. Dinc, Corporate Computer Systems, Holmdel, NJ, USA
Y. Bar-Ness, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 376-379
T. Soni, Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
J.R. Zeidler, Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
W.H. Ku, Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
pp. 384-387
Z. Fejzo, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
H. Lev-Ari, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 388-391
M.L.R. de Campos, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
P.S.R. Diniz, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
A. Antoniou, Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
pp. 392-395
N.I. Cho, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
S.U. Lee, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
pp. 396-399
M. Montazeri, CNET, Issy-les-Moulineaux, France
P. Duhamel, CNET, Issy-les-Moulineaux, France
pp. 412-415
K. Zhao, DSP Software Engineering Inc., Bedford, MA, USA
H. Lev-Ari, CNET, Issy-les-Moulineaux, France
J.G. Proakis, Kyoto Univ., Japan
pp. 416-419
P.M. Clarkson, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
M.V. Dokic, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 420-423
D. Panescu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Y.H. Hu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
W.J. Tompkins, Kyoto Univ., Japan
pp. 424-427
J. Lee, Ind. Technol. Res. Inst., Chutung, Hsinchu, Taiwan
V.J. Mathews, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 428-431
M.M. Chansarkar, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
U.B. Desai, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
pp. 432-435
H.M. Ahmed, Nonlinear Modelling Lab., Boston, MA, USA
F. Rauf, Nonlinear Modelling Lab., Boston, MA, USA
M.U. Khurram, Nonlinear Modelling Lab., Boston, MA, USA
pp. 436-439
K.M. Perry, Dept. of Electr. Eng., Auburn Univ., AL, USA
S.J. Reeves, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 440-443
S.J. Reeves, Dept. of Electr. Eng., Auburn Univ., AL, USA
L.P. Heck, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 444-447
F. Champagnat, Lab. des Signaux et Systemes, Ecole Superieure d'Electricite, Gif-sur-Yvette, France
J. Idier, Lab. des Signaux et Systemes, Ecole Superieure d'Electricite, Gif-sur-Yvette, France
G. Demoment, Lab. des Signaux et Systemes, Ecole Superieure d'Electricite, Gif-sur-Yvette, France
pp. 452-455
I.F. Gorodnitsky, Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
B.D. Rao, Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
pp. 456-459
J. Murakami, Dept. of Inf. & Comput. Sci., Toyohashi Univ. of Technol., Japan
Y. Tadokoro, Dept. of Inf. & Comput. Sci., Toyohashi Univ. of Technol., Japan
pp. 460-463
M.J. Grimble, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
M. Vetterli, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 468-471
J.A. Bucklew, Dept. of Electr. & Comput. Eng. Wisconsin Univ., Madison, WI, USA
W.A. Sethares, Dept. of Electr. & Comput. Eng. Wisconsin Univ., Madison, WI, USA
pp. 472-475
H. Dedieu, Dept. of Electr. Eng., Swiss Federal Inst. of Technol., Lausanne, Switzerland
O. Chetelat, Dept. of Electr. Eng., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 476-479
S.T. Alexander, Electr. & Comput. Eng. Dept., North Carolina State Univ., Raleigh, NC, USA
V.L. Stonick, Dept. of Electr. Eng., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 480-483
J.B. Evans, Dept. of Electr. & Comput. Eng., Kansas Univ., Lawrence, KS, USA
pp. 484-487
M. Doroslovacki, Cincinnati Univ., OH, USA
H. Fan, Cincinnati Univ., OH, USA
pp. 488-491
H. Fan, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
Q. Li, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 492-495
P. Duhamel, CNET, Issy-les-Moulineaux, France
M. Montazeri, CNET, Issy-les-Moulineaux, France
K. Hilal, CNET, Issy-les-Moulineaux, France
pp. 496-499
N. Erdol, Electr. Eng. Dept., Florida Atlantic Univ., Boca Raton, FL, USA
F. Basbug, Electr. Eng. Dept., Florida Atlantic Univ., Boca Raton, FL, USA
pp. 500-503
E.M. Dowling, Univ. of Texas at Dallas, Richardson, TX, USA
R.D. DeGroat, Univ. of Texas at Dallas, Richardson, TX, USA
pp. 504-507
S. Hosur, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 508-510
F. Laichi, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
W. Steenaart, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 515-518
M. Rupp, Inst. fuer Netzwerk and Signaltheorie, Darmstadt, Germany
pp. 527-530
G. Kubin, Vienna Univ. of Technol., Austria
G. Kubin, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
B. Egardt, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 531-534
L.S.L. Hsieh, National Semiconductor Corp., Santa Clara, CA, USA
S.L. Wood, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 535-538
G.A. Williamson, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 543-546
Y. Fu, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
G.A. Williams, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 547-550
Z. Gu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
W.A. Sethares, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 551-554
M. Sternad, Uppsala Univ., Sweden
A. Ahlen, Uppsala Univ., Sweden
E. Lindskog, Uppsala Univ., Sweden
pp. 555-558
A.H. Sayed, Stanford Univ., CA, USA
T. Kailath, Stanford Univ., CA, USA
pp. 559-562
F. Rauf, Nonlinear Modeling Lab., Boston, MA, USA
H.M. Ahmed, Nonlinear Modeling Lab., Boston, MA, USA
pp. 563-566
Y.C. Park, Yonsei Univ., Seoul, South Korea
W.K. Kim, Yonsei Univ., Seoul, South Korea
D.H. Youn, Yonsei Univ., Seoul, South Korea
pp. 567-570
R.J. Plemmons, Comput. Sci. Dept., Wake Forest Univ., Winston-Salem, NC, USA
pp. 571-574
S. Banerjee, Dept. of ECE, California Univ., San Diego, La Jolla, CA, USA
P.M. Chau, Dept. of ECE, California Univ., San Diego, La Jolla, CA, USA
pp. 575-578
F. Perez, Vigo Univ., Spain
D. Docampo, Vigo Univ., Spain
A. Artes, Vigo Univ., Spain
C. Abdallah, Vienna Univ. of Technol., Austria
pp. 579-582
M. Sun, Pittsburgh Univ., PA, USA
G.S. Burg, Pittsburgh Univ., PA, USA
R.J. Sclabassi, Pittsburgh Univ., PA, USA
pp. 583-586
H. Soltanian-Zadeh, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 591-594
S. Dharanipragada, Illinois Univ., Urbana, IL, USA
K.S. Arun, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 595-598
G. Matsopoulos, Strathclyde Univ., Glasgow, UK
S. Marshall, Strathclyde Univ., Glasgow, UK
pp. 599-602
Y.-T. Kim, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
G.R. Arce, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 603-606
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