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Acoustics, Speech, and Signal Processing, 1991. ICASSP-91., 1991 International Conference on
Toronto, Ont., Canada
April 14-April 17
ISBN: 0-7803-0003-3
Table of Contents
C. Laflamme, Commun. Res. Center, Sherbrooke Univ., Que., Canada
J.-P. Adoul, Commun. Res. Center, Sherbrooke Univ., Que., Canada
R. Salami, Commun. Res. Center, Sherbrooke Univ., Que., Canada
S. Morissette, Commun. Res. Center, Sherbrooke Univ., Que., Canada
P. Mabilleau, Commun. Res. Center, Sherbrooke Univ., Que., Canada
pp. 13-16
G. Roy, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 17-20
J.-H. Chen, AT&T Bell Lab., Murray Hill, NJ, USA
Y.-C. Lin, AT&T Bell Lab., Murray Hill, NJ, USA
R.V. Cox, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 21-24
M. Foodeei, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 25-28
R. Peng, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
V. Cuperman, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 29-32
A. Aarskog, EB Technol., Billingstadsletta, Norway
A. Nilsen, EB Technol., Billingstadsletta, Norway
O. Berg, EB Technol., Billingstadsletta, Norway
H.C. Guren, EB Technol., Billingstadsletta, Norway
pp. 37-40
C.R. Nassar, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
M.R. Soleymani, EB Technol., Billingstadsletta, Norway
pp. 41-44
N. Morgan, Int. Comput. Sci. Inst., Berkeley, CA, USA
H. Hermansky, EB Technol., Billingstadsletta, Norway
H. Bourlard, EB Technol., Billingstadsletta, Norway
P. Kohn, EB Technol., Billingstadsletta, Norway
C. Wooters, Commun. Res. Center, Sherbrooke Univ., Que., Canada
pp. 49-52
J. Tebelskis, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
B. Petek, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
O. Schmidbauer, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 61-64
Jhing-Fa Wang, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Chung-Hsien Wu, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Chaug-Ching Haung, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Jau-Yien Lee, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 69-72
F. Bimbot, Telecom Paris, CNRS, France
G. Chollet, Telecom Paris, CNRS, France
J.-P. Tubach, Telecom Paris, CNRS, France
pp. 73-76
J.-P. Tubach, Korea Adv. Inst. of Sci. & Technol., Cheongryang, Seoul, South Korea
J.-P. Tubach, Korea Adv. Inst. of Sci. & Technol., Cheongryang, Seoul, South Korea
Hyunsoo Yoon, Korea Adv. Inst. of Sci. & Technol., Cheongryang, Seoul, South Korea
Hyunsoo Yoon, Korea Adv. Inst. of Sci. & Technol., Cheongryang, Seoul, South Korea
pp. 77-80
F. Greco, Fondazione Ugo Bordoni, Roma, Italy
A. Paoloni, Fondazione Ugo Bordoni, Roma, Italy
G. Ravaioli, Fondazione Ugo Bordoni, Roma, Italy
pp. 81-84
M. Nakamura, Sumitomo Metal Ind., Ltd., Japan
S. Tamura, Fondazione Ugo Bordoni, Roma, Italy
S. Sagayama, Fondazione Ugo Bordoni, Roma, Italy
pp. 85-88
J.-i. Takami, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
S. Sagayama, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 89-92
Y. Bennani, Univ. Paris Sud, Orsay, France
N. Chaourar, Univ. Paris Sud, Orsay, France
P. Gallinari, Univ. Paris Sud, Orsay, France
A. Mellouk, Univ. Paris Sud, Orsay, France
pp. 97-100
J. Kangas, Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
pp. 101-104
P. Haffner, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Franzini, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 105-108
M.M. Hochberg, LEMS, Brown Univ., Providence, RI, USA
L.T. Niles, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.T. Foote, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
H.F. Silverman, Univ. Paris Sud, Orsay, France
pp. 109-112
P. Ramesh, AT&T Bell Lab., Murray Hill, NJ, USA
S. Katagiri, AT&T Bell Lab., Murray Hill, NJ, USA
C.-H. Lee, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 113-116
U. Bodenhausen, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 117-120
P. Brauer, Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
P. Hedelin, Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
D. Huber, Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
P. Knagenhjelm, Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
pp. 133-136
J.-E. Stromberg, Dept. of Electr. Eng., Linkoping Univ., Sweden
J. Zrida, Dept. of Electr. Eng., Linkoping Univ., Sweden
A. Isaksson, Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 137-140
E.R. Buhrke, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
J.L. LoCicero, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 157-160
C.-H. Lee, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 161-164
T. Yamada, NTT Human Interface Lab., Tokyo, Japan
T. Hanazawa, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
T. Kawabata, CRI, INRIA, Nancy, France
S. Matsunaga, Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
K. Shikano, Commun. Res. Center, Sherbrooke Univ., Que., Canada
pp. 169-172
L.R. Bahl, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Das, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. deSouza, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Epstein, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
R.L. Mercer, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
B. Merialdo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Powell, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 173-176
L.R. Bahl, IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
J.R. Bellegarda, IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
P.V. deSouza, IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan, IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM, Thomas Watson Res. Center, Yorktown Heights, NY, USA
pp. 177-180
L.C. Wood, GEC-Marconi Ltd., Wembley, UK
D.J.B. Pearce, GEC-Marconi Ltd., Wembley, UK
F. Novello, GEC-Marconi Ltd., Wembley, UK
pp. 181-184
L.R. Bahl, IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
P.V. deSouza, IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan, IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas Watson Res. Center, Yorktown Heights, NY, USA
pp. 185-188
E. Sanchis, Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
F. Casacuberta, Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
I. Galiano, Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
E. Segarra, Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
pp. 189-192
L. Deng, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
K. Erler, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 193-196
P. Dalsgaard, Speech Technol. Centre, Aalborg Univ., Denmark
O. Andersen, Speech Technol. Centre, Aalborg Univ., Denmark
W. Barry, Dept. Sistemas Inf. & Computacion, Univ. Politecnica de Valencia, Spain
pp. 197-200
I.A. Gerson, Motorola Inc., Schaumburg, IL, USA
M.A. Jasiuk, Motorola Inc., Schaumburg, IL, USA
pp. 205-208
A. Le Guyader, France Telecom, Lannion, France
R. Di Francesco, France Telecom, Lannion, France
C. Lamblin, France Telecom, Lannion, France
pp. 209-212
W. Granzow, AT&T Bell Lab., Murray Hill, NJ, USA
B.S. Atal, AT&T Bell Lab., Murray Hill, NJ, USA
K.K. Paliwal, AT&T Bell Lab., Murray Hill, NJ, USA
J. Schroeter, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 217-220
P. Hedelin, Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
A. Bergstrom, Dept. of Inf. Theory, Chalmers Univ. of Technol., Gothenburg, Sweden
pp. 225-228
K. Miseki, Toshiba Res. & Dev. Center, Kawasaki, Japan
M. Akamine, Toshiba Res. & Dev. Center, Kawasaki, Japan
pp. 229-232
U. Kipper, Inst. fuer Angewandte Phys., Frankfurt am Main Univ., Germany
H. Reininger, Inst. fuer Angewandte Phys., Frankfurt am Main Univ., Germany
D. Wolf, Inst. fuer Angewandte Phys., Frankfurt am Main Univ., Germany
pp. 237-240
T. Taniguchi, Fujitsu Labs. Ltd., Kawasaki, Japan
M. Johnson, Fujitsu Labs. Ltd., Kawasaki, Japan
Y. Ohta, Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 241-244
P.C. Loizou, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
A.S. Spanias, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 245-248
J.C. Hardwick, Digital Voice Syst. Inc., Cambridge, MA, USA
J.S. Lim, Digital Voice Syst. Inc., Cambridge, MA, USA
pp. 249-252
L. Fissore, CSELT, Torino, Italy
P. Laface, Digital Voice Syst. Inc., Cambridge, MA, USA
G. Micca, Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 253-256
Yuqing Gao, Inst. of Autom., Chinese Acad. of Sci., Beijing, China
Taiyi Huang, Inst. of Autom., Chinese Acad. of Sci., Beijing, China
Zhiwei Lin, Inst. of Autom., Chinese Acad. of Sci., Beijing, China
Bo Xu, Inst. of Autom., Chinese Acad. of Sci., Beijing, China
Dongxin Xu, Inst. of Autom., Chinese Acad. of Sci., Beijing, China
pp. 257-260
K. Torkkola, Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
M. Kokkonen, Lab. of Inf. & Comput. Sci., Helsinki Univ. of Technol., Espoo, Finland
pp. 261-264
T. Matsuoka, NTT Human Interface Lab., Tokyo, Japan
K. Shikano, NTT Human Interface Lab., Tokyo, Japan
pp. 265-268
K. Kita, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
W.H. Ward, NTT Human Interface Lab., Tokyo, Japan
pp. 269-272
S. Makino, Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
A. Ito, Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
M. Endo, Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
K. Kido, Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
pp. 273-276
J.S. Bridle, R. Signals & Radar Establ., Malvern, UK
L. Dodd, R. Signals & Radar Establ., Malvern, UK
pp. 277-280
J.N. Marcus, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
V.W. Zue, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 281-284
H.M. Meng, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
V.W. Zue, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 285-288
V. Digalakis, Boston Univ., MA, USA
J.R. Rohlicek, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
M. Ostendorf, Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
pp. 289-292
K.L. Brown, Center for Image Process. & Integrated Comput., Univ. of California, Davis, CA, USA
V.R. Algazi, Center for Image Process. & Integrated Comput., Univ. of California, Davis, CA, USA
pp. 293-296
H. Cerf-Danon, IBM-France Sci. Center, Paris, France
M. El-Beze, IBM-France Sci. Center, Paris, France
pp. 297-300
S. Euler, Telenorma, Bosch Telecom, Frankfurt am Main, Germany
J. Zinke, Telenorma, Bosch Telecom, Frankfurt am Main, Germany
pp. 301-304
A. Asadi, Northeastern Univ., Boston, MA, USA
R. Schwartz, Telenorma, Bosch Telecom, Frankfurt am Main, Germany
J. Makhoul, Res. Center for Appl. Inf. Sci., Tohoku Univ., Sendai, Japan
pp. 305-308
J.G. Wilpon, AT&T Bell Labs., Murray Hill, NJ, USA
L.G. Miller, AT&T Bell Labs., Murray Hill, NJ, USA
P. Modi, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 309-312
D.P. Morgan, Lockheed Sanders Inc., Nashua, NH, USA
C.L. Scofield, AT&T Bell Labs., Murray Hill, NJ, USA
J.E. Adcock, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 313-316
R.C. Rose, Lincoln Lab., MIT, Lexington, MA, USA
E.I. Chang, Lincoln Lab., MIT, Lexington, MA, USA
R.P. Lippmann, Lincoln Lab., MIT, Lexington, MA, USA
pp. 317-320
R.A. Cole, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Fanty, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Gopalakrishnan, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
R.D.T. Janssen, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 325-328
Y. Zhao, Panasonic Technol. Inc., Santa Barbara, CA, USA
H. Wakita, Panasonic Technol. Inc., Santa Barbara, CA, USA
X. Zhuang, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 333-336
W.S. Meisel, Speech Syst. Inc., Tarzana, CA, USA
M.T. Anikst, Speech Syst. Inc., Tarzana, CA, USA
S.S. Pirzadeh, Speech Syst. Inc., Tarzana, CA, USA
J.E. Schumacher, Speech Syst. Inc., Tarzana, CA, USA
M.C. Soares, Speech Syst. Inc., Tarzana, CA, USA
D.J. Trawick, Speech Syst. Inc., Tarzana, CA, USA
pp. 337-340
V.N. Gupta, INRS-Telecommun., Montreal, Que., Canada
M. Lennig, INRS-Telecommun., Montreal, Que., Canada
P. Mermelstein, INRS-Telecommun., Montreal, Que., Canada
P. Kenny, INRS-Telecommun., Montreal, Que., Canada
F. Seitz, INRS-Telecommun., Montreal, Que., Canada
D. O'Shaughnessy, INRS-Telecommun., Montreal, Que., Canada
pp. 341-344
X.D. Huang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
K.F. Lee, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
H.W. Hon, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
M.Y. Hwang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 345-348
J.G. Wilpon, AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee, AT&T Bell Labs., Murray Hill, NJ, USA
L.R. Rabiner, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 349-352
Y.K. Muthusamy, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
R.A. Cole, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
M. Gopalakrishnan, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 353-356
W. Ward, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 365-367
S. Renals, Centre for Speech Technol. Res., Edinburgh Univ., UK
D. McKelvie, Centre for Speech Technol. Res., Edinburgh Univ., UK
F. McInnes, Centre for Speech Technol. Res., Edinburgh Univ., UK
pp. 369-372
D.A. Gaganelis, Logica Cambridge Ltd., UK
E.D. Frangoulis, Logica Cambridge Ltd., UK
pp. 373-376
T. Matsui, NTT Human Interface Lab., Tokyo, Japan
S. Furui, NTT Human Interface Lab., Tokyo, Japan
pp. 377-380
A.E. Rosenberg, AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee, AT&T Bell Labs., Murray Hill, NJ, USA
S. Gokcen, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 381-384
Y. Bennani, Lab. de Recherche en Inf., Univ. de Paris-Sud, Orsay, France
P. Gallinari, Lab. de Recherche en Inf., Univ. de Paris-Sud, Orsay, France
pp. 385-388
L. Rudasi, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
S.A. Zahorian, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 389-392
J. Oglesby, Dept. of Electr. & Electron. Eng., Univ. Coll., Swansea, UK
J.S. Mason, Dept. of Electr. & Electron. Eng., Univ. Coll., Swansea, UK
pp. 393-396
M.J. Carey, Ensigma Ltd., Chepstow, UK
E.S. Parris, Ensigma Ltd., Chepstow, UK
J.S. Bridle, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 397-400
R.C. Rose, MIT Lincoln Lab., Lexington, MA, USA
J. Fitzmaurice, MIT Lincoln Lab., Lexington, MA, USA
E.M. Hofstetter, MIT Lincoln Lab., Lexington, MA, USA
D.A. Reynolds, MIT Lincoln Lab., Lexington, MA, USA
pp. 401-404
A.L. Higgins, MIT Lincoln Lab., Lexington, MA, USA
L.G. Bahler, MIT Lincoln Lab., Lexington, MA, USA
pp. 405-408
P. Maragos, Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
T.F. Quatieri, MIT Lincoln Lab., Lexington, MA, USA
J.F. Kaiser, MIT Lincoln Lab., Lexington, MA, USA
pp. 421-424
K.K. Paliwal, AT&T Bell Labs., Murray Hill, NJ, USA
M.M. Sondhi, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 429-432
L.E. Atlas, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
P.J. Loughlin, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
J.W. Pitton, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 433-436
T. Ghiselli-Crippa, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
A. El-Jaroudi, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 441-444
K.S. Nathan, LEMS, Brown Univ., Providence, RI, USA
H.F. Silverman, LEMS, Brown Univ., Providence, RI, USA
pp. 445-448
S. Kadambe, Appl. Sci. & Eng. Lab., A.I. duPont Inst., Wilmington, DE, USA
G.F. Bourdeaux-Bartels, LEMS, Brown Univ., Providence, RI, USA
pp. 449-452
A.I.C. Monaghan, Centre for Speech Technol. Res., Edinburgh Univ., UK
D.R. Ladd, LEMS, Brown Univ., Providence, RI, USA
pp. 453-456
D.J. Pepper, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements, MIT, Cambridge, MA, USA
pp. 465-468
N. Merhav, Dept. of Electr. Eng., Technion, Haifa, Israel
Y. Ephraim, MIT, Cambridge, MA, USA
pp. 469-472
A. Ljolje, AT&T Bell Labs., Murray Hill, NJ, USA
M.D. Riley, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 473-476
S.K. Gupta, AT&T Bell Labs., Murray Hill, NJ, USA
J. Schroeter, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 481-484
M.G. Rahim, AT&T Bell Labs., Murray Hill, NJ, USA
W.B. Keijn, AT&T Bell Labs., Murray Hill, NJ, USA
J. Schroeter, AT&T Bell Labs., Murray Hill, NJ, USA
C.C. Goodyear, MIT Lincoln Lab., Lexington, MA, USA
pp. 485-488
T. Kobayashi, Dept. of Electr. Eng., Hosei Univ., Tokyo, Japan
M. Yagyu, Dept. of Electr. Eng., Hosei Univ., Tokyo, Japan
K. Shirai, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 489-492
S. Wang, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Sekey, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 493-496
W. Verhelst, Inst. for Perception Res., Eindhoven Univ. of Technol., Netherlands
pp. 501-504
A.L. Lalwani, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
D.G. Childers, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 505-508
S. Lucas, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
B. Damper, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 509-512
N. Polish, Dept. of Comput. Sci., Columbia Univ., New York, NY, USA
pp. 513-516
P. Bhaskararao, Dept. of Linguistics, Deccan Coll., Pune, India
S.J. Eady, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
J.H. Esling, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 517-520
H. Martinez-Alfaro, Centro de Inteligencia Artificial, Inst. Tecnologicoy de Estudios Superiores de Monterrey, Mexico
J.L. Contreras-Vidal, Centro de Inteligencia Artificial, Inst. Tecnologicoy de Estudios Superiores de Monterrey, Mexico
pp. 521-523
N. Yiourgalis, Lab. of Wire Commun., Patras Univ., Greece
G. Kokkinakis, Lab. of Wire Commun., Patras Univ., Greece
pp. 525-528
N. Merhav, Dept. of Electr. Eng., Technion, Haifa, Israel
Y. Ephraim, Lab. of Wire Commun., Patras Univ., Greece
pp. 529-532
R. Cardin, Centre de Recherche Inf. de Montreal, Que., Canada
Y. Normandin, Centre de Recherche Inf. de Montreal, Que., Canada
R. De Mori, Centre de Recherche Inf. de Montreal, Que., Canada
pp. 533-536
Y. Normandin, Centre de Recherche Inf. de Montreal, Que., Canada
S.D. Morgera, Centre de Recherche Inf. de Montreal, Que., Canada
pp. 537-540
Keh-Yin Su, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Chin-Hui Lee, Centre de Recherche Inf. de Montreal, Que., Canada
pp. 541-544
P.C. Woodland, Dept. of Eng., Cambridge Univ., UK
D.R. Cole, Dept. of Eng., Cambridge Univ., UK
pp. 545-548
Fao-Chung Chang, Telecommun. Lab., Minist. of Commun., Taiwan
Sin-Horng Chen, Dept. of Eng., Cambridge Univ., UK
Biing-Hwang Juang, Centre de Recherche Inf. de Montreal, Que., Canada
pp. 549-552
H. Iwamida, ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
S. Katagiri, ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
E. McDermott, ATR Auditory & Visual Perception Res. Lab., Kyoto, Japan
pp. 553-556
T. Kawahara, Dept. of Inf. Sci., Kyoto Univ., Japan
S. Doshita, Dept. of Inf. Sci., Kyoto Univ., Japan
pp. 557-560
S.A. Zahorian, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
D. Qian, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
A.J. Jagharghi, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 561-564
A. Nadas, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Powell, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 565-568
D.B. Paul, MIT Lincoln Lab., Lexington, MA, USA
J.K. Baker, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J.M. Baker, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 569-572
R.J. McAulay, Lincoln Lab., MIT, Lexington, MA, USA
T.F. Quatieri, Lincoln Lab., MIT, Lexington, MA, USA
pp. 577-580
H. Carl, AG Digitale Signalverarbeitung, Ruhr-Univ. Bochum, Germany
B. Kopatzik, AG Digitale Signalverarbeitung, Ruhr-Univ. Bochum, Germany
pp. 581-584
L.A. Hernandez-Gomez, ETSI Telecommun., Madrid, Spain
F.J. Casajus-Quiros, ETSI Telecommun., Madrid, Spain
C. Garcia-Mateo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Ortega-Garcia, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
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H. Nielsen, Telecommun. Res. Lab., Horsholm, Denmark
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A.V. McCree, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
A.V. McCree, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
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J.A. Martins, CPqD-Telebras, Campinas, Brazil
F. Violaro, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
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P. Jeanrenaud, BBN Syst. & Technol., Cambridge, MA, USA
P. Peterson, BBN Syst. & Technol., Cambridge, MA, USA
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D.P. Kemp, US Dept. of Defense, Fort Meade, MD, USA
J.S. Collura, US Dept. of Defense, Fort Meade, MD, USA
T.E. Tremain, US Dept. of Defense, Fort Meade, MD, USA
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Y. Wu, Telecom Denmark, Tastrup, Denmark
H.B. Hansen, US Dept. of Defense, Fort Meade, MD, USA
K.J. Larsen, US Dept. of Defense, Fort Meade, MD, USA
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C. Gruet, Matra Commun., Bois d'Arcy, France
F. Pommaret, Matra Commun., Bois d'Arcy, France
M. Delprat, Matra Commun., Bois d'Arcy, France
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V. Maiorano, Italtel SIT, Milan, Italy
L. Vetrano, Italtel SIT, Milan, Italy
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T.B. Minde, Italtel SIT, Milan, Italy
J. Ahlberg, Italtel SIT, Milan, Italy
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K. Ganesan, Italtel SIT, Milan, Italy
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R. Laroia, Maryland Univ., College Park, MD, USA
N. Phamdo, Maryland Univ., College Park, MD, USA
N. Farvardin, Maryland Univ., College Park, MD, USA
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R.L. Joshi, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
P.G. Poonacha, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
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D.H. Lee, Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Michigan Univ., Ann Arbor, MI, USA
K.K. Paliwal, Maryland Univ., College Park, MD, USA
pp. 653-656
J. Grass, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
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K.K. Paliwal, AT&T Bell Lab., Murray Hill, NJ, USA
B.S. Atal, AT&T Bell Lab., Murray Hill, NJ, USA
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F. Class, Daimler Benz AG Res. Inst., Ulm, Germany
A. Kaltenmeier, Daimler Benz AG Res. Inst., Ulm, Germany
P. Regel, Daimler Benz AG Res. Inst., Ulm, Germany
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L. Chang, Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
M.M. Bayoumi, Dept. of Electr. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 669-672
N.-A. Lu, Arizona State Univ., Tempe, AZ, USA
D.R. Morrell, Arizona State Univ., Tempe, AZ, USA
pp. 673-676
F.J. Malassenet, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 677-680
M.G. Easton, Dept. of Electr. Eng. & Electron., Liverpool Univ., UK
C.C. Goodyear, Dept. of Electr. Eng. & Electron., Liverpool Univ., UK
pp. 685-688
P. Kenny, INRS-Telecommun., Montreal, Que., Canada
R. Hollan, INRS-Telecommun., Montreal, Que., Canada
V. Gupta, INRS-Telecommun., Montreal, Que., Canada
M. Lennig, INRS-Telecommun., Montreal, Que., Canada
P. Mermelstein, INRS-Telecommun., Montreal, Que., Canada
D. O'Shaughnessy, INRS-Telecommun., Montreal, Que., Canada
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S. Austin, BBN Syst. & Technol., Cambridge, MA, USA
R. Schwartz, BBN Syst. & Technol., Cambridge, MA, USA
P. Placeway, BBN Syst. & Technol., Cambridge, MA, USA
pp. 697-700
E. Lleida, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
J.B. Marino, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
C. Nedeu, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Salavedra, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
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V. Zue, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
J. Glass, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
D. Goodine, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
H. Leung, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
M. Phillips, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
J. Polifroni, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
S. Seneff, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
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S. Kimura, Fujitsu Labs. Ltd., Kawasaki, Japan
Y. Yamazaki, Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 717-720
Y. Gong, CRI INRIA-Lorraine, Vandoeuvre, France
J.-P. Haton, CRI INRIA-Lorraine, Vandoeuvre, France
F. Mouria, CRI INRIA-Lorraine, Vandoeuvre, France
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R. Pieraccini, AT&T Bell Labs., Murray Hill, NJ, USA
C.-H. Lee, AT&T Bell Labs., Murray Hill, NJ, USA
E. Giachin, AT&T Bell Labs., Murray Hill, NJ, USA
L.R. Rabiner, AT&T Bell Labs., Murray Hill, NJ, USA
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E.S. Dermatas, Dept. of Electr. Eng., Patras Univ., Greece
N.D. Fakotakis, Dept. of Electr. Eng., Patras Univ., Greece
G.K. Kokkinakis, Dept. of Electr. Eng., Patras Univ., Greece
pp. 733-736
B. Mulgrew, Dept. of Electr. Eng., Edinburgh Univ., UK
pp. 1513-1516
J. Radecki, INRS-Telecommun., Verdun, Que., Canada
J. Konrad, INRS-Telecommun., Verdun, Que., Canada
E. Dubois, INRS-Telecommun., Verdun, Que., Canada
pp. 1637-1640
R.W.P. Luk, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R.I. Damper, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 741-744
C. Tuerk, Dept. of Eng., Cambridge Univ., UK
P. Monaco, Dept. of Eng., Cambridge Univ., UK
T. Robinson, Dept. of Eng., Cambridge Univ., UK
pp. 749-752
V.V. Kumar, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
S.C. Ahalt, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
A.K. Krishnamurthy, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 753-756
R. Willemse, Nijmegen Univ., Netherlands
L. Boves, Nijmegen Univ., Netherlands
pp. 757-760
K.P.H. Sullivan, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R.I. Damper, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 761-764
M. Abe, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 765-768
K. Matsui, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
S.D. Pearson, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
K. Hata, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
T. Kamai, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 769-772
A.L. Lalwani, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
D.G. Childers, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 777-780
H.C. van Leeuwen, Inst. for Perception Res., Eindhoven, Netherlands
E. te Lindert, Inst. for Perception Res., Eindhoven, Netherlands
pp. 781-784
Y.-Y. Wang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 785-788
N. Prieto, Dept. de Sistemas Inf. y Computacion, Univ. Politecnica de Valencia, Spain
E. Vidal, Dept. de Sistemas Inf. y Computacion, Univ. Politecnica de Valencia, Spain
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A. Waibel, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A.N. Jain, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A.E. McNair, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
H. Saito, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
A.G. Hauptmann, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Tebelskis, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
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R. De Mori, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
R. Kuhn, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
G. Lazzari, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
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T. Takezawa, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
K. Kita, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
J. Hosaka, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
T. Morimoto, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
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A.L. Gorin, AT&T Bell Labs., Murray Hill, NJ, USA
S.E. Levinson, AT&T Bell Labs., Murray Hill, NJ, USA
A.N. Gertner, AT&T Bell Labs., Murray Hill, NJ, USA
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M. Sugiyama, ATR Interpreting Telephony Res. Inst., Kyoto, Japan
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M. Savic, Rensselaer Polytech. Inst., Troy, NY, USA
E. Acosta, Rensselaer Polytech. Inst., Troy, NY, USA
S.K. Gupta, Rensselaer Polytech. Inst., Troy, NY, USA
pp. 817-820
H. Ney, Philips GmbH Forschungslab. Aachen, Germany
U. Essen, Philips GmbH Forschungslab. Aachen, Germany
pp. 825-828
A.I. Rudnicky, Carnegie Mellon Univ., Pittsburgh, PA, USA
J.-M. Lunati, Carnegie Mellon Univ., Pittsburgh, PA, USA
A.M. Franz, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 829-832
F. Kubala, BBN Syst. & Technol., Cambridge, MA, USA
R. Schwartz, BBN Syst. & Technol., Cambridge, MA, USA
pp. 833-836
S. Nakamura, Sharp Corp., Nara, Japan
T. Akabane, Sharp Corp., Nara, Japan
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K. Shinoda, NEC Corp., Kawasaki, Japan
K.-I. Iso, NEC Corp., Kawasaki, Japan
T. Watanabe, NEC Corp., Kawasaki, Japan
pp. 857-860
W.A. Rozzi, Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 865-868
D.A. Reynolds, Dept. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
L.P. Heck, Dept. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 869-872
H. Gish, BBN Syst. & Technol., Cambridge, MA, USA
M.-H. Siu, BBN Syst. & Technol., Cambridge, MA, USA
R. Rohlicek, BBN Syst. & Technol., Cambridge, MA, USA
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X.D. Huang, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
K.F. Lee, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 877-880
M.J. Hunt, Marconi Speech & Inf. Syst., Portsmouth, UK
S.M. Richardson, Marconi Speech & Inf. Syst., Portsmouth, UK
D.C. Bateman, Marconi Speech & Inf. Syst., Portsmouth, UK
A. Piau, Marconi Speech & Inf. Syst., Portsmouth, UK
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Y. Komori, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
K. Hatazaki, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
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H.-W. Hon, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
K.-F. Lee, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 889-892
A. Acero, Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 893-896
Y. Takebayashi, Toshiba Corp., Kawasaki, Japan
H. Tsuboi, Toshiba Corp., Kawasaki, Japan
H. Kanazawa, Toshiba Corp., Kawasaki, Japan
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A.D. Berstein, DSP Group Inc., San Jose, CA, USA
I.D. Shallom, DSP Group Inc., San Jose, CA, USA
pp. 913-916
V.L. Beattie, Dept. of Eng., Cambridge Univ., UK
S.J. Young, Dept. of Eng., Cambridge Univ., UK
pp. 917-920
B.A. Carlson, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements, Dept. of Eng., Cambridge Univ., UK
pp. 921-924
K. Ohkura, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
M. Sugiyama, ATR Interpreting Telephony Res. Lab., Kyoto, Japan
pp. 929-932
J. Naylor, ITT Aerosp. Commun. Div., San Diego, CA, USA
J. Porter, ITT Aerosp. Commun. Div., San Diego, CA, USA
pp. 937-940
R. Le Bouquin, Lab. Traitement du Signal, Rennes I Univ., France
G. Faucon, Lab. Traitement du Signal, Rennes I Univ., France
pp. 941-944
B. Yegnanarayana, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
H.A. Murthy, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
V.R. Ramachandran, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
pp. 945-948
Y.H. Gu, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
W.M.G. van Bokhoven, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
pp. 949-952
H. Wang, Dept. of Electr. Eng., Nagoya Univ., Japan
F. Itakura, Dept. of Electr. Eng., Nagoya Univ., Japan
pp. 953-956
C.S. Wu, Martin Marietta Aero & Naval Syst., Glen Burnie, MD, USA
V.V. Nguyen, Martin Marietta Aero & Naval Syst., Glen Burnie, MD, USA
H. Sabrin, Martin Marietta Aero & Naval Syst., Glen Burnie, MD, USA
W. Kushner, Marconi Speech & Inf. Syst., Portsmouth, UK
J. Damoulakis, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 957-960
Y.M. Cheng, INRS-Telecommun., Verdun, Que., Canada
D. O'Shaughnessy, INRS-Telecommun., Verdun, Que., Canada
pp. 961-964
W. Etter, Inst. for Signal Process., ETH, Zurich, Switzerland
G.S. Moschytz, Inst. for Signal Process., ETH, Zurich, Switzerland
D. Graupe, Inst. for Signal Process., ETH, Zurich, Switzerland
pp. 965-968
H. Yamada, Dept. of Electr. Eng., Nagoya Univ., Japan
H. Wang, Dept. of Electr. Eng., Nagoya Univ., Japan
F. Itakura, Dept. of Electr. Eng., Nagoya Univ., Japan
pp. 969-972
H. Kobatake, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
K. Gyoutoku, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
S. Li, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
pp. 973-976
D. Bees, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
M. Blostein, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
P. Kabal, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 977-980
L. Gagnon, Dept. of Nat. Defence, Ottawa, Ont., Canada
W.F. McGee, Dept. of Nat. Defence, Ottawa, Ont., Canada
pp. 981-984
T.H. Applebaum, Speech Technol. Lab., Santa Barbara, CA, USA
B.A. Hanson, Speech Technol. Lab., Santa Barbara, CA, USA
pp. 985-988
J.G. van Velden, TNO Inst. for Perception, Soesterberg, Netherlands
G.F. Smoorenburg, TNO Inst. for Perception, Soesterberg, Netherlands
pp. 989-992
A. Schaub, Ascom Zelcom AG, Hombrechtikon, Switzerland
P. Straub, Ascom Zelcom AG, Hombrechtikon, Switzerland
pp. 993-996
E.H.-M. Sha, Dept. of Comput. Sci., Princeton Univ., NJ, USA
K. Steiglitz, Dept. of Comput. Sci., Princeton Univ., NJ, USA
pp. 1001-1004
Lih-Gwo Jeng, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Liang-Gee Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 1005-1008
S.F. Hsieh, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
K.J.R. Liu, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 1009-1012
M. Moonen, ESAT Katholieke Univ. Leuven, Heverlee, Belgium
J. Vandewalle, ESAT Katholieke Univ. Leuven, Heverlee, Belgium
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S.F. Hseih, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
K.J.R. Liu, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
K. Yao, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 1017-1020
S.P.S. Lam, Sch. of Electron. Eng., Birmingham Univ., UK
pp. 1021-1024
D. Rodriguez, Dept. of Electr. & Comput. Eng., Puerto Rico Univ., Mayaguez, Puerto Rico
pp. 1025-1028
H. Park, Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
V.K.P. Kumar, Dept. of Electr. Eng.-Syst., California Univ., Los Angeles, CA, USA
pp. 1029-1032
C.F.T. Tang, Maryland Univ., College Park, MD, USA
K.J.R. Liu, Maryland Univ., College Park, MD, USA
S.A. Tretter, Maryland Univ., College Park, MD, USA
pp. 1033-1036
K. Gao, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.O. Ahmad, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.N.S. Swamy, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
pp. 1041-1044
K.I. Diamantaras, Dept. of Electr. Eng., Princeton Univ., NJ, USA
S.Y. Kung, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 1049-1052
M.D. Emmerson, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
R.I. Damper, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
A.J.G. Hey, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
C. Upstill, Marconi Speech & Inf. Syst., Portsmouth, UK
pp. 1053-1056
Y.H. Hu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., WI, USA
Q. Xue, Dept. of Electr. & Comput. Eng., Wisconsin Univ., WI, USA
W.J. Tompkins, Dept. of Electr. & Comput. Eng., Wisconsin Univ., WI, USA
pp. 1061-1064
J.T.-H. Lo, Dept. of Math. & Stat., Maryland Univ., Baltimore, MD, USA
pp. 1065-1068
J.S. Taur, Dept. of Electr. Eng., Princeton Univ., NJ, USA
S.Y. Kung, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 1069-1072
S.Y. Kung, Dept. of Electr. Eng., Princton Univ., NJ, USA
W.D. Mao, Dept. of Electr. Eng., Princton Univ., NJ, USA
pp. 1073-1076
K.W. Leary, Analog Devices Inc., Norwood, MA, USA
C. Cavigioli, Analog Devices Inc., Norwood, MA, USA
pp. 1077-1080
F.J. Taylor, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
G.S. Zelniker, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
J.C. Smith, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
J. Mellott, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 1081-1084
R. Bhatia, Sharp Microelectron. Technol. Inc., Camas, WA, USA
M. Furuta, Sharp Microelectron. Technol. Inc., Camas, WA, USA
J. Ponce, Sharp Microelectron. Technol. Inc., Camas, WA, USA
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P.H. Siegel, IMB Corp., San Jose, CA, USA
C.B. Shung, IMB Corp., San Jose, CA, USA
T.D. Howell, IMB Corp., San Jose, CA, USA
H.K. Thapar, IMB Corp., San Jose, CA, USA
pp. 1093-1096
G. Feygin, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
P.G. Gulak, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
P. Chow, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 1097-1100
M. Ott, Dept. of Electr. Eng., Tokyo Univ., Japan
L.C. De Silva, Dept. of Electr. Eng., Tokyo Univ., Japan
L. Satou, Dept. of Electr. Eng., Tokyo Univ., Japan
K. Aizawa, Dept. of Electr. Eng., Tokyo Univ., Japan
M. Hatori, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 1105-1108
S. Beling, Analog Devices Inc., Norwood, MA, USA
K. Leary, Analog Devices Inc., Norwood, MA, USA
G. Yukna, Analog Devices Inc., Norwood, MA, USA
pp. 1109-1112
B. Barrera, Comdisco Syst. Inc., Foster City, CA, USA
E.A. Lee, Analog Devices Inc., Norwood, MA, USA
pp. 1113-1116
B. Kelley, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
V. Madisetti, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1117-1120
J. Normile, Apple Computer ATG, Cupertino, CA, USA
D. Wright, Apple Computer ATG, Cupertino, CA, USA
pp. 1121-1124
M.J. Irwin, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
R.M. Owens, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
T.P. Kelliher, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
K.-K. Leung, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
M. Vishwanath, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
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G. Adams, United Technol. Res. Center, East Hartford, CT, USA
A.M. Finn, United Technol. Res. Center, East Hartford, CT, USA
M.F. Griffin, United Technol. Res. Center, East Hartford, CT, USA
pp. 1129-1132
K.K. Parhi, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
J.-S. Lee, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1133-1136
F. Arguello, Dept. of Electron., Univ. of Santiago de Compostela, Spain
R. Doallo, Dept. of Electron., Univ. of Santiago de Compostela, Spain
J.D. Bruguera, Dept. of Electron., Univ. of Santiago de Compostela, Spain
E.L. Zapata, Dept. of Electron., Univ. of Santiago de Compostela, Spain
pp. 1137-1140
K. Zeger, Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI, USA
A. Gersho, Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI, USA
pp. 1141-1143
H.K. Kwan, Dept. of Electr. Eng., Windsor Univ., Ont., Canada
pp. 1145-1148
S.-j. Yeh, Rensselaer Polytech. Inst., Troy, NY, USA
H. Stark, Rensselaer Polytech. Inst., Troy, NY, USA
pp. 1149-1152
Z.-J. Mou, Dept. of Electron., Telecom Paris Univ., France
F. Jutand, Dept. of Electron., Telecom Paris Univ., France
pp. 1153-1156
N. Ranganathan, Dept. of Comput. Sci., Univ. of South Florida, Tampa, FL, USA
R. Mehrotra, Dept. of Electron., Telecom Paris Univ., France
K.R. Namuduri, Dept. of Electron., Univ. of Santiago de Compostela, Spain
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P.D. Schuler, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
R.H.S. Hardy, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
V. Cuperman, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
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S.C. Bass, Mitre Corp., McLean, VA, USA
G.M. Butler, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
R.L. Williams, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
F. Barlos, Dept. of Electron., Univ. of Santiago de Compostela, Spain
D.R. Miller, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 1165-1168
Y. Kadowaki, LSE Res. & Dev. Center, Osaka, Japan
S. Nakamura, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
A. Kawahashi, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 1169-1172
B.J. Sheu, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
W.-C. Fang, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1173-1176
M.D. Dikaiakos, Dept. of Computer Sci., Princeton Univ., NJ, USA
K. Steiglitz, Dept. of Computer Sci., Princeton Univ., NJ, USA
pp. 1177-1180
T. Oto, Toshiba Corp., Kawasaki, Japan
K. Kitagaki, Toshiba Corp., Kawasaki, Japan
T. Demura, Toshiba Corp., Kawasaki, Japan
Y. Araki, Toshiba Corp., Kawasaki, Japan
T. Takada, Toshiba Corp., Kawasaki, Japan
pp. 1181-1184
F. Lu, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
H. Samueli, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1185-1188
O.C. McNally, Dept. of Electr. & Electron. Eng., Queen's Univ. of Belfast, UK
W.P. Marnane, Dept. of Electr. & Electron. Eng., Queen's Univ. of Belfast, UK
J.V. McCanny, Dept. of Electr. & Electron. Eng., Queen's Univ. of Belfast, UK
pp. 1189-1192
H. Miyanaga, NTT LSI Lab., Kanagawa, Japan
H. Yamauchi, NTT LSI Lab., Kanagawa, Japan
K. Matsuda, NTT LSI Lab., Kanagawa, Japan
pp. 1193-1196
H. Yamauchi, NTT LSI Lab., Kanawaga, Japan
Y. Tashiro, NTT LSI Lab., Kanawaga, Japan
T. Minami, NTT LSI Lab., Kanawaga, Japan
Y. Suzuki, Toshiba Corp., Kawasaki, Japan
pp. 1197-1200
V.K. Jain, Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
G.E. Perez, Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
J.M. Wills, Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
pp. 1201-1204
S.E. McQuillan, Inst. of Adv. Microelectron., Queen's Univ. of Belfast, UK
J.V. McCanny, Inst. of Adv. Microelectron., Queen's Univ. of Belfast, UK
pp. 1205-1208
W. Steenaart, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
J.Y. Zhang, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 1209-1212
C.Y. Lee, IMEC Lab., Heverlee, Belgium
F. Catthoor, IMEC Lab., Heverlee, Belgium
H. De Man, IMEC Lab., Heverlee, Belgium
pp. 1213-1216
W.P. Burleson, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 1217-1220
Tung-Hao Huang, Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chi-Min Liu, Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chein-Wei Jen, Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 1221-1224
J.G. Payne, VLSI Technol. Inc., Sophia Antipolis, France
S.M. Kruse, VLSI Technol. Inc., Sophia Antipolis, France
S.G. Smith, VLSI Technol. Inc., Sophia Antipolis, France
R.W. Morgan, VLSI Technol. Inc., Sophia Antipolis, France
pp. 1225-1228
L. Liu, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
T. Yoshino, VLSI Technol. Inc., Sophia Antipolis, France
S. Sprouse, VLSI Technol. Inc., Sophia Antipolis, France
R. Jain, VLSI Technol. Inc., Sophia Antipolis, France
pp. 1229-1232
K.K. Chau, Texas Instrum., Dallas, TX, USA
I.-F. Wang, Texas Instrum., Dallas, TX, USA
C.L. Eldridge, Texas Instrum., Dallas, TX, USA
pp. 1233-1236
S. Rajopadhye, Dept. of Comput. Sci., Oregon Univ., Eugene, OR, USA
S. Kiaei, Texas Instrum., Dallas, TX, USA
pp. 1237-1240
X. Zhong, Dept. of Comput. Sci., Oregon Univ., Eugene, OR, USA
S. Rajopadhye, Dept. of Comput. Sci., Oregon Univ., Eugene, OR, USA
pp. 1241-1244