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  • Acoustics, Speech, and Signal Processing, 1993. ICASSP-93 Vol 2., 1993 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 1993. ICASSP-93 Vol 2., 1993 IEEE International Conference on
Minneapolis, MN, USA
April 27-April 30
ISBN: 0-7803-0946-4
Table of Contents
C. Xydeas, Dept. of Electr. Eng., Univ. of Manchester, UK
K. So, Dept. of Electr. Eng., Univ. of Manchester, UK
pp. 1-4
Y. Bistritz, Dept. of Electr. Eng., Tel Aviv Univ., Israel
S. Peller, Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 9-12
R. Hagen, Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
P. Hedelin, Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 13-16
J. Pan, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
T.R. Fischer, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 17-20
J.M. Lopez-Soler, Dept. Electron. y Tecnologia de Computadores, Granada Univ., Spain
N. Farvardin, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 21-24
E. Erzin, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
A.E. Cetin, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 25-28
J.S. Collura, US Dept. of Defense, Washington, DC, USA
T.E. Tremain, US Dept. of Defense, Washington, DC, USA
pp. 29-32
P. Placeway, Bolt Beranek & Newman Inc., Cambridge, MA, USA
R. Schwartz, Bolt Beranek & Newman Inc., Cambridge, MA, USA
P. Fung, Bolt Beranek & Newman Inc., Cambridge, MA, USA
L. Nguyen, Bolt Beranek & Newman Inc., Cambridge, MA, USA
pp. 33-36
M. Meteer, Rensselaer Polytech. Inst., Troy, NY, USA
J.R. Rohlicek, Bolt Beranek & Newman Inc., Cambridge, MA, USA
pp. 37-40
R. Lau, MIT, Cambridge, MA, USA
R. Rosenfeld, LIMSI-CNRS, Orsay, France
S. Roukos, Bolt Beranek & Newman Inc., Cambridge, MA, USA
pp. 45-48
W. Ward, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
S. Young, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 49-50
N.M. Veilleux, Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
M. Ostendorf, Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 51-54
R. Kuhn, CRIM, Montreal, Que., Canada
R. De Mori, Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 55-58
W.M. Fisher, Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
J.G. Fiscus, Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
pp. 59-62
M.P. Harper, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
L.H. Jamieson, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
C.B. Zoltowski, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
R.A. Helzerman, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
pp. 63-66
A.L.N. Fred, Centro de Analise e Processamento de Sinais, Inst. Superior Tecnico, Lisboa, Portugal
J.M.N. Leitao, Centro de Analise e Processamento de Sinais, Inst. Superior Tecnico, Lisboa, Portugal
pp. 67-70
S. Das, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
R. Bakis, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
A. Nadas, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
M. Picheny, IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 71-74
K. Ohkura, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
D. Rainton, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
M. Sugiyama, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 75-78
B.A. Hanson, Panasonic Technologies, Inc., Santa Barbara, CA, USA
T.H. Applebaum, Panasonic Technologies, Inc., Santa Barbara, CA, USA
pp. 79-82
H. Hermansky, US WEST Advanced Technologies, Boulder, CO, USA
N. Morgan, Panasonic Technologies, Inc., Santa Barbara, CA, USA
H.-G. Hirsch, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 83-86
B.A. Mellor, Defence Research Agency, Malvern, UK
A.P. Varga, Defence Research Agency, Malvern, UK
pp. 87-90
T.M. Sullivan, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 91-94
P. Alexandre, Matra Communication, Bois D'Arcy, France
J. Boudy, Matra Communication, Bois D'Arcy, France
P. Lockwood, Matra Communication, Bois D'Arcy, France
pp. 99-102
S.V. Vaseghi, Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
B.P. Milner, Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
pp. 103-106
C. Guan, Dept. of Radio Eng., Southeast Univ., Nanjing, China
Y. Chen, Dept. of Radio Eng., Southeast Univ., Nanjing, China
B. Wu, Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 107-110
M. Bates, BBN Systems & Technologies, Cambridge, MA, USA
R. Bobrow, BBN Systems & Technologies, Cambridge, MA, USA
P. Fung, BBN Systems & Technologies, Cambridge, MA, USA
R. Ingria, BBN Systems & Technologies, Cambridge, MA, USA
F. Kubala, BBN Systems & Technologies, Cambridge, MA, USA
J. Makhoul, BBN Systems & Technologies, Cambridge, MA, USA
L. Nguyen, BBN Systems & Technologies, Cambridge, MA, USA
R. Schwartz, BBN Systems & Technologies, Cambridge, MA, USA
D. Stallard, BBN Systems & Technologies, Cambridge, MA, USA
pp. 111-114
Y. Takebayashi, Toshiba Corp., Saiwai-ku, Kawasaki, Japan
Y. Nagata, Toshiba Corp., Saiwai-ku, Kawasaki, Japan
H. Kanazawa, Toshiba Corp., Saiwai-ku, Kawasaki, Japan
pp. 115-118
M. Oerder, Philips GmbH Forschungslab., Aachen, Germany
H. Ney, Philips GmbH Forschungslab., Aachen, Germany
pp. 119-122
P. Baggia, Centro Studi e Lab. Telecomunicazioni, Torino, Italy
C. Rullent, Centro Studi e Lab. Telecomunicazioni, Torino, Italy
pp. 123-126
P. Bianchini, IBM SEMEA, Rome, Italy
P. Ferragina, IBM SEMEA, Rome, Italy
M.N. Granieri, IBM SEMEA, Rome, Italy
L. Tarricone, IBM SEMEA, Rome, Italy
pp. 127-130
L. Denenberg, BBN Systems & Technologies, Cambridge, MA, USA
H. Gish, BBN Systems & Technologies, Cambridge, MA, USA
M. Meteer, BBN Systems & Technologies, Cambridge, MA, USA
T. Miller, BBN Systems & Technologies, Cambridge, MA, USA
J.R. Rohlicek, BBN Systems & Technologies, Cambridge, MA, USA
W. Sadkin, BBN Systems & Technologies, Cambridge, MA, USA
M. Siu, BBN Systems & Technologies, Cambridge, MA, USA
pp. 131-134
E. Gerbino, Centro Studi e Lab. Telecomunicazioni, Torino, Italy
P. Baggia, Centro Studi e Lab. Telecomunicazioni, Torino, Italy
A. Ciaramella, Centro Studi e Lab. Telecomunicazioni, Torino, Italy
C. Rullent, Centro Studi e Lab. Telecomunicazioni, Torino, Italy
pp. 135-138
A. Nagai, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
K. Yamaguchi, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
S. Sagayama, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
A. Kurematsu, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 139-142
P. Lupini, Sch. of Eng. Sci., Simon Fraser Univ., BC, Canada
H. Hassanein, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
V. Cuperman, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 143-146
C.-C. Kuo, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
F.-R. Jean, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
H.-C. Wang, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 147-150
M. Nishiguchi, Sony Corp., Tokyo, Japan
J. Matsumoto, Sony Corp., Tokyo, Japan
R. Wakatsuki, Sony Corp., Tokyo, Japan
S. Ono, Sony Corp., Tokyo, Japan
pp. 151-154
E. Paksoy, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
K. Srinivasan, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 155-158
A.V. McCree, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
A.V. McCree, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 159-162
T.E. Tremain, US Dept. of Defense, Washington, DC, USA
D.P. Kemp, US Dept. of Defense, Washington, DC, USA
J.S. Collura, US Dept. of Defense, Washington, DC, USA
M.A. Kohler, US Dept. of Defense, Washington, DC, USA
pp. 163-166
T. Eriksson, Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
J. Sjoberg, Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 171-174
I.S. Burnett, Sch. of Electron. & Electr. Eng., Bath Univ., UK
R.J. Holbeche, Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 175-178
G. Yang, Lernout & Hauspie Speechproducts nv, Wemmel, Belgium
H. Leich, Sch. of Electron. & Electr. Eng., Bath Univ., UK
R. Boite, US Dept. of Defense, Washington, DC, USA
pp. 179-182
E.R. Banga, DTC-ETSI Telecomunicacion, Vigo Univ., Spain
E. Lopez-Gonzalo, Sch. of Electron. & Electr. Eng., Bath Univ., UK
C. Garcia-Mateo, US Dept. of Defense, Washington, DC, USA
pp. 183-186
D. Bigorgne, France Telecom-CNET, Lannion, France
O. Boeffard, France Telecom-CNET, Lannion, France
B. Cherbonnel, France Telecom-CNET, Lannion, France
F. Emerard, France Telecom-CNET, Lannion, France
D. Larreur, France Telecom-CNET, Lannion, France
J.L. Le Saint-Milon, France Telecom-CNET, Lannion, France
I. Metayer, France Telecom-CNET, Lannion, France
C. Sorin, France Telecom-CNET, Lannion, France
S. White, France Telecom-CNET, Lannion, France
pp. 187-190
W.J. Wang, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
W.N. Campbell, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
N. Iwahashi, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
Y. Sagisaka, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 191-194
H. Mizuno, NTT Human Interface Lab., Tokyo, Japan
M. Abe, NTT Human Interface Lab., Tokyo, Japan
T. Hirokawa, NTT Human Interface Lab., Tokyo, Japan
pp. 195-198
K. Torkkola, Inst. Dalle Molle D'Intelligence Artificielle Perceptive, Martigny, Switzerland
pp. 199-202
R.W.P. Luk, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R.I. Damper, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 203-206
K.E. Cummings, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 207-210
H. Fujisaki, Dept. of Appl. Electron., Sci. Univ. of Tokyo, Noda, Japan
M. Ljungqvist, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
H. Murata, NTT Human Interface Lab., Tokyo, Japan
pp. 211-214
S. Takahashi, NTT Human Interface Lab., Tokyo, Japan
T. Matsuoka, NTT Human Interface Lab., Tokyo, Japan
Y. Minami, NTT Human Interface Lab., Tokyo, Japan
K. Shikano, NTT Human Interface Lab., Tokyo, Japan
pp. 219-222
P. Schmid, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
R. Cole, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Fanty, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 223-226
C.-H. Lin, Nat. Taiwan Univ., Taiwan
L.-S. Lee, Nat. Taiwan Univ., Taiwan
P.-Y. Ting, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 227-230
D. Jouvet, France Telecom, CNET, Lannion, France
A. Laine, France Telecom, CNET, Lannion, France
J. Monne, France Telecom, CNET, Lannion, France
C. Gagnoulet, France Telecom, CNET, Lannion, France
pp. 235-238
R. Haeb-Umbach, Philips GmbH Res. Lab., Aachen, Germany
D. Geller, Philips GmbH Res. Lab., Aachen, Germany
H. Ney, Philips GmbH Res. Lab., Aachen, Germany
pp. 239-242
R. Cardin, Centre de Recherche Inf. de Montreal, McGill Coll., Montreal, Que., Canada
Y. Normandin, Centre de Recherche Inf. de Montreal, McGill Coll., Montreal, Que., Canada
E. Millien, Centre de Recherche Inf. de Montreal, McGill Coll., Montreal, Que., Canada
pp. 243-246
J. de Veth, L&H Speech Products, Leper, Belgium
G. Gallopyn, L&H Speech Products, Leper, Belgium
H. Bourlard, L&H Speech Products, Leper, Belgium
pp. 247-250
P. Lockwood, Matra Communication, Bois D'Arcy, France
M. Blanchet, Matra Communication, Bois D'Arcy, France
pp. 251-254
H. Hild, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 255-258
J. Guo, Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
H.C. Lui, Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
pp. 263-266
T. Komori, ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
S. Katagiri, ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
pp. 271-274
A. Biem, ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
S. Katagiri, ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
pp. 275-278
Y. Anglade, CRIN-CNRS, Vandoeuvre-les-Nancy, France
D. Fohr, CRIN-CNRS, Vandoeuvre-les-Nancy, France
J.-C. Junqua, L&H Speech Products, Leper, Belgium
pp. 279-282
V. Valtchev, Eng. Dept., Cambridge Univ., UK
S. Kapadia, Eng. Dept., Cambridge Univ., UK
S.J. Young, Eng. Dept., Cambridge Univ., UK
pp. 287-290
E. McDermott, ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
S. Katagiri, ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
pp. 291-294
H. Singer, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
S. Sagayama, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 295-298
M. Galler, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
R. De Mori, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
pp. 303-306
F. Alleva, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
X. Huang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M.-Y. Hwang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 307-310
M.-Y. Hwang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
X. Huang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F. Alleva, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 311-314
L. Fissore, Centro Studi e Lab. Telecomunicazioni, Torino, Italy
P. Laface, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
P. Massafra, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F. Ravera, France Telecom, CNET, Lannion, France
pp. 315-318
H. Murveit, SRI Int., Menlo Park, CA, USA
J. Butzberger, SRI Int., Menlo Park, CA, USA
V. Digalakis, SRI Int., Menlo Park, CA, USA
M. Weintraub, SRI Int., Menlo Park, CA, USA
pp. 319-322
A. Kannan, Electr., Comput. & Syst. Eng., Boston Univ., MA, USA
M. Ostendorf, Electr., Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 327-330
C.D. Mitchell, Sch. of Elecr. Eng., Purdue Univ., W. Lafayette, IN, USA
L.H. Jamieson, Sch. of Elecr. Eng., Purdue Univ., W. Lafayette, IN, USA
pp. 331-334
K. Wang, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
S.A. Shamma, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
W.J. Byrne, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 335-338
J.T. Graf, Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
N. Hubing, Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
pp. 339-342
R.E. Slyh, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R.L. Moses, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 347-350
Y. Ephraim, AT&T Bell Lab., Murray Hill, NJ, USA
H.L. Van Trees, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 355-358
D. Tsoukalas, Wire Commun. Lab., Patras Univ., Greece
M. Paraskevas, Wire Commun. Lab., Patras Univ., Greece
J. Mourjopoulos, Wire Commun. Lab., Patras Univ., Greece
pp. 359-362
J. Hardwick, Res. Lab. of Electron., MIT, Cambridge, MA, USA
C.D. Yoo, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 367-370
J.P. Openshaw, Univ. Coll. of Swansea, UK
Z.P. Sun, Univ. Coll. of Swansea, UK
J.S. Mason, Univ. Coll. of Swansea, UK
pp. 371-374
A.L. Higgins, ITT Aerospace, San Diego, CA, USA
L.G. Bahler, ITT Aerospace, San Diego, CA, USA
J.E. Porter, ITT Aerospace, San Diego, CA, USA
pp. 375-378
Y.-H. Kao, Texas Instruments Inc., Dallas, TX, USA
J.S. Baras, ITT Aerospace, San Diego, CA, USA
P.K. Rajasekaran, ITT Aerospace, San Diego, CA, USA
pp. 379-382
G. Yu, BBN Systems & Technologies, Cambridge, MA, USA
H. Gish, BBN Systems & Technologies, Cambridge, MA, USA
pp. 383-386
J.J. Webb, AT&T Bell Lab., Columbus, OH, USA
E.L. Rissanen, AT&T Bell Lab., Columbus, OH, USA
pp. 387-390
T. Matsui, NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
S. Furui, NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
pp. 391-394
M. Sugiyama, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
J. Murakami, ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
H. Watanabe, ITT Aerospace, San Diego, CA, USA
pp. 395-398
Z.-X. Yuan, Inst. of Acoust., Nanjing Univ., China
C.-Z. Yu, Inst. of Acoust., Nanjing Univ., China
Y. Fang, Inst. of Acoust., Nanjing Univ., China
pp. 403-406
H.-C. Wang, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
M.-S. Chen, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
T. Yang, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 407-410
D. Sen, Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
D.H. Irving, Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
W.H. Holmes, Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
pp. 411-414
V.E. Sanchez, Dpto. de Electron., Granada Univ., Spain
J.-P. Adoul, Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
pp. 415-418
C.G. Gerlach, Inst. for Commun. Syst. & Data Process., Aachen Univ. of Technol., Germany
pp. 419-422
P. Knagenhjelm, Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
pp. 423-426
D.A.F. Florencio, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 427-430
J. Thyssen, Telecommun. Res. Lab., Horsholm, Denmark
S.D. Hansen, Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
pp. 431-434
J.D. Tardelli, ARCON Corp., Waltham, MA, USA
P.D. Gatewood, ARCON Corp., Waltham, MA, USA
E.W. Kreamer, ARCON Corp., Waltham, MA, USA
P.A. La Follette, ARCON Corp., Waltham, MA, USA
pp. 435-438
S.H. Nam, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
J.D. Gibson, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 443-446
H. Gish, BBN Systems & Technologies, Cambridge, MA, USA
K. Ng, BBN Systems & Technologies, Cambridge, MA, USA
pp. 447-450
R.A. Sukkar, AT&T Bell Lab., Naperville, IL, USA
J.G. Wilpon, AT&T Bell Lab., Naperville, IL, USA
pp. 451-454
J.R. Rohlicek, BBN Systems & Technologies, Cambridge, MA, USA
P. Jeanrenaud, BBN Systems & Technologies, Cambridge, MA, USA
K. Ng, BBN Systems & Technologies, Cambridge, MA, USA
H. Gish, BBN Systems & Technologies, Cambridge, MA, USA
B. Musicus, BBN Systems & Technologies, Cambridge, MA, USA
M. Siu, BBN Systems & Technologies, Cambridge, MA, USA
pp. 459-462
R.C. Rose, AT&T Bell Lab., Murray Hill, NJ, USA
E.M. Hofstetter, BBN Systems & Technologies, Cambridge, MA, USA
pp. 467-470
L. Gillick, Dragon Systems, Inc., Newton, MA, USA
J. Baker, Dragon Systems, Inc., Newton, MA, USA
J. Baker, Dragon Systems, Inc., Newton, MA, USA
J. Bridle, Dragon Systems, Inc., Newton, MA, USA
M. Hunt, Dragon Systems, Inc., Newton, MA, USA
Y. Ito, Dragon Systems, Inc., Newton, MA, USA
S. Lowe, Dragon Systems, Inc., Newton, MA, USA
J. Orloff, Dragon Systems, Inc., Newton, MA, USA
B. Peskin, Dragon Systems, Inc., Newton, MA, USA
R. Roth, Dragon Systems, Inc., Newton, MA, USA
F. Scattone, Dragon Systems, Inc., Newton, MA, USA
pp. 471-474
T. Zeppenfeld, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. Houghton, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 475-478
J.N. Marcus, Spoken Language Syst. Group, MIT, Cambridge, MA, USA
pp. 479-482
E. Eide, BBN Systems & Technologies, Cambridge, MA, USA
J.R. Rohlicek, BBN Systems & Technologies, Cambridge, MA, USA
H. Gish, BBN Systems & Technologies, Cambridge, MA, USA
S. Mitter, Dragon Systems, Inc., Newton, MA, USA
pp. 483-486
W.J. Holmes, GEC-Marconi Ltd., Wembley, UK
L.C. Wood, GEC-Marconi Ltd., Wembley, UK
D.J.B. Pearce, GEC-Marconi Ltd., Wembley, UK
pp. 487-490
S. Kapadia, Eng. Dept., Cambridge Univ., UK
V. Valtchev, Eng. Dept., Cambridge Univ., UK
S.J. Young, Eng. Dept., Cambridge Univ., UK
pp. 491-494
D. Kimber, Xerox Palo Alto Res. Center, CA, USA
M. Bush, Xerox Palo Alto Res. Center, CA, USA
pp. 495-498
L.-s. Lee, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
C.-y. Tseng, Xerox Palo Alto Res. Center, CA, USA
K.-J. Chen, Eng. Dept., Cambridge Univ., UK
I.-J. Hung, Dragon Systems, Inc., Newton, MA, USA
M.-Y. Lee, Dragon Systems, Inc., Newton, MA, USA
L.-F. Chien, Dragon Systems, Inc., Newton, MA, USA
Y. Lee, Dragon Systems, Inc., Newton, MA, USA
R. Lyu, Dragon Systems, Inc., Newton, MA, USA
H.-m. Wang, Dragon Systems, Inc., Newton, MA, USA
Y.-C. Wu, Dragon Systems, Inc., Newton, MA, USA
T.-S. Lin, Dragon Systems, Inc., Newton, MA, USA
pp. 503-506
O. Bezie, Matra Communication, Bois D'Arcy, France
P. Lockwood, Matra Communication, Bois D'Arcy, France
pp. 511-514
I. Torres, Dpto. Electr. y Electron., Univ. del Pais Vasco, Bilbao, Spain
F. Casacuberta, Matra Communication, Bois D'Arcy, France
pp. 515-518
J.D. Harris, Dept. of Defense, Ft. Meade, MD, USA
D. Nelson, Dept. of Defense, Ft. Meade, MD, USA
pp. 519-522
Q. Yasheng, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 523-526
D.W.N. Sharp, Dept. of Comput. Sci., Imperial Coll. of Sci. Technol. & Med., London, UK
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E.L. Riegelsberger, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
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M.G. Rahim, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
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H.C. Leung, NYNEX Science & Technology Inc., White Plains, NY, USA
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H. Niemann, Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
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T.R. Anderson, Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
S.K. Rogers, Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
D.W. Ruck, Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
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C. Giguere, Eng. Dept., Cambridge Univ., UK
P.C. Woodland, Eng. Dept., Cambridge Univ., UK
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A. Alwan, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
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H.M. Hanson, Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
P. Maragos, Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
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J.T. Foote, Div. of Eng., Brown Univ., Providence, RI, USA
D.J. Mashao, Div. of Eng., Brown Univ., Providence, RI, USA
H.F. Silverman, Div. of Eng., Brown Univ., Providence, RI, USA
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D. Chazan, IBM Sci. & Technol. Centre, Technion City, Haifa, Israel
Y. Stettiner, Div. of Eng., Brown Univ., Providence, RI, USA
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G.S. Ying, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
C.D. Mitchell, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
L.H. Jamieson, Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
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