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Acoustics, Speech, and Signal Processing, 1992. ICASSP-92 Vol 1., 1992 IEEE International Conference on
San Francisco, CA, USA
March 23-March 26
ISBN: 0-7803-0532-9
Table of Contents
R. Schwartz, BBN Systems & Technologies, Cambridge, MA, USA
S. Austin, BBN Systems & Technologies, Cambridge, MA, USA
F. Kubala, BBN Systems & Technologies, Cambridge, MA, USA
J. Makhoul, BBN Systems & Technologies, Cambridge, MA, USA
L. Nguyen, BBN Systems & Technologies, Cambridge, MA, USA
P. Placeway, BBN Systems & Technologies, Cambridge, MA, USA
pp. 1-4
R. Rosefeld, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
X. Huang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Furst, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 5-8
H. Ney, Philips Res. Lab. Aachen, Germany
R. Haeb-Umbach, Philips Res. Lab. Aachen, Germany
B.-H. Tran, Philips Res. Lab. Aachen, Germany
M. Oerder, Philips Res. Lab. Aachen, Germany
pp. 9-12
L.R. Bahl, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 17-20
I. Katunobu, Tokyo Inst. of Technol., Japan
H. Satoru, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
T. Hozumi, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 21-24
K. Asai, Electrotech. Lab., Ibaraki, Japan
S. Hayamizu, Electrotech. Lab., Ibaraki, Japan
K. Handa, Electrotech. Lab., Ibaraki, Japan
pp. 29-32
M.Y. Hwang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburg, PA, USA
X. Huang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburg, PA, USA
pp. 33-36
T. Yamada, NTT Human Interface Labs., Tokyo, Japan
S. Matsunaga, NTT Human Interface Labs., Tokyo, Japan
K. Shikano, NTT Human Interface Labs., Tokyo, Japan
pp. 37-40
R. Soheili, Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
A.M. Kondoz, Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
B.G. Evans, Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
pp. 41-44
J.-H. Yao, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
J.J. Shynk, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 45-48
M. Mauc, ESIEE Dept. Signaux et Telecommun., Noisy le Grand, France
G. Baudoin, ESIEE Dept. Signaux et Telecommun., Noisy le Grand, France
pp. 53-56
P. Hedelin, Dept. of Inf. Theor., Chalmers Univ. of Technol., Gothenburg, Sweden
pp. 57-60
N. Moreau, Telecom, Paris, France
P. Dymarski, ESIEE Dept. Signaux et Telecommun., Noisy le Grand, France
pp. 61-64
Zhang Xiongwei, Nanjing Inst. of Commun. Eng., China
Chen Xianzhi, Nanjing Inst. of Commun. Eng., China
pp. 65-68
J.-H. Chen, AT&T Bell Labs., Murray Hill, NJ, USA
N. Jayant, AT&T Bell Labs., Murray Hill, NJ, USA
R.V. Cox, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 69-72
M. Fratti, Teletra-Alcatel, Milan, Italy
G.A. Mian, AT&T Bell Labs., Murray Hill, NJ, USA
G. Riccardi, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 73-76
S. Crisafulli, Dept. Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
J.D. Mills, AT&T Bell Labs., Murray Hill, NJ, USA
R.R. Bitmead, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 77-80
B. Sylvestre, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 81-84
V. Ramasubramanian, Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
K.K. Paliwal, Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
pp. 89-92
V.R. Algazi, Speech Res. Lab., California Univ., Davis, CA, USA
D. Irvine, Speech Res. Lab., California Univ., Davis, CA, USA
C. Caldwell, Speech Res. Lab., California Univ., Davis, CA, USA
M. Ready, Speech Res. Lab., California Univ., Davis, CA, USA
K. Brown, Speech Res. Lab., California Univ., Davis, CA, USA
S. Chung, Speech Res. Lab., California Univ., Davis, CA, USA
pp. 93-96
Chih-Chung Kuo, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Fu-Rong Jean, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Hsiao-Chuan Wang, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 97-100
T.K. Wang, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
J. Foster, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
S. Ardalan, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
pp. 101-104
B. Bhattacharya, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
W. LeBlanc, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
S. Mahmoud, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
V. Cuperman, Speech Res. Lab., California Univ., Davis, CA, USA
pp. 105-108
M. Nakai, Dept. of Inf. Eng., Tohoku Univ., Sendai, Japan
H. Shimodaira, Dept. of Inf. Eng., Tohoku Univ., Sendai, Japan
M. Kimura, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
pp. 109-112
D. Sinha, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 113-116
Cheung-Fat Chan, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
Kwok-Wah Law, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 117-120
H. Hermansky, US West Advanced Technologies, Boulder, CO, USA
N. Morgan, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
A. Bayya, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
P. Kohn, Speech Res. Lab., California Univ., Davis, CA, USA
pp. 121-124
N. Hubing, Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
K. Yoo, Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
pp. 125-128
M.C. Dogan, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
J.M. Mendel, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 129-132
A. Moreno, ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
J.A.R. Fonollosa, ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 133-136
T. Fukada, Inf. Syst. Res. Center, Canon Inc., Kawasaki, Japan
K. Tokuda, ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
T. Kobayashi, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
S. Imai, Speech Res. Lab., California Univ., Davis, CA, USA
pp. 137-140
S. Qian, National Instruments, Austin, TX, USA
D. Chen, National Instruments, Austin, TX, USA
K. Chen, Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
pp. 141-144
H. Valbret, Telecom Paris, France
E. Moulines, Telecom Paris, France
J.P. Tubach, Telecom Paris, France
pp. 145-148
C. Montacie, Univ. Pierre et Marie Curie, Paris, France
P. Deleglise, Univ. Pierre et Marie Curie, Paris, France
F. Bimbot, Univ. Pierre et Marie Curie, Paris, France
M.-J. Caraty, Univ. Pierre et Marie Curie, Paris, France
pp. 153-156
U. Essen, Philips GmbH Forschungslaboratorien, Aachen, Germany
V. Steinbiss, Philips GmbH Forschungslaboratorien, Aachen, Germany
pp. 161-164
S. Matsunaga, NTT Human Interface Labs., Tokyo, Japan
T. Yamada, NTT Human Interface Labs., Tokyo, Japan
K. Shikano, NTT Human Interface Labs., Tokyo, Japan
pp. 165-168
J.H. Wright, Centre for Commun. Res., Bristol Univ., UK
G.J.F. Jones, Centre for Commun. Res., Bristol Univ., UK
E.N. Wrigley, Centre for Commun. Res., Bristol Univ., UK
pp. 169-172
D. Goddeau, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
V. Zue, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 181-184
Keh-Yih Su, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Tung-Hui Chiang, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Yi-Chung Lin, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 185-188
S. Seneff, Lab for Comput. Sci., MIT, Cambridge, MA, USA
pp. 189-192
R. Pieraccini, AT&T Bell Labs., Murray Hill, NJ, USA
E. Tzoukermann, AT&T Bell Labs., Murray Hill, NJ, USA
Z. Gorelov, AT&T Bell Labs., Murray Hill, NJ, USA
J.-L. Gauvain, AT&T Bell Labs., Murray Hill, NJ, USA
E. Levin, AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee, AT&T Bell Labs., Murray Hill, NJ, USA
J.G. Wilpon, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 193-196
L.G. Miller, AT&T Bell Labs., Murray Hill, NJ, USA
A.L. Gorin, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 201-204
A.N. Jain, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
D.S. Touretzky, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 205-208
L. Osterholtz, Carnegie Mellon Univ., Pittsburgh, PA, USA
C. Augustine, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. McNair, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
I. Rogina, AT&T Bell Labs., Murray Hill, NJ, USA
H. Saito, AT&T Bell Labs., Murray Hill, NJ, USA
T. Sloboda, AT&T Bell Labs., Murray Hill, NJ, USA
J. Tebelskis, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 209-212
D.B. Roe, AT&T Bell Labs., Murray Hill, NJ, USA
F.C.N. Pereira, AT&T Bell Labs., Murray Hill, NJ, USA
R.W. Sproat, AT&T Bell Labs., Murray Hill, NJ, USA
M.D. Riley, AT&T Bell Labs., Murray Hill, NJ, USA
P.J. Moreno, AT&T Bell Labs., Murray Hill, NJ, USA
A. Macarron, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 213-216
H. Shimodaira, Dept. of Inf. Eng., Tohoku Univ., Sendai, Japan
M. Kumura, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 217-220
J.L. Hieronymus, Center for Speech Technol. Res., Edinburgh Univ., UK
D. McKelvie, Center for Speech Technol. Res., Edinburgh Univ., UK
F. McInnes, Center for Speech Technol. Res., Edinburgh Univ., UK
pp. 225-227
F.R. Chen, Xerox Palo Alto Res. Center, CA, USA
M. Withgott, Xerox Palo Alto Res. Center, CA, USA
pp. 229-232
B.A. Carlson, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 237-240
D.C. Bateman, Marconi Speech & Information Systems, Portsmouth, UK
D.K. Bye, Marconi Speech & Information Systems, Portsmouth, UK
M.J. Hunt, Marconi Speech & Information Systems, Portsmouth, UK
pp. 241-244
S. Dobler, Philips Kommunikations Industrie AG, Nuernberg, Germany
P. Meyer, Philips Kommunikations Industrie AG, Nuernberg, Germany
H.W. Ruehl, Philips Kommunikations Industrie AG, Nuernberg, Germany
pp. 245-248
L. Fissore, CSELT, Torino, Italy
P. Laface, Philips Kommunikations Industrie AG, Nuernberg, Germany
P. Ruscitti, Philips Kommunikations Industrie AG, Nuernberg, Germany
pp. 249-252
F.-H. Liu, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Acero, Dept. of Eng., Cambridge Univ., UK
R.M. Stern, Philips Kommunikations Industrie AG, Nuernberg, Germany
pp. 257-260
S. Lerner, GTE Laboratories Inc., Waltham, MA, USA
B. Mazor, GTE Laboratories Inc., Waltham, MA, USA
pp. 261-264
P. Lockwood, Matra Commun., Bois d'Arcy, France
J. Boudy, Matra Commun., Bois d'Arcy, France
M. Blanchet, Matra Commun., Bois d'Arcy, France
pp. 265-268
B. Mak, Speech Technol. Lab., Panasonic Technologies Inc., Santa Barbara, CA, USA
J.-C. Junqua, Speech Technol. Lab., Panasonic Technologies Inc., Santa Barbara, CA, USA
B. Reaves, Speech Technol. Lab., Panasonic Technologies Inc., Santa Barbara, CA, USA
pp. 269-272
H. Singer, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
S. Sagayama, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 273-276
A.V. Oppenheim, MIT, Cambridge, MA, USA
E. Weinstein, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
K.C. Zangi, Speech Technol. Lab., Panasonic Technologies Inc., Santa Barbara, CA, USA
M. Feder, AT&T Bell Labs., Murray Hill, NJ, USA
D. Gauger, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 277-280
S. Oh, Texas Instruments, Dallas, TX, USA
V. Viswanathan, Texas Instruments, Dallas, TX, USA
P. Papamichalis, Texas Instruments, Dallas, TX, USA
pp. 281-284
K. Farrell, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
J.L. Flanagan, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
pp. 285-288
V.C. Soon, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
L. Tong, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
Y.F. Huang, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R. Liu, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 293-296
S. Nandkumar, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.H.L. Hansen, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 297-300
B.H. Juang, AT&T Bell Labs., Murray Hill, NJ, USA
K.K. Paliwal, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 301-304
Y. Grenier, Dept. of Electron. Eng., Changwon Nat. Univ., Kyungnam, South Korea
Byung-Gook Lee, AT&T Bell Labs., Murray Hill, NJ, USA
Iickho Song, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
Souguil Ann, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 309-312
R.L. Zinser, GE Corp. Res. & Dev., Schenectady, NY, USA
S.R. Koch, GE Corp. Res. & Dev., Schenectady, NY, USA
pp. 313-316
T. Miyano, NEC Corp., Kanagawa, Japan
M. Serizawa, NEC Corp., Kanagawa, Japan
J. Takizawa, Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
S. Ikeda, AT&T Bell Labs., Murray Hill, NJ, USA
K. Ozawa, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 321-324
T. Taniguchi, Fujitsu Laboratories Ltd., Kawasaki, Japan
Y. Tanaka, Fujitsu Laboratories Ltd., Kawasaki, Japan
Y. Ohta, Fujitsu Laboratories Ltd., Kawasaki, Japan
pp. 325-328
M. Delprat, Matra Commun., Bois d'Arcy, France
C. Gruet, Matra Commun., Bois d'Arcy, France
F. Dervaux, Matra Commun., Bois d'Arcy, France
C. Baroux, Matra Commun., Bois d'Arcy, France
pp. 329-332
P. Lupini, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
V. Cuperman, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 333-336
W.B. Kleijn, AT&T Bell Labs., Murray Hill, NJ, USA
R.P. Ramachandran, AT&T Bell Labs., Murray Hill, NJ, USA
P. Kroon, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 337-340
D. Docampo, ETSI Telecomunicacion, Vigo Univ., Spain
V. Abreu, ETSI Telecomunicacion, Vigo Univ., Spain
F. Perez, ETSI Telecomunicacion, Vigo Univ., Spain
F. Gonzalez, ETSI Telecomunicacion, Vigo Univ., Spain
pp. 341-344
A. Benyassine, New Jersey Inst. of Technol., Newark, NJ, USA
H. Abut, ETSI Telecomunicacion, Vigo Univ., Spain
pp. 345-348
S. Wang, Dept of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho, Dept of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 349-352
J.M. Koo, DigiCom Inst. of Telematics, Seoul, South Korea
H.S. Lee, Dept of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
C.K. Un, ETSI Telecomunicacion, Vigo Univ., Spain
pp. 357-360
C.J. Wellekens, Lernout & Hauspie Speech Products, Ieper, Belgium
pp. 361-364
T. Kawahara, Dept. of Inf. Sci., Kyoto Univ., Japan
S. Doshita, Dept. of Inf. Sci., Kyoto Univ., Japan
pp. 365-368
Z.-P. Hu, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
S. Imai, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
pp. 373-376
F. Brugnara, IRST, Povo di Trento, Italy
R. De Mori, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
D. Giuliani, ETSI Telecomunicacion, Vigo Univ., Spain
M. Omologo, ETSI Telecomunicacion, Vigo Univ., Spain
pp. 377-380
P. Ramesh, AT&T Bell Labs., Murray Hill, NJ, USA
J.G. Wilpon, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 381-384
T. Nitta, Toshiba Corp., Kawasaki, Japan
J. Iwasaki, Toshiba Corp., Kawasaki, Japan
Y. Masai, Toshiba Corp., Kawasaki, Japan
H. Matsu'ura, Toshiba Corp., Kawasaki, Japan
pp. 385-388
M. Ostendorf, Boston Univ., MA, USA
I. Bechwati, Boston Univ., MA, USA
O. Kimball, Boston Univ., MA, USA
pp. 389-392
B. Petek, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Tebelskis, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 397-400
E.R. Buhrke, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
J.L. LoCicero, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 401-404
S. Nakamura, Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
H. Sawai, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
M. Sugiyama, Boston Univ., MA, USA
pp. 409-412
E.L. Richards, Dept. of Comput. Sci., Colorado Univ., Boulder, CO, USA
pp. 413-416
E. McDermott, ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
S. Katagiri, ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
pp. 417-420
C. Dugast, Philips Res. Lab. Aachen, Germany
L. Devillers, ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
pp. 421-424
L.T. Niles, Xerox Palo Alto Res. Center, CA, USA
L.D. Wilcox, Xerox Palo Alto Res. Center, CA, USA
M.A. Bush, Xerox Palo Alto Res. Center, CA, USA
pp. 425-428
Huaiyu Zeng, Inst. of Acoust., Acad. Sinica, Beijing, China
Tiecheng Yu, Inst. of Acoust., Acad. Sinica, Beijing, China
pp. 429-432
K. Fukuzawa, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
Y. Komori, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
H. Sawai, Xerox Palo Alto Res. Center, CA, USA
M. Sugiyama, Toshiba Corp., Kawasaki, Japan
pp. 433-436
B.F. Necioglu, Boston Univ., MA, USA
M. Ostendorf, Boston Univ., MA, USA
J.R. Rohlicek, Xerox Palo Alto Res. Center, CA, USA
pp. 437-440
O. Schmidbauer, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Tebelskis, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 441-444
J.R. Bellegarda, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
A.J. Nadas, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
L.R. Bahl, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 445-448
H. Matsukoto, Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
H. Inoue, Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
pp. 449-452
M. Witbrock, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
P. Haffner, Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
pp. 453-456
T. Kobayashi, Dept. of Electr. Eng., Waseda Univ., Tokyo, Japan
Y. Uchiyama, Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
J. Osada, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
K. Shirai, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 457-460
F. Class, Daimler Benz AG, Ulm, Germany
A. Kaltenmeir, Daimler Benz AG, Ulm, Germany
P. Regal-Brietzmann, Daimler Benz AG, Ulm, Germany
K. Trottler, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 461-464
X. Huang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 465-468
M. Hoshimi, Matsushita Research Institute Tokyo, Inc., Kawasaki, Japan
M. Miyata, Matsushita Research Institute Tokyo, Inc., Kawasaki, Japan
S. Hiraoka, Matsushita Research Institute Tokyo, Inc., Kawasaki, Japan
K. Niyada, Matsushita Research Institute Tokyo, Inc., Kawasaki, Japan
pp. 469-472
W. Chou, AT&T Bell Labs., Murray Hill, NJ, USA
B.H. Juang, AT&T Bell Labs., Murray Hill, NJ, USA
C.H. Lee, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 473-476
L. Bahl, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Roukos, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 477-480
J.-L. Gauvain, AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 481-484
H.-W. Hon, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
K.-F. Lee, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 485-488
Pao-Chung Chang, Telecommunication Labs., Minist. of Commun., Taiwan
Biing-Hwang Juang, Logica Cambridge Ltd., UK
pp. 493-496
T. Komori, ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
S. Katagiri, ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
pp. 497-500
E.L. Bocchieri, AT&T Bell Labs., Murray Hill, NJ, USA
J.G. Wilpon, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 501-504
R. Cardin, Centre de Recherche Inf. de Montreal, Que., Canada
Y. Normandin, Centre de Recherche Inf. de Montreal, Que., Canada
R. De Mori, Centre de Recherche Inf. de Montreal, Que., Canada
pp. 505-508
H. Katterfeldt, Daimler-Benz Research Center, Ulm, Germany
P. Regel-Brietzmann, Daimler-Benz Research Center, Ulm, Germany
B. Vater, Daimler-Benz Research Center, Ulm, Germany
pp. 513-516
J.J. Godfrey, Texas Instruments, Inc., Dallas, TX, USA
E.C. Holliman, Texas Instruments, Inc., Dallas, TX, USA
J. McDaniel, Texas Instruments, Inc., Dallas, TX, USA
pp. 517-520
D. O'Shaughnessy, INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 521-524
M. Hahn, Electron. & Telecommun. Res. Inst., Daejon, South Korea
C.K. Park, Electron. & Telecommun. Res. Inst., Daejon, South Korea
pp. 525-528
Chorkin Chan, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Jian-Xiong Wu, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
pp. 529-532
B. Wheatley, Texas Instruments Inc., Dallas, TX, USA
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