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2008 Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems
Reno, NE
March 13-March 14
ISBN: 978-1-4244-2005-6
Table of Contents
Papers
L.A. Jones, Massachusetts Inst. of Technol., Cambridge
K. Ray, Massachusetts Inst. of Technol., Cambridge
pp. 33-39
M. Enriquez, Univ. of British Columbia, Vancouver
K. MacLean, Univ. of British Columbia, Vancouver
pp. 49-56
K. Bark, Stanford Univ., Stanford
J.W. Wheeler, Stanford Univ., Stanford
S. Premakumar, Stanford Univ., Stanford
M.R. Cutkosky, Stanford Univ., Stanford
pp. 71-78
M.B. Wagner, Univ. of Virginia, Charlottesville
G.J. Gerling, Univ. of Virginia, Charlottesville
J. Scanlon, Univ. of Virginia, Charlottesville
pp. 101-105
T. Fujimoto, Nagoya Inst. of Technol., Nagoya
Y. Ishibashi, Nagoya Inst. of Technol., Nagoya
S. Sugawara, Nagoya Inst. of Technol., Nagoya
pp. 113-119
E. Dorjgotov, Purdue Univ., West Lafayette
G.R. Bertoline, Purdue Univ., West Lafayette
L. Arns, Purdue Univ., West Lafayette
Z. Pizlo, Purdue Univ., West Lafayette
S.R. Dunlop, Purdue Univ., West Lafayette
pp. 121-127
Xing-Dong Yang, Univ. of Alberta, Edmonton
W.F. Bischof, Univ. of Alberta, Edmonton
P. Boulanger, Univ. of Alberta, Edmonton
pp. 129-135
Jonghyun Ryu, Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: fall@postech.ac.kr.
Jaehoon Jung, Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: uzys@postech.ac.kr. Currently with Hyundai Autonet Co.,
Seungmoon Choi, Haptics and Virtual Reality Laboratory, Department of Computer Science and Engineering, POSTECH, Republic of Korea, e-mail: choism@postech.ac.kr.
pp. 139-140
D.W. Weir, Northwestern Univ. Evanston, Evanston
J.E. Colgate, Northwestern Univ. Evanston, Evanston
M.A. Peshkin, Northwestern Univ. Evanston, Evanston
pp. 169-175
Z. Pezzementi, Johns Hopkins Univ., Hopkins
D. Ursu, Johns Hopkins Univ., Hopkins
S. Misra, Johns Hopkins Univ., Hopkins
A.M. Okamura, Johns Hopkins Univ., Hopkins
pp. 209-215
R. Unal, Sabanci Univ., Istanbul
G. Kiziltas, Sabanci Univ., Istanbul
V. Patoglu, Sabanci Univ., Istanbul
pp. 231-238
M. Ramezanifard, Concordia Univ., Montreal
S. Sokhanvar, Concordia Univ., Montreal
J. Dargahi, Concordia Univ., Montreal
Wen-Fang Xie, Concordia Univ., Montreal
M. Packirisamy, Concordia Univ., Montreal
pp. 247-252
A. Ma, Simon Fraser Univ., Burnaby
S. Payandeh, Simon Fraser Univ., Burnaby
pp. 351-356
H. Vasudevan, Indian Inst. of Technol. Madras, Chennai
M. Manivannan, Indian Inst. of Technol. Madras, Chennai
pp. 357-360
H. Al Osman, Univ. of Ottawa, Ottawa
M. Eid, Univ. of Ottawa, Ottawa
A. El Saddik, Univ. of Ottawa, Ottawa
pp. 361-366
Hiroaki Yano, University of Tsukuba, e-mail: yano@iit.tsukuba.ac.jp
Itsuro Hayashi, University of Tsukuba, e-mail: hayashi@vrlab.esys.tsukuba.ac.jp
Hiroo Iwata, University of Tsukuba, e-mail: iwata@kz.tsukuba.ac.jp
pp. 369-370
C.R. Wagner, Cybernet Syst. Corp., Ann Arbor
A.L. Christiana, Cybernet Syst. Corp., Ann Arbor
pp. 371-372
Brian T. Gleeson, University of Utah, Department of Mechanical Engineering; 50 S. Central Campus Dr. 2120 Merrill Engineering Bldg. Salt Lake City, UT 84112-9208, brian.gleeson@gmail.com
William R. Provancher, University of Utah, Department of Mechanical Engineering; 50 S. Central Campus Dr. 2120 Merrill Engineering Bldg. Salt Lake City, UT 84112-9208, wil@mech.utah.edu
pp. 373-374
Chaodong Li, Shanghai Univ., Shanghai
Hua Yao, Shanghai Univ., Shanghai
Jingjing Xu, Shanghai Univ., Shanghai
Yanyan Zhang, Shanghai Univ., Shanghai
Boqian Kuang, Shanghai Univ., Shanghai
pp. 375-376
G. Campion, McGill Univ., Montreal
A.H.C. Gosline, McGill Univ., Montreal
V. Hayward, McGill Univ., Montreal
pp. 379-380
G. Grindlay, Media Lab. Massachusetts Inst. of Technol., Cambridge
pp. 397-404
Keehoon Kim, Northwestern Univ., Evanston
J.E. Colgate, Northwestern Univ., Evanston
M.A. Peshkin, Northwestern Univ., Evanston
pp. 413-419
Y. Kondo, Toyohashi Univ. of Technol., Toyohashi
T. Miyoshi, Toyohashi Univ. of Technol., Toyohashi
K. Terashima, Toyohashi Univ. of Technol., Toyohashi
pp. 437-444
F.G. Hamza-Lup, Armstrong Atlantic State Univ., Savannah
M. Adams, Armstrong Atlantic State Univ., Savannah
pp. 445-450
Yuan Wang, Univ. of Manchester, Manchester
M.J. Turner, Univ. of Manchester, Manchester
W.T. Hewitt, Univ. of Manchester, Manchester
pp. 457-464
M. Mahvash, Johns Hopkins Univ., Baltimore
J. Gwilliam, Johns Hopkins Univ., Baltimore
R. Agarwal, Johns Hopkins Univ., Baltimore
B. Vagvolgyi, Johns Hopkins Univ., Baltimore
Li-Ming Su, Johns Hopkins Univ., Baltimore
D.D. Yuh, Johns Hopkins Univ., Baltimore
A.M. Okamura, Johns Hopkins Univ., Baltimore
pp. 465-471
D.I. Grow, Johns Hopkins Univ., Baltimore
Mengnan Wu, Johns Hopkins Univ., Baltimore
M.J. Locastro, Johns Hopkins Univ., Baltimore
S.K. Arora, Johns Hopkins Univ., Baltimore
A.J. Bastian, Johns Hopkins Univ., Baltimore
A.M. Okamura, Johns Hopkins Univ., Baltimore
pp. 475-476
E. Samur, Lab. of Robotic Syst., Lausanne
L. Flection, Lab. of Robotic Syst., Lausanne
U. Spaelter, Lab. of Robotic Syst., Lausanne
H. Bleuler, Lab. of Robotic Syst., Lausanne
pp. 477-478
A. Baheti, State Univ. of New York, Buffalo
S. Seshadri, State Univ. of New York, Buffalo
A. Kumar, State Univ. of New York, Buffalo
G. Srimathveeravalli, State Univ. of New York, Buffalo
T. Kesavadas, State Univ. of New York, Buffalo
pp. 479-480
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