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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1992)
San Francisco, CA, USA
Mar. 23, 1992 to Mar. 26, 1992
ISBN: 0-7803-0532-9
TABLE OF CONTENTS
P. Maragos , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
pp. 1-4
L. Atlas , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 9-12
A.P. Lobo , Dept. of Commun. & Neurosci., Keele Univ., UK
W.A. Ainsworth , Dept. of Commun. & Neurosci., Keele Univ., UK
pp. 13-16
A. Kiessling , Erlangen-Nurnberg Univ., Germany
H. Niemann , Erlangen-Nurnberg Univ., Germany
E. Noth , Erlangen-Nurnberg Univ., Germany
pp. 17-20
Y.H. Gu , Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
pp. 21-24
K.E. Cummings , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 25-28
P. Alku , Acoustics Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 29-32
E.H. Shiva , Dept. of Electr. Eng., Florida Univ., FL, USA
P.P.L. Prado , Dept. of Electr. Eng., Florida Univ., FL, USA
pp. 33-36
M.M. Thomson , Dept. of Electr. & Electron. Eng., Auckland Univ., New Zealand
pp. 37-40
T. Hayashi , NTT DATA Communication Systems Corp., Kanagawa, Japan
K. Murakami , NTT DATA Communication Systems Corp., Kanagawa, Japan
pp. 41-44
Shaw-Hwa Hwang , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chun-Yu Tsai , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 45-48
Y. Sagisaka , ATR Interpreting Technology Res. Lab., Kyoto, Japan
pp. 49-52
M. Abe , NTT Human Interface Labs., Tokyo, Japan
pp. 53-56
Q. Lin , Dept. of Speech Commun. & Music Acoust., R. Inst. of Technol., Stockholm, Sweden
pp. 57-60
R.W.P. Luk , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 61-64
N. Iwahashi , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
N. Kaiki , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
Y. Sagisaka , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 65-68
Y. Yamashita , Inst. of Sci. & Ind. Res., Osaka Univ., Japan
pp. 69-72
M.C. Viana , Inst. of Sci. & Ind. Res., Osaka Univ., Japan
I.M. Trancoso , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 73-76
T. Zeppenfeld , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 77-80
K.P. Li , ITT A/CD, San Diego, CA, USA
M.L. Rossen , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 81-84
H. Tsuboi , Toshiba Corp., Kawasaki, Japan
H. Kanazawa , Toshiba Corp., Kawasaki, Japan
pp. 85-88
J.N. Marcus , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 89-92
B. Chigier , Artificial Intelligence Lab., NYNEX Sci. & Technol., White Plains, NY, USA
pp. 93-96
L.D. Wilcox , Xerox Palo Alto Res. Center, CA, USA
pp. 97-100
E.M. Hofstetter , MIT Lincoln Lab., Lexington, MA, USA
pp. 101-104
K. Ng , BBN Systems & Technologies, Cambridge, MA, USA
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
J.R. Rohlicek , BBN Systems & Technologies, Cambridge, MA, USA
pp. 109-112
D. Ayuso , BBN Systems & Technologies, Cambridge, MA, USA
M. Bates , BBN Systems & Technologies, Cambridge, MA, USA
R. Bobrow , BBN Systems & Technologies, Cambridge, MA, USA
A. Boulanger , BBN Systems & Technologies, Cambridge, MA, USA
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
P. Jeanrenaud , BBN Systems & Technologies, Cambridge, MA, USA
J.R. Rohlicek , BBN Systems & Technologies, Cambridge, MA, USA
M. Siu , BBN Systems & Technologies, Cambridge, MA, USA
pp. 113-116
J.H. Chung , AT&T Bell Labs., Naperville, IL, USA
pp. 117-120
H.Y. Su , BNR, Verdun, Que., Canada
P. Mermelstein , BNR, Verdun, Que., Canada
pp. 121-124
M. Yong , Motorola Codex, Mansfield, MA, USA
pp. 125-128
K.B. Mikkelsen , Telecommun. Res. Lab., Horsholm, Denmark
H.B. Hansen , Telecommun. Res. Lab., Horsholm, Denmark
H. Nielsen , Telecommun. Res. Lab., Horsholm, Denmark
K.J. Larsen , Telecommun. Res. Lab., Horsholm, Denmark
J.A. Sorensen , Telecommun. Res. Lab., Horsholm, Denmark
pp. 129-132
Y. Hussain , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 133-136
A.V. McCree , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
A.V. McCree , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 137-140
D. Rowe , Dept. of Electr. & Comput. Eng., Wollongong Univ., NSW, Australia
P. Secker , Dept. of Electr. & Comput. Eng., Wollongong Univ., NSW, Australia
pp. 141-144
J. Haagen , Telecommun. Res. Lab., Horsholm, Denmark
S.D. Hansen , Telecommun. Res. Lab., Horsholm, Denmark
pp. 145-148
H. Hattori , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 153-156
F.K. Soong , NTT Human Interface Lab., Tokyo, Japan
A.E. Rosenberg , Telecommun. Res. Lab., Horsholm, Denmark
pp. 161-164
M. Savic , Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J. Sorensen , Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 165-168
H.M. Chang , NYNEX Science & Technology Inc., White Plains, NY, USA
pp. 169-172
Y. Gong , CRIN/CRNS, INRIA, Vandoeuvre, France
J.-P. Haton , CRIN/CRNS, INRIA, Vandoeuvre, France
pp. 173-176
P.K. Rajasekaran , Texas Instruments Inc., Dallas, TX, USA
Y.-H. Kao , Texas Instruments Inc., Dallas, TX, USA
pp. 177-180
L.P. Netsch , Texas Instruments Inc., Dallas, TX, USA
G.R. Doddington , Texas Instruments Inc., Dallas, TX, USA
pp. 181-184
D.A. Reynolds , MIT Lincoln Lab., Lexington, MA, USA
R.C. Rose , MIT Lincoln Lab., Lexington, MA, USA
pp. 185-188
M.-H. Siu , BBN Systems & Technologies, Cambridge, MA, USA
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
pp. 189-192
G. Davidson , Dolby Labs. Inc., San Francisco, CA, USA
A. Lovrich , BBN Systems & Technologies, Cambridge, MA, USA
pp. 193-196
Ah-Peng Tan , Asia Matsushita Electric S Pte Ltd., Singapore
Do-Hui Teh , Asia Matsushita Electric S Pte Ltd., Singapore
pp. 197-200
C. Heegard , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 201-203
P.M. Boers , Philips Res. Lab., Eindhoven, Netherlands
A. Makivirta , BBN Systems & Technologies, Cambridge, MA, USA
J. Kuusama , Telecommun. Res. Lab., Horsholm, Denmark
K.E. Christensen , Telecommun. Res. Lab., Horsholm, Denmark
W.R.T. ten Kate , Philips Res. Lab., Eindhoven, Netherlands
pp. 205-208
Y.S. Cho , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 209-212
S. Makino , NTT Human Interface Labs., Tokyo, Japan
Y. Haneda , NTT Human Interface Labs., Tokyo, Japan
pp. 213-216
A.S. Munshi , Dept. of Electr. Eng., Toronto Unv., Ont., Canada
pp. 217-220
J.-M. Jot , Studer Digetec SA, Chatou, France
pp. 221-224
N.D. Black , Dept. of Electr. Eng., Ulster Univ., Jordanstown, UK
M. Lydon , Dept. of Electr. Eng., Ulster Univ., Jordanstown, UK
N. Waterman , Dept. of Electr. Eng., Ulster Univ., Jordanstown, UK
M. Powderly , Dept. of Electr. Eng., Ulster Univ., Jordanstown, UK
pp. 225-228
D.E. Melton , Nelson Industries Inc., Stoughton, WI, USA
R.A. Greiner , Dept. of Electr. Eng., Ulster Univ., Jordanstown, UK
pp. 229-232
J. Thi , AT&T Bell Labs., Arlington, VA, USA
pp. 233-236
S.J. Elliott , Inst. of Sound & Vibration Res., Southampton Univ., UK
J. Rex , Dept. of Electr. Eng., Ulster Univ., Jordanstown, UK
pp. 237-240
A.A. Beck , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
S.A. Zahorian , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 241-244
W.-H. Ki , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
K. Thompson , Dept. of Electr. Eng., Ulster Univ., Jordanstown, UK
S. Shamma , Dept. of Electr. Eng., Ulster Univ., Jordanstown, UK
pp. 245-248
V. Valimaki , Helsinki Univ. of Technol., Espoo, Finland
M. Karjalainen , Helsinki Univ. of Technol., Espoo, Finland
Z. Janosy , Helsinki Univ. of Technol., Espoo, Finland
U.K. Laine , Helsinki Univ. of Technol., Espoo, Finland
pp. 249-252
V.L. Stonick , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 253-256
K.S. Jog , Dept. of Electron. & Telecommun., Gov. Coll. of Eng., Pune, India
pp. 257-260
S.J. Godsill , Dept. of Eng., Cambridge Univ., UK
P.J.W. Rayner , Dept. of Eng., Cambridge Univ., UK
pp. 261-264
X. Qi , Dept. of Electr. & Syst. Eng., Connecticut Univ., Storrs, CT, USA
pp. 265-268
M. Niranjan , Dept. of Eng., Cambridge Univ., UK
V. Kadirkamanathan , Dept. of Eng., Cambridge Univ., UK
pp. 269-272
S.B. Holden , Dept. of Eng., Cambridge Univ., UK
P.J.W. Rayner , Dept. of Eng., Cambridge Univ., UK
pp. 273-276
Y. Autret , Univ. de Bretagne Occidentale, Brest, France
B. Solaiman , Dept. of Eng., Cambridge Univ., UK
pp. 277-280
M.D. Emmerson , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 281-284
P.W. Rander , General Motors Research Labs., Warren, MI, USA
K.P. Unnikrishnan , General Motors Research Labs., Warren, MI, USA
pp. 285-288
H. Gish , BBN Systems & Technologies, Cambridge, MA, USA
pp. 289-292
H. Chen , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 293-296
S. Bannour , Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
pp. 297-300
M. Peng , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
C.L. Nikias , Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
J.G. Proakis , Dept. of Eng., Cambridge Univ., UK
pp. 301-304
Zengjun Xiang , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 305-308vol.2
Z. Michalopoulou , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
L. Nolte , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
D. Alexandrou , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 309-312
Q. Wu , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
J. Yang , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 313-316
Yupeng Chen , Inst. of Acoust., Academia Sinica, Beijing, China
Chaohuan Hou , Inst. of Acoust., Academia Sinica, Beijing, China
pp. 317-320
H. Kobatake , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
W. Morita , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
Y. Yano , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 321-324
A. Dinc , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 325-328
J.A. Sorensen , Electron. Inst., Tech. Univ. of Denmark, Lyngby, Denmark
pp. 329-332
S.M. Aghili , Dept. of Electr. Eng., McNeese State Univ., Lake Charles, LA, USA
M.H. Thursby , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
D.R. Marpaka , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 333-336
T.R. Anderson , Armstrong Lab., Wright-Patterson AFB, OH, USA
pp. 337-340
K. Torkkola , Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
J. Kangas , Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
pp. 341-344
M.G. Rahim , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 345-348
N. Morgan , Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
H. Bourlard , L&H Speech Products, Ieper, Belgium
S. Renals , Helsinki Univ. of Technol., Espoo, Finland
pp. 349-352
H.B.D. Sorensen , Inst. of Electron. Syst., Aalborg Univ., Denmark
pp. 353-356
T.M. English , Dept. of Comput. Sci., Texas Tech Univ., Lubbock, TX, USA
pp. 357-360
M.A. Franzini , Telefonica Investigacion y Desarrollo, Madrid, Spain
pp. 361-364
K.M. Curtis , Dept. of Electr. & Electron. Eng., Nottingham Univ., UK
J. Burinston , Dept. of Electr. & Electron. Eng., Nottingham Univ., UK
pp. 369-372
K. Rohani , Motorola Inc., Ft. Worth, TX, USA
pp. 373-376
L.E. Russo , Lockheed Sanders Inc., Nashua, NH, USA
pp. 377-380
S. Fioravanti , Dept. of Biophys. & Electron. & Eng., Genoa Univ., Italy
F. Arduini , Dept. of Biophys. & Electron. & Eng., Genoa Univ., Italy
pp. 381-384
B.J. Sheu , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
O.T.-C. Chen , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 385-388
F. Perego , CEFRIEL, Milano, Italy
S. Tubaro , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 389-392
S.T. Acton , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
A.C. Bovik , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 393-396
J.-N. Hwang , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
H. Li , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 397-400
F. Roli , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
S.B. Serpico , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
R. Re , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 401-404
I.N.M. Papadakis , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
J.G. Reisman , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
S.C.A. Thomopoulos , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 405-408
M. Teles de Figueiredo , Dept. de Engenharia Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
J.M.N. Leitao , Dept. de Engenharia Electrotecnica e de Computadores, Inst. Superior Tecnico, Lisboa, Portugal
pp. 409-412
M. Bouvet , Centre d'Etudes et de Recherches en Detection Sous-Marine, Six-Fours-Les-Plages, France
pp. 413-416
D. Alexandrou , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
B. Breed , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
D. DeFatta , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 417-420
B. Ottersten , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
P. Stoica , Dept. of Control & Comput., Polytech. Inst. of Bucharest, Romania
pp. 421-424
V.A.N. Barroso , Dept. of Eng. Electr. e de Comp., Inst. Superior Tecnico, Lisboa, Portugal
pp. 425-428
S. Stergiopoulos , Defence Research Establishment Atlantic, Dartmouth, NS, Canada
pp. 433-436
M. Viberg , Telecom Paris, France
B. Ottersten , Dept. of Autom. Control, R. Inst. of Technol., Stockholm, Sweden
pp. 441-444
O. Zugmeyer , IRISA, Rennes, France
J.P. Le Cadre , IRISA, Rennes, France
pp. 445-448
F. Martinerie , Thomson Sintra Activities-Sous-Marines, Arcueil, France
pp. 449-452
B. Baygun , Michigan Univ., Ann Arbor, MI, USA
pp. 453-456
I.M.G. Lourtie , CAPS, Inst. Superior Tecnico, Lisboa, Portugal
G.C. Carter , Michigan Univ., Ann Arbor, MI, USA
S. Basu , Dept. of Electr. & Comput. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 457-460
H.S. Chang , Michigan Univ., Ann Arbor, MI, USA
pp. 461-464
Q.T. Zhang , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
H.S. Miao , Michigan Univ., Ann Arbor, MI, USA
pp. 465-468
A.J. Efron , Illinois Univ., Chicago, IL, USA
H. Jeen , Michigan Univ., Ann Arbor, MI, USA
pp. 469-472
B. Porat , Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
B. Friedlander , Michigan Univ., Ann Arbor, MI, USA
pp. 473-476
A.P. Petropulu , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 477-480
T.W. Parks , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 481-484
S. Fioravanti , Dept. of Biophys. & Electr. Eng., Genoa Univ., Italy
D.D. Giusto , Dept. of Biophys. & Electr. Eng., Genoa Univ., Italy
F.G.B. De Natale , Dept. of Biophys. & Electr. Eng., Genoa Univ., Italy
pp. 485-488
M.A. Doron , Dept. of Electron. Syst., Tel-Aviv Univ., Ramat-Aviv, Israel
pp. 489-492
W. Hong , Dept. of Electron. Eng., Naval Aad., Kyoungham, South Korea
pp. 493-496
E. Doron , Dept. of Nucl. Phys., Weizmann Inst. of Sci., Rehovot, Israel
M.A. Doron , Dept. of Electron. Syst., Tel-Aviv Univ., Ramat-Aviv, Israel
pp. 497-500
G.H. Niezgoda , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
J. Krolik , Dept. of Electron. Syst., Tel-Aviv Univ., Ramat-Aviv, Israel
pp. 501-504
D. Sinno , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
D. Cochran , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 505-508
M.J.D. Rendas , CAPS, Inst. Superior Tecnico, Lisboa, Portugal
J.M.F. Moura , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 509-512
J. Jachner , Atlantic Aerospace Electronics Corp., Waltham, MA, USA
pp. 513-516
H.R. Karimi , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 517-520
X.-L. Xu , Minnesota Univ., Minneapolis, MN, USA
K. Buckley , Minnesota Univ., Minneapolis, MN, USA
pp. 521-524
J.J. Towers , Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
pp. 525-528
P. Larzabal , THOMSON-CSF, Gennevilliers, France
H. Clergeot , Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
pp. 529-532
D.E. Ohlms , IBM Corp., Manassas, VA, USA
pp. 533-536
H. Liu , Dept. of Electr. Eng., Portland State Univ., OR, USA
F. Li , Dept. of Electr. Eng., Portland State Univ., OR, USA
pp. 537-540
C.M. McIntyre , Defence Res. Establ. Atlantic, Dartmouth, NS, Canada
D.A. Dermott , Defence Res. Establ. Atlantic, Dartmouth, NS, Canada
pp. 541-544
S.K. Mehta , US Naval Underwater Syst. Center, New London, CT, USA
E.L. Titlebaum , Defence Res. Establ. Atlantic, Dartmouth, NS, Canada
pp. 545-548
R.J. Vaccaro , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 549-552
S. Umesh , Dept of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 553-556
H.J. Lee , Tetra Systems Inc., Palo Alto., CA, USA
J.S. Abel , Tetra Systems Inc., Palo Alto., CA, USA
pp. 561-564
A. Zeira , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
P.M. Schultheiss , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 565-568
J.D. Johnston , AT&T Bell Labs., Murray Hill, NJ, USA
A.J. Ferreira , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 569-572
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