ISBN: 978-1-4244-2005-6

B. Unger, Carnegie Mellon Univ., Pittsburgh

R. Hollis, Carnegie Mellon Univ., Pittsburgh

R. Klatzky

D. Shang, Univ. of Waterloo, Waterloo

H. Carnahan, Univ. of Toronto, Toronto

A. Israr, Purdue Univ., West Lafayette

C.M. Reed

H.Z. Tan

Yanfang Li, Rice Univ., Houston

A. Israr

V. Patoglu

M. O'Malley

L.A. Jones, Massachusetts Inst. of Technol., Cambridge

K. Ray, Massachusetts Inst. of Technol., Cambridge

M. Biet, Univ. of Lille, Lille

G. Casiez

F. Giraud

B. Lemaire-Semail

M. Enriquez, Univ. of British Columbia, Vancouver

K. MacLean, Univ. of British Columbia, Vancouver

V. Varadharajan, Robotics Inst., Pittsburgh

R. Klatzky

B. Unger

R. Swendsen

R. Hollis

Zhuanghua Shi, Ludwig-Maximilians-Univ. Munchen, Munich

S. Hirche

W.X. Schneider

H. Muller

K. Bark, Stanford Univ., Stanford

J.W. Wheeler, Stanford Univ., Stanford

S. Premakumar, Stanford Univ., Stanford

M.R. Cutkosky, Stanford Univ., Stanford

M. Kuschel, Tech. Univ. Munchen, Munich

M. Buss, Tech. Univ. Munchen, Munich

F. Freyberger

B. Farber

R.L. Klatzky

S.A. Cholewiak, Purdue Univ., West Lafayette

H.Z. Tan, Purdue Univ., West Lafayette

D.S. Ebert

S. Peddamatham, Haptic Interface Res. Lab., West Lafayette

W. Peine

H.Z. Tan

M.B. Wagner, Univ. of Virginia, Charlottesville

G.J. Gerling, Univ. of Virginia, Charlottesville

J. Scanlon, Univ. of Virginia, Charlottesville

M. Tada, AIST, Tokyo

D.K. Pai, AIST, Tokyo

T. Fujimoto, Nagoya Inst. of Technol., Nagoya

Y. Ishibashi, Nagoya Inst. of Technol., Nagoya

S. Sugawara, Nagoya Inst. of Technol., Nagoya

E. Dorjgotov, Purdue Univ., West Lafayette

G.R. Bertoline, Purdue Univ., West Lafayette

L. Arns, Purdue Univ., West Lafayette

Z. Pizlo, Purdue Univ., West Lafayette

S.R. Dunlop, Purdue Univ., West Lafayette

Xing-Dong Yang, Univ. of Alberta, Edmonton

W.F. Bischof, Univ. of Alberta, Edmonton

P. Boulanger, Univ. of Alberta, Edmonton

G. Schillhuber, Tech. Univ. Munchen, Munich

H. Ulbrich, Tech. Univ. Munchen, Munich

Jonghyun Ryu, Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: fall@postech.ac.kr.

Jaehoon Jung, Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: uzys@postech.ac.kr. Currently with Hyundai Autonet Co.,

Seungmoon Choi, Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: choism@postech.ac.kr.

A. Blank, Johns Hopkins Univ., Hopkins

A.M. Okamura, Johns Hopkins Univ., Hopkins

K.J. Kuchenbecker

A. Abdossalami

S. Sirouspour

I. Goncharenko, 3D Inc., Kawasaki

M. Svinin

S. Hosoe

Y. Kanou

M.J.-D. Otis, Laval Univ., Quebec City

M. Mokhtari

C. du Tremblay

D. Laurendeau

F.-M. De Rainville

C.M. Gosselin

D.W. Weir, Northwestern Univ. Evanston, Evanston

J.E. Colgate, Northwestern Univ. Evanston, Evanston

M.A. Peshkin, Northwestern Univ. Evanston, Evanston

G. Bianchini, Univ. di Siena, Siena

M. Orlandesi, Univ. di Siena, Siena

D. Prattichizzo, Univ. di Siena, Siena

M. Zinn, Univ. of Wisconsin, Madison

O. Khatib

B. Roth

J.K. Salisbury

Jaeyoung Cheon, POSTECH, Kyungbuk

Inwook Hwang, POSTECH, Kyungbuk

Gabjong Han, POSTECH, Kyungbuk

Seungmoon Choi, POSTECH, Kyungbuk

R. Hover, ETH Zurich, Zurich

M. Harders, ETH Zurich, Zurich

G. Szekely, ETH Zurich, Zurich

Z. Pezzementi, Johns Hopkins Univ., Hopkins

D. Ursu, Johns Hopkins Univ., Hopkins

S. Misra, Johns Hopkins Univ., Hopkins

A.M. Okamura, Johns Hopkins Univ., Hopkins

A. Maciel, Rensselaer Polytech. Inst., Troy

Suvranu De

T. Edmunds, Rutgers Univ., Newark

D.K. Pai, Rutgers Univ., Newark

R. Unal, Sabanci Univ., Istanbul

G. Kiziltas, Sabanci Univ., Istanbul

V. Patoglu, Sabanci Univ., Istanbul

K.J. Kuchenbecker, Univ. of Pennsylvania, Philadelphia

D. Ferguson

M. Kutzer

M. Moses

A.M. Okamura

M. Ramezanifard, Concordia Univ., Montreal

S. Sokhanvar, Concordia Univ., Montreal

J. Dargahi, Concordia Univ., Montreal

Wen-Fang Xie, Concordia Univ., Montreal

M. Packirisamy, Concordia Univ., Montreal

B.A. Black

W.J. Book

G. Sankaranarayanan, Univ. of Washington, Seattle

B. Hannaford, Univ. of Washington, Seattle

L.N. Verner, Johns Hopkins Univ., Baltimore

A.M. Okamura, Johns Hopkins Univ., Baltimore

P.G. Griffiths, Univ. of Michigan, Ann Arbor

R.B. Gillespie, Univ. of Michigan, Ann Arbor

Yiru Zhou, Nagoya Univ., Nagoya

M. Ohka, Nagoya Univ., Nagoya

T. Miyaoka

S. Moghimi

S. Sirouspour

P. Malysz

A.L. Barrow, Univ. of Reading, Reading

W.S. Harwin, Univ. of Reading, Reading

Dangxiao Wang, Beihang Univ., Beijing

Yuru Zhang, Beihang Univ., Beijing

Yu Wang, Beihang Univ., Beijing

P. Tripicchio, PERCRO, Pisa

E. Ruffaldi, PERCRO, Pisa

C.A. Avizzano, PERCRO, Pisa

M. Bergamasco, PERCRO, Pisa

E. Ruffaldi, Scuola Superiore S. Anna, Pisa

D. Morris

F. Barbagli

K. Salisbury

M. Bergamasco

K. Tagawa, Univ. of Tokyo, Tokyo

K. Hirota

M. Hirose

Dongjun Lee, Univ. of Tennessee, Knoxville

Ke Huang, Univ. of Tennessee, Knoxville

P. Mitra, Stanford Univ., Stanford

G. Niemeyer, Stanford Univ., Stanford

A. Ma, Simon Fraser Univ., Burnaby

S. Payandeh, Simon Fraser Univ., Burnaby

H. Vasudevan, Indian Inst. of Technol. Madras, Chennai

M. Manivannan, Indian Inst. of Technol. Madras, Chennai

H. Al Osman, Univ. of Ottawa, Ottawa

M. Eid, Univ. of Ottawa, Ottawa

A. El Saddik, Univ. of Ottawa, Ottawa

K. Minamizawa, Univ. of Tokyo, Tokyo

S. Fukamachi, Univ. of Tokyo, Tokyo

N. Kawakami, Univ. of Tokyo, Tokyo

S. Tachi, Univ. of Tokyo, Tokyo

Hiroaki Yano, University of Tsukuba, e-mail: yano@iit.tsukuba.ac.jp

Itsuro Hayashi, University of Tsukuba, e-mail: hayashi@vrlab.esys.tsukuba.ac.jp

Hiroo Iwata, University of Tsukuba, e-mail: iwata@kz.tsukuba.ac.jp

C.R. Wagner, Cybernet Syst. Corp., Ann Arbor

A.L. Christiana, Cybernet Syst. Corp., Ann Arbor

Brian T. Gleeson, University of Utah, Department of Mechanical Engineering; 50 S. Central Campus Dr. 2120 Merrill Engineering Bldg. Salt Lake City, UT 84112-9208, brian.gleeson@gmail.com

William R. Provancher, University of Utah, Department of Mechanical Engineering; 50 S. Central Campus Dr. 2120 Merrill Engineering Bldg. Salt Lake City, UT 84112-9208, wil@mech.utah.edu

Chaodong Li, Shanghai Univ., Shanghai

Hua Yao, Shanghai Univ., Shanghai

Jingjing Xu, Shanghai Univ., Shanghai

Yanyan Zhang, Shanghai Univ., Shanghai

Boqian Kuang, Shanghai Univ., Shanghai

M. Tavakoli, Harvard Univ., Cambridge

R.D. Howe, Harvard Univ., Cambridge

G. Campion, McGill Univ., Montreal

A.H.C. Gosline, McGill Univ., Montreal

V. Hayward, McGill Univ., Montreal

R. Leuschke, Univ. of Washington, Seattle

R. Donlin, Univ. of Washington, Seattle

M. Claus

M. Nugent

D. van der Reyden

B. Hannaford

A.M. Brandt, Brigham Young Univ., Provo

M.B. Colton, Brigham Young Univ., Provo

G. Grindlay, Media Lab. Massachusetts Inst. of Technol., Cambridge

M. Frey, Univ. of Utah, Salt Lake City

D.E. Johnson

J. Hollerbach

Keehoon Kim, Northwestern Univ., Evanston

J.E. Colgate, Northwestern Univ., Evanston

M.A. Peshkin, Northwestern Univ., Evanston

Woojin Ahn, Korea Adv. Inst. of Sci.&Technol., Daejeon

D.B. Jones

Doo Yong Lee

Suvranu De

V. Levesque, McGill Univ., Montreal

V. Hayward, McGill Univ., Montreal

Y. Kondo, Toyohashi Univ. of Technol., Toyohashi

T. Miyoshi, Toyohashi Univ. of Technol., Toyohashi

K. Terashima, Toyohashi Univ. of Technol., Toyohashi

H. Kitagawa

F.G. Hamza-Lup, Armstrong Atlantic State Univ., Savannah

M. Adams, Armstrong Atlantic State Univ., Savannah

R. Iglesias, lkerlan Technol. Res. Centre, Arrastate-Mondragon

M. Orozco

J.J. Valdes

A. El Saddik

Yuan Wang, Univ. of Manchester, Manchester

M.J. Turner, Univ. of Manchester, Manchester

W.T. Hewitt, Univ. of Manchester, Manchester

M. Mahvash, Johns Hopkins Univ., Baltimore

J. Gwilliam, Johns Hopkins Univ., Baltimore

R. Agarwal, Johns Hopkins Univ., Baltimore

B. Vagvolgyi, Johns Hopkins Univ., Baltimore

Li-Ming Su, Johns Hopkins Univ., Baltimore

D.D. Yuh, Johns Hopkins Univ., Baltimore

A.M. Okamura, Johns Hopkins Univ., Baltimore

Chaehyun Lee, POSTECH, Pohang

B.D. Adelstein

Seungmoon Choi

D.I. Grow, Johns Hopkins Univ., Baltimore

Mengnan Wu, Johns Hopkins Univ., Baltimore

M.J. Locastro, Johns Hopkins Univ., Baltimore

S.K. Arora, Johns Hopkins Univ., Baltimore

A.J. Bastian, Johns Hopkins Univ., Baltimore

A.M. Okamura, Johns Hopkins Univ., Baltimore

E. Samur, Lab. of Robotic Syst., Lausanne

L. Flection, Lab. of Robotic Syst., Lausanne

U. Spaelter, Lab. of Robotic Syst., Lausanne

H. Bleuler, Lab. of Robotic Syst., Lausanne

D. Hellier

S. Ourselin

A. Baheti, State Univ. of New York, Buffalo

S. Seshadri, State Univ. of New York, Buffalo

A. Kumar, State Univ. of New York, Buffalo

G. Srimathveeravalli, State Univ. of New York, Buffalo

T. Kesavadas, State Univ. of New York, Buffalo

K. Guru