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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1993)
Minneapolis, MN, USA
Apr. 27, 1993 to Apr. 30, 1993
ISBN: 0-7803-0946-4
TABLE OF CONTENTS
C. Xydeas , Dept. of Electr. Eng., Univ. of Manchester, UK
K. So , Dept. of Electr. Eng., Univ. of Manchester, UK
pp. 1-4
Y. Tanaka , Fujitsu Lab. Ltd., Kawasaki, Japan
T. Taniguchi , Fujitsu Lab. Ltd., Kawasaki, Japan
pp. 5-8
Y. Bistritz , Dept. of Electr. Eng., Tel Aviv Univ., Israel
S. Peller , Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 9-12
R. Hagen , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
P. Hedelin , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 13-16
J. Pan , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
T.R. Fischer , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 17-20
J.M. Lopez-Soler , Dept. Electron. y Tecnologia de Computadores, Granada Univ., Spain
N. Farvardin , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 21-24
E. Erzin , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
A.E. Cetin , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 25-28
J.S. Collura , US Dept. of Defense, Washington, DC, USA
T.E. Tremain , US Dept. of Defense, Washington, DC, USA
pp. 29-32
P. Placeway , Bolt Beranek & Newman Inc., Cambridge, MA, USA
R. Schwartz , Bolt Beranek & Newman Inc., Cambridge, MA, USA
P. Fung , Bolt Beranek & Newman Inc., Cambridge, MA, USA
L. Nguyen , Bolt Beranek & Newman Inc., Cambridge, MA, USA
pp. 33-36
M. Meteer , Rensselaer Polytech. Inst., Troy, NY, USA
J.R. Rohlicek , Bolt Beranek & Newman Inc., Cambridge, MA, USA
pp. 37-40
M. Jardino , LIMSI-CNRS, Orsay, France
G. Adda , LIMSI-CNRS, Orsay, France
pp. 41-44
R. Lau , MIT, Cambridge, MA, USA
R. Rosenfeld , LIMSI-CNRS, Orsay, France
S. Roukos , Bolt Beranek & Newman Inc., Cambridge, MA, USA
pp. 45-48
W. Ward , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
S. Young , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 49-50
N.M. Veilleux , Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
M. Ostendorf , Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 51-54
R. Kuhn , CRIM, Montreal, Que., Canada
R. De Mori , Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 55-58
W.M. Fisher , Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
J.G. Fiscus , Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
pp. 59-62
M.P. Harper , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
L.H. Jamieson , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
C.B. Zoltowski , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
R.A. Helzerman , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
pp. 63-66
A.L.N. Fred , Centro de Analise e Processamento de Sinais, Inst. Superior Tecnico, Lisboa, Portugal
J.M.N. Leitao , Centro de Analise e Processamento de Sinais, Inst. Superior Tecnico, Lisboa, Portugal
pp. 67-70
S. Das , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
R. Bakis , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
A. Nadas , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
M. Picheny , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 71-74
K. Ohkura , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
D. Rainton , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
M. Sugiyama , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 75-78
B.A. Hanson , Panasonic Technologies, Inc., Santa Barbara, CA, USA
T.H. Applebaum , Panasonic Technologies, Inc., Santa Barbara, CA, USA
pp. 79-82
H. Hermansky , US WEST Advanced Technologies, Boulder, CO, USA
N. Morgan , Panasonic Technologies, Inc., Santa Barbara, CA, USA
H.-G. Hirsch , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 83-86
B.A. Mellor , Defence Research Agency, Malvern, UK
A.P. Varga , Defence Research Agency, Malvern, UK
pp. 87-90
T.M. Sullivan , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 91-94
P. Alexandre , Matra Communication, Bois D'Arcy, France
J. Boudy , Matra Communication, Bois D'Arcy, France
P. Lockwood , Matra Communication, Bois D'Arcy, France
pp. 99-102
S.V. Vaseghi , Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
B.P. Milner , Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
pp. 103-106
C. Guan , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Y. Chen , Dept. of Radio Eng., Southeast Univ., Nanjing, China
B. Wu , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 107-110
M. Bates , BBN Systems & Technologies, Cambridge, MA, USA
R. Bobrow , BBN Systems & Technologies, Cambridge, MA, USA
P. Fung , BBN Systems & Technologies, Cambridge, MA, USA
R. Ingria , BBN Systems & Technologies, Cambridge, MA, USA
F. Kubala , BBN Systems & Technologies, Cambridge, MA, USA
J. Makhoul , BBN Systems & Technologies, Cambridge, MA, USA
L. Nguyen , BBN Systems & Technologies, Cambridge, MA, USA
R. Schwartz , BBN Systems & Technologies, Cambridge, MA, USA
D. Stallard , BBN Systems & Technologies, Cambridge, MA, USA
pp. 111-114
Y. Takebayashi , Toshiba Corp., Saiwai-ku, Kawasaki, Japan
Y. Nagata , Toshiba Corp., Saiwai-ku, Kawasaki, Japan
H. Kanazawa , Toshiba Corp., Saiwai-ku, Kawasaki, Japan
pp. 115-118
M. Oerder , Philips GmbH Forschungslab., Aachen, Germany
H. Ney , Philips GmbH Forschungslab., Aachen, Germany
pp. 119-122
P. Baggia , Centro Studi e Lab. Telecomunicazioni, Torino, Italy
C. Rullent , Centro Studi e Lab. Telecomunicazioni, Torino, Italy
pp. 123-126
P. Bianchini , IBM SEMEA, Rome, Italy
P. Ferragina , IBM SEMEA, Rome, Italy
M.N. Granieri , IBM SEMEA, Rome, Italy
L. Tarricone , IBM SEMEA, Rome, Italy
pp. 127-130
L. Denenberg , BBN Systems & Technologies, Cambridge, MA, USA
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
M. Meteer , BBN Systems & Technologies, Cambridge, MA, USA
T. Miller , BBN Systems & Technologies, Cambridge, MA, USA
J.R. Rohlicek , BBN Systems & Technologies, Cambridge, MA, USA
W. Sadkin , BBN Systems & Technologies, Cambridge, MA, USA
M. Siu , BBN Systems & Technologies, Cambridge, MA, USA
pp. 131-134
E. Gerbino , Centro Studi e Lab. Telecomunicazioni, Torino, Italy
P. Baggia , Centro Studi e Lab. Telecomunicazioni, Torino, Italy
A. Ciaramella , Centro Studi e Lab. Telecomunicazioni, Torino, Italy
C. Rullent , Centro Studi e Lab. Telecomunicazioni, Torino, Italy
pp. 135-138
A. Nagai , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
K. Yamaguchi , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
S. Sagayama , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
A. Kurematsu , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 139-142
P. Lupini , Sch. of Eng. Sci., Simon Fraser Univ., BC, Canada
H. Hassanein , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
V. Cuperman , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 143-146
C.-C. Kuo , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
F.-R. Jean , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
H.-C. Wang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 147-150
M. Nishiguchi , Sony Corp., Tokyo, Japan
J. Matsumoto , Sony Corp., Tokyo, Japan
R. Wakatsuki , Sony Corp., Tokyo, Japan
S. Ono , Sony Corp., Tokyo, Japan
pp. 151-154
E. Paksoy , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
K. Srinivasan , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 155-158
A.V. McCree , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
A.V. McCree , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 159-162
T.E. Tremain , US Dept. of Defense, Washington, DC, USA
D.P. Kemp , US Dept. of Defense, Washington, DC, USA
J.S. Collura , US Dept. of Defense, Washington, DC, USA
M.A. Kohler , US Dept. of Defense, Washington, DC, USA
pp. 163-166
Y. Shoham , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 167-170
T. Eriksson , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
J. Sjoberg , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 171-174
I.S. Burnett , Sch. of Electron. & Electr. Eng., Bath Univ., UK
R.J. Holbeche , Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 175-178
G. Yang , Lernout & Hauspie Speechproducts nv, Wemmel, Belgium
H. Leich , Sch. of Electron. & Electr. Eng., Bath Univ., UK
R. Boite , US Dept. of Defense, Washington, DC, USA
pp. 179-182
E.R. Banga , DTC-ETSI Telecomunicacion, Vigo Univ., Spain
E. Lopez-Gonzalo , Sch. of Electron. & Electr. Eng., Bath Univ., UK
C. Garcia-Mateo , US Dept. of Defense, Washington, DC, USA
pp. 183-186
D. Bigorgne , France Telecom-CNET, Lannion, France
O. Boeffard , France Telecom-CNET, Lannion, France
B. Cherbonnel , France Telecom-CNET, Lannion, France
F. Emerard , France Telecom-CNET, Lannion, France
D. Larreur , France Telecom-CNET, Lannion, France
J.L. Le Saint-Milon , France Telecom-CNET, Lannion, France
I. Metayer , France Telecom-CNET, Lannion, France
C. Sorin , France Telecom-CNET, Lannion, France
S. White , France Telecom-CNET, Lannion, France
pp. 187-190
W.J. Wang , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
W.N. Campbell , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
N. Iwahashi , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
Y. Sagisaka , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 191-194
H. Mizuno , NTT Human Interface Lab., Tokyo, Japan
M. Abe , NTT Human Interface Lab., Tokyo, Japan
T. Hirokawa , NTT Human Interface Lab., Tokyo, Japan
pp. 195-198
K. Torkkola , Inst. Dalle Molle D'Intelligence Artificielle Perceptive, Martigny, Switzerland
pp. 199-202
R.W.P. Luk , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R.I. Damper , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 203-206
K.E. Cummings , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 207-210
H. Fujisaki , Dept. of Appl. Electron., Sci. Univ. of Tokyo, Noda, Japan
M. Ljungqvist , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
H. Murata , NTT Human Interface Lab., Tokyo, Japan
pp. 211-214
K.K. Paliwal , Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
pp. 215-218
S. Takahashi , NTT Human Interface Lab., Tokyo, Japan
T. Matsuoka , NTT Human Interface Lab., Tokyo, Japan
Y. Minami , NTT Human Interface Lab., Tokyo, Japan
K. Shikano , NTT Human Interface Lab., Tokyo, Japan
pp. 219-222
P. Schmid , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
R. Cole , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Fanty , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 223-226
C.-H. Lin , Nat. Taiwan Univ., Taiwan
L.-S. Lee , Nat. Taiwan Univ., Taiwan
P.-Y. Ting , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 227-230
T.R. Anderson , Armstrong Lab., Wright-Patterson AFB, OH, USA
pp. 231-234
D. Jouvet , France Telecom, CNET, Lannion, France
A. Laine , France Telecom, CNET, Lannion, France
J. Monne , France Telecom, CNET, Lannion, France
C. Gagnoulet , France Telecom, CNET, Lannion, France
pp. 235-238
R. Haeb-Umbach , Philips GmbH Res. Lab., Aachen, Germany
D. Geller , Philips GmbH Res. Lab., Aachen, Germany
H. Ney , Philips GmbH Res. Lab., Aachen, Germany
pp. 239-242
R. Cardin , Centre de Recherche Inf. de Montreal, McGill Coll., Montreal, Que., Canada
Y. Normandin , Centre de Recherche Inf. de Montreal, McGill Coll., Montreal, Que., Canada
E. Millien , Centre de Recherche Inf. de Montreal, McGill Coll., Montreal, Que., Canada
pp. 243-246
J. de Veth , L&H Speech Products, Leper, Belgium
G. Gallopyn , L&H Speech Products, Leper, Belgium
H. Bourlard , L&H Speech Products, Leper, Belgium
pp. 247-250
P. Lockwood , Matra Communication, Bois D'Arcy, France
M. Blanchet , Matra Communication, Bois D'Arcy, France
pp. 251-254
H. Hild , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 255-258
J. Tebelskis , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 259-262
J. Guo , Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
H.C. Lui , Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
pp. 263-266
B. Petek , Univ. of Ljubljana, Slovenia
A. Ferligoj , Univ. of Ljubljana, Slovenia
pp. 267-270
T. Komori , ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
S. Katagiri , ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
pp. 271-274
A. Biem , ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
S. Katagiri , ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
pp. 275-278
Y. Anglade , CRIN-CNRS, Vandoeuvre-les-Nancy, France
D. Fohr , CRIN-CNRS, Vandoeuvre-les-Nancy, France
J.-C. Junqua , L&H Speech Products, Leper, Belgium
pp. 279-282
K.j. Iso , NEC Corp., Miyamae-ku, Kawasaki, Japan
pp. 283-286
V. Valtchev , Eng. Dept., Cambridge Univ., UK
S. Kapadia , Eng. Dept., Cambridge Univ., UK
S.J. Young , Eng. Dept., Cambridge Univ., UK
pp. 287-290
E. McDermott , ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
S. Katagiri , ATR Auditory & Visual Perception Res. Lab., Soraku-gun, Kyoto, Japan
pp. 291-294
H. Singer , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
S. Sagayama , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 295-298
A. Ito , Tohoku Univ., Sendai, Japan
S. Makino , Tohoku Univ., Sendai, Japan
pp. 299-302
M. Galler , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
R. De Mori , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
pp. 303-306
F. Alleva , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
X. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M.-Y. Hwang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 307-310
M.-Y. Hwang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
X. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F. Alleva , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 311-314
L. Fissore , Centro Studi e Lab. Telecomunicazioni, Torino, Italy
P. Laface , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
P. Massafra , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F. Ravera , France Telecom, CNET, Lannion, France
pp. 315-318
H. Murveit , SRI Int., Menlo Park, CA, USA
J. Butzberger , SRI Int., Menlo Park, CA, USA
V. Digalakis , SRI Int., Menlo Park, CA, USA
M. Weintraub , SRI Int., Menlo Park, CA, USA
pp. 319-322
M. Jones , Eng. Dept., Cambridge Univ., UK
P.C. Woodland , Eng. Dept., Cambridge Univ., UK
pp. 323-326
A. Kannan , Electr., Comput. & Syst. Eng., Boston Univ., MA, USA
M. Ostendorf , Electr., Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 327-330
C.D. Mitchell , Sch. of Elecr. Eng., Purdue Univ., W. Lafayette, IN, USA
L.H. Jamieson , Sch. of Elecr. Eng., Purdue Univ., W. Lafayette, IN, USA
pp. 331-334
K. Wang , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
S.A. Shamma , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
W.J. Byrne , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 335-338
J.T. Graf , Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
N. Hubing , Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
pp. 339-342
A.M. Engebretson , Comput. Sci. Dept., Washington Univ., St. Louis, MO, USA
pp. 343-346
R.E. Slyh , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R.L. Moses , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 347-350
K.C. Zangi , MIT, Cambridge, MA, USA
pp. 351-354
Y. Ephraim , AT&T Bell Lab., Murray Hill, NJ, USA
H.L. Van Trees , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 355-358
D. Tsoukalas , Wire Commun. Lab., Patras Univ., Greece
M. Paraskevas , Wire Commun. Lab., Patras Univ., Greece
J. Mourjopoulos , Wire Commun. Lab., Patras Univ., Greece
pp. 359-362
J. Yang , NovAtel Communications Ltd., Calgary, Alta., Canada
pp. 363-366
J. Hardwick , Res. Lab. of Electron., MIT, Cambridge, MA, USA
C.D. Yoo , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 367-370
J.P. Openshaw , Univ. Coll. of Swansea, UK
Z.P. Sun , Univ. Coll. of Swansea, UK
J.S. Mason , Univ. Coll. of Swansea, UK
pp. 371-374
A.L. Higgins , ITT Aerospace, San Diego, CA, USA
L.G. Bahler , ITT Aerospace, San Diego, CA, USA
J.E. Porter , ITT Aerospace, San Diego, CA, USA
pp. 375-378
Y.-H. Kao , Texas Instruments Inc., Dallas, TX, USA
J.S. Baras , ITT Aerospace, San Diego, CA, USA
P.K. Rajasekaran , ITT Aerospace, San Diego, CA, USA
pp. 379-382
G. Yu , BBN Systems & Technologies, Cambridge, MA, USA
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
pp. 383-386
J.J. Webb , AT&T Bell Lab., Columbus, OH, USA
E.L. Rissanen , AT&T Bell Lab., Columbus, OH, USA
pp. 387-390
T. Matsui , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
S. Furui , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
pp. 391-394
M. Sugiyama , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
J. Murakami , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
H. Watanabe , ITT Aerospace, San Diego, CA, USA
pp. 395-398
M.A. Zissman , MIT Lincoln Lab., Lexington, MA, USA
pp. 399-402
Z.-X. Yuan , Inst. of Acoust., Nanjing Univ., China
C.-Z. Yu , Inst. of Acoust., Nanjing Univ., China
Y. Fang , Inst. of Acoust., Nanjing Univ., China
pp. 403-406
H.-C. Wang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
M.-S. Chen , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
T. Yang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 407-410
D. Sen , Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
D.H. Irving , Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
W.H. Holmes , Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
pp. 411-414
V.E. Sanchez , Dpto. de Electron., Granada Univ., Spain
J.-P. Adoul , Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
pp. 415-418
C.G. Gerlach , Inst. for Commun. Syst. & Data Process., Aachen Univ. of Technol., Germany
pp. 419-422
P. Knagenhjelm , Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
pp. 423-426
D.A.F. Florencio , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 427-430
J. Thyssen , Telecommun. Res. Lab., Horsholm, Denmark
S.D. Hansen , Sch. of Electr. Eng., New South Wales Univ., Kennsington, NSW, Australia
pp. 431-434
J.D. Tardelli , ARCON Corp., Waltham, MA, USA
P.D. Gatewood , ARCON Corp., Waltham, MA, USA
E.W. Kreamer , ARCON Corp., Waltham, MA, USA
P.A. La Follette , ARCON Corp., Waltham, MA, USA
pp. 435-438
R.J. McAulay , MIT Lincoln Lab., Lexington, MA, USA
T.F. Quatieri , MIT Lincoln Lab., Lexington, MA, USA
pp. 439-442
S.H. Nam , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
J.D. Gibson , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 443-446
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
K. Ng , BBN Systems & Technologies, Cambridge, MA, USA
pp. 447-450
R.A. Sukkar , AT&T Bell Lab., Naperville, IL, USA
J.G. Wilpon , AT&T Bell Lab., Naperville, IL, USA
pp. 451-454
L. Villarrubia , Telefonica I+D, Madrid, Spain
A. Acero , Telefonica I+D, Madrid, Spain
pp. 455-458
J.R. Rohlicek , BBN Systems & Technologies, Cambridge, MA, USA
P. Jeanrenaud , BBN Systems & Technologies, Cambridge, MA, USA
K. Ng , BBN Systems & Technologies, Cambridge, MA, USA
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
B. Musicus , BBN Systems & Technologies, Cambridge, MA, USA
M. Siu , BBN Systems & Technologies, Cambridge, MA, USA
pp. 459-462
R.C. Rose , AT&T Bell Lab., Murray Hill, NJ, USA
E.M. Hofstetter , BBN Systems & Technologies, Cambridge, MA, USA
pp. 467-470
L. Gillick , Dragon Systems, Inc., Newton, MA, USA
J. Baker , Dragon Systems, Inc., Newton, MA, USA
J. Baker , Dragon Systems, Inc., Newton, MA, USA
J. Bridle , Dragon Systems, Inc., Newton, MA, USA
M. Hunt , Dragon Systems, Inc., Newton, MA, USA
Y. Ito , Dragon Systems, Inc., Newton, MA, USA
S. Lowe , Dragon Systems, Inc., Newton, MA, USA
J. Orloff , Dragon Systems, Inc., Newton, MA, USA
B. Peskin , Dragon Systems, Inc., Newton, MA, USA
R. Roth , Dragon Systems, Inc., Newton, MA, USA
F. Scattone , Dragon Systems, Inc., Newton, MA, USA
pp. 471-474
T. Zeppenfeld , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. Houghton , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 475-478
J.N. Marcus , Spoken Language Syst. Group, MIT, Cambridge, MA, USA
pp. 479-482
E. Eide , BBN Systems & Technologies, Cambridge, MA, USA
J.R. Rohlicek , BBN Systems & Technologies, Cambridge, MA, USA
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
S. Mitter , Dragon Systems, Inc., Newton, MA, USA
pp. 483-486
W.J. Holmes , GEC-Marconi Ltd., Wembley, UK
L.C. Wood , GEC-Marconi Ltd., Wembley, UK
D.J.B. Pearce , GEC-Marconi Ltd., Wembley, UK
pp. 487-490
S. Kapadia , Eng. Dept., Cambridge Univ., UK
V. Valtchev , Eng. Dept., Cambridge Univ., UK
S.J. Young , Eng. Dept., Cambridge Univ., UK
pp. 491-494
D. Kimber , Xerox Palo Alto Res. Center, CA, USA
M. Bush , Xerox Palo Alto Res. Center, CA, USA
pp. 495-498
M. Russell , DRA Malvern, UK
pp. 499-502
L.-s. Lee , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
C.-y. Tseng , Xerox Palo Alto Res. Center, CA, USA
K.-J. Chen , Eng. Dept., Cambridge Univ., UK
I.-J. Hung , Dragon Systems, Inc., Newton, MA, USA
M.-Y. Lee , Dragon Systems, Inc., Newton, MA, USA
L.-F. Chien , Dragon Systems, Inc., Newton, MA, USA
Y. Lee , Dragon Systems, Inc., Newton, MA, USA
R. Lyu , Dragon Systems, Inc., Newton, MA, USA
H.-m. Wang , Dragon Systems, Inc., Newton, MA, USA
Y.-C. Wu , Dragon Systems, Inc., Newton, MA, USA
T.-S. Lin , Dragon Systems, Inc., Newton, MA, USA
pp. 503-506
L.F. Lamel , LIMSI-CNRS, Orsay, France
J.-L. Gauvain , LIMSI-CNRS, Orsay, France
pp. 507-510
O. Bezie , Matra Communication, Bois D'Arcy, France
P. Lockwood , Matra Communication, Bois D'Arcy, France
pp. 511-514
I. Torres , Dpto. Electr. y Electron., Univ. del Pais Vasco, Bilbao, Spain
F. Casacuberta , Matra Communication, Bois D'Arcy, France
pp. 515-518
J.D. Harris , Dept. of Defense, Ft. Meade, MD, USA
D. Nelson , Dept. of Defense, Ft. Meade, MD, USA
pp. 519-522
Q. Yasheng , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 523-526
D.W.N. Sharp , Dept. of Comput. Sci., Imperial Coll. of Sci. Technol. & Med., London, UK
R.L. While , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 527-529
P. Chen , Eng. Res. Inst., Tokyo Univ., Japan
S. Ando , Eng. Res. Inst., Tokyo Univ., Japan
pp. 530-533
Y. Stettiner , Dept. of Electr. Eng., Technion, Haifa, Israel
D. Malah , Dept. of Electr. Eng., Technion, Haifa, Israel
D. Chazan , Eng. Dept., Cambridge Univ., UK
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Q. Guo , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
P. Milenkovic , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 538-541
E.L. Riegelsberger , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
A.K. Krishnamurthy , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 542-545
A. Mohsen , Eng. Math. & Phys. Dept., Cairo Univ., Giza, Egypt
T. El-Mistikawy , Eng. Math. & Phys. Dept., Cairo Univ., Giza, Egypt
M. Hesham , Eng. Math. & Phys. Dept., Cairo Univ., Giza, Egypt
pp. 546-549
J. Laroche , Telecom Paris, France
Y. Stylianou , Telecom Paris, France
E. Moulines , Telecom Paris, France
pp. 550-553
W. Verhelst , Fac. of Appl. Sci., Brussels Free Univ., Belgium
M. Roelands , Fac. of Appl. Sci., Brussels Free Univ., Belgium
pp. 554-557
C.-H. Lee , AT&T Bell Lab., Murray Hill, NJ, USA
J.-L. Gauvain , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 558-561
Y. Zhao , Panasonic Technologies Inc., Santa Barbara, CA, USA
pp. 562-565
G. Rigoll , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
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T. Kosaka , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
J. Takami , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
S. Sagayama , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
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Y. Miyazawa , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
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S. Ohno , Dept. of Electron. Eng., Tokyo Univ., Japan
K. Hirose , Dept. of Electron. Eng., Tokyo Univ., Japan
H. Fujasaki , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
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K. Yamaguchi , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
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R. Kneser , Philips GmbH Forschungslab, Aachen, Germany
V. Steinbiss , Philips GmbH Forschungslab, Aachen, Germany
pp. 586-589
S.R. Young , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Ward , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 590-591
A. Kataoka , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
T. Moriya , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
S. Hayashi , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
pp. 592-595
W.B. Kleijn , AT&T Bell Lab., Murray Hill, NJ, USA
P. Kroon , AT&T Bell Lab., Murray Hill, NJ, USA
L. Cellario , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
D. Sereno , Dragon Systems, Inc., Newton, MA, USA
pp. 596-599
I. Lee , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
J.D. Gibson , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 600-603
T.B. Minde , Erisoft AB, Lulea, Sweden
T. Wigren , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
J. Ahlberg , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
H. Hermansson , Dragon Systems, Inc., Newton, MA, USA
pp. 604-607
S. Dimolitsas , COMSAT Lab., Clarksburg, MD, USA
F.L. Corcoran , COMSAT Lab., Clarksburg, MD, USA
M. Baraniecki , NTT Human Interface Lab., Musashino-Shi, Tokyo, Japan
M. Baraniecki , Dragon Systems, Inc., Newton, MA, USA
pp. 608-611
R. Lefebvre , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
R. Salami , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
C. Laflamme , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
J.P. Adoul , Dept. of Electr. Eng., Sherbrooke Univ., Que., Canada
pp. 612-615
R. Soheili , Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
A.M. Kondoz , Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
B.G. Evans , Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
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C. McElroy , Dept. of Electr. & Electron. Eng., Univ. Coll., Dublin, Ireland
B. Murray , Dept. of Electr. & Electron. Eng., Univ. Coll., Dublin, Ireland
A.D. Fagan , Dept. of Electr. & Electron. Eng., Univ. Coll., Dublin, Ireland
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P.M. McCourt , Dept. of Electr. & Electron. Eng., Queen's Univ. of Belfast, UK
H.A. Kaouri , Dept. of Electr. & Electron. Eng., Queen's Univ. of Belfast, UK
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L.A. Hernandez-Gomez , Dpto. SSR, Ciudad Univ., Madrid, Spain
E. Lopez-Gonzalo , Dpto. SSR, Ciudad Univ., Madrid, Spain
pp. 628-631
L.R. Bahl , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 632-635
X. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Belin , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
F. Alleva , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Hwang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
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R. Roth , Dragon Systems Inc., Newton, MA, USA
J. Baker , Dragon Systems Inc., Newton, MA, USA
J. Baker , Dragon Systems Inc., Newton, MA, USA
L. Gillick , Dragon Systems Inc., Newton, MA, USA
M. Hunt , Dragon Systems Inc., Newton, MA, USA
Y. Ito , Dragon Systems Inc., Newton, MA, USA
S. Lowe , Dragon Systems Inc., Newton, MA, USA
J. Orloff , Dragon Systems Inc., Newton, MA, USA
B. Peskin , Dragon Systems Inc., Newton, MA, USA
F. Scattone , Dragon Systems Inc., Newton, MA, USA
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J.R. Bellegarda , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
L.R. Bahl , IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
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X. Aubert , Philips GmbH Res. Lab., Aachen, Germany
R. Haeb-Umbach , Philips GmbH Res. Lab., Aachen, Germany
H. Ney , Philips GmbH Res. Lab., Aachen, Germany
pp. 648-651
W. Chou , AT&T Bell Lab., Murray Hill, NJ, USA
C.H. Lee , AT&T Bell Lab., Murray Hill, NJ, USA
B.H. Juang , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 652-655
P. Kenny , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
P. Labute , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
Z. Li , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
R. Hollan , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
M. Lennig , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
D. O'Shaughnessy , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
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D.B. Paul , MIT Lincoln Lab., Lexington, MA, USA
B.F. Necioglu , MIT Lincoln Lab., Lexington, MA, USA
pp. 660-663
K.T. Assaleh , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
M.G. Rahim , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
J.L. Flanagan , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
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K. Aikawa , ATR Auditory & Visual Perception Lab., Soraku-gun, Kyoto, Japan
H. Singer , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
H. Kawahara , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
Y. Tohkura , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
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H.-F. Pai , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
H.-C. Wang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
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S. Nakagawa , Dept. of Inf. & Comput. Sci., Toyohashi Univ. of Technol., Japan
H. Suzuki , Dept. of Inf. & Comput. Sci., Toyohashi Univ. of Technol., Japan
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H.C. Leung , NYNEX Science & Technology Inc., White Plains, NY, USA
B. Chigier , NYNEX Science & Technology Inc., White Plains, NY, USA
J.R. Glass , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
pp. 680-683
J. Smolders , K. Univ., Leuven, Heverlee, Belgium
D. Van Compernolle , K. Univ., Leuven, Heverlee, Belgium
pp. 684-687
E.G. Schukat-Talamazzini , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
M. Bielecki , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
H. Niemann , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
T. Kuhn , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
S. Rieck , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
pp. 688-691
E. Bocchieri , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 692-695
T. Kawabata , NTT Basic Res. Lab., Musashino-shi, Tokyo, Japan
pp. 696-699
J.M. Colombi , AFIT/EN, Wright-Patterson AFB, OH, USA
T.R. Anderson , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
S.K. Rogers , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
D.W. Ruck , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
G.T. Warhola , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
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Y. Gao , CRIN/INRIA Lorraine, Vandoeuvre-les-Nancy, France
T. Huang , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
J.-P. Haton , Lehrstuhl fuer Inf., Univ. Erlangen-Nurnberg, Erlangen, Germany
pp. 704-707
C. Giguere , Eng. Dept., Cambridge Univ., UK
P.C. Woodland , Eng. Dept., Cambridge Univ., UK
pp. 708-711
A. Alwan , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 712-715
H.M. Hanson , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
P. Maragos , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
A. Potamianos , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
pp. 716-719
J.T. Foote , Div. of Eng., Brown Univ., Providence, RI, USA
D.J. Mashao , Div. of Eng., Brown Univ., Providence, RI, USA
H.F. Silverman , Div. of Eng., Brown Univ., Providence, RI, USA
pp. 720-723
D. O'Shaughnessy , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 724-727
D. Chazan , IBM Sci. & Technol. Centre, Technion City, Haifa, Israel
Y. Stettiner , Div. of Eng., Brown Univ., Providence, RI, USA
D. Malah , Div. of Eng., Brown Univ., Providence, RI, USA
pp. 728-731
G.S. Ying , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
C.D. Mitchell , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
L.H. Jamieson , Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
pp. 732-735
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