- I
- ICASSP
- 1992
- Acoustics, Speech, and Signal Processing, 1992. ICASSP-92 Vol 4., 1992 IEEE International Conference on
| | This Publication | |
| | | |
| |
| |
| | Bibliographic References | |
| |
| |
| | |
Acoustics, Speech, and Signal Processing, 1992. ICASSP-92 Vol 4., 1992 IEEE International Conference on
San Francisco, CA, USA
March 23-March 26
ISBN: 0-7803-0532-9
Table of Contents
M. Mboup, Lab. des Signaux et Syst. et Groupement de Recherche TDSI, CNRS-ESE, Gif-sur-Yvette, France
M. Bonnet, Lab. des Signaux et Syst. et Groupement de Recherche TDSI, CNRS-ESE, Gif-sur-Yvette, France
pp. 1-4
L.S. Wen, CNET, Issy-Les-Moulineaux, France
pp. 5-8
G.K. Boray, Bell-Northern Res., Richardson, TX, USA
pp. 13-16
K. Hilal, CNET Centre Paris B, Issy-Les-Moulineaux, France
P. Duhamel, CNET Centre Paris B, Issy-Les-Moulineaux, France
pp. 17-20
L.S. Resende, DECOM/FEE, Univ. de Campinas, Sao Paulo, Brazil
pp. 21-24
K.M. Tao, Integrated Systems Inc., Santa Clara, CA, USA
pp. 25-28
R.C. North, Center for Ultra-High Speed Integrated Circuits & Syst., California Univ., La Jolla, CA, USA
J.R. Zeidler, Center for Ultra-High Speed Integrated Circuits & Syst., California Univ., La Jolla, CA, USA
W.H. Ku, CNRS URA, Telecom Paris, France
pp. 33-36
R. Nambiar, Sch. of Eng. & Comput. Sci., Durham Univ., UK
P. Mars, CNRS URA, Telecom Paris, France
pp. 41-44
K. Zhao, Dept. of Electr. & Comput. Eng., Northwestern Univ., Boston, MA, USA
F. Ling, Wisconsin Univ., Madison, WI, USA
pp. 49-52
L. Yin, Dept. of Electr. Eng., Tampere Univ. of Technol., Finland
J. Astola, Dept. of Electr. Eng., Tampere Univ. of Technol., Finland
Y. Neuvo, Dept. of Electr. Eng., Tampere Univ. of Technol., Finland
pp. 53-56
N. Ansari, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
Y. Huang, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
J.-H. Lin, Dept. of Electr. Eng., Tampere Univ. of Technol., Finland
pp. 57-60
W.S. Gan, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
J.J. Soraghan, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
R.W. Stewart, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
T.S. Durrani, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 65-68
P.C.W. Sommen, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
E. de Wilde, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
pp. 69-72
S.L. Wood, Dept. of Electr. Eng., Santa Clara Univ., CA, USA
pp. 77-80
E.A. Lee, Dept. of Electron. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 81-84
M. Herbrt, Lehrstuhl fur Nachrichtentechnik, Erlangen Univ., Germany
H.W. Schussler, Lehrstuhl fur Nachrichtentechnik, Erlangen Univ., Germany
pp. 85-88
G.E. Sobelman, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 89-92
C.S. Burrus, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 93-96
M.B. Grady, Texas Instruments Inc., Dallas, TX, USA
pp. 97-100
G.F. McLean, Dept. of Mech. Eng., Victoria Univ., BC, Canada
E.D. Graham, Lehrstuhl fur Nachrichtentechnik, Erlangen Univ., Germany
M.E. Jernigan, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 101-104
V.K. Ingle, Commun. & Digital Signal Process. Center for Res. & Graduate Studies, Northeastern Univ., Boston, MA, USA
J.G. Proakis, Commun. & Digital Signal Process. Center for Res. & Graduate Studies, Northeastern Univ., Boston, MA, USA
pp. 105-108
M. Bellanger, Commun. & Digital Signal Process. Center for Res. & Graduate Studies, Northeastern Univ., Boston, MA, USA
H. Mimoun, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
H.A. Gancedo, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 109-112
G.W. Wornell, Res. Lab. of Electron., MIT, Cambridge, MA, USA
K.M. Cuomo, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 117-120
J.J. Sidorowich, Inst. for Nonlinear Sci., California Univ., La Jolla, CA, USA
pp. 121-124
S. Haykin, McMaster Univ., Hamilton, Ont., Canada
H. Leung, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 125-128
C. Myers, Lockheed Sanders Inc., Nashua, NH, USA
S. Kay, Res. Lab. of Electron., MIT, Cambridge, MA, USA
M. Richard, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 129-132
G.W. Wornell, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 133-136
L. Pecora, US Naval Res. Lab., Washington, DC, USA
T. Carroll, US Naval Res. Lab., Washington, DC, USA
pp. 137-140
P.C. Doerschuk, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 141-144
J. Weng, Ecole Polytech. de Montreal, Que., Canada
pp. 145-148
W. Kim, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.H. Hayes, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 149-152
D.M. Goodman, Lawrence Livermore Nat. Lab., Livermore, CA, USA
D.R. Yu, Lawrence Livermore Nat. Lab., Livermore, CA, USA
pp. 153-156
I. Sadka, Dept. of Electr. Eng.-Syst., Tel-Aviv Univ., Israel
H. Ur, Dept. of Electr. Eng.-Syst., Tel-Aviv Univ., Israel
pp. 157-160
S. Hein, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
A. Zakhor, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 161-164
N.T. Thao, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
M. Vetterli, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 165-168
P. Moulin, Bell Commun. Res., Morristown, NJ, USA
pp. 169-172
L.C. Potter, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
D. Chiang, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 173-176
Y.S. Zhu, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
S.W. Leung, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 177-180
M.V. Dragosevic, Dept. of Comput. Syst. Design, 'Boris Kridic' Inst. of Nucl. Sci., Belgrade, Yugoslavia
S.S. Stankovic, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 181-184
H.M. Ahmed, Dept. of Electron. & Comput. Sci., Boston Univ., MA, USA
F. Rauf, Dept. of Electron. & Comput. Sci., Boston Univ., MA, USA
pp. 185-188
C. Vignat, Lab. des Signaux et Systemes, Gif-sur-Yvette, France
C. Uhl, Dept. of Electron. & Comput. Sci., Boston Univ., MA, USA
S. Marcos, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 189-192
Y.H. Hu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
H.E. Liao, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 193-196
K.X. Miao, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
H. Fan, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 197-200
N.J. Bershad, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
J.J. Shynk, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 201-204
G. Mathew, Indian Inst. of Sci., Bangalore, India
V.U. Reddy, Indian Inst. of Sci., Bangalore, India
S. Dasgupta, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 205-208
X.Q. Liu, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
H. Fan, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
K.X. Miao, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 209-212
W. Alexander, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
M. Chouikha, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 213-216
C.-H. Wu, Dept. of Electr. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle, Dept. of Electr. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 217-219
J.M. Skutnik, US Naval Underwater Syst. Center, New London, CT, USA
G. Coutu, Katholieke Univ., Leuven, Heverlee, Belgium
G. Exley, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 225-228
H. Sakai, Fac. of Eng., Kyoto Univ., Japan
pp. 233-236
P.F. Campos, AT&T Network Syst. Nederland B.V., Hilversum, Netherlands
pp. 237-240
K.M. Knill, Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
J.A. Chambers, Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
pp. 241-244
J.C. Principe, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
B. de Vries, Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
pp. 245-248
R. Atay, Equipe Signal et Image, Talence, France
P. Baylou, Equipe Signal et Image, Talence, France
M. Najim, Equipe Signal et Image, Talence, France
pp. 249-252
P.M. Clarkson, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
G.A. Williamson, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 253-256
J.C. Wood, Dept. of PM&R, Michigan Univ., Ann Arbor, MI, USA
D.T. Barry, Dept. of PM&R, Michigan Univ., Ann Arbor, MI, USA
pp. 257-260
H. Kiya, Fac. of Technol., Tokyo Metropolitan Univ., Japan
S. Yamaguchi, Fac. of Technol., Tokyo Metropolitan Univ., Japan
pp. 261-264
M. Padmanabhan, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
K. Martin, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 265-268
J. Mau, Dept. of Picture Coding & Psychovisual Studies, CCETT, Cesson-Sevigne, France
pp. 273-276
R.S. Orr, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 277-280
K. Nishikawa, Fac. of Technol., Tokyo Metropolitan Univ., Japan
H. Kiya, Fac. of Technol., Tokyo Metropolitan Univ., Japan
M. Sagawa, Fac. of Technol., Tokyo Metropolitan Univ., Japan
pp. 281-284
H.E. Hanrahan, Dept. of Electr. Eng., Univ. of the Witwatersrand, Wits, South Africa
pp. 285-288
I. Jouny, Dept. of Electr. Eng., Lafayette Coll., Easton, PA, USA
pp. 289-292
B. Carlsson, Autom. Control & Syst. Anal. Group, Uppsala Univ., Sweden
P. Handel, Autom. Control & Syst. Anal. Group, Uppsala Univ., Sweden
pp. 293-296
K.K. Dhar, Commun. Technol. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland
pp. 297-300
W. Wang, Dept. of Telecommun. Eng., Beijing Univ. of Posts & Telecomm., China
D. Wang, Dept. of Telecommun. Eng., Beijing Univ. of Posts & Telecomm., China
pp. 301-304
C.-P. Lan, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
S.-C. Wen, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
C.-W. Jen, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 305-308
K. Arakawa, Dept. of Comput. Sci., Meiji Univ., Kawasaki, Japan
Y. Arakawa, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 309-312
W.-J. Shyu, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
J. Tsao, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 313-316
V.E. DeBrunner, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
pp. 317-320
L.B. Jackson, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 321-324
K. Martin, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 329-332
A.K. Shaw, Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
P. Misra, Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
pp. 333-336
J. Chun, GE Res. & Dev., Schenectady, NY, USA
pp. 337-340
J. Konrad, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que., Canada
J. Radecki, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que., Canada
E. Dubois, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que., Canada
pp. 341-344
R. Suoranta, Machine Autom. Lab., Tech. Res. Centre of Finland, Tampere, Finland
K.-P. Estola, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que., Canada
pp. 345-348
A. Skavantzos, Dept. of Electr. & Comput. Eng., Louisiana State Univ., Baton Rouge, LA, USA
pp. 349-352
K.J. Raghunath, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 353-356
T.J. Robnett, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
B. Charny, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 357-360
A.C. Cheung, City Polytech. Inst. of Hong Kong, Hong Kong
C.K. Chui, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
A.K. Chan, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que., Canada
pp. 361-364
Y. Luo, Dept. of Phys. & Biophys., Massey Univ., New Zealand
D.N. Pinder, Dept. of Phys. & Biophys., Massey Univ., New Zealand
pp. 365-368
Y.-S. Wang, Hughes Network Systems, Germantown, MD, USA
pp. 369-372
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M.J. Kim, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 373-376
S. Mallat, Courant Inst., New York Univ., NY, USA
pp. 377-380
N. Saito, Schlumberger-Doll Res., Ridgefield, CT, USA
G. Beylkin, Courant Inst., New York Univ., NY, USA
pp. 381-384
R.A. Gopinath, Dept. of Electron. & Comput. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus, Dept. of Electron. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 385-388
M. Vetterli, Dept. of Electron. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 389-392
H.S. Malvar, Dept. de Engenharia Eletrica, Brasilia Univ, Brazil
pp. 393-396
A.K. Soman, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 397-400
Q. Song, Rutgers Univ., Piscataway, NJ, USA
H.S. Wang, Rutgers Univ., Piscataway, NJ, USA
pp. 405-408
C.J. Kuo, Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
Y.F. Hsu, Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
pp. 409-412
P.H. Bauer, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
J. Wang, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 413-416
C. Tsai, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
A.T. Fam, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 417-420
D.H. Kitabjian, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
P.R. Chitrapu, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 421-424
G. Li, Lab. d'Autom., Dynamique et Anal. des Syst., Univ. Catholique de Louvain, Belgium
M. Gevers, Lab. d'Autom., Dynamique et Anal. des Syst., Univ. Catholique de Louvain, Belgium
pp. 429-432
K.-H. Chang, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
W.G. Bliss, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 433-436
P.P. Gandhi, Dept. of Electr. Eng., Villanova Univ., PA, USA
pp. 437-440
F. Qian, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
B.D. Van Veen, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 441-444
B. Friedlander, Dept. of Electr. & Comput. Sci., California Univ., Davis, CA, USA
pp. 445-448
A.J. Weiss, Dept. of Electr. Eng., Tel Aviv Univ., Israel
B. Friedlander, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 449-452
Shi-Wei Gao, Electron. Eng. Inst., Xidian Univ., Xi'an, China
Zheng Bao, Electron. Eng. Inst., Xidian Univ., Xi'an, China
pp. 453-456
B. Friedlander, Dept. of Electr. & Comput. Sci., California Univ., Davis, CA, USA
A.J. Weiss, Electron. Eng. Inst., Xidian Univ., Xi'an, China
pp. 457-460
R. DeLap, Michigan Univ., Ann Arbor, MI, USA
A. Hero, Michigan Univ., Ann Arbor, MI, USA
pp. 461-464
D. Starer, Dept. of Electr. & Comput. Eng., Wollongon Univ., NSW, Australia
pp. 465-468
L. Hong, Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
pp. 469-472
L. Li, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 473-476
C.F.T. Tang, Computer Sciences Corp., El Segundo, CA, USA
K.J.R. Liu, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 477-480
X. Kong, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 481-484
B.R. Ghosh, Teknekron Communications Systems, Berkeley, CA, USA
pp. 485-488
M.G. Larimore, Applied Signal Technology Inc., Sunnyvale, CA, USA
S.L. Wood, Rutgers Univ., Piscataway, NJ, USA
pp. 489-492
E. Del Re, Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
G. Castellini, Applied Signal Technology Inc., Sunnyvale, CA, USA
F. Conti, Rutgers Univ., Piscataway, NJ, USA
pp. 493-496
C.N. Pateros, Dept. of Electr.-Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
G.J. Saulnier, Dept. of Electr.-Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 501-504
Xiao-Hu Yu, Dept. of Radio Eng., Southeast Univ., Nanjing, China
Shi-Xin Cheng, Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 505-508
M.Y. Zaidan, Dept. of Electr. Eng., King Fahd Univ. of Pet. & Miner., Dhahran, Saudi Arabia
M.S. El-Hennawey, Dept. of Electr. Eng., King Fahd Univ. of Pet. & Miner., Dhahran, Saudi Arabia
pp. 509-512
V.R. Raman, Digital Sound Corp., Carpinteria, CA, USA
pp. 513-516
T. Adali, Center for Commun. & Signal Process., North Carolina State Univ., Raleigh, NC, USA
S.H. Ardalan, Center for Commun. & Signal Process., North Carolina State Univ., Raleigh, NC, USA
A.S. Sadri, Center for Commun. & Signal Process., North Carolina State Univ., Raleigh, NC, USA
pp. 517-520
S.H. Leung, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
B.L. Chan, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
S.M. Lau, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 521-524
S.A. Ahmed, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
J.R. Cruz, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
pp. 525-528
W.Y. Chen, Bell Communications Res., Morristown, NJ, USA
pp. 529-532
J. Cioffi, Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 533-536
G.A. Williamson, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
P.M. Clarkson, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 537-540
Y. Bar-Ness, New Jersey Inst. of Technol., Newark, NJ, USA
W.-L. Chen, New Jersey Inst. of Technol., Newark, NJ, USA
pp. 541-544
Y. Lou, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 545-548
A.H. Sayed, Inf. Syst. Lab., Stanford Univ., CA, USA
H. Lev-Ari, New Jersey Inst. of Technol., Newark, NJ, USA
T. Kailath, New Jersey Inst. of Technol., Newark, NJ, USA
pp. 549-552
K. Yamazaki, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.A. Kennedy, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
Z. Ding, New Jersey Inst. of Technol., Newark, NJ, USA
pp. 553-556
H. Longbotham, Nonlinear Signal Process. Lab., Texas Univ., San Antonio, TX, USA
pp. 557-560
H. Longbotham, Dept. of Electr. & Comput. Eng., US Naval Postgraduate Sch., Monterey, CA, USA
M. Tummala, Dept. of Electr. & Comput. Eng., US Naval Postgraduate Sch., Monterey, CA, USA
pp. 561-564
C. Myers, Lockheed Sanders Inc., Nashua, NH, USA
A. Singer, Dept. of Electr. & Comput. Eng., US Naval Postgraduate Sch., Monterey, CA, USA
F. Shin, New Jersey Inst. of Technol., Newark, NJ, USA
E. Church, Rutgers Univ., Piscataway, NJ, USA
pp. 565-568
J.T. Foote, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
M.M. Hochberg, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
P.M. Athanas, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
A.T. Smith, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
M.E. Wazlowski, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
H.F. Silverman, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
pp. 569-572
B.R.S. Reddy, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
A.J. Greenspon, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
G.A. Kidwell, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
P.R. Chitrapu, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
pp. 573-576
C.J. Finelli, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
G.H. Wakefield, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
J.M. Jenkins, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
L.A. DiCarlo, Lab. for Eng. Man-Machine Syst., Brown Univ., Providence, RI, USA
pp. 577-580
Y. Ishiyama, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 581-584
G.A. Ray, Boeing High Technology Center, Seattle, WA, USA
pp. 589-592
Y. Goussard, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 593-596
J.E. Odegard, Dept. of Comput. & Electr. Eng., Rice Univ., Houston, TX, USA
R.A. Gopinath, Dept. of Comput. & Electr. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus, Dept. of Comput. & Electr. Eng., Rice Univ., Houston, TX, USA
pp. 597-600
C. Herley, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
M. Vetterli, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 601-604
H. Zou, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 605-608
J.C. Pesquet, Lab. des Signaux et Syst., Ecole Superieure d'Electricite, Gif sur Yvette, France
pp. 609-612
K. Nayebi, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 617-620
A.N. Akansu, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
H. Caglar, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 621-624
W. Yim, Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
F. Coakley, Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
pp. 625-627
Z. Berman, Syst. Res. Center, Maryland Univ., College Park, MD, USA
pp. 629-632
G.C. Gurski, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
A.W. Hull, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 633-636
T. Chen, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 637-640
H. Jozawa, NTT Human Interface Labs., Yokosuka, Japan
H. Watanabe, NTT Human Interface Labs., Yokosuka, Japan
S. Singhal, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 649-652
M.R. Banham, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 653-656
T. Chang, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 661-664
R. Rinaldo, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
A. Zakhor, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 665-668
A.C. Bovik, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 669-672
C.W. Kim, Pennsylvania Univ., Philadelphia, PA, USA
R. Ansari, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
A.E. Cetin, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 673-676
U. Tuisel, Telecommun. Group, Tech. Univ. of Hamburg, Germany
K.D. Kammeyer, Telecommun. Group, Tech. Univ. of Hamburg, Germany
pp. 677-680
P.D. West, Concepts Anal. Lab., Georgia Tech. Res. Inst., Atlanta, GA, USA
M.D. Austin, Concepts Anal. Lab., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 685-688
Y. Wan, NovAtel Communications Ltd., Calgary, Alta., Canada
Q. Liu, NovAtel Communications Ltd., Calgary, Alta., Canada
A.M. Sendyk, NovAtel Communications Ltd., Calgary, Alta., Canada
pp. 689-692
S.M. Zabin, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 697-700
B. Wahlberg, NovAtel Communications Ltd., Calgary, Alta., Canada
pp. 701-704
P. Willett, NovAtel Communications Ltd., Calgary, Alta., Canada
pp. 709-712
R. Kirkman, Lockheed Missiles & Space Co. Inc., Sunnyvale, CA, USA
B. Rice, Lockheed Missiles & Space Co. Inc., Sunnyvale, CA, USA
pp. 713-716
Usage of this product signifies your acceptance of the
Terms of Use.
| | | | | | | |
