The Community for Technology Leaders
RSS Icon
Subscribe
Acoustics, Speech, and Signal Processing, IEEE International Conference on (1992)
San Francisco, CA, USA
Mar. 23, 1992 to Mar. 26, 1992
ISBN: 0-7803-0532-9
TABLE OF CONTENTS
R. Stasinski , Dept. of Electron. & Commun., Tech. Univ. of Poznan, Poland
pp. 1-4
D. Schonfeld , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 5-8
D.P.-K. Lun , Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
W.-C. Siu , Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
pp. 9-12
C. Lu , Dept. of Comput. Sci., Towson State Univ., Baltimore, MD, USA
R. Tolimieri , Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
pp. 13-16
J. Chen , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
H. Sorensen , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 17-20
F. Desbouvries , Inst. Nat. des Telecommun., Evry, France
C. Gueguen , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 21-24
A. Wojtkiewicz , Inst. of Electron. Fund., Warsaw Univ. of Technol., Poland
M. Tuszynski , Inst. of Electron. Fund., Warsaw Univ. of Technol., Poland
pp. 25-28
R.S. Orr , Atlantic Aerospace Electron. Corp., Greenbelt, MD, USA
J.M. Morris , Inst. of Electron. Fund., Warsaw Univ. of Technol., Poland
pp. 29-31
Wan-Chi Siu , Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
D.P.K. Lun , Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
pp. 33-36
L.C. Ludeman , Dept. of Electr. & Comput. Eng., New Mexico State Univ., Las Cruces, NM, USA
pp. 37-40
H. Shahri , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 41-44
H. Kanai , Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
N. Chubachi , Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
pp. 45-48
P. Comon , Thomson-Sintra, Valbonne, France
pp. 49-52
A.N. Skodras , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 53-55
T. Ebrahimi , Lab. de Traitement des Signaux, EPFL-Ecublens, Lausanne, Switzerland
M. Kunt , Lab. de Traitement des Signaux, EPFL-Ecublens, Lausanne, Switzerland
pp. 57-60
S. Shaw , SRI Int., Menlo Park, CA, USA
T. Garvey , SRI Int., Menlo Park, CA, USA
pp. 61-64
W.A. Kittel , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.H. Hayes , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 65-68
M.N. Brown , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
R.W. Stewart , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
T.S. Durrani , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 69-72
E. Dorken , Boston Univ., MA, USA
S.H. Nawab , Boston Univ., MA, USA
V.R. Lesser , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 73-76
R.A. Nobakht , IBM Corp., Research Triangle Park, NC, USA
pp. 77-80
A. Drygajlo , Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 81-84
S.A. Martucci , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 85-88
S.R. Powell , Dept. of Electron. Comput. Eng., California Univ., La Jolla, CA, USA
P.M. Chau , Dept. of Electron. Comput. Eng., California Univ., La Jolla, CA, USA
pp. 89-92
T. Kobayashi , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
K. Fukushi , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
K. Tokuda , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 93-96
K. Schwarz , Lehrstuhl fuer Nachrichtentechnik, Erlangen-Nurnberg Univ., Germany
R. Reng , Lehrstuhl fuer Nachrichtentechnik, Erlangen-Nurnberg Univ., Germany
H.W. Schussler , Lehrstuhl fuer Nachrichtentechnik, Erlangen-Nurnberg Univ., Germany
pp. 97-100
M. Schulist , Lehrstuhl fuer Nachrichtentechnik, Erlangen-Nurnberg Univ., Germany
pp. 101-104
Z.-J. Mou , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 105-108
C. Young , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
D.L. Jones , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 109-112
L. Cohen , CAIP Res. Center, Rutgers Univ., Piscataway, NJ, USA
pp. 113-116
J.P. Ovarlez , ONERA, Chatillon, France
J. Bertrand , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
P. Bertrand , Lehrstuhl fuer Nachrichtentechnik, Erlangen-Nurnberg Univ., Germany
pp. 117-120
J. Wilbur , US Naval Coastal Syst. Center, Panama City Beach, FL, USA
pp. 121-124
P.J. Loughlin , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
J.W. Pitton , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
L.E. Atlas , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 125-128
E.L. Titlebaum , Dept. of Electr. Eng., Rochester Univ., NY, USA
S.K. Mehta , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 129-132
C.E. Davila , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
M.S. Mobin , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 133-136
R.G. Braniuk , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
D.L. Jones , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 137-140
X. Yu , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
I.S. Reed , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
W. Kraske , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
A.D. Stocker , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 141-144
N.S. Kontoyannis , Bradley Dept. of Electr. Eng., Virginia Tech, Blacksburg, VA, USA
J.R. Mitchell , Bradley Dept. of Electr. Eng., Virginia Tech, Blacksburg, VA, USA
A.A. Beex , Bradley Dept. of Electr. Eng., Virginia Tech, Blacksburg, VA, USA
pp. 145-148
Y. Takizawa , Commun. Syst. Lab., OKI Electr., Toyko, Japan
A. Fukasawa , Commun. Syst. Lab., OKI Electr., Toyko, Japan
pp. 149-152
M.A. Lagunas , Dept. de TSC, ETSI de Telecomun., Barcelona, Spain
A. Pages , Dept. de TSC, ETSI de Telecomun., Barcelona, Spain
pp. 153-156
P. Goncalves , CNRS, Ecole Normale Superieure de Lyon, Lyon, France
P. Flandrin , CNRS, Ecole Normale Superieure de Lyon, Lyon, France
pp. 157-160
P.M. Djuric , Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
S.M. Kay , CNRS, Ecole Normale Superieure de Lyon, Lyon, France
G.F. Boudreaux-Bartels , Bradley Dept. of Electr. Eng., Virginia Tech, Blacksburg, VA, USA
pp. 161-164
N. Zhou , Dept. of Electr. Eng. & Comput. Sci., Norwegian Inst. of Technol., Trondheim, Norway
N. Holte , Dept. of Electr. Eng. & Comput. Sci., Norwegian Inst. of Technol., Trondheim, Norway
pp. 165-168
P.A. Regalia , Dept. Electron. et Commun., Inst. Nat. des Telecommun., Evry, France
pp. 169-172
S. Barbarossa , INFO-COM Dept., Rome Univ., Italy
A. Zanalda , INFO-COM Dept., Rome Univ., Italy
pp. 173-176
G.S. Cunningham , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
W.J. Williams , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 177-180
A. Papandreou , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
G.F. Boudreaux-Bartels , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 181-184
R.G. Shenoy , Schlumberger-Doll Res., Ridgefield, CT, USA
T.W. Parks , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 185-188
J.I. Portillo-Garcia , E.T.S. de Ingenieros de Telecommun., Ciudad Univ., Madrid, Spain
J.R. Casar-Corredera , E.T.S. de Ingenieros de Telecommun., Ciudad Univ., Madrid, Spain
G. de Miguel-Vela , E.T.S. de Ingenieros de Telecommun., Ciudad Univ., Madrid, Spain
pp. 189-192
B. Boashash , Centre for Signal Process. Res., Queensland Univ. of Technol., Brisbane, Qld., Australia
G. Frazer , Centre for Signal Process. Res., Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 193-196
J.R. Fonollosa , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
C.L. Nikias , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 197-200
G.R. Wilson , Appl. Res. Lab., Texas Univ., Austin, TX, USA
K.R. Hardwicke , Appl. Res. Lab., Texas Univ., Austin, TX, USA
R.T. Trochta , Appl. Res. Lab., Texas Univ., Austin, TX, USA
pp. 201-204
D.C. Shin , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
J.M. Mendel , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 205-208
Z. Shi , Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
F.W. Fairman , Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 209-212
V. Chandran , Washington State Univ., Pullman, WA, USA
S.L. Elgar , Washington State Univ., Pullman, WA, USA
pp. 213-216
E. Dilaveroglu , Colorado Univ., Colarado Springs, CO, USA
M.A. Wickert , Colorado Univ., Colarado Springs, CO, USA
pp. 217-220
J. Reichert , Inst. for RF-Eng., Tech. Univ. of Darmstadt, Germany
pp. 221-224
D.H. Brooks , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 225-228
A.V. Dandawate , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
G.B. Giannakis , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 229-232
M. Wax , RAFAEL, Haifa, Israel
pp. 233-236
K. Krim , Lab. des Signaux et Systemes, Gif-sur-Yvette, France
J.G. Proakis , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 237-240
Q. Wu , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
K.M. Wong , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
J.P. Reilly , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 241-244
M.D. Zoltowski , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
C.P. Mathews , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 245-248
L. Tong , Dept. of Electr. & Comput. Eng., West Virginia Univ., Morgantown, WV, USA
R. Liu , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 249-252
J.O. Jonsson , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
A.O. Steinhardt , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 253-256
C. Roller , Melpar Div., E-Systems, Fairfax, VA, USA
W. Wasylkiwskyj , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 257-260
B. Jost , Georgia Inst. of Technol., Atlanta, GA, USA
D.B. Williams , Georgia Inst. of Technol., Atlanta, GA, USA
pp. 261-264
J.A. Marks , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.M. Buckley , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 265-268
K. Diepold , Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
R. Pauli , Inst. for Network Theory & Circuit Design, Tech. Univ. Munich, Germany
pp. 269-272
R.M. Liang , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K.S. Arun , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 273-276
J.A. Cadzow , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
D.M. Wilkes , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
pp. 277-280
S. Kay , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
V. Nagesha , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 281-284
J.C. Preisig , Dept. of Appl. Ocean Phys. & Eng., Woods Hole Oceanogr. Inst., MA, USA
pp. 285-288
N. Antoniadis , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.O. Heo , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 289-292
M.F. Griffin , United Technologies Res. Center, East Hartford, CT, USA
E.C. Boman , United Technologies Res. Center, East Hartford, CT, USA
G.W. Stewart , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 293-296
A.P. Quinn , Dept. of Eng., Cambridge Univ., UK
pp. 297-300
P. Bondon , Lab. de Signaux et Syst., Gif-sur-Yvette, France
M. Benidir , Lab. de Signaux et Syst., Gif-sur-Yvette, France
B. Picinbono , Lab. de Signaux et Syst., Gif-sur-Yvette, France
pp. 301-304
K. Yao , Dept. of Eng., California Univ., Los Angeles, CA, USA
F. Lorenzelli , Dept. of Eng., California Univ., Los Angeles, CA, USA
J. Kong , Dept. of Eng., California Univ., Los Angeles, CA, USA
pp. 305-308
A.R.N. Nilchi , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
V.J. Mathews , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 309-312
A.M. Fraser , Portland State Univ., OR, USA
pp. 313-316
O. Michel , Ecole Normale Superieure de Lyon, France
P. Flandrin , Ecole Normale Superieure de Lyon, France
pp. 317-320
J.S. Brush , RTA Corp., Springfield, VA, USA
J.B. Kadtke , Ecole Normale Superieure de Lyon, France
pp. 321-324
A.C. Singer , Res. Lab. of Electron., MIT, Cambridge, MA, USA
G.W. Wornell , Res. Lab. of Electron., MIT, Cambridge, MA, USA
A.V. Oppenheim , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 325-328
D.F. Drake , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
D.B. Williams , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 329-332
A. Sano , Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
H. Tsuji , Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
H. Ohmori , Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
pp. 333-336
M. Nayeri , Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
M. Nayeri , Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
M.M. Krunz , Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 337-340
E.M. Dowling , Center for Eng. Math., Texas Univ., Richardson, TX, USA
R.D. DeGroat , Center for Eng. Math., Texas Univ., Richardson, TX, USA
D.A. Linebarger , Center for Eng. Math., Texas Univ., Richardson, TX, USA
pp. 341-344
S. Valaee , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal , Center for Eng. Math., Texas Univ., Richardson, TX, USA
pp. 345-348
G. Xu , Inf. Syst. Lab., Stanford Univ., CA, USA
R.H. Roy , Center for Eng. Math., Texas Univ., Richardson, TX, USA
T. Kailath , Center for Eng. Math., Texas Univ., Richardson, TX, USA
pp. 349-352
K.A. Burgess , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
B.D. Van Veen , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 353-356
S. Bose , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
A.O. Steinhardt , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 357-360
M.J. Sousa , The MITRE Corp., Bedford, MA, USA
pp. 361-364
V. Nagesha , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
S. Kay , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
J. Salisbury , Center for Eng. Math., Texas Univ., Richardson, TX, USA
pp. 365-368
R. Onn , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
A.O. Steinhardt , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 369-372
H. Wang , Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA
L. Cai , Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA
pp. 373-376
W.G. Chen , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
J.P. Reilly , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
K.M. Wong , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 377-380
Q.T. Zhang , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
K.M. Wong , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 381-384
A. Drosopoulos , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 385-388
H. Liu , Dept. of Electr. Eng., Portland State Univ., OR, USA
F. Li , Dept. of Electr. Eng., Portland State Univ., OR, USA
pp. 389-392
A.A. Shah , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
D.W. Tufts , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 393-396
D.J. Yemc , Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
pp. 397-400
A.L. Swindlehurst , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 401-404
W. Xu , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M. Kaveh , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 405-408
B. Champagne , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 409-412
M. Cabrera , ETSI Telecommun., Univ. Politechnica de Cataluna, Barcelona, Spain
M.A. Lagunas , ETSI Telecommun., Univ. Politechnica de Cataluna, Barcelona, Spain
pp. 413-416
J. Li , Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
J. Li , ETSI Telecommun., Univ. Politechnica de Cataluna, Barcelona, Spain
pp. 417-420
C.M. Monti , Dept. of Electron. & Inf., Padova Univ., Italy
G.L. Pierobon , Dept. of Electron. & Inf., Padova Univ., Italy
U. Viaro , Dept. of Electron. & Inf., Padova Univ., Italy
pp. 421-424
J.D. George , Signalmetrics Inc., Winter Park, FL, USA
R.R. Muise , Dept. of Electron. & Inf., Padova Univ., Italy
J.S. Abel , Dept. of Electron. & Inf., Padova Univ., Italy
pp. 425-428
T.P. Bronez , MITRE Corp., McLean, VA, USA
D.S. Brown , MITRE Corp., McLean, VA, USA
pp. 429-432
J.-T. Yang , Dept. of Electr. & comput. Eng., Pennsylvania State Univ., University Park, PA, USA
S.D. Cabrera , Dept. of Electr. & comput. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 433-436
G.A. Zimmerman , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
E.T. Olsen , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 437-440
A.A. Platonov , Inst. of Electron. Fundamentals, Warsaw Univ. of Technol., Poland
Z.K. Gajo , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
J. Szabatin , Dept. of Electron. & Inf., Padova Univ., Italy
pp. 441-444
M. Garci-Otero , ETSI Telecommun.-UPM, Ciudad Univ., Madrid, Spain
pp. 445-448
J. Tsao , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
W.-J. Shyu , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 449-452
J. Schroeder , Dept. of Eng., Denver Univ., CO, USA
J. Lansford , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 453-456
P.L. Ainsleigh , US Naval Res. Lab., Orlando, FL, USA
J.D. George , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 457-460
M.R. Raghuveer , Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
S.A. Dianat , Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
pp. 461-464
R.D. DeGroat , Center for Eng. Math., Texas Univ., Richardson, TX, USA
L.R. Hunt , Center for Eng. Math., Texas Univ., Richardson, TX, USA
D.A. Linebarger , Center for Eng. Math., Texas Univ., Richardson, TX, USA
pp. 465-468
T. Ning , Dept. of Eng. & Comput. Sci., Trinity Coll., Hartford, CT, USA
S.M. Gao , Center for Eng. Math., Texas Univ., Richardson, TX, USA
pp. 469-472
J.A.R. Fonollosa , ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Vidal , ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
A. Moreno , ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 473-476
P.O. Amblard , CEPHAG-ENSIEG, St. Martin d'Heres, France
D. Baudois , CEPHAG-ENSIEG, St. Martin d'Heres, France
J.L. Lacoume , CEPHAG-ENSIEG, St. Martin d'Heres, France
pp. 477-480
L.F. Chaparro , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
L. Luo , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 481-484
A.K. Nandi , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
C.A. Greated , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 485-488
B. Shafai , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
S. Mo , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 489-492
S.B. Kim , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
E.J. Powers , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 493-496
P.M.T. Broersen , Fac. of Appl. Phys., Delft Univ. of Technol., Netherlands
H.E. Wensink , Fac. of Appl. Phys., Delft Univ. of Technol., Netherlands
pp. 497-500
J. Le Roux , Univ. de Nice, CNRS, Valbonne, France
pp. 501-504
K.M.M. Prabhu , Dept. of Electr. Eng., Indian Inst. of Tech., Madras, India
K.B. Bagan , Fac. of Appl. Phys., Delft Univ. of Technol., Netherlands
pp. 505-508
M.G. Ruano , Sch. of Electr. Eng. Sci., Univ. Coll. of North Wales, Bangor, UK
P.J. Fish , Sch. of Electr. Eng. Sci., Univ. Coll. of North Wales, Bangor, UK
pp. 513-516
A. Ferrari , LASSY, Univ. de Nice-Sophia Antipolis, France
G. Alengrin , LASSY, Univ. de Nice-Sophia Antipolis, France
C. Theys , LASSY, Univ. de Nice-Sophia Antipolis, France
pp. 517-520
J. Sanubari , Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
K. Tokuda , Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
M. Onoda , Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
pp. 521-524
D.M. Wilkes , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
G. Liang , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
J.A. Cadzow , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
pp. 525-528
A. Spanias , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
G. Lim , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
P. Loizou , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
M. Deisher , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 529-532
G.S. Edelson , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
R. Kumaresan , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
D.W. Tufts , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 533-536
S.-S. Hang , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
R. Jain , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 537-540
G. Menez , Dept. de l'URA, CNRS, Univ. de Nice-Sophia Antipolis, France
M. Auguin , Dept. de l'URA, CNRS, Univ. de Nice-Sophia Antipolis, France
F. Boeri , Dept. de l'URA, CNRS, Univ. de Nice-Sophia Antipolis, France
C. Carriere , Dept. de l'URA, CNRS, Univ. de Nice-Sophia Antipolis, France
pp. 541-544
M.A. Bayoumi , Univ. of Southwestern Louisiana, Lafayette, LA, USA
N.A. Ramakrishna , Univ. of Southwestern Louisiana, Lafayette, LA, USA
V. Israni , Univ. of Southwestern Louisiana, Lafayette, LA, USA
R.K. Jayam , Univ. of Southwestern Louisiana, Lafayette, LA, USA
pp. 545-548
I. Kuroda , NEC Corp., Kawasaki, Japan
T. Nishitani , NEC Corp., Kawasaki, Japan
pp. 549-552
D.B. Powell , Condisco Systems, Foster City, CA, USA
E.A. Lee , NEC Corp., Kawasaki, Japan
W.C. Newman , Univ. of Southwestern Louisiana, Lafayette, LA, USA
pp. 553-556
P.E. Beckmann , Res. Lab. of Electron., MIT, Cambridge, MA, USA
B.R. Musicus , NEC Corp., Kawasaki, Japan
pp. 557-560
G.R. Gao , McGill Univ., Montreal, Que., Canada
R. Govindarajan , McGill Univ., Montreal, Que., Canada
P. Panangaden , McGill Univ., Montreal, Que., Canada
pp. 561-564
L.-F. Chao , Dept. of Comput. Sci., Princeton Univ., NJ, USA
E.H.-M. Sha , Dept. of Comput. Sci., Princeton Univ., NJ, USA
pp. 565-568
M. Potkonjak , NEC C&C Res. Lab., Princeton, NJ, USA
J. Rabaey , Dept. of Comput. Sci., Princeton Univ., NJ, USA
pp. 569-572
N. Ling , Dept. of Comput. Eng., Santa Clara Univ., CA, USA
T. Shih , Dept. of Comput. Eng., Santa Clara Univ., CA, USA
J. Huang , Dept. of Comput. Eng., Santa Clara Univ., CA, USA
pp. 573-576
G. Mirchandani , Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
G. Mirchandani , Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
J. Michel , Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
P. Twombly , Univ. of Southwestern Louisiana, Lafayette, LA, USA
pp. 577-580
P. Hoang , Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
J. Rabaey , Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
pp. 581-584
F. Lorenzelli , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
K. Yao , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 585-588
B.A. Curtis , IBM, Boca Raton, FL, USA
V.K. Madisetti , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 589-592
P.R. Gelabert , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
P.R. Gelabert , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 593-596
T. Hamada , California Univ., La Jolla, CA, USA
S. Banerjee , California Univ., La Jolla, CA, USA
P.M. Chau , California Univ., La Jolla, CA, USA
R.D. Fellman , California Univ., La Jolla, CA, USA
pp. 597-600
M. Karjalainen , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 601-604
P. Duncan , California Univ., Los Angeles, CA, USA
S. Swamy , California Univ., Los Angeles, CA, USA
S. Sprouse , California Univ., Los Angeles, CA, USA
D. Potasz , California Univ., Los Angeles, CA, USA
R. Jain , California Univ., Los Angeles, CA, USA
pp. 605-608
B.P. McGovern , Inst. of Adv. Microelectron., Queen's Univ., Belfast, UK
R.F. Woods , Inst. of Adv. Microelectron., Queen's Univ., Belfast, UK
J.V. McCanny , Inst. of Adv. Microelectron., Queen's Univ., Belfast, UK
pp. 609-612
T. Yoshino , Texas Instruments Tsukuba Res. & Dev. Center, Japan
H. Nishimura , Inst. of Adv. Microelectron., Queen's Univ., Belfast, UK
pp. 613-616
E. Bernard , Inst. for Network Theory & Circuit Design, Tech. Univ., Munich, Germany
J.G. Krammer , Inst. for Network Theory & Circuit Design, Tech. Univ., Munich, Germany
M. Sauer , Inst. for Network Theory & Circuit Design, Tech. Univ., Munich, Germany
R. Schweizer , Inst. for Network Theory & Circuit Design, Tech. Univ., Munich, Germany
pp. 617-620
J.-I. Guo , Nat. Chiao Tung Univ., Hsinchu, Taiwan
C.-M. Liu , Nat. Chiao Tung Univ., Hsinchu, Taiwan
C.-W. Jen , Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 621-624
E.H.-M. Sha , Dept. of Comput. Sci., Princeton Univ., NJ, USA
K. Steiglitz , Dept. of Comput. Sci., Princeton Univ., NJ, USA
pp. 625-628
P.J. Black , Inf. Syst. Lab., Stanford Univ., CA, USA
T.H.-Y. Meng , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 629-632
A.R. Ansari , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
F.J. Taylor , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 633-636
C.-F. Chang , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
B.J. Sheu , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
H. Okada , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 637-640
M.J. Irwin , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
R.M. Owens , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 641-644
L.E. Lucke , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 645-648
M. Vishwanath , Dept. of Comput. Sci., Pennylvania State Univ., University Park, PA, USA
R.M. Owens , Dept. of Comput. Sci., Pennylvania State Univ., University Park, PA, USA
pp. 649-652
H.-D. Lin , AT&T Bell Lab., Holmdel, NJ, USA
D.G. Messerschmitt , Dept. of Comput. Sci., Pennylvania State Univ., University Park, PA, USA
pp. 653-656
M. Karaman , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
E. Kolagasioglu , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
A. Atalar , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 657-660
I. Tamitani , NEC Corp., Kawasaki, Japan
M. Ohta , NEC Corp., Kawasaki, Japan
Y. Ooi , NEC Corp., Kawasaki, Japan
A. Yoshida , NEC Corp., Kawasaki, Japan
M. Nomura , NEC Corp., Kawasaki, Japan
H. Koyama , NEC Corp., Kawasaki, Japan
T. Nishitani , NEC Corp., Kawasaki, Japan
pp. 661-664
G. Dudley , PictureTel Corp., Peabody, MA, USA
M. Nieman , PictureTel Corp., Peabody, MA, USA
S. Vernick , PictureTel Corp., Peabody, MA, USA
pp. 665-668
A. Razavi , Zoran Corp., Santa Clara, CA, USA
R. Adar , Zoran Corp., Santa Clara, CA, USA
I. Shenberg , Zoran Corp., Santa Clara, CA, USA
R. Retter , Zoran Corp., Santa Clara, CA, USA
R. Friedlander , Zoran Corp., Santa Clara, CA, USA
pp. 669-672
C.D. Summerfield , Syrinx Speech Systems Pty Ltd., Waterloo, NSW, Australia
R.F. Lyon , Zoran Corp., Santa Clara, CA, USA
pp. 673-676
A. Madisetti , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
R. Jain , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
R.L. Baker , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
R. Dianysian , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 677-680
T. Araki , Matsushita Electric Ind. Co. Ltd., Osaka, Japan
M. Toyokura , Matsushita Electric Ind. Co. Ltd., Osaka, Japan
M. Wakamori , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
K. Aono , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 681-684
J. Venbrux , NASA Space Eng. Res. Center, Idaho Univ., Moscow, ID, USA
M. Liu , NASA Space Eng. Res. Center, Idaho Univ., Moscow, ID, USA
pp. 685-688
S.S. Ardalan , North Carolina A&T State Univ., Greensboro, NC, USA
J. Foster , North Carolina A&T State Univ., Greensboro, NC, USA
T.-K. Wang , North Carolina A&T State Univ., Greensboro, NC, USA
pp. 689-692
S. Cucchi , DSP Lab., ALCATEL Telettra, Vimercate, Italy
M. Fratti , DSP Lab., ALCATEL Telettra, Vimercate, Italy
pp. 693-696
6 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool