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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1992)
San Francisco, CA, USA
Mar. 23, 1992 to Mar. 26, 1992
ISBN: 0-7803-0532-9
TABLE OF CONTENTS
T.J. Flynn , Sandia Nat. Labs., Albuquerque, NM, USA
pp. 1-4
J. Dall , Electromagn. Inst., Tech. Univ. of Denmark, Lyngby, Denmark
pp. 5-8
A.W. Krone , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 13-16
H. Yang , Dept. of Electr. & Comput. Eng., State Univ. of New York, Amherst, NY, USA
M. Soumekh , Dept. of Electr. & Comput. Eng., State Univ. of New York, Amherst, NY, USA
pp. 17-20
W. Chuang , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
T.S. Huang , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 21-24
E. Rignot , Jet Propulation Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 25-28
R. Garello , Dept. Math. et Syst. de Commun., Ecole Nat. Superierure de Telecommun. de Bretagne, Brest, France
Y. Delignon , Dept. Math. et Syst. de Commun., Ecole Nat. Superierure de Telecommun. de Bretagne, Brest, France
pp. 29-32
S.D. Silverstein , GE Corporate Res. & Dev., Schenectady, NY, USA
pp. 33-36
B.L. Douglas , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 37-40
D.P. de Garrido , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.M. Francos , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 41-44
R.W. Picard , MIT Media Lab., Cambridge, MA, USA
pp. 45-48
A.A. Farag , Dept. of Eng. Math. & Comput. Sci., Louisville Univ., KY, USA
pp. 49-52
J. Cunillera , Dept. Teoria de la Senal y Communicaciones, ETSETB, Barcelona, Spain
F. Marques , Dept. Teoria de la Senal y Communicaciones, ETSETB, Barcelona, Spain
pp. 53-56
D.A. Langan , General Electric Corp. R&D Center, Schenectady, NY, USA
K.L. Molnar , General Electric Corp. R&D Center, Schenectady, NY, USA
J.W. Modestino , Dept. Teoria de la Senal y Communicaciones, ETSETB, Barcelona, Spain
pp. 57-60
P. Perez , IRISA/CNRS, Rennes, France
F. Heitz , General Electric Corp. R&D Center, Schenectady, NY, USA
pp. 61-64
W. Higgins , Pennsylvania State Univ., University Park, PA, USA
J. Wakeley , Pennsylvania State Univ., University Park, PA, USA
pp. 65-68
J.-L. Chen , Dept. of Electr. & Comput. Eng., State Univ. of New York, Amherst, NY, USA
pp. 69-72
G.K. Gregoriou , Imaging & Comput. Vision Center, Drexel Univ., Philadelphia, PA, USA
O.J. Tretiak , Imaging & Comput. Vision Center, Drexel Univ., Philadelphia, PA, USA
pp. 73-76
F.A. DeCosta , Commun. & Signal Process. Lab., Howard Univ., Washington, DC, USA
pp. 77-80
M. Hedley , Dept. of Electr. Eng., Sydney Univ., NSW, Australia
H. Yan , Dept. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 81-84
J. Riek , Rochester Univ., NY, USA
M.A. Tekalp , Rochester Univ., NY, USA
W.E. Smith , Rochester Univ., NY, USA
pp. 85-88
E. Hughlett , Karl Suss America Inc., Westbury Center, Vermont, USA
pp. 93-96
H. Na , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
H. Lee , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 97-100
P.K. Moller , Electron. Inst., Tech. Univ. of Denmark, Lyngby, Denmark
pp. 101-104
J.R. Kroh , Signal Processing Div., Strathclyde Univ., Glasgow, UK
E. Harrigan , Signal Processing Div., Strathclyde Univ., Glasgow, UK
T.S. Durrani , Signal Processing Div., Strathclyde Univ., Glasgow, UK
pp. 105-108
T.-K. Ku , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 109-112
S.A. Kassam , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
R.J. Kozick , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 113-116
L. Onural , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
G. Bozdagi , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 117-120
R.W. Brockett , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
pp. 125-128
M. Shridhar , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
D. Zhao , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
pp. 129-132
J. Samarabandu , State Univ. of New York, Buffalo, NY, USA
R. Acharya , State Univ. of New York, Buffalo, NY, USA
E. Hausmann , State Univ. of New York, Buffalo, NY, USA
K. Allen , State Univ. of New York, Buffalo, NY, USA
pp. 133-136
X. Cao , Dept. of Electr. & Electron. Eng., Wales Univ., Swansea, UK
pp. 137-140
J.G. Verly , MIT Lincoln Lab., Lexington, MA, USA
R.L. Delanoy , MIT Lincoln Lab., Lexington, MA, USA
pp. 141-144
L.-X. Wang , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 145-148
E. Levin , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 149-152
Y. He , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
M.-Y. Chen , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
A. Kundu , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 153-156
Kuo-Sen Chou , Telecommun. Lab., Minist. of Commun., Taipei, Taiwan
Bor-Shenn Jeng , Telecommun. Lab., Minist. of Commun., Taipei, Taiwan
Chang-Keng Lin , Telecommun. Lab., Minist. of Commun., Taipei, Taiwan
Tzu-Kai Su , Telecommun. Lab., Minist. of Commun., Taipei, Taiwan
pp. 157-160
H.J. Trussel , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
P. Vora , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 161-164
R.R. Estes , Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
G.E. Ford , Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
pp. 165-168
A.M. Tekalp , Dept. of Electr. Eng., Rochester Univ., NY, USA
M.I. Sezan , Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
pp. 169-172
R.R. Schultz , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
R.L. Stevenson , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 173-176
M. Unser , Nat. Inst. of Health, Bethesda, MD, USA
A. Aldroubi , Nat. Inst. of Health, Bethesda, MD, USA
pp. 177-180
B. Ayazifar , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 181-184
J. Weng , Beckman Inst., Illinois Univ., Urbana, IL, USA
J. Zhong , Beckman Inst., Illinois Univ., Urbana, IL, USA
pp. 185-188
D.L. Neuhoff , Dept. of Electr. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
N. Seshadri , Beckman Inst., Illinois Univ., Urbana, IL, USA
pp. 189-192
T. Mitsa , Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 193-196
T.M. Bernard , ETCA/CREA/SP, Arcueil, France
pp. 197-200
X. Ran , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 201-204
C.T. Chiu , Maryland Univ., College Park, MD, USA
K.J.R. Liu , Maryland Univ., College Park, MD, USA
pp. 205-208
D. Friedlander , Columbia Univ., NY, USA
H. Torbey , Columbia Univ., NY, USA
pp. 209-212
D. Taubman , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
A. Zakhor , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 213-216
R.H. Bamberger , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 217-220
R.L. Lagendijk , Delft Univ. of Technol., Netherlands
J. Biemond , Delft Univ. of Technol., Netherlands
pp. 221-224
J. Hartung , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 225-228
J.-R. Ohm , Inst. fur Fernmeldetech., Tech. Univ. Berlin, Germany
pp. 229-232
N. Mohsenian , Dept. of Electr. Eng., Worcester Polytech. Inst., MA, USA
pp. 233-236
R.E. Van Dyck , Center for Commun. & Signal Process., North Carolina State Univ., Raleigh, NC, USA
S.A. Rajala , Center for Commun. & Signal Process., North Carolina State Univ., Raleigh, NC, USA
pp. 237-240
S. Liu , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.H. Hayes , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
J. Huang , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 241-244
S.N. Efstratiadis , Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 245-248
G.M. Quenot , DGA/Etablissement Tech. Central de l'Armement, Arcueil, France
pp. 249-252
I.M. Abdelqadar , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
G.L. Bilbro , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S.A. Rajala , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 253-256
W.E. Snyder , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J.L. Prince , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 257-260
R.W. Young , Dept. of Eng., Cambridge Univ., UK
pp. 261-264
R. Depommier , INRS-Telecommun., Verdun, Que., Canada
pp. 269-272
C.W. Chen , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
T.S. Huang , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 273-276
N.P. Willis , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Y. Bresler , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 277-280
M. Zibulski , Dept. of Electr. Eng., Technion, Israel Inst. of Technol., Haifa, Israel
pp. 281-284
K. Chehdi , Rennes Univ., Lannion, France
M. Sabri , Rennes Univ., Lannion, France
pp. 285-288
K. Aizawa , Beckman Inst., Illinois Univ., Urbana, IL, USA
T. Komatsu , Rennes Univ., Lannion, France
T. Saito , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 289-292
A.T. Erdem , Eastman Kodak Co., Rochester, NY, USA
M.K. Ozkan , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 293-296
J.W. Woods , Rensselaer Polytech. Inst., Troy, NY, USA
pp. 297-300
S.J. Reeves , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 301-304
S.F. Yau , Illinois Univ., Urbana, IL, USA
Y. Bresler , Illinois Univ., Urbana, IL, USA
pp. 305-308
V. Ramamoorthy , Southwestern Bell Technology Resources Inc., St. Louis, MO, USA
pp. 309-312
M. Analoui , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 313-316
G.L. Wise , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 317-320
J.K. Tugnait , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 321-324
W.-H. Fang , Dept. of Electron. Eng., Nat. Taiwan Inst. of Technol., Taipei, Taiwan
pp. 325-328
X. Liu , Bordeaux Univ., Talence, France
P. Baylou , Bordeaux Univ., Talence, France
M. Najim , Bordeaux Univ., Talence, France
pp. 329-332
W.M. Steedly , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R.L. Moses , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 333-336
A.D. Salvia , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 337-340
C.R. Champlin , Motorola Strategic Electronics Div., Chandler, AZ, USA
pp. 341-344
N. Balram , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 345-348
M. Benidir , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
P.L. Combettes , Dept. of Electr. Eng., City Univ. of New York, NY, USA
pp. 349-352
W.S. So , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 353-356
S.A. Mohamed , Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 357-360
S.D. Morgera , McGill Univ., Montreal, Que., Canada
pp. 361-364
R. Baseri , Rensselaer Polytech. Inst., Troy, NY, USA
V.J. Mathews , Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 365-368
F. Kossentini , Georgia Tech. Lorraine, Metz, France
C.F. Barnes , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 369-372
D.P. de Garrido , Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 373-376
D. Miller , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 377-380
K. Zeger , Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI, USA
pp. 381-384
L. Torres , Dept. of Signal Theory & Commun., Univ. Politechnica de Cataluna, Barcelona, Spain
E. Arias , Dept. of Signal Theory & Commun., Univ. Politechnica de Cataluna, Barcelona, Spain
pp. 385-388
W.-Y. Chan , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 389-392
G.J. Sullivan , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 393-396
D. Soudris , Dept. of Electr. Eng., Patras Univ., Greece
V. Paliouras , Dept. of Electr. Eng., Patras Univ., Greece
T. Stouraitis , Dept. of Electr. Eng., Patras Univ., Greece
pp. 397-400
J.V. Krogmeier , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 405-408
B.T. Kelley , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 409-412
J. Segman , Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 413-416
S. Mann , MIT, Cambridge, MA, USA
pp. 417-420
W. Philips , Lab. for Electron. & Metrol., Gent, Belgium
pp. 421-424
N. Polyak , Dept. of Electr.-Comput.-Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 425-428
L. Bomer , Siemens AG, Munchen, Germany
H. Schotten , Dept. of Electr. Eng., Patras Univ., Greece
pp. 429-432
T.L. Marzetta , Nichols Res. Corp., Wakefield, MA, USA
pp. 433-435
G.W. Donohoe , Dept. of Electr. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
C.-H. Jeong , Dept. of Electr. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
pp. 437-440
E.A. Riskin , Washington Univ., Seattle, WA, USA
M.Y. Jaisimha , Washington Univ., Seattle, WA, USA
pp. 441-444
W.E. Lynch , Panasonic Advanced TV-Video Laboratories Inc., Burlington, NJ, USA
pp. 445-448
A. Zaccarin , Dept. de Genie Electrique, Laval Univ., Quebec City, Que., Canada
pp. 449-452
R.L. Lagendijk , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
M.I. Sezan , Washington Univ., Seattle, WA, USA
pp. 453-46-
S. Gupta , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 457-460
J.M. Boyce , Panasonic Advanced TV-Video Laboratories Inc., Burlington, NJ, USA
pp. 461-464
L. Haglund , Linkoping Univ., Sweden
H. Barman , Linkoping Univ., Sweden
H. Knutsson , Linkoping Univ., Sweden
pp. 469-472
S.-M. Lei , Bellcore, Red Bank, NJ, USA
K.-H. Tzou , Linkoping Univ., Sweden
pp. 473-476
W.-M. Lam , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 477-480
Z. Zhou , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 481-484
D.M. Monro , Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 485-488
T. Rao , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
S. Lucke , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 489-492
B. Zeng , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
Y. Neuvo , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
A.N. Venetsanopoulos , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 493-496
P.A. Chou , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.A. Vander Kam , Dept. of Elect. Eng., Stanford Univ., CA, USA
R.M. Gray , Linkoping Univ., Sweden
pp. 497-500
N.M. Nasrabadi , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
N. Mohsenian , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 501-504
K.S. Knudsen , Dept. of Electr. & Comput Eng., Calgary Univ., Alta., Canada
L.T. Bruton , Dept. of Electr. & Comput Eng., Calgary Univ., Alta., Canada
pp. 505-508
H.A. Cohen , Dept. of Comput. Sci. & Comput. Eng., La Trobe Univ., Bundoora, Vic., Australia
pp. 509-512
C. Labit , IRISA/INRIA, Rennes, France
F. Garcia-Ugalde , IRISA/INRIA, Rennes, France
pp. 513-516
S.-G. Kong , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 517-520
H. Watanabe , NTT Human Interface Labs., Yokosuka, Japan
S. Sinbghal , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 521-524
S. Liu , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 525-528
K. Kashiwabuchi , NTT Transmission Syst. Labs., Kanagawa, Japan
S. Ono , NTT Transmission Syst. Labs., Kanagawa, Japan
pp. 529-532
T. Fujii , NTT Transmission Syst. Labs., Kanagawa, Japan
H. Nakada , NTT Transmission Syst. Labs., Kanagawa, Japan
T. Sawabe , NTT Transmission Syst. Labs., Kanagawa, Japan
S. Ono , NTT Transmission Syst. Labs., Kanagawa, Japan
pp. 533-536
H. Ohira , Mitsubishi Electric Corp., Kamakura, Japan
O. Tanno , Mitsubishi Electric Corp., Kamakura, Japan
R. Suzuki , Mitsubishi Electric Corp., Kamakura, Japan
M. Wada , Mitsubishi Electric Corp., Kamakura, Japan
T. Saito , Mitsubishi Electric Corp., Kamakura, Japan
K. Ogura , Mitsubishi Electric Corp., Kamakura, Japan
K. Asai , Mitsubishi Electric Corp., Kamakura, Japan
pp. 537-540
S. Kusevitzky , Zoran Corp., Santa Clara, CA, USA
C. Erskine , Zoran Corp., Santa Clara, CA, USA
H. Watanabe , Mitsubishi Electric Corp., Kamakura, Japan
pp. 541-544
P. Haskell , California Univ., Berkeley, CA, USA
pp. 545-548
Q. Zhang , Dept. of Electr. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 549-552
I.W. Sandberg , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 553-555
K. Huper , Tech. Univ. Munich, Germany
J.A. Nossek , Tech. Univ. Munich, Germany
pp. 557-560
J. Crespo , Sch. of Electr. Eng., Georgia Inst. of Tech., Atlanta, GA, USA
R.W. Schafer , Tech. Univ. Munich, Germany
pp. 561-564
C. Bouman , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 565-568
C.A. Davatzikos , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J.L. Prince , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 569-572
Z. Kato , INRIA, Valbonne, France
J. Zerubia , INRIA, Valbonne, France
M. Berthod , INRIA, Valbonne, France
pp. 573-576
J.V. Candy , Lawrence Livermore Nat. Lab., CA, USA
pp. 577-580
T. Soni , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
J.R. Zeidler , INRIA, Valbonne, France
W.H. Ku , INRIA, Valbonne, France
pp. 581-584
Shuqiu Li , Inst. of Acoust., Acad. Sinica, Beijing, China
Ziqiang Hou , Inst. of Acoust., Acad. Sinica, Beijing, China
Qihu Li , Inst. of Acoust., Acad. Sinica, Beijing, China
pp. 585-588
H. Shinoda , Eng. Res. Inst., Tokyo Univ., Japan
S. Ando , Eng. Res. Inst., Tokyo Univ., Japan
pp. 589-592
H. Li , Dept. of Electr. Eng., Linkoping Univ., Sweden
P. Roivainen , Dept. of Electr. Eng., Linkoping Univ., Sweden
R. Forchheimer , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 593-596
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