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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1991)
Toronto, Ont., Canada
Apr. 14, 1991 to Apr. 17, 1991
ISBN: 0-7803-0003-3
TABLE OF CONTENTS
S. Quackenbush , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 1-4
E. Ordentlich , AT&T Bell Lab., Murray Hill, NJ, USA
Y. Shoham , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 9-12
C. Laflamme , Commun. Res. Center, Sherbrooke Univ., Que., Canada
J.-P. Adoul , Commun. Res. Center, Sherbrooke Univ., Que., Canada
R. Salami , Commun. Res. Center, Sherbrooke Univ., Que., Canada
S. Morissette , Commun. Res. Center, Sherbrooke Univ., Que., Canada
P. Mabilleau , Commun. Res. Center, Sherbrooke Univ., Que., Canada
pp. 13-16
G. Roy , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 17-20
J.-H. Chen , AT&T Bell Lab., Murray Hill, NJ, USA
Y.-C. Lin , AT&T Bell Lab., Murray Hill, NJ, USA
R.V. Cox , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 21-24
M. Foodeei , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 25-28
R. Peng , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
V. Cuperman , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 29-32
A. Aarskog , EB Technol., Billingstadsletta, Norway
A. Nilsen , EB Technol., Billingstadsletta, Norway
O. Berg , EB Technol., Billingstadsletta, Norway
H.C. Guren , EB Technol., Billingstadsletta, Norway
pp. 37-40
C.R. Nassar , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
M.R. Soleymani , EB Technol., Billingstadsletta, Norway
pp. 41-44
H. Sawai , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 45-48
N. Morgan , Int. Comput. Sci. Inst., Berkeley, CA, USA
H. Hermansky , EB Technol., Billingstadsletta, Norway
H. Bourlard , EB Technol., Billingstadsletta, Norway
P. Kohn , EB Technol., Billingstadsletta, Norway
C. Wooters , Commun. Res. Center, Sherbrooke Univ., Que., Canada
pp. 49-52
H. Sawai , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 53-56
K.-i. Iso , NEC Corp., Kawasaki, Japan
T. Wantabe , NEC Corp., Kawasaki, Japan
pp. 57-60
J. Tebelskis , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
B. Petek , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
O. Schmidbauer , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 61-64
Jhing-Fa Wang , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Chung-Hsien Wu , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Chaug-Ching Haung , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Jau-Yien Lee , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 69-72
F. Bimbot , Telecom Paris, CNRS, France
G. Chollet , Telecom Paris, CNRS, France
J.-P. Tubach , Telecom Paris, CNRS, France
pp. 73-76
J.-P. Tubach , Korea Adv. Inst. of Sci. & Technol., Cheongryang, Seoul, South Korea
J.-P. Tubach , Korea Adv. Inst. of Sci. & Technol., Cheongryang, Seoul, South Korea
Hyunsoo Yoon , Korea Adv. Inst. of Sci. & Technol., Cheongryang, Seoul, South Korea
Hyunsoo Yoon , Korea Adv. Inst. of Sci. & Technol., Cheongryang, Seoul, South Korea
pp. 77-80
F. Greco , Fondazione Ugo Bordoni, Roma, Italy
A. Paoloni , Fondazione Ugo Bordoni, Roma, Italy
G. Ravaioli , Fondazione Ugo Bordoni, Roma, Italy
pp. 81-84
M. Nakamura , Sumitomo Metal Ind., Ltd., Japan
S. Tamura , Fondazione Ugo Bordoni, Roma, Italy
S. Sagayama , Fondazione Ugo Bordoni, Roma, Italy
pp. 85-88
J.-i. Takami , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
S. Sagayama , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 89-92
Y. Bennani , Univ. Paris Sud, Orsay, France
N. Chaourar , Univ. Paris Sud, Orsay, France
P. Gallinari , Univ. Paris Sud, Orsay, France
A. Mellouk , Univ. Paris Sud, Orsay, France
pp. 97-100
J. Kangas , Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
pp. 101-104
P. Haffner , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Franzini , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 105-108
M.M. Hochberg , LEMS, Brown Univ., Providence, RI, USA
L.T. Niles , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.T. Foote , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
H.F. Silverman , Univ. Paris Sud, Orsay, France
pp. 109-112
P. Ramesh , AT&T Bell Lab., Murray Hill, NJ, USA
S. Katagiri , AT&T Bell Lab., Murray Hill, NJ, USA
C.-H. Lee , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 113-116
U. Bodenhausen , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 117-120
Y. Gong , CRI INRIA, Nancy, France
J.-P. Haton , CRI INRIA, Nancy, France
pp. 121-124
R.L. Watrous , Dept. of Comput. Sci., Toronto Univ., Ont., Canada
pp. 129-131
P. Brauer , Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
P. Hedelin , Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
D. Huber , Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
P. Knagenhjelm , Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
pp. 133-136
J.-E. Stromberg , Dept. of Electr. Eng., Linkoping Univ., Sweden
J. Zrida , Dept. of Electr. Eng., Linkoping Univ., Sweden
A. Isaksson , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 137-140
D. Lubensky , NYNEX Sci. & Technol., White Plains, NY, USA
pp. 141-144
L. Barbier , Telecom Paris, CNRS, France
G. Chollet , Telecom Paris, CNRS, France
pp. 145-148
T.R. Anderson , Harry G. Armstrong Aerosp. Med. Res. Lab., Wright-Patterson AFB, OH, USA
pp. 149-152
Y. Gong , CRI, INRIA, Nancy, France
Y. Cheng , CRI, INRIA, Nancy, France
J.-P. Haton , CRI, INRIA, Nancy, France
pp. 153-156
E.R. Buhrke , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
J.L. LoCicero , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 157-160
C.-H. Lee , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 161-164
Y. Laprie , CRI, INRIA-Lorraine, Vandoeuvre-Les-Nancy, France
pp. 165-168
T. Yamada , NTT Human Interface Lab., Tokyo, Japan
T. Hanazawa , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
T. Kawabata , CRI, INRIA, Nancy, France
S. Matsunaga , Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
K. Shikano , Commun. Res. Center, Sherbrooke Univ., Que., Canada
pp. 169-172
L.R. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Das , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. deSouza , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Epstein , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
R.L. Mercer , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
B. Merialdo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Powell , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 173-176
L.R. Bahl , IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
J.R. Bellegarda , IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
P.V. deSouza , IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan , IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
pp. 177-180
L.C. Wood , GEC-Marconi Ltd., Wembley, UK
D.J.B. Pearce , GEC-Marconi Ltd., Wembley, UK
F. Novello , GEC-Marconi Ltd., Wembley, UK
pp. 181-184
L.R. Bahl , IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
P.V. deSouza , IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan , IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
pp. 185-188
E. Sanchis , Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
F. Casacuberta , Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
I. Galiano , Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
E. Segarra , Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
pp. 189-192
L. Deng , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
K. Erler , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 193-196
P. Dalsgaard , Speech Technol. Centre, Aalborg Univ., Denmark
O. Andersen , Speech Technol. Centre, Aalborg Univ., Denmark
W. Barry , Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
pp. 197-200
W.B. Kleijn , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 201-204
I.A. Gerson , Motorola Inc., Schaumburg, IL, USA
M.A. Jasiuk , Motorola Inc., Schaumburg, IL, USA
pp. 205-208
A. Le Guyader , France Telecom, Lannion, France
R. Di Francesco , France Telecom, Lannion, France
C. Lamblin , France Telecom, Lannion, France
pp. 209-212
K. Ozawa , NEC Corp., Kanagawa, Japan
T. Miyano , NEC Corp., Kanagawa, Japan
pp. 213-216
W. Granzow , AT&T Bell Lab., Murray Hill, NJ, USA
B.S. Atal , AT&T Bell Lab., Murray Hill, NJ, USA
K.K. Paliwal , AT&T Bell Lab., Murray Hill, NJ, USA
J. Schroeter , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 217-220
M. Johnson , Fujitsu Labs. Ltd., Kawasaki, Japan
T. Taniguchi , Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 221-224
P. Hedelin , Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
A. Bergstrom , Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
pp. 225-228
K. Miseki , Toshiba Res. & Dev. Center, Kawasaki, Japan
M. Akamine , Toshiba Res. & Dev. Center, Kawasaki, Japan
pp. 229-232
M. Copperi , SIP Headquarters, Torino, Italy
pp. 233-236
U. Kipper , Inst. fuer Angewandte Phys., Frankfurt am Main Univ., Germany
H. Reininger , Inst. fuer Angewandte Phys., Frankfurt am Main Univ., Germany
D. Wolf , Inst. fuer Angewandte Phys., Frankfurt am Main Univ., Germany
pp. 237-240
T. Taniguchi , Fujitsu Labs. Ltd., Kawasaki, Japan
M. Johnson , Fujitsu Labs. Ltd., Kawasaki, Japan
Y. Ohta , Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 241-244
P.C. Loizou , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
A.S. Spanias , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 245-248
J.C. Hardwick , Digital Voice Syst. Inc., Cambridge, MA, USA
J.S. Lim , Digital Voice Syst. Inc., Cambridge, MA, USA
pp. 249-252
L. Fissore , CSELT, Torino, Italy
P. Laface , Digital Voice Syst. Inc., Cambridge, MA, USA
G. Micca , Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 253-256
Yuqing Gao , Inst. of Autom., Chinese Acad. of Sci., Beijing, China
Taiyi Huang , Inst. of Autom., Chinese Acad. of Sci., Beijing, China
Zhiwei Lin , Inst. of Autom., Chinese Acad. of Sci., Beijing, China
Bo Xu , Inst. of Autom., Chinese Acad. of Sci., Beijing, China
Dongxin Xu , Inst. of Autom., Chinese Acad. of Sci., Beijing, China
pp. 257-260
K. Torkkola , Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
M. Kokkonen , Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
pp. 261-264
T. Matsuoka , NTT Human Interface Lab., Tokyo, Japan
K. Shikano , NTT Human Interface Lab., Tokyo, Japan
pp. 265-268
K. Kita , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
W.H. Ward , NTT Human Interface Lab., Tokyo, Japan
pp. 269-272
S. Makino , Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
A. Ito , Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
M. Endo , Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
K. Kido , Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
pp. 273-276
J.S. Bridle , R. Signals & Radar Establ., Malvern, UK
L. Dodd , R. Signals & Radar Establ., Malvern, UK
pp. 277-280
J.N. Marcus , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
V.W. Zue , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 281-284
H.M. Meng , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
V.W. Zue , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 285-288
V. Digalakis , Boston Univ., MA, USA
J.R. Rohlicek , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
M. Ostendorf , Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
pp. 289-292
K.L. Brown , Center for Image Process. & Integrated Comput., Univ. of California, Davis, CA, USA
V.R. Algazi , Center for Image Process. & Integrated Comput., Univ. of California, Davis, CA, USA
pp. 293-296
H. Cerf-Danon , IBM-France Sci. Center, Paris, France
M. El-Beze , IBM-France Sci. Center, Paris, France
pp. 297-300
S. Euler , Telenorma, Bosch Telecom, Frankfurt am Main, Germany
J. Zinke , Telenorma, Bosch Telecom, Frankfurt am Main, Germany
pp. 301-304
A. Asadi , Northeastern Univ., Boston, MA, USA
R. Schwartz , Telenorma, Bosch Telecom, Frankfurt am Main, Germany
J. Makhoul , Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
pp. 305-308
J.G. Wilpon , AT&T Bell Labs., Murray Hill, NJ, USA
L.G. Miller , AT&T Bell Labs., Murray Hill, NJ, USA
P. Modi , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 309-312
D.P. Morgan , Lockheed Sanders Inc., Nashua, NH, USA
C.L. Scofield , AT&T Bell Labs., Murray Hill, NJ, USA
J.E. Adcock , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 313-316
R.C. Rose , Lincoln Lab., MIT, Lexington, MA, USA
E.I. Chang , Lincoln Lab., MIT, Lexington, MA, USA
R.P. Lippmann , Lincoln Lab., MIT, Lexington, MA, USA
pp. 317-320
C.W. Wightman , Boston Univ., MA, USA
M. Ostendorf , Boston Univ., MA, USA
pp. 321-324
R.A. Cole , Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Fanty , Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Gopalakrishnan , Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
R.D.T. Janssen , Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 325-328
D.B. Paul , MIT Lincoln Lab., Lexington, MA, USA
pp. 329-332
Y. Zhao , Panasonic Technol. Inc., Santa Barbara, CA, USA
H. Wakita , Panasonic Technol. Inc., Santa Barbara, CA, USA
X. Zhuang , Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 333-336
W.S. Meisel , Speech Syst. Inc., Tarzana, CA, USA
M.T. Anikst , Speech Syst. Inc., Tarzana, CA, USA
S.S. Pirzadeh , Speech Syst. Inc., Tarzana, CA, USA
J.E. Schumacher , Speech Syst. Inc., Tarzana, CA, USA
M.C. Soares , Speech Syst. Inc., Tarzana, CA, USA
D.J. Trawick , Speech Syst. Inc., Tarzana, CA, USA
pp. 337-340
V.N. Gupta , INRS-Telecommun., Montreal, Que., Canada
M. Lennig , INRS-Telecommun., Montreal, Que., Canada
P. Mermelstein , INRS-Telecommun., Montreal, Que., Canada
P. Kenny , INRS-Telecommun., Montreal, Que., Canada
F. Seitz , INRS-Telecommun., Montreal, Que., Canada
D. O'Shaughnessy , INRS-Telecommun., Montreal, Que., Canada
pp. 341-344
X.D. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
K.F. Lee , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
H.W. Hon , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M.Y. Hwang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 345-348
J.G. Wilpon , AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee , AT&T Bell Labs., Murray Hill, NJ, USA
L.R. Rabiner , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 349-352
Y.K. Muthusamy , Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
R.A. Cole , Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Gopalakrishnan , Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 353-356
H. Franco , INESC, Lisboa, Portugal
A. Serralheiro , INESC, Lisboa, Portugal
pp. 357-360
W. Ward , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 365-367
S. Renals , Centre for Speech Technol. Res., Edinburgh Univ., UK
D. McKelvie , Centre for Speech Technol. Res., Edinburgh Univ., UK
F. McInnes , Centre for Speech Technol. Res., Edinburgh Univ., UK
pp. 369-372
D.A. Gaganelis , Logica Cambridge Ltd., UK
E.D. Frangoulis , Logica Cambridge Ltd., UK
pp. 373-376
T. Matsui , NTT Human Interface Lab., Tokyo, Japan
S. Furui , NTT Human Interface Lab., Tokyo, Japan
pp. 377-380
A.E. Rosenberg , AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee , AT&T Bell Labs., Murray Hill, NJ, USA
S. Gokcen , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 381-384
Y. Bennani , Lab. de Recherche en Inf., Univ. de Paris-Sud, Orsay, France
P. Gallinari , Lab. de Recherche en Inf., Univ. de Paris-Sud, Orsay, France
pp. 385-388
L. Rudasi , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
S.A. Zahorian , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 389-392
J. Oglesby , Dept. of Electr. & Electron. Eng., Univ. Coll., Swansea, UK
J.S. Mason , Dept. of Electr. & Electron. Eng., Univ. Coll., Swansea, UK
pp. 393-396
M.J. Carey , Ensigma Ltd., Chepstow, UK
E.S. Parris , Ensigma Ltd., Chepstow, UK
J.S. Bridle , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 397-400
R.C. Rose , MIT Lincoln Lab., Lexington, MA, USA
J. Fitzmaurice , MIT Lincoln Lab., Lexington, MA, USA
E.M. Hofstetter , MIT Lincoln Lab., Lexington, MA, USA
D.A. Reynolds , MIT Lincoln Lab., Lexington, MA, USA
pp. 401-404
A.L. Higgins , MIT Lincoln Lab., Lexington, MA, USA
L.G. Bahler , MIT Lincoln Lab., Lexington, MA, USA
pp. 405-408
J.W. Fussell , Dept. of Defense, Fort Meade, MD, USA
pp. 409-412
P. Maragos , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
pp. 417-420
P. Maragos , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
T.F. Quatieri , MIT Lincoln Lab., Lexington, MA, USA
J.F. Kaiser , MIT Lincoln Lab., Lexington, MA, USA
pp. 421-424
B. Townshend , TCT, Montreal, Que., Canada
pp. 425-428
K.K. Paliwal , AT&T Bell Labs., Murray Hill, NJ, USA
M.M. Sondhi , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 429-432
L.E. Atlas , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
P.J. Loughlin , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
J.W. Pitton , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 433-436
R.P. Cohn , US Dept. of Defense, Fort Meade, MD, USA
pp. 437-440
T. Ghiselli-Crippa , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
A. El-Jaroudi , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 441-444
K.S. Nathan , LEMS, Brown Univ., Providence, RI, USA
H.F. Silverman , LEMS, Brown Univ., Providence, RI, USA
pp. 445-448
S. Kadambe , Appl. Sci. & Eng. Lab., A.I. duPont Inst., Wilmington, DE, USA
G.F. Bourdeaux-Bartels , LEMS, Brown Univ., Providence, RI, USA
pp. 449-452
A.I.C. Monaghan , Centre for Speech Technol. Res., Edinburgh Univ., UK
D.R. Ladd , LEMS, Brown Univ., Providence, RI, USA
pp. 453-456
S. Cheung , MIT, Cambridge, MA, USA
J.S. Lim , MIT, Cambridge, MA, USA
pp. 457-460
D. Rainton , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 461-464
D.J. Pepper , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements , MIT, Cambridge, MA, USA
pp. 465-468
N. Merhav , Dept. of Electr. Eng., Technion, Haifa, Israel
Y. Ephraim , MIT, Cambridge, MA, USA
pp. 469-472
A. Ljolje , AT&T Bell Labs., Murray Hill, NJ, USA
M.D. Riley , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 473-476
G.C. Hegerl , Siemens AG, Munich, Germany
H. Hoge , Siemens AG, Munich, Germany
pp. 477-480
S.K. Gupta , AT&T Bell Labs., Murray Hill, NJ, USA
J. Schroeter , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 481-484
M.G. Rahim , AT&T Bell Labs., Murray Hill, NJ, USA
W.B. Keijn , AT&T Bell Labs., Murray Hill, NJ, USA
J. Schroeter , AT&T Bell Labs., Murray Hill, NJ, USA
C.C. Goodyear , MIT Lincoln Lab., Lexington, MA, USA
pp. 485-488
T. Kobayashi , Dept. of Electr. Eng., Hosei Univ., Tokyo, Japan
M. Yagyu , Dept. of Electr. Eng., Hosei Univ., Tokyo, Japan
K. Shirai , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 489-492
S. Wang , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Sekey , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 493-496
U. Halka , AG Digitale Signalverarbeitung, Ruhr-Univ. Bochum, Germany
pp. 497-500
W. Verhelst , Inst. for Perception Res., Eindhoven Univ. of Technol., Netherlands
pp. 501-504
A.L. Lalwani , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
D.G. Childers , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 505-508
S. Lucas , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
B. Damper , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 509-512
N. Polish , Dept. of Comput. Sci., Columbia Univ., New York, NY, USA
pp. 513-516
P. Bhaskararao , Dept. of Linguistics, Deccan Coll., Pune, India
S.J. Eady , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
J.H. Esling , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 517-520
H. Martinez-Alfaro , Centro de Inteligencia Artificial, Inst. Tecnologicoy de Estudios Superiores de Monterrey, Mexico
J.L. Contreras-Vidal , Centro de Inteligencia Artificial, Inst. Tecnologicoy de Estudios Superiores de Monterrey, Mexico
pp. 521-523
N. Yiourgalis , Lab. of Wire Commun., Patras Univ., Greece
G. Kokkinakis , Lab. of Wire Commun., Patras Univ., Greece
pp. 525-528
N. Merhav , Dept. of Electr. Eng., Technion, Haifa, Israel
Y. Ephraim , Lab. of Wire Commun., Patras Univ., Greece
pp. 529-532
R. Cardin , Centre de Recherche Inf. de Montreal, Que., Canada
Y. Normandin , Centre de Recherche Inf. de Montreal, Que., Canada
R. De Mori , Centre de Recherche Inf. de Montreal, Que., Canada
pp. 533-536
Y. Normandin , Centre de Recherche Inf. de Montreal, Que., Canada
S.D. Morgera , Centre de Recherche Inf. de Montreal, Que., Canada
pp. 537-540
Keh-Yin Su , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Chin-Hui Lee , Centre de Recherche Inf. de Montreal, Que., Canada
pp. 541-544
P.C. Woodland , Dept. of Eng., Cambridge Univ., UK
D.R. Cole , Dept. of Eng., Cambridge Univ., UK
pp. 545-548
Fao-Chung Chang , Telecommun. Lab., Minist. of Commun., Taiwan
Sin-Horng Chen , Dept. of Eng., Cambridge Univ., UK
Biing-Hwang Juang , Centre de Recherche Inf. de Montreal, Que., Canada
pp. 549-552
H. Iwamida , ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
S. Katagiri , ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
E. McDermott , ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
pp. 553-556
T. Kawahara , Dept. of Inf. Sci., Kyoto Univ., Japan
S. Doshita , Dept. of Inf. Sci., Kyoto Univ., Japan
pp. 557-560
S.A. Zahorian , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
D. Qian , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
A.J. Jagharghi , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 561-564
A. Nadas , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Powell , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 565-568
D.B. Paul , MIT Lincoln Lab., Lexington, MA, USA
J.K. Baker , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J.M. Baker , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 569-572
R.J. McAulay , Lincoln Lab., MIT, Lexington, MA, USA
T.F. Quatieri , Lincoln Lab., MIT, Lexington, MA, USA
pp. 577-580
H. Carl , AG Digitale Signalverarbeitung, Ruhr-Univ. Bochum, Germany
B. Kopatzik , AG Digitale Signalverarbeitung, Ruhr-Univ. Bochum, Germany
pp. 581-584
L.A. Hernandez-Gomez , ETSI Telecommun., Madrid, Spain
F.J. Casajus-Quiros , ETSI Telecommun., Madrid, Spain
C. Garcia-Mateo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Ortega-Garcia , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 585-588
J. Haagen , Telecommun. Res. Lab., Horsholm, Denmark
H. Nielsen , Telecommun. Res. Lab., Horsholm, Denmark
S.D. Hansen , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 589-592
A.V. McCree , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
A.V. McCree , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 593-596
J.A. Martins , CPqD-Telebras, Campinas, Brazil
F. Violaro , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 597-600
Y.J. Liu , ITT Aerosp., Commun. Div., Nutley, NJ, USA
pp. 601-604
P. Jeanrenaud , BBN Syst. & Technol., Cambridge, MA, USA
P. Peterson , BBN Syst. & Technol., Cambridge, MA, USA
pp. 605-608
D.P. Kemp , US Dept. of Defense, Fort Meade, MD, USA
J.S. Collura , US Dept. of Defense, Fort Meade, MD, USA
T.E. Tremain , US Dept. of Defense, Fort Meade, MD, USA
pp. 609-612
Y. Wu , Telecom Denmark, Tastrup, Denmark
H.B. Hansen , US Dept. of Defense, Fort Meade, MD, USA
K.J. Larsen , US Dept. of Defense, Fort Meade, MD, USA
H. Nielsen , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J.A. Sorensen , INRS-Telecommun., Montreal, Que., Canada
pp. 613-616
C. Gruet , Matra Commun., Bois d'Arcy, France
F. Pommaret , Matra Commun., Bois d'Arcy, France
M. Delprat , Matra Commun., Bois d'Arcy, France
pp. 617-620
F.G. Andreotti , Italtel SIT, Milan, Italy
V. Maiorano , Italtel SIT, Milan, Italy
L. Vetrano , Italtel SIT, Milan, Italy
pp. 621-624
H. Hermansson , Ericsson Radio Syst. AB, Stockholm, Sweden
T.B. Minde , Italtel SIT, Milan, Italy
J. Ahlberg , Italtel SIT, Milan, Italy
P. Lundqvist , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 625-628
S.-W. Wong , Inmarsat, London, UK
pp. 629-632
Y. Medan , IBM Israel Sci. & Technol., Haifa, Israel
pp. 633-636
F.H. Wu , US West Adv. Technol. Inc., Englewood, CO, USA
K.K. Parhi , Italtel SIT, Milan, Italy
K. Ganesan , Italtel SIT, Milan, Italy
pp. 637-640
R. Laroia , Maryland Univ., College Park, MD, USA
N. Phamdo , Maryland Univ., College Park, MD, USA
N. Farvardin , Maryland Univ., College Park, MD, USA
pp. 641-644
R.L. Joshi , Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
P.G. Poonacha , Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
pp. 645-648
D.H. Lee , Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff , Michigan Univ., Ann Arbor, MI, USA
K.K. Paliwal , Maryland Univ., College Park, MD, USA
pp. 653-656
J. Grass , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 657-660
K.K. Paliwal , AT&T Bell Lab., Murray Hill, NJ, USA
B.S. Atal , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 661-664
F. Class , Daimler Benz AG Res. Inst., Ulm, Germany
A. Kaltenmeier , Daimler Benz AG Res. Inst., Ulm, Germany
P. Regel , Daimler Benz AG Res. Inst., Ulm, Germany
pp. 665-668
L. Chang , Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
M.M. Bayoumi , Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 669-672
N.-A. Lu , Arizona State Univ., Tempe, AZ, USA
D.R. Morrell , Arizona State Univ., Tempe, AZ, USA
pp. 673-676
F.J. Malassenet , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 677-680
R. Drogo De Iacovo , CSELT, Torino, Italy
D. Sereno , CSELT, Torino, Italy
pp. 681-684
M.G. Easton , Dept. of Electr. Eng. & Electron., Liverpool Univ., UK
C.C. Goodyear , Dept. of Electr. Eng. & Electron., Liverpool Univ., UK
pp. 685-688
P. Kenny , INRS-Telecommun., Montreal, Que., Canada
R. Hollan , INRS-Telecommun., Montreal, Que., Canada
V. Gupta , INRS-Telecommun., Montreal, Que., Canada
M. Lennig , INRS-Telecommun., Montreal, Que., Canada
P. Mermelstein , INRS-Telecommun., Montreal, Que., Canada
D. O'Shaughnessy , INRS-Telecommun., Montreal, Que., Canada
pp. 689-692
D.B. Paul , Lincoln Lab., MIT, Lexington, MA, USA
pp. 693-696
S. Austin , BBN Syst. & Technol., Cambridge, MA, USA
R. Schwartz , BBN Syst. & Technol., Cambridge, MA, USA
P. Placeway , BBN Syst. & Technol., Cambridge, MA, USA
pp. 697-700
R. Schwartz , BBN Syst. & Technol., Cambridge, MA, USA
S. Austin , BBN Syst. & Technol., Cambridge, MA, USA
pp. 701-704
F.K. Soong , AT&T Bell Labs., Murray Hill, NJ, USA
E.-F. Huang , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 705-708
E. Lleida , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
J.B. Marino , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
C. Nedeu , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Salavedra , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 709-712
V. Zue , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
J. Glass , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
D. Goodine , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
H. Leung , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
M. Phillips , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
J. Polifroni , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
S. Seneff , Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 713-716
S. Kimura , Fujitsu Labs. Ltd., Kawasaki, Japan
Y. Yamazaki , Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 717-720
M. Okada , NTT Basic Res. Lab., Tokyo, Japan
pp. 721-724
Y. Gong , CRI INRIA-Lorraine, Vandoeuvre, France
J.-P. Haton , CRI INRIA-Lorraine, Vandoeuvre, France
F. Mouria , CRI INRIA-Lorraine, Vandoeuvre, France
pp. 725-728
R. Pieraccini , AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee , AT&T Bell Labs., Murray Hill, NJ, USA
E. Giachin , AT&T Bell Labs., Murray Hill, NJ, USA
L.R. Rabiner , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 729-732
E.S. Dermatas , Dept. of Electr. Eng., Patras Univ., Greece
N.D. Fakotakis , Dept. of Electr. Eng., Patras Univ., Greece
G.K. Kokkinakis , Dept. of Electr. Eng., Patras Univ., Greece
pp. 733-736
B. Mulgrew , Dept. of Electr. Eng., Edinburgh Univ., UK
pp. 1513-1516
J. Radecki , INRS-Telecommun., Verdun, Que., Canada
J. Konrad , INRS-Telecommun., Verdun, Que., Canada
E. Dubois , INRS-Telecommun., Verdun, Que., Canada
pp. 1637-1640
M.D. Riley , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 737-740
R.W.P. Luk , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R.I. Damper , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 741-744
B. Van Coile , Lernout & Hauspie Speechproducts, Ieper, Belgium
pp. 745-748
C. Tuerk , Dept. of Eng., Cambridge Univ., UK
P. Monaco , Dept. of Eng., Cambridge Univ., UK
T. Robinson , Dept. of Eng., Cambridge Univ., UK
pp. 749-752
V.V. Kumar , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
S.C. Ahalt , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
A.K. Krishnamurthy , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 753-756
R. Willemse , Nijmegen Univ., Netherlands
L. Boves , Nijmegen Univ., Netherlands
pp. 757-760
K.P.H. Sullivan , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R.I. Damper , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 761-764
M. Abe , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 765-768
K. Matsui , Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
S.D. Pearson , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
K. Hata , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
T. Kamai , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 769-772
H. Loman , Nijmegen Univ., Netherlands
J. de Veth , Nijmegen Univ., Netherlands
L. Boves , Nijmegen Univ., Netherlands
pp. 773-776
A.L. Lalwani , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
D.G. Childers , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 777-780
H.C. van Leeuwen , Inst. for Perception Res., Eindhoven, Netherlands
E. te Lindert , Inst. for Perception Res., Eindhoven, Netherlands
pp. 781-784
Y.-Y. Wang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 785-788
N. Prieto , Dept. de Sistemas Inf. y Computacion, Univ. Politecnica de Valencia, Spain
E. Vidal , Dept. de Sistemas Inf. y Computacion, Univ. Politecnica de Valencia, Spain
pp. 789-792
A. Waibel , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A.N. Jain , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A.E. McNair , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
H. Saito , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A.G. Hauptmann , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Tebelskis , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 793-796
R. De Mori , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
R. Kuhn , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
G. Lazzari , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
pp. 797-800
T. Takezawa , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
K. Kita , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
J. Hosaka , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
T. Morimoto , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 801-804
A.L. Gorin , AT&T Bell Labs., Murray Hill, NJ, USA
S.E. Levinson , AT&T Bell Labs., Murray Hill, NJ, USA
A.N. Gertner , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 805-808
B. Merialdo , IBM France Sci. Center, Paris, France
pp. 809-812
M. Sugiyama , ATR Interpreting Telephony Res. Inst., Kyoto, Japan
pp. 813-816
M. Savic , Rensselaer Polytech. Inst., Troy, NY, USA
E. Acosta , Rensselaer Polytech. Inst., Troy, NY, USA
S.K. Gupta , Rensselaer Polytech. Inst., Troy, NY, USA
pp. 817-820
S. Ono , NEC Corp., Kawasaki, Japan
pp. 821-824
H. Ney , Philips GmbH Forschungslab. Aachen, Germany
U. Essen , Philips GmbH Forschungslab. Aachen, Germany
pp. 825-828
A.I. Rudnicky , Carnegie Mellon Univ., Pittsburgh, PA, USA
J.-M. Lunati , Carnegie Mellon Univ., Pittsburgh, PA, USA
A.M. Franz , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 829-832
F. Kubala , BBN Syst. & Technol., Cambridge, MA, USA
R. Schwartz , BBN Syst. & Technol., Cambridge, MA, USA
pp. 833-836
D.J.B. Pearce , GEC-Marconi Ltd., Wembley, UK
L.C. Wood , GEC-Marconi Ltd., Wembley, UK
pp. 837-840
A. Imamura , NTT Human Interface Lab., Kanagawa, Japan
pp. 841-844
H. Hattori , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 845-848
M. Ferretti , IBM Semea Rome Sci. Center, Rome, Italy
A.M. Mazza , IBM Semea Rome Sci. Center, Rome, Italy
pp. 849-852
S. Nakamura , Sharp Corp., Nara, Japan
T. Akabane , Sharp Corp., Nara, Japan
pp. 853-856
K. Shinoda , NEC Corp., Kawasaki, Japan
K.-I. Iso , NEC Corp., Kawasaki, Japan
T. Watanabe , NEC Corp., Kawasaki, Japan
pp. 857-860
E. Frangoulis , Logica Cambridge Ltd., UK
V. Sgardoni , Logica Cambridge Ltd., UK
pp. 861-864
W.A. Rozzi , Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 865-868
D.A. Reynolds , Dept. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
L.P. Heck , Dept. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 869-872
H. Gish , BBN Syst. & Technol., Cambridge, MA, USA
M.-H. Siu , BBN Syst. & Technol., Cambridge, MA, USA
R. Rohlicek , BBN Syst. & Technol., Cambridge, MA, USA
pp. 873-876
X.D. Huang , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
K.F. Lee , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 877-880
M.J. Hunt , Marconi Speech & Inf. Syst., Portsmouth, UK
S.M. Richardson , Marconi Speech & Inf. Syst., Portsmouth, UK
D.C. Bateman , Marconi Speech & Inf. Syst., Portsmouth, UK
A. Piau , Marconi Speech & Inf. Syst., Portsmouth, UK
pp. 881-884
Y. Komori , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
K. Hatazaki , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 885-888
H.-W. Hon , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
K.-F. Lee , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 889-892
A. Acero , Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 893-896
M. Kadirkamanathan , Speech Res. Unit, RSRE, Malvern, UK
A.P. Varga , Speech Res. Unit, RSRE, Malvern, UK
pp. 897-900
J.H.L. Hansen , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 901-904
Y. Takebayashi , Toshiba Corp., Kawasaki, Japan
H. Tsuboi , Toshiba Corp., Kawasaki, Japan
H. Kanazawa , Toshiba Corp., Kawasaki, Japan
pp. 905-908
A. Erell , SRI Int., Menlo Park, CA, USA
M. Weintraub , SRI Int., Menlo Park, CA, USA
pp. 909-912
A.D. Berstein , DSP Group Inc., San Jose, CA, USA
I.D. Shallom , DSP Group Inc., San Jose, CA, USA
pp. 913-916
V.L. Beattie , Dept. of Eng., Cambridge Univ., UK
S.J. Young , Dept. of Eng., Cambridge Univ., UK
pp. 917-920
B.A. Carlson , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements , Dept. of Eng., Cambridge Univ., UK
pp. 921-924
C. Mokbel , Telecom-Paris, France
G. Chollet , Telecom-Paris, France
pp. 925-928
K. Ohkura , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
M. Sugiyama , ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 929-932
H.B.D. Sorensen , Inst. of Electron. Syst., Aalborg Univ., Denmark
pp. 933-936
J. Naylor , ITT Aerosp. Commun. Div., San Diego, CA, USA
J. Porter , ITT Aerosp. Commun. Div., San Diego, CA, USA
pp. 937-940
R. Le Bouquin , Lab. Traitement du Signal, Rennes I Univ., France
G. Faucon , Lab. Traitement du Signal, Rennes I Univ., France
pp. 941-944
B. Yegnanarayana , Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
H.A. Murthy , Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
V.R. Ramachandran , Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
pp. 945-948
Y.H. Gu , Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
W.M.G. van Bokhoven , Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
pp. 949-952
H. Wang , Dept. of Electr. Eng., Nagoya Univ., Japan
F. Itakura , Dept. of Electr. Eng., Nagoya Univ., Japan
pp. 953-956
C.S. Wu , Martin Marietta Aero & Naval Syst., Glen Burnie, MD, USA
V.V. Nguyen , Martin Marietta Aero & Naval Syst., Glen Burnie, MD, USA
H. Sabrin , Martin Marietta Aero & Naval Syst., Glen Burnie, MD, USA
W. Kushner , Marconi Speech & Inf. Syst., Portsmouth, UK
J. Damoulakis , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 957-960
Y.M. Cheng , INRS-Telecommun., Verdun, Que., Canada
D. O'Shaughnessy , INRS-Telecommun., Verdun, Que., Canada
pp. 961-964
W. Etter , Inst. for Signal Process., ETH, Zurich, Switzerland
G.S. Moschytz , Inst. for Signal Process., ETH, Zurich, Switzerland
D. Graupe , Inst. for Signal Process., ETH, Zurich, Switzerland
pp. 965-968
H. Yamada , Dept. of Electr. Eng., Nagoya Univ., Japan
H. Wang , Dept. of Electr. Eng., Nagoya Univ., Japan
F. Itakura , Dept. of Electr. Eng., Nagoya Univ., Japan
pp. 969-972
H. Kobatake , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
K. Gyoutoku , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
S. Li , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
pp. 973-976
D. Bees , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
M. Blostein , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 977-980
L. Gagnon , Dept. of Nat. Defence, Ottawa, Ont., Canada
W.F. McGee , Dept. of Nat. Defence, Ottawa, Ont., Canada
pp. 981-984
T.H. Applebaum , Speech Technol. Lab., Santa Barbara, CA, USA
B.A. Hanson , Speech Technol. Lab., Santa Barbara, CA, USA
pp. 985-988
J.G. van Velden , TNO Inst. for Perception, Soesterberg, Netherlands
G.F. Smoorenburg , TNO Inst. for Perception, Soesterberg, Netherlands
pp. 989-992
A. Schaub , Ascom Zelcom AG, Hombrechtikon, Switzerland
P. Straub , Ascom Zelcom AG, Hombrechtikon, Switzerland
pp. 993-996
Y. Ephraim , AT&T Bell Lab., Murray Hill, NJ, USA
pp. 997-1000
E.H.-M. Sha , Dept. of Comput. Sci., Princeton Univ., NJ, USA
K. Steiglitz , Dept. of Comput. Sci., Princeton Univ., NJ, USA
pp. 1001-1004
Lih-Gwo Jeng , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Liang-Gee Chen , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 1005-1008
S.F. Hsieh , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
K.J.R. Liu , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 1009-1012
M. Moonen , ESAT Katholieke Univ. Leuven, Heverlee, Belgium
J. Vandewalle , ESAT Katholieke Univ. Leuven, Heverlee, Belgium
pp. 1013-1016
S.F. Hseih , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
K.J.R. Liu , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
K. Yao , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 1017-1020
S.P.S. Lam , Sch. of Electron. Eng., Birmingham Univ., UK
pp. 1021-1024
D. Rodriguez , Dept. of Electr. & Comput. Eng., Puerto Rico Univ., Mayaguez, Puerto Rico
pp. 1025-1028
H. Park , Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
V.K.P. Kumar , Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
pp. 1029-1032
C.F.T. Tang , Maryland Univ., College Park, MD, USA
K.J.R. Liu , Maryland Univ., College Park, MD, USA
S.A. Tretter , Maryland Univ., College Park, MD, USA
pp. 1033-1036
W.G. Bliss , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 1037-1040
K. Gao , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.O. Ahmad , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.N.S. Swamy , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
pp. 1041-1044
T.H. Reiss , Dept. of Eng., Cambridge Univ., UK
pp. 1045-1048
K.I. Diamantaras , Dept. of Electr. Eng., Princeton Univ., NJ, USA
S.Y. Kung , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 1049-1052
M.D. Emmerson , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R.I. Damper , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
A.J.G. Hey , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
C. Upstill , Marconi Speech & Inf. Syst., Portsmouth, UK
pp. 1053-1056
A. Krikelis , Aspex Microsyst. Ltd., Brunel Univ., Uxbridge, UK
pp. 1057-1060
Y.H. Hu , Dept. of Electr. & Comput. Eng., Wisconsin Univ., WI, USA
Q. Xue , Dept. of Electr. & Comput. Eng., Wisconsin Univ., WI, USA
W.J. Tompkins , Dept. of Electr. & Comput. Eng., Wisconsin Univ., WI, USA
pp. 1061-1064
J.T.-H. Lo , Dept. of Math. & Stat., Maryland Univ., Baltimore, MD, USA
pp. 1065-1068
J.S. Taur , Dept. of Electr. Eng., Princeton Univ., NJ, USA
S.Y. Kung , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 1069-1072
S.Y. Kung , Dept. of Electr. Eng., Princton Univ., NJ, USA
W.D. Mao , Dept. of Electr. Eng., Princton Univ., NJ, USA
pp. 1073-1076
K.W. Leary , Analog Devices Inc., Norwood, MA, USA
C. Cavigioli , Analog Devices Inc., Norwood, MA, USA
pp. 1077-1080
F.J. Taylor , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
G.S. Zelniker , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
J.C. Smith , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
J. Mellott , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 1081-1084
R. Bhatia , Sharp Microelectron. Technol. Inc., Camas, WA, USA
M. Furuta , Sharp Microelectron. Technol. Inc., Camas, WA, USA
J. Ponce , Sharp Microelectron. Technol. Inc., Camas, WA, USA
pp. 1085-1088
J. Ponce , Texas Instrum. Inc., Houston, TX, USA
pp. 1089-1092
P.H. Siegel , IMB Corp., San Jose, CA, USA
C.B. Shung , IMB Corp., San Jose, CA, USA
T.D. Howell , IMB Corp., San Jose, CA, USA
H.K. Thapar , IMB Corp., San Jose, CA, USA
pp. 1093-1096
G. Feygin , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
P.G. Gulak , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
P. Chow , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 1097-1100
B.K. Min , Telecom Paris Univ., France
N. Demassieux , Telecom Paris Univ., France
pp. 1101-1104
M. Ott , Dept. of Electr. Eng., Tokyo Univ., Japan
L.C. De Silva , Dept. of Electr. Eng., Tokyo Univ., Japan
L. Satou , Dept. of Electr. Eng., Tokyo Univ., Japan
K. Aizawa , Dept. of Electr. Eng., Tokyo Univ., Japan
M. Hatori , Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 1105-1108
S. Beling , Analog Devices Inc., Norwood, MA, USA
K. Leary , Analog Devices Inc., Norwood, MA, USA
G. Yukna , Analog Devices Inc., Norwood, MA, USA
pp. 1109-1112
B. Barrera , Comdisco Syst. Inc., Foster City, CA, USA
E.A. Lee , Analog Devices Inc., Norwood, MA, USA
pp. 1113-1116
B. Kelley , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
V. Madisetti , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1117-1120
J. Normile , Apple Computer ATG, Cupertino, CA, USA
D. Wright , Apple Computer ATG, Cupertino, CA, USA
pp. 1121-1124
M.J. Irwin , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
R.M. Owens , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
T.P. Kelliher , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
K.-K. Leung , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M. Vishwanath , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 1125-1128
G. Adams , United Technol. Res. Center, East Hartford, CT, USA
A.M. Finn , United Technol. Res. Center, East Hartford, CT, USA
M.F. Griffin , United Technol. Res. Center, East Hartford, CT, USA
pp. 1129-1132
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
J.-S. Lee , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1133-1136
F. Arguello , Dept. of Electron., Univ. of Santiago de Compostela, Spain
R. Doallo , Dept. of Electron., Univ. of Santiago de Compostela, Spain
J.D. Bruguera , Dept. of Electron., Univ. of Santiago de Compostela, Spain
E.L. Zapata , Dept. of Electron., Univ. of Santiago de Compostela, Spain
pp. 1137-1140
K. Zeger , Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI, USA
A. Gersho , Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI, USA
pp. 1141-1143
H.K. Kwan , Dept. of Electr. Eng., Windsor Univ., Ont., Canada
pp. 1145-1148
S.-j. Yeh , Rensselaer Polytech. Inst., Troy, NY, USA
H. Stark , Rensselaer Polytech. Inst., Troy, NY, USA
pp. 1149-1152
Z.-J. Mou , Dept. of Electron., Telecom Paris Univ., France
F. Jutand , Dept. of Electron., Telecom Paris Univ., France
pp. 1153-1156
N. Ranganathan , Dept. of Comput. Sci., Univ. of South Florida, Tampa, FL, USA
R. Mehrotra , Dept. of Electron., Telecom Paris Univ., France
K.R. Namuduri , Dept. of Electron., Univ. of Santiago de Compostela, Spain
pp. 1157-1160
P.D. Schuler , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
R.H.S. Hardy , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
V. Cuperman , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 1161-1164
S.C. Bass , Mitre Corp., McLean, VA, USA
G.M. Butler , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
R.L. Williams , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
F. Barlos , Dept. of Electron., Univ. of Santiago de Compostela, Spain
D.R. Miller , Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 1165-1168
Y. Kadowaki , LSE Res. & Dev. Center, Osaka, Japan
S. Nakamura , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
A. Kawahashi , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 1169-1172
B.J. Sheu , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
W.-C. Fang , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1173-1176
M.D. Dikaiakos , Dept. of Computer Sci., Princeton Univ., NJ, USA
K. Steiglitz , Dept. of Computer Sci., Princeton Univ., NJ, USA
pp. 1177-1180
T. Oto , Toshiba Corp., Kawasaki, Japan
K. Kitagaki , Toshiba Corp., Kawasaki, Japan
T. Demura , Toshiba Corp., Kawasaki, Japan
Y. Araki , Toshiba Corp., Kawasaki, Japan
T. Takada , Toshiba Corp., Kawasaki, Japan
pp. 1181-1184
F. Lu , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
H. Samueli , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1185-1188
O.C. McNally , Dept. of Electr. & Electron. Eng., Queen's Univ. of Belfast, UK
W.P. Marnane , Dept. of Electr. & Electron. Eng., Queen's Univ. of Belfast, UK
J.V. McCanny , Dept. of Electr. & Electron. Eng., Queen's Univ. of Belfast, UK
pp. 1189-1192
H. Miyanaga , NTT LSI Lab., Kanagawa, Japan
H. Yamauchi , NTT LSI Lab., Kanagawa, Japan
K. Matsuda , NTT LSI Lab., Kanagawa, Japan
pp. 1193-1196
H. Yamauchi , NTT LSI Lab., Kanawaga, Japan
Y. Tashiro , NTT LSI Lab., Kanawaga, Japan
T. Minami , NTT LSI Lab., Kanawaga, Japan
Y. Suzuki , Toshiba Corp., Kawasaki, Japan
pp. 1197-1200
V.K. Jain , Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
G.E. Perez , Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
J.M. Wills , Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
pp. 1201-1204
S.E. McQuillan , Inst. of Adv. Microelectron., Queen's Univ. of Belfast, UK
J.V. McCanny , Inst. of Adv. Microelectron., Queen's Univ. of Belfast, UK
pp. 1205-1208
W. Steenaart , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
J.Y. Zhang , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 1209-1212
C.Y. Lee , IMEC Lab., Heverlee, Belgium
F. Catthoor , IMEC Lab., Heverlee, Belgium
H. De Man , IMEC Lab., Heverlee, Belgium
pp. 1213-1216
W.P. Burleson , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 1217-1220
Tung-Hao Huang , Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chi-Min Liu , Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chein-Wei Jen , Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 1221-1224
J.G. Payne , VLSI Technol. Inc., Sophia Antipolis, France
S.M. Kruse , VLSI Technol. Inc., Sophia Antipolis, France
S.G. Smith , VLSI Technol. Inc., Sophia Antipolis, France
R.W. Morgan , VLSI Technol. Inc., Sophia Antipolis, France
pp. 1225-1228
L. Liu , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
T. Yoshino , VLSI Technol. Inc., Sophia Antipolis, France
S. Sprouse , VLSI Technol. Inc., Sophia Antipolis, France
R. Jain , VLSI Technol. Inc., Sophia Antipolis, France
pp. 1229-1232
K.K. Chau , Texas Instrum., Dallas, TX, USA
I.-F. Wang , Texas Instrum., Dallas, TX, USA
C.L. Eldridge , Texas Instrum., Dallas, TX, USA
pp. 1233-1236
S. Rajopadhye , Dept. of Comput. Sci., Oregon Univ., Eugene, OR, USA
S. Kiaei , Texas Instrum., Dallas, TX, USA
pp. 1237-1240
X. Zhong , Dept. of Comput. Sci., Oregon Univ., Eugene, OR, USA
S. Rajopadhye , Dept. of Comput. Sci., Oregon Univ., Eugene, OR, USA
pp. 1241-1244
J. Buck , EECS Dept., California Univ., Berkeley, CA, USA
S. Ha , EECS Dept., California Univ., Berkeley, CA, USA
E.A. Lee , EECS Dept., California Univ., Berkeley, CA, USA
D.G. Messerschmitt , EECS Dept., California Univ., Berkeley, CA, USA
pp. 1245-1248
C. Hong , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
C. Hong , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1249-1252
C.-Y. Wang , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1253-1256
M. Takefman , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
P. Chow , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 1257-1260
A. Zeira , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
P.M. Schultheiss , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 1261-1264
J.K. Tugnait , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 1265-1268
B. Champagne , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
M. Eizenman , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
S. Pasupathy , EECS Dept., California Univ., Berkeley, CA, USA
pp. 1269-1272
B. Barshan , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
R. Kuc , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 1273-1276
O. Michel , Lab. de Phys., ENS Lyon, France
H. Clergeot , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 1277-1280
J. Krolik , Scripps Inst. of Oceanog., California Univ., San Diego, CA, USA
G. Niezgoda , Scripps Inst. of Oceanog., California Univ., San Diego, CA, USA
D. Swingler , Scripps Inst. of Oceanog., California Univ., San Diego, CA, USA
pp. 1281-1284
M.J.D. Rendas , Dept. Eng. Electr. e Comput., Inst. Superior Tecnico, Lisboa, Portugal
J.M.F. Moura , Scripps Inst. of Oceanog., California Univ., San Diego, CA, USA
pp. 1285-1288
D. Jaarsma , Planning Syst. Inc., McLean, VA, USA
R.A. Davis , Planning Syst. Inc., McLean, VA, USA
pp. 1289-1292
Y. Bar-Shalom , Connecticut Univ., Storrs, CT, USA
F. Palmieri , Connecticut Univ., Storrs, CT, USA
A. Kumar , Connecticut Univ., Storrs, CT, USA
H.M. Shertukde , EECS Dept., California Univ., Berkeley, CA, USA
pp. 1293-1296
I.M.G. Lourtie , CAPS, Inst. Superior Tecnico, Lisboa, Portugal
G.C. Carter , Connecticut Univ., Storrs, CT, USA
pp. 1297-1300
C.J. Musso , Onera, Chatillon, France
C.G. Jauffret , Onera, Chatillon, France
pp. 1301-1304
D. Kletter , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
P.M. Schultheiss , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
H. Messer , Connecticut Univ., Storrs, CT, USA
pp. 1305-1308
L. Marple , Orincon Corp., San Diego, CA, USA
T. Brotherton , Orincon Corp., San Diego, CA, USA
pp. 1309-1312
M. Frisch , Dept. of Electr. Eng. Syst., Tel Aviv Univ., Israel
H. Messer , Dept. of Electr. Eng. Syst., Tel Aviv Univ., Israel
pp. 1313-1316
B. Baygun , Dept. of EECS, Michigan Univ., Ann Arbor, MI, USA
A.O. Hero , Dept. of EECS, Michigan Univ., Ann Arbor, MI, USA
pp. 1317-1320
M. Solal , Thomson Sintra ASM, Valbonne, France
D. Pillon , Thomson Sintra ASM, Valbonne, France
S. Brasseur , Thomson Sintra ASM, Valbonne, France
pp. 1321-1324
J.M. Passerieux , Thomson Sintra ASM, Valbonne, France
pp. 1325-1328
B. Picinbono , Lab. des Signaux et Syst., Ese, Gif sur Yvette, France
M.P. Boyer , Lab. des Signaux et Syst., Ese, Gif sur Yvette, France
pp. 1329-1332
J.D. Gorman , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
A.O. Hero , Lab. des Signaux et Syst., Ese, Gif sur Yvette, France
pp. 1333-1336
S.K. Mehta , Dept. of Electr. Eng., Rochester Univ., NY, USA
E.L. Titlebaum , Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 1337-1340
S.D. Blostein , Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
Y. Liu , Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 1341-1344
J.C. Preisig , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 1349-1352
Y. Bresler , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 1353-1356
G.T. Zunich , Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
L.J. Griffiths , Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
pp. 1357-1360
K.A. Blanton , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
J.H. McClellan , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1361-1364
J. Pierre , Dept. of Electron. Eng., Minnesota Univ., Minneapolis, MN, USA
M. Kaveh , Dept. of Electron. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1365-1368
D.R. Fuhrmann , Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
pp. 1369-1372
B.D. Van Veen , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 1373-1376
A.J. Weiss , Signal Processing Technol. Ltd., Palo Alto, CA, USA
B. Friedlander , Signal Processing Technol. Ltd., Palo Alto, CA, USA
pp. 1377-1380
D.D. Feldman , Signal & Image Process. Inst., California Univ., Los Angeles, CA, USA
L.J. Griffiths , Signal & Image Process. Inst., California Univ., Los Angeles, CA, USA
pp. 1381-1384
G. Adams , United Technol. Res. Center, East Hartford, CT, USA
M.F. Griffin , United Technol. Res. Center, East Hartford, CT, USA
G.W. Stewart , Thomson Sintra ASM, Valbonne, France
pp. 1385-1388
R.L. Kirlin , Dept. of Electr. & Computer Eng., Victoria Univ., BC, Canada
W. Du , Dept. of Electr. & Computer Eng., Victoria Univ., BC, Canada
pp. 1389-1392
R.C. Turner , US Naval Underwater Syst. Center, New London, CT, USA
pp. 1393-1396
G.H. Niezgoda , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
J. Krolik , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
pp. 1397-1400
N.A. Lehtomaki , Alliant Techsyst., Everett, WA, USA
pp. 1401-1404
X. Huang , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
J.P. Reilly , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
M. Wong , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1405-1408
V.A.N. Barroso , Dept. Eng. Electr. e Comput. Inst., Superior Tecnico, Lisboa, Portugal
J.M.F. Moura , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1409-1412
F. Li , Dept. of Electr. Eng., Portland State Univ., Portland, OR, USA
R.J. Vaccaro , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1413-1416
C. Rago , LEICI, Univ. Nacional de La Plata, Argentina
C. Muravchik , LEICI, Univ. Nacional de La Plata, Argentina
pp. 1417-1420
S. Bourennane , CEPHAG, CNRS, St. Martin d'Heres, France
B. Faure , CEPHAG, CNRS, St. Martin d'Heres, France
pp. 1421-1423
Q. Wu , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
K.M. Wong , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1425-1428
C. Wang , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
J.A. Cadzow , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
pp. 1429-1432
S.K. Hui , Defense Sci. Organ., Singapore, Singapore
M.H. Er , Dept. of Electr. Eng., Vanderbilt Univ., Nashville, TN, USA
pp. 1433-1436
S. Prosperi , Thomson Sintra ASM, Valbonne, France
pp. 1437-1440
J.P. Le Cadre , IRISA, Rennes, France
O. Zugmeyer , IRISA, Rennes, France
pp. 1441-1444
J.G. Kelly , US Naval Underwater Syst. Center, Newport, RI, USA
R.N. Carpenter , US Naval Underwater Syst. Center, Newport, RI, USA
J.A. Tague , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
N.K. Haddad , EECS Dept., California Univ., Berkeley, CA, USA
pp. 1445-1448
Z. Kostic , Dept. of Electr. Eng., Rochester Univ., NY, USA
M.I. Sezan , US Naval Underwater Syst. Center, Newport, RI, USA
E.L. Titlebaum , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1449-1452
R.L. Culver , Appl. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
S.T. McDaniel , Appl. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
pp. 1453-1456
O. Bozma , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
R. Kuc , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 1457-1460
K.C. Ho , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
P.C. Ching , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Y.T. Chan , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1461-1464
Y.T. Chan , Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
J.J. Towers , Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
pp. 1465-1468
Zhen-Ya He , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Li-Hua Li , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 1469-1472
S. Li , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
P.M. Schultheiss , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 1473-1476
X. Gu , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
M. Wong , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 1477-1480
I.J. Morrison , Dept. of Eng., Cambridge Univ., UK
P.J.W. Rayner , Dept. of Eng., Cambridge Univ., UK
pp. 1481-1484
C. Griffin , US Naval Underwater Syst. Center, New London, CT, USA
pp. 1485-1488
C.M. Pike , Dept. of Electr. & Comput. Eng., Ohio Univ., Athens, OH, USA
J.A. Tague , Dept. of Electr. & Comput. Eng., Ohio Univ., Athens, OH, USA
E.J. Sullivan , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1489-1492
D. Burton , Entropic Res. Lab., Washington, DC, USA
pp. 1493-1496
G. Xu , Inf. Syst. Lab., Stanford Univ., CA, USA
S.D. Silverstein , Dept. of Electr. & Comput. Eng., Ohio Univ., Athens, OH, USA
R.H. Roy , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
T. Kailath , EECS Dept., California Univ., Berkeley, CA, USA
pp. 1497-1500
P. Rao , Dept. of Electr. Eng., Florida Univ., FL, USA
pp. 1501-1504
O.C. Au , Dept. of Electr. Eng., Princeton Univ., NJ, USA
J.B. Thomas , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 1505-1508
S.J. Flockton , R. Holloway & Bedford New Coll., London Univ., Egham, UK
pp. 2081-2084
T.G. Xydis , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2161-2164
M.A. Lagunas , ETSI Telecommunicacion, Barcelona, Spain
G. Vazguez , ETSI Telecommunicacion, Barcelona, Spain
pp. 3717-3720
W.Y. Chen , Bell Commun. Res., Morristown, NJ, USA
pp. 1509-1512
G.W. Pulford , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.A. Kennedy , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
B.D.O. Anderson , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 1517-1520
N. Benvenuto , Dept. of Electron. & Autom., Ancona Univ., Italy
M. Marchesi , Dept. of Electron. & Autom., Ancona Univ., Italy
F. Piazza , Dept. of Electron. & Autom., Ancona Univ., Italy
A. Uncini , Dept. of Electron. & Autom., Ancona Univ., Italy
pp. 1521-1524
S. Ikeda , NEC Corp., Tokyo, Japan
A. Sugiyama , NEC Corp., Tokyo, Japan
pp. 1525-1528
W.A. Sethares , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
R.A. Kennedy , NEC Corp., Tokyo, Japan
Z. Gu , Dept. of Electron. & Autom., Ancona Univ., Italy
pp. 1529-1532
Z. Ding , Dept. of Electr. Eng., Auburn Univ., AL, USA
Z. Ding , NEC Corp., Tokyo, Japan
R.A. Kennedy , Dept. of Electron. & Autom., Ancona Univ., Italy
pp. 1533-1536
D. Hatzinakos , Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 1537-1540
S. Gee , Inst. fuer Netzwerk und Signaltheorie, Tech. Hochschule Darmstadt, Germany
M. Rupp , Inst. fuer Netzwerk und Signaltheorie, Tech. Hochschule Darmstadt, Germany
pp. 1541-1544
F. Laichi , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
W. Steenaart , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 1545-1548