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Haptic Interfaces for Virtual Environment and Teleoperator Systems, International Symposium on (2008)
Reno, NE
Mar. 13, 2008 to Mar. 14, 2008
ISBN: 978-1-4244-2005-6
TABLE OF CONTENTS
Papers
pp. 381
pp. 143
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pp. 472
Preface (PDF)
pp. x
B. Unger , Carnegie Mellon Univ., Pittsburgh
R. Hollis , Carnegie Mellon Univ., Pittsburgh
pp. 3-10
D. Shang , Univ. of Waterloo, Waterloo
H. Carnahan , Univ. of Toronto, Toronto
pp. 11-16
A. Israr , Purdue Univ., West Lafayette
pp. 17-24
L.A. Jones , Massachusetts Inst. of Technol., Cambridge
K. Ray , Massachusetts Inst. of Technol., Cambridge
pp. 33-39
M. Enriquez , Univ. of British Columbia, Vancouver
K. MacLean , Univ. of British Columbia, Vancouver
pp. 49-56
K. Bark , Stanford Univ., Stanford
J.W. Wheeler , Stanford Univ., Stanford
S. Premakumar , Stanford Univ., Stanford
M.R. Cutkosky , Stanford Univ., Stanford
pp. 71-78
M. Kuschel , Tech. Univ. Munchen, Munich
M. Buss , Tech. Univ. Munchen, Munich
pp. 79-86
S.A. Cholewiak , Purdue Univ., West Lafayette
H.Z. Tan , Purdue Univ., West Lafayette
pp. 87-91
M.B. Wagner , Univ. of Virginia, Charlottesville
G.J. Gerling , Univ. of Virginia, Charlottesville
J. Scanlon , Univ. of Virginia, Charlottesville
pp. 101-105
M. Tada , AIST, Tokyo
D.K. Pai , AIST, Tokyo
pp. 107-112
T. Fujimoto , Nagoya Inst. of Technol., Nagoya
Y. Ishibashi , Nagoya Inst. of Technol., Nagoya
S. Sugawara , Nagoya Inst. of Technol., Nagoya
pp. 113-119
E. Dorjgotov , Purdue Univ., West Lafayette
G.R. Bertoline , Purdue Univ., West Lafayette
L. Arns , Purdue Univ., West Lafayette
Z. Pizlo , Purdue Univ., West Lafayette
S.R. Dunlop , Purdue Univ., West Lafayette
pp. 121-127
Xing-Dong Yang , Univ. of Alberta, Edmonton
W.F. Bischof , Univ. of Alberta, Edmonton
P. Boulanger , Univ. of Alberta, Edmonton
pp. 129-135
G. Schillhuber , Tech. Univ. Munchen, Munich
H. Ulbrich , Tech. Univ. Munchen, Munich
pp. 137-138
Jonghyun Ryu , Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: fall@postech.ac.kr.
Jaehoon Jung , Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: uzys@postech.ac.kr. Currently with Hyundai Autonet Co.,
Seungmoon Choi , Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: choism@postech.ac.kr.
pp. 139-140
D.W. Weir , Northwestern Univ. Evanston, Evanston
J.E. Colgate , Northwestern Univ. Evanston, Evanston
M.A. Peshkin , Northwestern Univ. Evanston, Evanston
pp. 169-175
G. Bianchini , Univ. di Siena, Siena
M. Orlandesi , Univ. di Siena, Siena
D. Prattichizzo , Univ. di Siena, Siena
pp. 177-184
Jaeyoung Cheon , POSTECH, Kyungbuk
Inwook Hwang , POSTECH, Kyungbuk
Gabjong Han , POSTECH, Kyungbuk
Seungmoon Choi , POSTECH, Kyungbuk
pp. 193-200
R. Hover , ETH Zurich, Zurich
M. Harders , ETH Zurich, Zurich
G. Szekely , ETH Zurich, Zurich
pp. 201-208
Z. Pezzementi , Johns Hopkins Univ., Hopkins
D. Ursu , Johns Hopkins Univ., Hopkins
S. Misra , Johns Hopkins Univ., Hopkins
A.M. Okamura , Johns Hopkins Univ., Hopkins
pp. 209-215
T. Edmunds , Rutgers Univ., Newark
D.K. Pai , Rutgers Univ., Newark
pp. 225-230
R. Unal , Sabanci Univ., Istanbul
G. Kiziltas , Sabanci Univ., Istanbul
V. Patoglu , Sabanci Univ., Istanbul
pp. 231-238
M. Ramezanifard , Concordia Univ., Montreal
S. Sokhanvar , Concordia Univ., Montreal
J. Dargahi , Concordia Univ., Montreal
Wen-Fang Xie , Concordia Univ., Montreal
M. Packirisamy , Concordia Univ., Montreal
pp. 247-252
G. Sankaranarayanan , Univ. of Washington, Seattle
B. Hannaford , Univ. of Washington, Seattle
pp. 259-266
L.N. Verner , Johns Hopkins Univ., Baltimore
A.M. Okamura , Johns Hopkins Univ., Baltimore
pp. 267-271
P.G. Griffiths , Univ. of Michigan, Ann Arbor
R.B. Gillespie , Univ. of Michigan, Ann Arbor
pp. 273-280
Yiru Zhou , Nagoya Univ., Nagoya
M. Ohka , Nagoya Univ., Nagoya
pp. 281-285
A.L. Barrow , Univ. of Reading, Reading
W.S. Harwin , Univ. of Reading, Reading
pp. 295-302
Dangxiao Wang , Beihang Univ., Beijing
Yuru Zhang , Beihang Univ., Beijing
Yu Wang , Beihang Univ., Beijing
pp. 303-310
P. Tripicchio , PERCRO, Pisa
E. Ruffaldi , PERCRO, Pisa
C.A. Avizzano , PERCRO, Pisa
M. Bergamasco , PERCRO, Pisa
pp. 311-318
K. Tagawa , Univ. of Tokyo, Tokyo
pp. 327-333
Dongjun Lee , Univ. of Tennessee, Knoxville
Ke Huang , Univ. of Tennessee, Knoxville
pp. 335-342
P. Mitra , Stanford Univ., Stanford
G. Niemeyer , Stanford Univ., Stanford
pp. 343-350
A. Ma , Simon Fraser Univ., Burnaby
S. Payandeh , Simon Fraser Univ., Burnaby
pp. 351-356
H. Vasudevan , Indian Inst. of Technol. Madras, Chennai
M. Manivannan , Indian Inst. of Technol. Madras, Chennai
pp. 357-360
H. Al Osman , Univ. of Ottawa, Ottawa
M. Eid , Univ. of Ottawa, Ottawa
A. El Saddik , Univ. of Ottawa, Ottawa
pp. 361-366
K. Minamizawa , Univ. of Tokyo, Tokyo
S. Fukamachi , Univ. of Tokyo, Tokyo
N. Kawakami , Univ. of Tokyo, Tokyo
S. Tachi , Univ. of Tokyo, Tokyo
pp. 367-368
Hiroaki Yano , University of Tsukuba, e-mail: yano@iit.tsukuba.ac.jp
Itsuro Hayashi , University of Tsukuba, e-mail: hayashi@vrlab.esys.tsukuba.ac.jp
Hiroo Iwata , University of Tsukuba, e-mail: iwata@kz.tsukuba.ac.jp
pp. 369-370
C.R. Wagner , Cybernet Syst. Corp., Ann Arbor
A.L. Christiana , Cybernet Syst. Corp., Ann Arbor
pp. 371-372
Brian T. Gleeson , University of Utah, Department of Mechanical Engineering; 50 S. Central Campus Dr. 2120 Merrill Engineering Bldg. Salt Lake City, UT 84112-9208, brian.gleeson@gmail.com
William R. Provancher , University of Utah, Department of Mechanical Engineering; 50 S. Central Campus Dr. 2120 Merrill Engineering Bldg. Salt Lake City, UT 84112-9208, wil@mech.utah.edu
pp. 373-374
Chaodong Li , Shanghai Univ., Shanghai
Hua Yao , Shanghai Univ., Shanghai
Jingjing Xu , Shanghai Univ., Shanghai
Yanyan Zhang , Shanghai Univ., Shanghai
Boqian Kuang , Shanghai Univ., Shanghai
pp. 375-376
M. Tavakoli , Harvard Univ., Cambridge
R.D. Howe , Harvard Univ., Cambridge
pp. 377-378
G. Campion , McGill Univ., Montreal
A.H.C. Gosline , McGill Univ., Montreal
V. Hayward , McGill Univ., Montreal
pp. 379-380
R. Leuschke , Univ. of Washington, Seattle
R. Donlin , Univ. of Washington, Seattle
pp. 383-388
A.M. Brandt , Brigham Young Univ., Provo
M.B. Colton , Brigham Young Univ., Provo
pp. 389-395
G. Grindlay , Media Lab. Massachusetts Inst. of Technol., Cambridge
pp. 397-404
M. Frey , Univ. of Utah, Salt Lake City
pp. 405-412
Keehoon Kim , Northwestern Univ., Evanston
J.E. Colgate , Northwestern Univ., Evanston
M.A. Peshkin , Northwestern Univ., Evanston
pp. 413-419
Woojin Ahn , Korea Adv. Inst. of Sci.&Technol., Daejeon
pp. 421-428
V. Levesque , McGill Univ., Montreal
V. Hayward , McGill Univ., Montreal
pp. 429-436
Y. Kondo , Toyohashi Univ. of Technol., Toyohashi
T. Miyoshi , Toyohashi Univ. of Technol., Toyohashi
K. Terashima , Toyohashi Univ. of Technol., Toyohashi
pp. 437-444
F.G. Hamza-Lup , Armstrong Atlantic State Univ., Savannah
M. Adams , Armstrong Atlantic State Univ., Savannah
pp. 445-450
R. Iglesias , lkerlan Technol. Res. Centre, Arrastate-Mondragon
pp. 451-456
Yuan Wang , Univ. of Manchester, Manchester
M.J. Turner , Univ. of Manchester, Manchester
W.T. Hewitt , Univ. of Manchester, Manchester
pp. 457-464
M. Mahvash , Johns Hopkins Univ., Baltimore
J. Gwilliam , Johns Hopkins Univ., Baltimore
R. Agarwal , Johns Hopkins Univ., Baltimore
B. Vagvolgyi , Johns Hopkins Univ., Baltimore
Li-Ming Su , Johns Hopkins Univ., Baltimore
D.D. Yuh , Johns Hopkins Univ., Baltimore
A.M. Okamura , Johns Hopkins Univ., Baltimore
pp. 465-471
Haptic Weather (Abstract)
Chaehyun Lee , POSTECH, Pohang
pp. 473-474
D.I. Grow , Johns Hopkins Univ., Baltimore
Mengnan Wu , Johns Hopkins Univ., Baltimore
M.J. Locastro , Johns Hopkins Univ., Baltimore
S.K. Arora , Johns Hopkins Univ., Baltimore
A.J. Bastian , Johns Hopkins Univ., Baltimore
A.M. Okamura , Johns Hopkins Univ., Baltimore
pp. 475-476
E. Samur , Lab. of Robotic Syst., Lausanne
L. Flection , Lab. of Robotic Syst., Lausanne
U. Spaelter , Lab. of Robotic Syst., Lausanne
H. Bleuler , Lab. of Robotic Syst., Lausanne
pp. 477-478
A. Baheti , State Univ. of New York, Buffalo
S. Seshadri , State Univ. of New York, Buffalo
A. Kumar , State Univ. of New York, Buffalo
G. Srimathveeravalli , State Univ. of New York, Buffalo
T. Kesavadas , State Univ. of New York, Buffalo
pp. 479-480
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