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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1992)
San Francisco, CA, USA
Mar. 23, 1992 to Mar. 26, 1992
ISBN: 0-7803-0532-9
TABLE OF CONTENTS
R. Schwartz , BBN Systems & Technologies, Cambridge, MA, USA
S. Austin , BBN Systems & Technologies, Cambridge, MA, USA
F. Kubala , BBN Systems & Technologies, Cambridge, MA, USA
J. Makhoul , BBN Systems & Technologies, Cambridge, MA, USA
L. Nguyen , BBN Systems & Technologies, Cambridge, MA, USA
P. Placeway , BBN Systems & Technologies, Cambridge, MA, USA
pp. 1-4
R. Rosefeld , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
X. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Furst , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 5-8
H. Ney , Philips Res. Lab. Aachen, Germany
R. Haeb-Umbach , Philips Res. Lab. Aachen, Germany
B.-H. Tran , Philips Res. Lab. Aachen, Germany
M. Oerder , Philips Res. Lab. Aachen, Germany
pp. 9-12
R. Haeb-Umbach , Philips Res. Lab., Aachen, Germany
H. Ney , Philips Res. Lab., Aachen, Germany
pp. 13-16
L.R. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 17-20
I. Katunobu , Tokyo Inst. of Technol., Japan
H. Satoru , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
T. Hozumi , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 21-24
K. Asai , Electrotech. Lab., Ibaraki, Japan
S. Hayamizu , Electrotech. Lab., Ibaraki, Japan
K. Handa , Electrotech. Lab., Ibaraki, Japan
pp. 29-32
M.Y. Hwang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburg, PA, USA
X. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburg, PA, USA
pp. 33-36
T. Yamada , NTT Human Interface Labs., Tokyo, Japan
S. Matsunaga , NTT Human Interface Labs., Tokyo, Japan
K. Shikano , NTT Human Interface Labs., Tokyo, Japan
pp. 37-40
R. Soheili , Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
A.M. Kondoz , Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
B.G. Evans , Centre for Satellite Eng. Res., Surrey Univ., Guildford, UK
pp. 41-44
J.-H. Yao , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
J.J. Shynk , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 45-48
Y.J. Liu , ITT Aerospace, Nutley, NJ, USA
pp. 49-52
M. Mauc , ESIEE Dept. Signaux et Telecommun., Noisy le Grand, France
G. Baudoin , ESIEE Dept. Signaux et Telecommun., Noisy le Grand, France
pp. 53-56
P. Hedelin , Dept. of Inf. Theor., Chalmers Univ. of Technol., Gothenburg, Sweden
pp. 57-60
N. Moreau , Telecom, Paris, France
P. Dymarski , ESIEE Dept. Signaux et Telecommun., Noisy le Grand, France
pp. 61-64
Zhang Xiongwei , Nanjing Inst. of Commun. Eng., China
Chen Xianzhi , Nanjing Inst. of Commun. Eng., China
pp. 65-68
J.-H. Chen , AT&T Bell Labs., Murray Hill, NJ, USA
N. Jayant , AT&T Bell Labs., Murray Hill, NJ, USA
R.V. Cox , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 69-72
M. Fratti , Teletra-Alcatel, Milan, Italy
G.A. Mian , AT&T Bell Labs., Murray Hill, NJ, USA
G. Riccardi , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 73-76
S. Crisafulli , Dept. Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
J.D. Mills , AT&T Bell Labs., Murray Hill, NJ, USA
R.R. Bitmead , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 77-80
B. Sylvestre , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 81-84
T. Irino , NTT Basic Res. Labs., Tokyo, Japan
H. Kawahara , NTT Basic Res. Labs., Tokyo, Japan
pp. 85-88
V. Ramasubramanian , Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
K.K. Paliwal , Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
pp. 89-92
V.R. Algazi , Speech Res. Lab., California Univ., Davis, CA, USA
D. Irvine , Speech Res. Lab., California Univ., Davis, CA, USA
C. Caldwell , Speech Res. Lab., California Univ., Davis, CA, USA
M. Ready , Speech Res. Lab., California Univ., Davis, CA, USA
K. Brown , Speech Res. Lab., California Univ., Davis, CA, USA
S. Chung , Speech Res. Lab., California Univ., Davis, CA, USA
pp. 93-96
Chih-Chung Kuo , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Fu-Rong Jean , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Hsiao-Chuan Wang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 97-100
T.K. Wang , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
J. Foster , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
S. Ardalan , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
pp. 101-104
B. Bhattacharya , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
W. LeBlanc , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
S. Mahmoud , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
V. Cuperman , Speech Res. Lab., California Univ., Davis, CA, USA
pp. 105-108
M. Nakai , Dept. of Inf. Eng., Tohoku Univ., Sendai, Japan
H. Shimodaira , Dept. of Inf. Eng., Tohoku Univ., Sendai, Japan
M. Kimura , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
pp. 109-112
D. Sinha , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 113-116
Cheung-Fat Chan , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
Kwok-Wah Law , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 117-120
H. Hermansky , US West Advanced Technologies, Boulder, CO, USA
N. Morgan , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
A. Bayya , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
P. Kohn , Speech Res. Lab., California Univ., Davis, CA, USA
pp. 121-124
N. Hubing , Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
K. Yoo , Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
pp. 125-128
M.C. Dogan , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
J.M. Mendel , Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 129-132
A. Moreno , ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
J.A.R. Fonollosa , ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 133-136
T. Fukada , Inf. Syst. Res. Center, Canon Inc., Kawasaki, Japan
K. Tokuda , ETSE Telecommun., Univ. Politecnica de Catalunya, Barcelona, Spain
T. Kobayashi , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
S. Imai , Speech Res. Lab., California Univ., Davis, CA, USA
pp. 137-140
S. Qian , National Instruments, Austin, TX, USA
D. Chen , National Instruments, Austin, TX, USA
K. Chen , Dept. of Electr. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
pp. 141-144
H. Valbret , Telecom Paris, France
E. Moulines , Telecom Paris, France
J.P. Tubach , Telecom Paris, France
pp. 145-148
K. Hirose , Fac. of Eng., Tokyo Univ., Japan
H. Fujisaki , Telecom Paris, France
S. Seto , Telecom Paris, France
pp. 149-152
C. Montacie , Univ. Pierre et Marie Curie, Paris, France
P. Deleglise , Univ. Pierre et Marie Curie, Paris, France
F. Bimbot , Univ. Pierre et Marie Curie, Paris, France
M.-J. Caraty , Univ. Pierre et Marie Curie, Paris, France
pp. 153-156
G. Maltese , IBM Semea Rome Sci. Center, Italy
F. Mancini , IBM Semea Rome Sci. Center, Italy
pp. 157-160
U. Essen , Philips GmbH Forschungslaboratorien, Aachen, Germany
V. Steinbiss , Philips GmbH Forschungslaboratorien, Aachen, Germany
pp. 161-164
S. Matsunaga , NTT Human Interface Labs., Tokyo, Japan
T. Yamada , NTT Human Interface Labs., Tokyo, Japan
K. Shikano , NTT Human Interface Labs., Tokyo, Japan
pp. 165-168
J.H. Wright , Centre for Commun. Res., Bristol Univ., UK
G.J.F. Jones , Centre for Commun. Res., Bristol Univ., UK
E.N. Wrigley , Centre for Commun. Res., Bristol Univ., UK
pp. 169-172
J. Kupiec , Xerox Palo Alto Res. Center, CA, USA
pp. 177-180
D. Goddeau , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
V. Zue , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 181-184
Keh-Yih Su , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Tung-Hui Chiang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Yi-Chung Lin , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 185-188
S. Seneff , Lab for Comput. Sci., MIT, Cambridge, MA, USA
pp. 189-192
R. Pieraccini , AT&T Bell Labs., Murray Hill, NJ, USA
E. Tzoukermann , AT&T Bell Labs., Murray Hill, NJ, USA
Z. Gorelov , AT&T Bell Labs., Murray Hill, NJ, USA
J.-L. Gauvain , AT&T Bell Labs., Murray Hill, NJ, USA
E. Levin , AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee , AT&T Bell Labs., Murray Hill, NJ, USA
J.G. Wilpon , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 193-196
H. Tsuboi , Toshiba Corp., Kawasaki, Japan
Y. Takebayashi , Toshiba Corp., Kawasaki, Japan
pp. 197-200
L.G. Miller , AT&T Bell Labs., Murray Hill, NJ, USA
A.L. Gorin , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 201-204
A.N. Jain , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
D.S. Touretzky , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 205-208
L. Osterholtz , Carnegie Mellon Univ., Pittsburgh, PA, USA
C. Augustine , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. McNair , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
I. Rogina , AT&T Bell Labs., Murray Hill, NJ, USA
H. Saito , AT&T Bell Labs., Murray Hill, NJ, USA
T. Sloboda , AT&T Bell Labs., Murray Hill, NJ, USA
J. Tebelskis , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 209-212
D.B. Roe , AT&T Bell Labs., Murray Hill, NJ, USA
F.C.N. Pereira , AT&T Bell Labs., Murray Hill, NJ, USA
R.W. Sproat , AT&T Bell Labs., Murray Hill, NJ, USA
M.D. Riley , AT&T Bell Labs., Murray Hill, NJ, USA
P.J. Moreno , AT&T Bell Labs., Murray Hill, NJ, USA
A. Macarron , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 213-216
H. Shimodaira , Dept. of Inf. Eng., Tohoku Univ., Sendai, Japan
M. Kumura , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 217-220
C.W. Wightman , Boston Univ., MA, USA
M. Ostendorf , Boston Univ., MA, USA
pp. 221-224
J.L. Hieronymus , Center for Speech Technol. Res., Edinburgh Univ., UK
D. McKelvie , Center for Speech Technol. Res., Edinburgh Univ., UK
F. McInnes , Center for Speech Technol. Res., Edinburgh Univ., UK
pp. 225-227
F.R. Chen , Xerox Palo Alto Res. Center, CA, USA
M. Withgott , Xerox Palo Alto Res. Center, CA, USA
pp. 229-232
M.J.F. Gales , Dept. of Eng., Cambridge Univ., UK
S. Young , Dept. of Eng., Cambridge Univ., UK
pp. 233-236
B.A. Carlson , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 237-240
D.C. Bateman , Marconi Speech & Information Systems, Portsmouth, UK
D.K. Bye , Marconi Speech & Information Systems, Portsmouth, UK
M.J. Hunt , Marconi Speech & Information Systems, Portsmouth, UK
pp. 241-244
S. Dobler , Philips Kommunikations Industrie AG, Nuernberg, Germany
P. Meyer , Philips Kommunikations Industrie AG, Nuernberg, Germany
H.W. Ruehl , Philips Kommunikations Industrie AG, Nuernberg, Germany
pp. 245-248
L. Fissore , CSELT, Torino, Italy
P. Laface , Philips Kommunikations Industrie AG, Nuernberg, Germany
P. Ruscitti , Philips Kommunikations Industrie AG, Nuernberg, Germany
pp. 249-252
M.Q. Wang , Dept. of Eng., Cambridge Univ., UK
S.J. Young , Dept. of Eng., Cambridge Univ., UK
pp. 253-256
F.-H. Liu , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Acero , Dept. of Eng., Cambridge Univ., UK
R.M. Stern , Philips Kommunikations Industrie AG, Nuernberg, Germany
pp. 257-260
S. Lerner , GTE Laboratories Inc., Waltham, MA, USA
B. Mazor , GTE Laboratories Inc., Waltham, MA, USA
pp. 261-264
P. Lockwood , Matra Commun., Bois d'Arcy, France
J. Boudy , Matra Commun., Bois d'Arcy, France
M. Blanchet , Matra Commun., Bois d'Arcy, France
pp. 265-268
B. Mak , Speech Technol. Lab., Panasonic Technologies Inc., Santa Barbara, CA, USA
J.-C. Junqua , Speech Technol. Lab., Panasonic Technologies Inc., Santa Barbara, CA, USA
B. Reaves , Speech Technol. Lab., Panasonic Technologies Inc., Santa Barbara, CA, USA
pp. 269-272
H. Singer , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
S. Sagayama , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 273-276
A.V. Oppenheim , MIT, Cambridge, MA, USA
E. Weinstein , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
K.C. Zangi , Speech Technol. Lab., Panasonic Technologies Inc., Santa Barbara, CA, USA
M. Feder , AT&T Bell Labs., Murray Hill, NJ, USA
D. Gauger , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 277-280
S. Oh , Texas Instruments, Dallas, TX, USA
V. Viswanathan , Texas Instruments, Dallas, TX, USA
P. Papamichalis , Texas Instruments, Dallas, TX, USA
pp. 281-284
K. Farrell , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
J.L. Flanagan , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
pp. 285-288
Y. Ephraim , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 289-292
V.C. Soon , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
L. Tong , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
Y.F. Huang , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R. Liu , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 293-296
S. Nandkumar , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.H.L. Hansen , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 297-300
B.H. Juang , AT&T Bell Labs., Murray Hill, NJ, USA
K.K. Paliwal , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 301-304
Y. Grenier , ENST, Paris, France
pp. 305-308
Y. Grenier , Dept. of Electron. Eng., Changwon Nat. Univ., Kyungnam, South Korea
Byung-Gook Lee , AT&T Bell Labs., Murray Hill, NJ, USA
Iickho Song , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
Souguil Ann , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 309-312
R.L. Zinser , GE Corp. Res. & Dev., Schenectady, NY, USA
S.R. Koch , GE Corp. Res. & Dev., Schenectady, NY, USA
pp. 313-316
D. Lin , Hughes Network Systems, Germantown, MD, USA
pp. 317-320
T. Miyano , NEC Corp., Kanagawa, Japan
M. Serizawa , NEC Corp., Kanagawa, Japan
J. Takizawa , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
S. Ikeda , AT&T Bell Labs., Murray Hill, NJ, USA
K. Ozawa , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 321-324
T. Taniguchi , Fujitsu Laboratories Ltd., Kawasaki, Japan
Y. Tanaka , Fujitsu Laboratories Ltd., Kawasaki, Japan
Y. Ohta , Fujitsu Laboratories Ltd., Kawasaki, Japan
pp. 325-328
M. Delprat , Matra Commun., Bois d'Arcy, France
C. Gruet , Matra Commun., Bois d'Arcy, France
F. Dervaux , Matra Commun., Bois d'Arcy, France
C. Baroux , Matra Commun., Bois d'Arcy, France
pp. 329-332
P. Lupini , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
V. Cuperman , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 333-336
W.B. Kleijn , AT&T Bell Labs., Murray Hill, NJ, USA
R.P. Ramachandran , AT&T Bell Labs., Murray Hill, NJ, USA
P. Kroon , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 337-340
D. Docampo , ETSI Telecomunicacion, Vigo Univ., Spain
V. Abreu , ETSI Telecomunicacion, Vigo Univ., Spain
F. Perez , ETSI Telecomunicacion, Vigo Univ., Spain
F. Gonzalez , ETSI Telecomunicacion, Vigo Univ., Spain
pp. 341-344
A. Benyassine , New Jersey Inst. of Technol., Newark, NJ, USA
H. Abut , ETSI Telecomunicacion, Vigo Univ., Spain
pp. 345-348
S. Wang , Dept of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho , Dept of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 349-352
T. Kawabata , NTT Basic Res. Labs., Tokyo, Japan
pp. 353-356
J.M. Koo , DigiCom Inst. of Telematics, Seoul, South Korea
H.S. Lee , Dept of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
C.K. Un , ETSI Telecomunicacion, Vigo Univ., Spain
pp. 357-360
C.J. Wellekens , Lernout & Hauspie Speech Products, Ieper, Belgium
pp. 361-364
T. Kawahara , Dept. of Inf. Sci., Kyoto Univ., Japan
S. Doshita , Dept. of Inf. Sci., Kyoto Univ., Japan
pp. 365-368
M. Taylor , Telecom Paris, France
F. Bimbot , Telecom Paris, France
pp. 369-372
Z.-P. Hu , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
S. Imai , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
pp. 373-376
F. Brugnara , IRST, Povo di Trento, Italy
R. De Mori , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
D. Giuliani , ETSI Telecomunicacion, Vigo Univ., Spain
M. Omologo , ETSI Telecomunicacion, Vigo Univ., Spain
pp. 377-380
P. Ramesh , AT&T Bell Labs., Murray Hill, NJ, USA
J.G. Wilpon , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 381-384
T. Nitta , Toshiba Corp., Kawasaki, Japan
J. Iwasaki , Toshiba Corp., Kawasaki, Japan
Y. Masai , Toshiba Corp., Kawasaki, Japan
H. Matsu'ura , Toshiba Corp., Kawasaki, Japan
pp. 385-388
M. Ostendorf , Boston Univ., MA, USA
I. Bechwati , Boston Univ., MA, USA
O. Kimball , Boston Univ., MA, USA
pp. 389-392
G. Rigoll , NTT Human Interface Labs., Tokyo, Japan
pp. 393-396
B. Petek , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Tebelskis , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 397-400
E.R. Buhrke , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
J.L. LoCicero , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 401-404
Y. Komori , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 405-408
S. Nakamura , Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
H. Sawai , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
M. Sugiyama , Boston Univ., MA, USA
pp. 409-412
E.L. Richards , Dept. of Comput. Sci., Colorado Univ., Boulder, CO, USA
pp. 413-416
E. McDermott , ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
S. Katagiri , ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
pp. 417-420
C. Dugast , Philips Res. Lab. Aachen, Germany
L. Devillers , ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
pp. 421-424
L.T. Niles , Xerox Palo Alto Res. Center, CA, USA
L.D. Wilcox , Xerox Palo Alto Res. Center, CA, USA
M.A. Bush , Xerox Palo Alto Res. Center, CA, USA
pp. 425-428
Huaiyu Zeng , Inst. of Acoust., Acad. Sinica, Beijing, China
Tiecheng Yu , Inst. of Acoust., Acad. Sinica, Beijing, China
pp. 429-432
K. Fukuzawa , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
Y. Komori , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
H. Sawai , Xerox Palo Alto Res. Center, CA, USA
M. Sugiyama , Toshiba Corp., Kawasaki, Japan
pp. 433-436
B.F. Necioglu , Boston Univ., MA, USA
M. Ostendorf , Boston Univ., MA, USA
J.R. Rohlicek , Xerox Palo Alto Res. Center, CA, USA
pp. 437-440
O. Schmidbauer , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Tebelskis , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 441-444
J.R. Bellegarda , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
A.J. Nadas , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
L.R. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 445-448
H. Matsukoto , Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
H. Inoue , Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
pp. 449-452
M. Witbrock , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
P. Haffner , Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
pp. 453-456
T. Kobayashi , Dept. of Electr. Eng., Waseda Univ., Tokyo, Japan
Y. Uchiyama , Dept. of Electr. & Electron. Eng., Shinshu Univ., Nagano, Japan
J. Osada , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
K. Shirai , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 457-460
F. Class , Daimler Benz AG, Ulm, Germany
A. Kaltenmeir , Daimler Benz AG, Ulm, Germany
P. Regal-Brietzmann , Daimler Benz AG, Ulm, Germany
K. Trottler , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 461-464
X. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 465-468
M. Hoshimi , Matsushita Research Institute Tokyo, Inc., Kawasaki, Japan
M. Miyata , Matsushita Research Institute Tokyo, Inc., Kawasaki, Japan
S. Hiraoka , Matsushita Research Institute Tokyo, Inc., Kawasaki, Japan
K. Niyada , Matsushita Research Institute Tokyo, Inc., Kawasaki, Japan
pp. 469-472
W. Chou , AT&T Bell Labs., Murray Hill, NJ, USA
B.H. Juang , AT&T Bell Labs., Murray Hill, NJ, USA
C.H. Lee , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 473-476
L. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Roukos , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 477-480
J.-L. Gauvain , AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 481-484
H.-W. Hon , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
K.-F. Lee , AT&T Bell Labs., Murray Hill, NJ, USA
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D.A. Gaganelis , Logica Cambridge Ltd., UK
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Pao-Chung Chang , Telecommunication Labs., Minist. of Commun., Taiwan
Biing-Hwang Juang , Logica Cambridge Ltd., UK
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T. Komori , ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
S. Katagiri , ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
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J.J. Godfrey , Texas Instruments, Inc., Dallas, TX, USA
E.C. Holliman , Texas Instruments, Inc., Dallas, TX, USA
J. McDaniel , Texas Instruments, Inc., Dallas, TX, USA
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M. Hahn , Electron. & Telecommun. Res. Inst., Daejon, South Korea
C.K. Park , Electron. & Telecommun. Res. Inst., Daejon, South Korea
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Jian-Xiong Wu , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
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B. Wheatley , Texas Instruments Inc., Dallas, TX, USA
G. Doddington , Texas Instruments Inc., Dallas, TX, USA
C. Hemphill , Texas Instruments Inc., Dallas, TX, USA
J. Godfrey , Texas Instruments Inc., Dallas, TX, USA
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D. Fisher , Texas Instruments Inc., Dallas, TX, USA
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A.B. Fineberg , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
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P. Dalsgaard , Speech Technol. Centre, Aalborg Univ., Denmark
O. Andersen , Speech Technol. Centre, Aalborg Univ., Denmark
W. Barry , Center for Comput. Aids for Ind. Productivity, Rutgers Univ., Piscataway, NJ, USA
R. Jorgensen , Texas Instruments Inc., Dallas, TX, USA
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T. Matsuoka , NTT Human Interface Labs., Tokyo, Japan
K. Shikano , NTT Human Interface Labs., Tokyo, Japan
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J.-L. Gauvain , LIMSI-CNRS, Orsay, France
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H. Niemann , Lehrstuhl fuer Inf., Erlangen Univ., Germany
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T. Kuhn , Lehrstuhl fuer Inf., Erlangen Univ., Germany
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T. Waardenburg , Stellenbosch Univ., South Africa
J.A. de Preez , Stellenbosch Univ., South Africa
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F. Fallside , Dept. of Eng., Cambridge Univ., UK
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H.C. Leung , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
I.L. Heherington , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
V.W. Zue , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
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T. Robinson , Dept. of Eng., Cambridge Univ., UK
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P. Haffner , CNET, Lannion, France
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S. Della Pietra , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
V. Della Pietra , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
R.L. Mercer , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Roukos , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
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M. Dunn , Dept. of Electron. & Electr. Eng., Univ., Coll. Dublin, Ireland
B. Murray , Dept. of Electron. & Electr. Eng., Univ., Coll. Dublin, Ireland
A.D. Fagan , Dept. of Electron. & Electr. Eng., Univ., Coll. Dublin, Ireland
pp. 637-639
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