- F
- FIE
- 2000
- 30th Annual Frontiers in Education - Vol 1 (FIE'2000)
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30th Annual Frontiers in Education - Vol 1 (FIE'2000)
Kansas City, MO, USA
October 18-October 21
ISBN: 0-7803-6424-4
Table of Contents
 | Papers |
D.W. Field, Dept. of Ind. Educ. & Technol., Iowa State Univ., Ames, IA, USA
pp. F1A/123
A.S. Ruocco, Dept. of Electr. Eng. & Comput. Sci., US Mil. Acad., West Point, NY, USA
pp. F1A/223
J. Tuya, Dept. de Inf., Oviedo Univ., Spain
pp. F1A/3-F1A/6
J. McGourty, Sch. of Eng., Columbia Univ., New York, NY, USA
pp. F1A/7-F1A11
K.A. Smith, Dept. of Civil Eng., Minnesota Univ., Minneapolis, MN, USA
pp. F1B/1F1A11
S. Labidi, Dept. of Electr. Eng., Fed.. Univ. of Maranhao, Brazil
pp. F1B/14-F1B/18
B.M. Moskal, Dept. of Math. & Comput. Sci., Colorado Sch. of Mines, Golden, CO, USA
pp. F1B/19-F1B/24
E.F. Gehringer, Dept. of Electr. Eng. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. F1B/2-F1B/7
M.E. Ssemakula, Div. of Eng. Technol., Wayne State Univ., Detroit, MI, USA
pp. F1B/8-F1B13
G.K. Heitman, Dept. of Electr. & Comput. Eng., Univ. of West Florida, Pensacola, FL, USA
pp. F1C/1-F1C/5
T. Clear, Dept. of Comput.-Syst. & Technol., Auckland Univ. of Technol., New Zealand
pp. F1C/18-F1C/23
S. Ghosh, Dept. of Comput. Sci. & Eng., Arizona State Univ., Tempe, AZ, USA
pp. F1C/24F1C/23
D. Moore, Dept. of Electr. & Comput. Eng., Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
pp. F1C/6-F1C11
R. Ross, Dept. of Electr. & Comput. Eng., Univ. of Detroit Mercy, MI, USA
pp. F1D/1-F1D/6
R.M. Winter, Dept. of Chem. & Chem. Eng., South Dakota Sch. of Mines & Technol., Rapid City, SD, USA
pp. F1D/14-F1D/17
W.A. Moreno, Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
pp. F1D/8-F1D13
H.S. Hinton, Dept. of Electr. Eng. & Comput. Sci., Kansas Univ., Lawrence, KS, USA
pp. F1E/1-F1E/6
D. Braun, Dept. of Electr. Eng., California Polytech. State Univ., San Luis Obispo, CA, USA
pp. F1E/12F1E/6
V.C. Parro, Dept. of Electr. Eng., Maua Inst. of Technol., Sao Paulo, Brazil
pp. F1E/13-F1E/17
R. Martin, Dept. of Basic Sci., Esslingen Univ. of Appl. Sci., Germany
pp. F1E/7-F1E11
A. Scalise, Sch. of Eng., Pittsburgh Univ., PA, USA
pp. F1F/11-F1F/16
M. Ohland, Dept. of Chem. Eng., Florida Univ., Gainesville, FL, USA
pp. F1F/17-F1F/20
R.W. Freeman, Coll. of Eng., Iowa State Univ., Ames, IA, USA
pp. F1F/21F1F/20
J. Froyd, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. F1G/1-F1G/6
J.A. Polack-Wahl, Dept. of Comput. Sci., Mary Washington Coll., Fredericksburg, VA, USA
pp. F1G/16-F1G/21
J. Graulau-Santiago, Dept. of Civil & Environ. Eng., Michigan State Univ., East Lansing, MI, USA
pp. F1G/22-F1F/23
F.J. Lage, Fac. de Ingenieria, Buenos Aires Univ., Argentina
pp. F1G/7-F1G/8
T. Nitta, Fac. of Inf. Sci., Osaka Inst. of Technol., Japan
pp. F1G/9-F1G15
J. Impagliazzo, Dept. of Comput. Sci., Hofstra Univ., Hempstead, NY, USA
pp. F2A/1F1G15
T. Mzoughi, Dept. of Phys. & Astron., Mississippi State Univ., MS, USA
pp. F2B/1-F2B/6
D.N. Batanov, Dept. of Comput. Sci. & Inf. Manage., Asian Inst. of Technol., Bangkok, Thailand
pp. F2B/12-F2B/18
M.L. de la Barra, Dept. de Matica, Univ. Tecnica Federico Santa Maria, Valparaiso, Chile
pp. F2B/7F2B/18
C.F. Yokomoto, Dept. de Matica, Univ. Tecnica Federico Santa Maria, Valparaiso, Chile
pp. F2B/8-F2B11
T.L. Skvarenina, Dept. of Electr. Eng. Technol., Purdue Univ., West Lafayette, IN, USA
pp. T1A/11-T1A/16
D.J. Ahlgen, Dept. of Eng., Trinity Coll., Hartford, CT, USA
pp. T1A/17-T1A/22
M. Moreno, Sch. of Eng., Pittsburgh Univ., PA, USA
pp. T1A/23-T1A/28
J.A. Orr, Dept. of Electr. & Comput. Eng., Worcester Polytech. Inst., MA, USA
pp. T1A/7-T1A10
A. Klinger, Sch. of Eng. & Appl. Sci., California Univ., Los Angeles, CA, USA
pp. T1B/1-T1B/6
K.J. McDermott, Sch. of Electr. & Inf. Eng., Univ. of South Australia, Mawson Lakes, SA, Australia
pp. T1B/11-T1B/15
H. Detloff, Coll. of Eng. & Technol., Nebraska Univ., Omaha, NE, USA
pp. T1B/16-T1B/21
M. Huth, Dept. of Comput. & Inf. Sci., Kansas State Univ., Manhattan, KS, USA
pp. T1C/1-T1C/6
S.A. White, Software Eng. Program, Houston Univ., TX, USA
pp. T1C/13-T1C/18
D. Gustafson, Dept. of Comput. & Inf. Sci., Kansas State Univ., Manhattan, KS, USA
pp. T1C/19-T1C/20
A.Q. Gates, Dept. of Comput. Sci., Texas Univ., El Paso, TX, USA
pp. T1C/21-T1C/26
R.L. Upchurch, CIS Dept., Massachusetts Univ., North Dartmouth, MA, USA
pp. T1C/7-T1C12
H. Hodge, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. T1D/1-T1D/6
D.G. Kastern, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. T1D/13-T1D/18
W.B. Kuhn, Dept. of Electr. & Comput. Eng., Kansas State Univ., Manhattan, KS, USA
pp. T1D/19-T1D/23
Hong Shen, Rensselaer Polytech. Inst., Troy, NY, USA
pp. T1D/7T1D/23
R.P. Cook, Dept. of Comput. Sci., Mississippi Univ., MS, USA
pp. T1E/1-T1E/6
D.M. Wilson, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. T1E/12-T1E/17
J. deGrazia, Coll. of Eng., Colorado Univ., Boulder, CO, USA
pp. T1E/18-T1E/22
M.A. Yoder, Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
pp. T1E/7T1E/22
J. McGourty, Sch. of Eng., Columbia Univ., New York, NY, USA
pp. T1E/8-T1E11
K.M. Tarhini, Dept. of Civil Eng., Valparaiso Univ., IN, USA
pp. T1F/1-T1F/2
L.D. Fink, Instructional Dev. Program, Oklahoma Univ., Norman, OK, USA
pp. T1F/3-T1F/8
A. McKenna, Graduate Group in Eng., Sci., & Math. Educ., California Univ., Berkeley, CA, USA
pp. T1F/9T1F/8
M. Ayre, Univ. of South Australia, Mawson Lakes, SA, Australia
pp. T2B/18-T2B/23
J.E. Lyczko, Cooper Union Sch. of Eng., New York, NY, USA
pp. T2B/24T2B/23
M. Urban-Lurain, Dept. of Comput. Sci. & Eng., Michigan State Univ., East Lansing, MI, USA
pp. T2B/7-T2B11
H.J.C. Ellis, Dept. of Comput. & Inf. Sci., Rensselaer, Hartford, CT, USA
pp. T2C/1-T2C/6
P. Brazier, Dept. of Comput. Sci., Texas Univ., Edinburg, TX, USA
pp. T2C/13-T2C/17
G. Pour, Dept. of Comput., Inf. & Syst. Eng., San Jose State Univ., CA, USA
pp. T2C/18-T2C/23
Juan Wang, Dept. of Comput. Sci. & Inf. Syst., Nebraska Univ., Kearney, NE, USA
pp. T2C/7-T2C/8
D. Rosca, Dept. of Software & Electr. Eng., Monmouth Univ., NJ, USA
pp. T2C/9-T2C12
E.M.D. Pereira, GREEN, Pontificia Univ. Catolica de Minas Gerais, Belo Horizonte, Brazil
pp. T2D/1-T2D/4
J. Bravo, Grupo CHICO, Univ. de Castilla La Mancha, Spain
pp. T2D/11-T2D/16
E.C. Shaffer, Dept. of Electr. Eng. & Comput. Sci., US Mil. Acad., West Point, NY, USA
pp. T2D/17-T2D/22
S.R. Smith, Dept. of Electr. & Comput. Eng., Southern Illinois Univ., Edwardsville, IL, USA
pp. T2D/23T2D/22
M.S. Zywno, Dept. of Electr. & Comput. Eng., Ryerson Polytech. Inst., Toronto, Ont., Canada
pp. T2D/5-T2D10
S.L. Titcomb, Coll. of Eng. & Math., Vermont Univ., Burlington, VT, USA
pp. T2E/1-T2E/5
S. Kocijancic, Dept. of Phys. & Technol., Ljubljana Univ., Slovenia
pp. T2E/13-T2E/18
M.S. Fadali, Dept. of Electr. Eng., Nevada Univ., Reno, NV, USA
pp. T2E/6-T2E10
J.A. Pearce, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. T2F/1-T2F/3
J.D. Jones, Dept. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
pp. T2F/10T2F/3
W.C. Oakes, Dept. of Freshman Eng., Purdue Univ., West Lafayette, IN, USA
pp. T2F/4-T2F/9
S. Clark, Tennessee Univ., Knoxville, TN, USA
pp. T3A/1-T3A/4
J.L. Newcomer, Dept. of Eng. Technol., Washington Univ., Bellingham, WA, USA
pp. T3A/16-T3A/21
P.D. Fisher, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. T3A/5-T3A10
F. Azadivar, Dept. of Ind. & Manuf. Syst. Eng., Kansas State Univ., Manhattan, KS, USA
pp. T3B/1-T3B/5
H. Andersson, Chalmers Medialab, Chalmers Univ. of Technol., Goteborg, Sweden
pp. T3B/6T3B/5
M.B. Walker, Nat. Center for Supercomput. Applications, Illinois Univ., Urbana, IL, USA
pp. T3B/7-T3B12
C.B. Margi, Polytech. Sch., Sao Paulo Univ., Brazil
pp. T3D/1-T3D/6
B.P. Butz, Intelligent Syst. Application Center, Temple Univ., Philadelphia, PA, USA
pp. T3D/11-T3D/16
A. Duran, Escuela Politecnica Superior, Univ. Carlos III, Madrid, Spain
pp. T3D/17T3D/16
V. Uskov, Bradley Univ., Peoria, IL, USA
pp. T3D/18T3D/16
D.A. Gustafson, Dept. of Comput. & Inf. Sci., Kansas State Univ., Manhattan, KS, USA
pp. T3D/7-T3D10
J. Heywood, Div. of In-Service Educ., Trinity Coll., Dublin, Ireland
pp. T3E/13-T3E/17
D.T. Stephenson, Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. T3E/18-T3E/21
F. Golshani, Dept. of Comput. Sci. & Eng., Arizona State Univ., Tempe, AZ, USA
pp. T3E/8-T3E12
V. Uskov, Bradley Univ., Peoria, IL, USA
pp. T3F/12T3F/7
Y. Morton, Dept. of Manuf. Eng., Miami Univ., Oxford, OH, USA
pp. T3F/8-T3F11
A. Velez, Dept. of Civil & Environ. Eng., Michigan State Univ., East Lansing, MI, USA
pp. T3G/12T3G/6
G. Bowman, Rensselaer Polytech. Inst., Troy, NY, USA
pp. T3G/13T3G/6
R. Shiavi, Sch. of Eng., Vanderbilt Univ., Nashville, TN, USA
pp. T3G/14-T3G/16
M. Marcus, Dept. of Eng., Pennsylvania State Univ., York, PA, USA
pp. T3G/7-T3G11
E. Carlson, Dept. of Educ., Univ. of Detroit Mercy, MI, USA
pp. T4A/1-T4A/5
D. Moore, Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
pp. T4A/12-T4A/17
C. Plumb, Dept. of Tech. Commun., Washington Univ., Seattle, WA, USA
pp. T4A/18T4A/17
R. McCauley, Dept. of Comput. Sci., Coll. of Charleston, SC, USA
pp. T4A/19-T4A/24
D.W. Petr, Dept. of Electr. Eng. & Comput. Sci., Kansas Univ., Lawrence, KS, USA
pp. T4B/1-T4B/6
P.K. Raju, Dept. of Mech. Eng., Auburn Univ., AL, USA
pp. T4B/11-T4B/16
G.B. Lush, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
pp. T4B/17T4B/16
W.B. Kuhn, Dept. of Electr. & Comput. Eng., Kansas State Univ., Manhattan, KS, USA
pp. T4B/7T4B/16
G.O. Glas, Dept. de Ingenieria Electron., Buenos Aires Univ., Argentina
pp. T4B/8-T4B10
N. Singhal, Ramapo Coll. of New Jersey, Mahwah, NJ, USA
pp. T4C/1, T4C/3-T4C/6
K. Nagaoka, Nat. Inst. of Multimedia Educ., Chiba, Japan
pp. T4C/12T4C/6
D.R. Raymond, Dept. of Electr. Eng. & Comput. Sci., US Mil. Acad., West Point, NY, USA
pp. T4C/7-T4C11
K.O. Jeppso, Sch. of Electr. & Comput. Eng., Chalmers Univ. of Technol., Goteborg, Sweden
pp. T4E/1-T4E/2
R.H. Brown, Dept. of Comput. & Inf. Sci., Rensselaer Polytech. Inst., Troy, NY, USA
pp. T4E/10-T4E/15
A. Zaky, Arab Acad. for Sci. & Technol., Alexandria, Egypt
pp. T4E/3-T4E/6
T.W. Schultz, Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. T4G/1-T4G/6
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