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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1993)
Minneapolis, MN, USA
Apr. 27, 1993 to Apr. 30, 1993
ISBN: 0-7803-0946-4
TABLE OF CONTENTS
A. Gevins , EEG Syst. Lab. & SAM Technol., San Francisco, CA, USA
pp. 2-3
G.D. Cain , Sch. of Electron. & Manuf. Syst. Eng., Westminster Univ., London, UK
A. Yardim , Sch. of Electron. & Manuf. Syst. Eng., Westminster Univ., London, UK
R.C.S. Morling , Sch. of Electron. & Manuf. Syst. Eng., Westminster Univ., London, UK
pp. 4-7
D.M. Etter , Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 8-11
B.L. Evans , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
J.H. McClellan , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
H.J. Trussell , Sch. of Electron. & Manuf. Syst. Eng., Westminster Univ., London, UK
pp. 12-15
R.H. Bamberger , Sch. of EECS, Washington State Univ., Pullman, WA, USA
S.L. Eddins , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
S.J. Reeves , Sch. of Electron. & Manuf. Syst. Eng., Westminster Univ., London, UK
pp. 16-19
C.S. Burrus , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 20-23
R.L. Kirlin , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
B.A. Hedstrom , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 24-27
R. Chassaing , Roger Williams Univ., Bristol, RI, USA
W. Anakwa , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
A. Richardson , Sch. of Electron. & Manuf. Syst. Eng., Westminster Univ., London, UK
pp. 28-31
R.W. Stewart , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 32-35
V.L. Stonick , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 36-39
F.M. Waltz , 3M Eng. Syst. & Technol. Lab., Saint Paul, MN, USA
pp. 40-43
D. Brzakovic , Dept. of Electr. & Comput. Eng., Tennessee Univ., Knoxville, TN, USA
H. Beck , Dept. of Electr. & Comput. Eng., Tennessee Univ., Knoxville, TN, USA
P. Shanmugam , Dept. of Electr. & Comput. Eng., Tennessee Univ., Knoxville, TN, USA
pp. 44-47
J.A. Adams , Four Pi Systems, San Diego, CA, USA
pp. 48-50
L.J. Eriksson , DIGISONIX, Inc., Middleton, WI, USA
pp. 51-54
L.P. Heck , SRI Int., Menlo Park, CA, USA
pp. 55-58
M.J. Dowling , Liberty Technologies, Inc., Conshohocken, PA, USA
pp. 59-62
J.R. Treichler , Applied Signal Technology, Sunnyvale, CA, USA
pp. 63-66
D.A. Coast , Allegheny-Singer Res. Inst., Pittsburgh, PA, USA
pp. 67-70
C.L. Nikias , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
S. Gao , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
S. Heidari , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 71-74
T.G. Xydis , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 75-78
R.A. Malkin , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
T.C. Pilkington , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 79-82
W.J. Williams , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 83-86
X. Kong , The Johns Hopkins Univ., Baltimore, MD, USA
N. Thakor , The Johns Hopkins Univ., Baltimore, MD, USA
pp. 87-90
J.C. Mosher , Los Alamos Nat. Lab., NM, USA
R.M. Leahy , Los Alamos Nat. Lab., NM, USA
P.S. Lewis , Los Alamos Nat. Lab., NM, USA
pp. 91-94
E. Dubois , INRS-Telecommun., Verdun, Que., Canada
J. Konrad , INRS-Telecommun., Verdun, Que., Canada
pp. 95-98
S.W. Wu , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 103-106
T. Kamae , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
T. Kishimoto , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 107-109
J.G. Apostolopoulos , Res. Lab. of Electron., MIT, Cambridge, MA, USA
P.A. Monta , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.J. Nicolas , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 110-113
B.G. Haskell , AT&T Bell Lab., Holmdel, NJ, USA
A.R. Reibman , AT&T Bell Lab., Holmdel, NJ, USA
pp. 114-116
D. Raychaudhuri , David Sarnoff Res. Center, Princeton, NJ, USA
H. Sun , David Sarnoff Res. Center, Princeton, NJ, USA
R.S. Girons , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 117-120
R.S. Girons , Media Lab., MIT, Cambridge, MA, USA
pp. 121-124
J. Backman , Acoustics Lab., Helsinki Univ. of Technol., Espoo, Finland
M. Karjalainen , Acoustics Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 125-128
J. Chen , Wisconsin Univ., Madison, WI, USA
B.D. Van Veen , Wisconsin Univ., Madison, WI, USA
K.E. Hecox , Wisconsin Univ., Madison, WI, USA
pp. 129-132
R.E.P. Dowling , Imperial Coll. of Sci., Technol., & Med., London, UK
L.F. Turner , Imperial Coll. of Sci., Technol., & Med., London, UK
pp. 133-136
R. Wang , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
R. Harjani , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 137-140
J.C. Rutledge , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
A. Tungthangthum , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 141-144
H. Javkin , Panasonic Technologies Inc., Santa Barbara, CA, USA
N. Antonanzas-Barroso , Panasonic Technologies Inc., Santa Barbara, CA, USA
A. Das , Panasonic Technologies Inc., Santa Barbara, CA, USA
D. Zerkle , Panasonic Technologies Inc., Santa Barbara, CA, USA
pp. 145-148
R.S. Goldhor , AudioFile Inc., Lexington, MA, USA
pp. 149-152
M. Schoenle , Hamburg Tech. Univ., Germany
N. Fliege , Hamburg Tech. Univ., Germany
U. Zoelzer , Hamburg Tech. Univ., Germany
pp. 153-156
M. Tohyama , NTT Human Interface Lab., Musashino-shi, Tokyo, Japan
R.H. Lyon , Hamburg Tech. Univ., Germany
T. Koike , Hamburg Tech. Univ., Germany
pp. 157-160
V.A. Margo , Colorado Univ., Boulder, CO, USA
D.M. Etter , Colorado Univ., Boulder, CO, USA
N.C. Carlson , Colorado Univ., Boulder, CO, USA
J.H. Gross , Panasonic Technologies Inc., Santa Barbara, CA, USA
pp. 161-164
R. de Vries , Dept. of Electr. Eng., Twente Univ., AE Enschede, Netherlands
A.P. Berkhoff , Dept. of Electr. Eng., Twente Univ., AE Enschede, Netherlands
C.H. Slump , Dept. of Electr. Eng., Twente Univ., AE Enschede, Netherlands
O.E. Herrmann , Dept. of Electr. Eng., Twente Univ., AE Enschede, Netherlands
pp. 165-168
M.M. Goodwin , AT&T Bell Lab., Murray Hill, NJ, USA
G.W. Elko , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 169-172
G.W. Elko , AT&T Bell Lab., Murray Hill, NJ, USA
M.M. Goodwin , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 173-176
E.D. McKinney , Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
V.E. DeBrunner , Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
pp. 177-180
J. Thi , AT&T Bell Lab., Arlington, VA, USA
D.R. Morgan , Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
pp. 181-184
R.W. Stewart , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
R. Duncan , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
S. Weiss , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 185-188
M.J. Ji , Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
S.M. Kuo , Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
pp. 189-192
K. Brandenburg , Lehrstuhl f. Tech. Elektronik, Erlangen-Nurnberg Univ., Germany
R. Henke , Lehrstuhl f. Tech. Elektronik, Erlangen-Nurnberg Univ., Germany
pp. 193-196
D. Sinha , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 197-200
X. Lin , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R. Steele , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 201-204
M. Paraskevas , Wire Commun. Lab., Patras Univ., Greece
D. Tsoukalas , Wire Commun. Lab., Patras Univ., Greece
J. Mourjopoulos , Wire Commun. Lab., Patras Univ., Greece
pp. 205-208
S.J. Godsill , Dept. of Eng., Cambridge Univ., UK
P.J.W. Rayner , Dept. of Eng., Cambridge Univ., UK
pp. 209-212
T.F. Quatieri , MIT Lincoln Lab., Lexington, MA, USA
R.B. Dunn , MIT Lincoln Lab., Lexington, MA, USA
T.E. Hanna , Wire Commun. Lab., Patras Univ., Greece
pp. 213-216
B. Doval , LAFORIA-Univ., Paris VI, France
X. Rodet , MIT Lincoln Lab., Lexington, MA, USA
pp. 221-224
P. Depalle , IRCAM, Paris, France
G. Garcia , IRCAM, Paris, France
X. Rodet , IRCAM, Paris, France
pp. 225-228
M. Karjalainen , Acoustics Lab., Helsinki Univ. of Technol., Espoo, Finland
J. Backman , Acoustics Lab., Helsinki Univ. of Technol., Espoo, Finland
J. Polkki , IRCAM, Paris, France
pp. 229-232
H. Messer , Dept. of Electr. Eng.-Syst., Tel Aviv Univ., Israel
P.M. Schultheiss , Acoustics Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 233-236
B.X. Li , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 237-240
Q. Jin , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
K.M. Wong , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
Z.Q. Luo , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 241-244
H. Krim , ECE Dept., Northeastern Univ., Boston, MA, USA
J.-C. Pesquet , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
K. Drouiche , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 245-248
F. Martinerie , Thomson Sintra Activites-Sous-Marines, Arcueil, France
pp. 249-252
H. Chuberre , Univ. Rennes I, France
J.-J. Fuchs , Univ. Rennes I, France
pp. 253-256
D. Kraus , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
A. Dhaouadi , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
J.F. Bohme , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 257-260
H. Lee , Atlantic Aerospace Electronics Corp., Waltham, MA, USA
F. Li , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 261-264
W. Chang , NUWC Detachment, New London, CT, USA
B. Bosworth , NUWC Detachment, New London, CT, USA
G.C. Carter , NUWC Detachment, New London, CT, USA
pp. 265-268
B.A. Weisburn , Cornell Univ., Ithaca, NY, USA
S.G. Mitchell , Cornell Univ., Ithaca, NY, USA
C.W. Clark , Cornell Univ., Ithaca, NY, USA
T.W. Parks , Cornell Univ., Ithaca, NY, USA
pp. 269-272
I.M.G. Lourtie , Inst. Superior Tecn., Lisbon, Portugal
G.C. Carter , Cornell Univ., Ithaca, NY, USA
pp. 277-280
M.P. Wylie , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
S. Roy , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
R.F. Schmitt , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 281-284
M.L. Graham , US Naval Undersea Warfare Center Div., Newport, RI, USA
F. O'Brien , US Naval Undersea Warfare Center Div., Newport, RI, USA
K.F. Gong , US Naval Undersea Warfare Center Div., Newport, RI, USA
S.E. Hammel , US Naval Undersea Warfare Center Div., Newport, RI, USA
pp. 285-288
I. Jouny , Dept. of Electr. Eng., Lafayette Coll., Easton, PA, USA
pp. 289-292
H.B. Riley , Dept. of Electr. & Comput. Eng., Ohio Univ., Athens, OH, USA
J.A. Tague , Dept. of Electr. & Comput. Eng., Ohio Univ., Athens, OH, USA
pp. 293-296
H.C. Song , KORDI, APL, Seoul, South Korea
pp. 297-300
M. Lu , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Z.Y. He , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 301-304
J.A. Nuttall , US Naval Undersea Warfare Center, New London, CT, USA
P. Willett , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 305-308
E.C. Real , Lockheed Sanders Inc., Nashua, NH, USA
D.P. Charette , Lockheed Sanders Inc., Nashua, NH, USA
R.A. Gilbert , Lockheed Sanders Inc., Nashua, NH, USA
D.W. Tufts , US Naval Undersea Warfare Center Div., Newport, RI, USA
pp. 309-312
H.C. So , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, NT, Hong Kong
P.C. Ching , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, NT, Hong Kong
H.C. Ho , Lockheed Sanders Inc., Nashua, NH, USA
Y.T. Chan , US Naval Undersea Warfare Center Div., Newport, RI, USA
pp. 313-316
J.C. Di Martino , CRIN/INRIA, Vandoeuvre, France
J.P. Haton , CRIN/INRIA, Vandoeuvre, France
A. Laporte , Lockheed Sanders Inc., Nashua, NH, USA
pp. 317-320
B. Senadji , Ecole Nat. Superieure des Telecommun., Paris, France
Y. Grenier , Ecole Nat. Superieure des Telecommun., Paris, France
pp. 321-324
G.T. Zunich , Information Systems Lab. Inc., Vienna, VA, USA
pp. 325-328
G. Loubet , CEPHA/ENSIEG, St-Martin d'Heres, France
G. Jourdain , CEPHA/ENSIEG, St-Martin d'Heres, France
pp. 329-332
T.G. Manickam , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
R.J. Vaccaro , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 333-336
S.K. Mehta , US Naval Undersea Warfare Center, New London, CT, USA
E.L. Titlebaum , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 337-340
M.G. Parker , Sch. of Eng., Huddersfield Univ., UK
M. Benaissa , Sch. of Eng., Huddersfield Univ., UK
pp. 341-344
S. Sriram , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
E.A. Lee , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 345-348
M. Petrowski , Harris Semiconductor, Melbourne, FL, USA
D.B. Chester , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
W.R. Young , Lockheed Sanders Inc., Nashua, NH, USA
pp. 349-352
A. Lafage , Telecom Paris, France
F. Jutand , Telecom Paris, France
pp. 353-356
L.E. Lucke , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 357-360
G. Shrimali , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 361-364
T.P. Kelliher , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M.J. Irwin , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 365-368
M. Terre , Thomson CSF/CNI, Boulogne Billancourt, France
M. Bellanger , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 373-376
F.F. Islam , Dept. of Electron., Kyoto Univ., Japan
K. Tamaru , Dept. of Electron., Kyoto Univ., Japan
pp. 377-380
M. Potkonjak , NEC USA, Princeton, NJ, USA
J. Rabaey , Dept. of Electron., Kyoto Univ., Japan
pp. 381-384
D.V. Poornaiah , Indian Telephone Ind. Ltd., Bangalore, India
R. Haribabu , Indian Telephone Ind. Ltd., Bangalore, India
M.O. Ahmad , Lockheed Sanders Inc., Nashua, NH, USA
pp. 385-388
D. Soudris , Dept. of Electr. Eng., Patras Univ., Greece
V. Paliouras , Dept. of Electr. Eng., Patras Univ., Greece
T. Stouraitis , Dept. of Electr. Eng., Patras Univ., Greece
A. Skavantzos , US Naval Undersea Warfare Center Div., Newport, RI, USA
pp. 389-392
K. Nourji , Telecom Paris, France
N. Demassieux , Telecom Paris, France
pp. 393-396
J. Schonfeld , Lab. fuer Informationstechnolgie, Hannover Univ., Germany
P. Pirsch , Lab. fuer Informationstechnolgie, Hannover Univ., Germany
pp. 397-400
C. Nagendra , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M. Borah , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M. Vishwanath , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
R.M. Owens , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M.J. Irwin , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 401-404
D.R. Bull , Dept. of Electr. & Electron. Eng., Bristol Univ., UK
G. Wacey , Dept. of Electr. & Electron. Eng., Bristol Univ., UK
J.J. Stone , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
J.M. Soloff , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 405-408
W.-C. Fang , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
T. Shaw , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
J. Yu , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
B. Lau , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Y.-C. Lin , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 409-412
C. Chakrabarti , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 413-416
M. Freericks , Tech. Univ., Berlin, Germany
A. Knoll , Tech. Univ., Berlin, Germany
pp. 417-420
L.-F. Chao , Dept. of Comput. Sci., Princeton Univ., NJ, USA
E.H.-M. Sha , Tech. Univ., Berlin, Germany
pp. 421-424
M. Auguin , Lab. d'Inf. Signaux et Syst., Nice Univ., France
F. Boeri , Lab. d'Inf. Signaux et Syst., Nice Univ., France
C. Carriere , Lab. d'Inf. Signaux et Syst., Nice Univ., France
G. Menez , Lab. d'Inf. Signaux et Syst., Nice Univ., France
pp. 425-428
J.T. Buck , Dept. of EECS, California Univ., Berkeley, CA, USA
E.A. Lee , Dept. of EECS, California Univ., Berkeley, CA, USA
pp. 429-432
P.J. Black , Inf. Syst. Lab., Stanford Univ., CA, USA
T.H.-Y. Meng , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 433-436
H. Park , Dept. of Electr. Eng-Syst., Univ. of Southern California, Los Angeles, CA, USA
V.K. Prasanna , Dept. of Electr. Eng-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 437-440
J. Eldon , Raytheon Semiconductor, La Jolla, CA, USA
pp. 441-444
E. Frantzeskakis , Electr. Eng. Dept., Maryland Univ., College Park, MD, USA
J.S. Baras , Electr. Eng. Dept., Maryland Univ., College Park, MD, USA
K.J.R. Liu , Electr. Eng. Dept., Maryland Univ., College Park, MD, USA
pp. 445-448
M. Bertran , Tech. Univ. of Catalonia, Barcelona, Spain
F. Oller , Tech. Univ. of Catalonia, Barcelona, Spain
J. Forga , Tech. Univ. of Catalonia, Barcelona, Spain
J.A. Frau , Tech. Univ. of Catalonia, Barcelona, Spain
J.M. Espejo , Tech. Univ. of Catalonia, Barcelona, Spain
A. Ripoll , Tech. Univ. of Catalonia, Barcelona, Spain
J.C. Herranz , Tech. Univ. of Catalonia, Barcelona, Spain
pp. 449-452
E.A. Lee , Dept. of EECS, California Univ., Berkeley, CA, USA
pp. 453-456
A. Fauth , Tech. Univ. Berlin, Germany
A. Knoll , Tech. Univ. Berlin, Germany
pp. 457-460
K.H. Yu , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Y.H. Hu , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 461-464
G.I. Kechriotis , Electr. & Comput. Eng. Dept., Northeastern Univ., Boston, MA, USA
E.S. Manolakos , Electr. & Comput. Eng. Dept., Northeastern Univ., Boston, MA, USA
pp. 465-468
K.A. Al-Mashouq , King Saud Univ., Riyadh, Saudi Arabia
I.S. Reed , Electr. & Comput. Eng. Dept., Northeastern Univ., Boston, MA, USA
pp. 469-472
Z. Xiang , Dept. of Radio Eng., Southeast Univ., Nanjing, China
G. Bi , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 473-476
J. Yang , Dept. of Electr. Eng., Brigham Young Univ., Provo, UT, USA
Q. Wu , Dept. of Radio Eng., Southeast Univ., Nanjing, China
J.P. Reilly , Tech. Univ. of Catalonia, Barcelona, Spain
pp. 477-480
V. Ramamurti , Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
S.S. Rao , Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
P.P. Gandhi , Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. 481-484
F.-L. Luo , Dept. of Autom., Tsinghua Univ., Beijing, China
Y.-D. Li , Dept. of Autom., Tsinghua Univ., Beijing, China
pp. 485-488
E. Wilson , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
S. Umesh , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
D.W. Tufts , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 489-492
C.H. Chen , Electr. & Comput. Eng. Dept., Massachusetts Dartmouth Univ., N. Dartmouth, MA, USA
G.G. Lee , Electr. & Comput. Eng. Dept., Massachusetts Dartmouth Univ., N. Dartmouth, MA, USA
pp. 493-496
Z. Wang , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
J.V. Hanson , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 497-500
K. Farrell , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
A.L. Gorin , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 501-504
A.L. Gorin , AT&T Bell Lab., Murray Hill, NJ, USA
L.G. Miller , AT&T Bell Lab., Murray Hill, NJ, USA
S.E. Levinson , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 505-508
A. Basu , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
T. Svendsen , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 509-512
G. Zavaliagkos , Northeastern Univ., Boston, MA, USA
R. Schwartz , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
J. Makhoul , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 513-516
M.G. Rahim , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 517-520
M.P. DeSimio , Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
T.R. Anderson , Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 521-524
B. de Vries , David Sarnoff Res. Center, Princeton, NJ, USA
L. Dias , David Sarnoff Res. Center, Princeton, NJ, USA
J. Pearson , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 525-528
J.E. Diaz-Verdejo , Dpto. de Electronica y Tecnologia de Computadores, Granada Univ., Spain
J.C. Segura-Luna , Dpto. de Electronica y Tecnologia de Computadores, Granada Univ., Spain
A.J. Rubio-Ayuso , Dpto. de Electronica y Tecnologia de Computadores, Granada Univ., Spain
A.M. Peinado-Herreros , Dpto. de Electronica y Tecnologia de Computadores, Granada Univ., Spain
J.L. Perez-Cordoba , Dpto. de Electronica y Tecnologia de Computadores, Granada Univ., Spain
pp. 529-532
A. Mellouk , LRI, UA 410 CNRS, Univ. Paris Sud, Orsay, France
P. Gallinari , Dpto. de Electronica y Tecnologia de Computadores, Granada Univ., Spain
pp. 533-536
H.B.D. Sorensen , Speech Technol. Centre, Aalborg Univ., Denmark
U. Hartmann , Speech Technol. Centre, Aalborg Univ., Denmark
pp. 537-540
Y. Konig , Int. Comput. Sci. Inst., Berkeley, CA, USA
N. Morgan , Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 545-548
M. Fanty , Oregon Grad. Inst. of Sci. & Technol., Beaverton, OR, USA
P. Schmid , Oregon Grad. Inst. of Sci. & Technol., Beaverton, OR, USA
R. Cole , Oregon Grad. Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 549-552
Y. Kato , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
M. Sugiyama , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
pp. 553-556
C. Bregler , Dept. of Comput. Sci., Karlsruhe Univ., Germany
H. Hild , ATR Interpreting Telephony Res. Lab., Soraku-gun, Kyoto, Japan
S. Manke , Oregon Grad. Inst. of Sci. & Technol., Beaverton, OR, USA
A. Waibel , Dpto. de Electronica y Tecnologia de Computadores, Granada Univ., Spain
pp. 557-560
P. Le Cerf , Katholieke Univ. Leuven, Heverlee, Belgium
D. Van Compernolle , Katholieke Univ. Leuven, Heverlee, Belgium
pp. 561-564
R.P. Lippmann , MIT Lincoln Lab., Lexington, MA, USA
E. Singer , MIT Lincoln Lab., Lexington, MA, USA
pp. 565-568
J. Alvarez-Cercadillo , ETSI Telecommun, UPM, Madrid, Spain
J. Ortega-Garcia , ETSI Telecommun, UPM, Madrid, Spain
L.A. Hernandez-Gomez , ETSI Telecommun, UPM, Madrid, Spain
pp. 569-572
S. Moon , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
J.-N. Hwang , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 573-576
J.S. Taur , Princeton Univ., NJ, USA
S.Y. Kung , Princeton Univ., NJ, USA
pp. 577-580
L. Xu , Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
M.R. Azimi-Sadjadi , Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
pp. 581-584
J.-N. Hwang , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
E.T.Y. Chen , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
A.F. Lippman , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 585-588
H. Chen , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
R.-W. Liu , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 589-592
P. Yee , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 597-600
J.J. Rajan , Dept. of Eng., Cambridge Univ., UK
P.J.W. Rayner , Dept. of Eng., Cambridge Univ., UK
pp. 601-604
A. Falaschi , Inst. of Elettron., Perugia Univ., Italy
A. Baldassarra , Dept. of Eng., Cambridge Univ., UK
G. Martinelli , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
L.P. Ricotti , Dpto. de Electronica y Tecnologia de Computadores, Granada Univ., Spain
pp. 605-608
R.D. Dony , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 609-612
S. Haykin , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
B.V.K. Vijaya Kumar , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 613-616
C. Shang , Dept. of Comput. & Electr. Eng., Heriot-Watt Univ., Edinburgh, UK
K. Brown , Dept. of Comput. & Electr. Eng., Heriot-Watt Univ., Edinburgh, UK
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A. Sankar , AT&T Bell Lab., Murray Hill, NJ, USA
A. Gorin , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 621-624
U. Bodenhausen , Comput. Sci. Dept., Karlsruhe Univ., Germany
S. Manke , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 625-628
N. Guglielmi , DEIS, Bologna Univ., Italy
R. Guerrieri , DEIS, Bologna Univ., Italy
M. Mastretta , DEIS, Bologna Univ., Italy
L. De Vena , DEIS, Bologna Univ., Italy
pp. 629-632
H. Li , Coll. of Med. Eng. & Arts & Sci., Univ. of South Florida, Tampa, FL, USA
W. Qian , Coll. of Med. Eng. & Arts & Sci., Univ. of South Florida, Tampa, FL, USA
L.P. Clarke , Coll. of Med. Eng. & Arts & Sci., Univ. of South Florida, Tampa, FL, USA
M. Kallergi , Coll. of Med. Eng. & Arts & Sci., Univ. of South Florida, Tampa, FL, USA
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T. Denk , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
V. Cherkassky , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 637-640
A. Tirakis , Dept. Electr. Eng., Nat. Tech. Univ. of Athens, Greece
S. Kollias , Dept. Electr. Eng., Nat. Tech. Univ. of Athens, Greece
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Q.-Z. Wu , Telecommun. Lab., Min. of Transp. & Commun., Chung-Li, Taiwan
B.-S. Jeng , Telecommun. Lab., Min. of Transp. & Commun., Chung-Li, Taiwan
Y.-F. Kuan , Telecommun. Lab., Min. of Transp. & Commun., Chung-Li, Taiwan
K.-S. Chou , Telecommun. Lab., Min. of Transp. & Commun., Chung-Li, Taiwan
M.-T. Chen , Telecommun. Lab., Min. of Transp. & Commun., Chung-Li, Taiwan
T.-K. Su , Telecommun. Lab., Min. of Transp. & Commun., Chung-Li, Taiwan
pp. 645-648
H. Hanek , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
N. Ansari , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
Z.Z. Zhang , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 649-652
pp. 0_1-652
J.L. Flanagan , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 1vol.1-652
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