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  • 30th Annual Frontiers in Education - Vol 1 (FIE'2000)
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30th Annual Frontiers in Education - Vol 1 (FIE'2000)
Kansas City, MO, USA
October 18-October 21
ISBN: 0-7803-6424-4
Table of Contents
Papers
A.S. Ruocco, Dept. of Electr. Eng. & Comput. Sci., US Mil. Acad., West Point, NY, USA
pp. F1A/223
K.A. Smith, Dept. of Civil Eng., Minnesota Univ., Minneapolis, MN, USA
pp. F1B/1F1A11
B.M. Moskal, Dept. of Math. & Comput. Sci., Colorado Sch. of Mines, Golden, CO, USA
pp. F1B/19-F1B/24
E.F. Gehringer, Dept. of Electr. Eng. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. F1B/2-F1B/7
G.K. Heitman, Dept. of Electr. & Comput. Eng., Univ. of West Florida, Pensacola, FL, USA
pp. F1C/1-F1C/5
T. Clear, Dept. of Comput.-Syst. & Technol., Auckland Univ. of Technol., New Zealand
pp. F1C/18-F1C/23
S. Ghosh, Dept. of Comput. Sci. & Eng., Arizona State Univ., Tempe, AZ, USA
pp. F1C/24F1C/23
D. Moore, Dept. of Electr. & Comput. Eng., Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
pp. F1C/6-F1C11
R. Ross, Dept. of Electr. & Comput. Eng., Univ. of Detroit Mercy, MI, USA
pp. F1D/1-F1D/6
R.M. Winter, Dept. of Chem. & Chem. Eng., South Dakota Sch. of Mines & Technol., Rapid City, SD, USA
pp. F1D/14-F1D/17
D. Braun, Dept. of Electr. Eng., California Polytech. State Univ., San Luis Obispo, CA, USA
pp. F1E/12F1E/6
V.C. Parro, Dept. of Electr. Eng., Maua Inst. of Technol., Sao Paulo, Brazil
pp. F1E/13-F1E/17
D. Popovici, Politehnic Univ., Timisoara, Romania
pp. F1E/18F1E/17
R. Martin, Dept. of Basic Sci., Esslingen Univ. of Appl. Sci., Germany
pp. F1E/7-F1E11
R.W. Freeman, Coll. of Eng., Iowa State Univ., Ames, IA, USA
pp. F1F/21F1F/20
J.A. Polack-Wahl, Dept. of Comput. Sci., Mary Washington Coll., Fredericksburg, VA, USA
pp. F1G/16-F1G/21
J. Graulau-Santiago, Dept. of Civil & Environ. Eng., Michigan State Univ., East Lansing, MI, USA
pp. F1G/22-F1F/23
D.N. Batanov, Dept. of Comput. Sci. & Inf. Manage., Asian Inst. of Technol., Bangkok, Thailand
pp. F2B/12-F2B/18
M.L. de la Barra, Dept. de Matica, Univ. Tecnica Federico Santa Maria, Valparaiso, Chile
pp. F2B/7F2B/18
T.L. Skvarenina, Dept. of Electr. Eng. Technol., Purdue Univ., West Lafayette, IN, USA
pp. T1A/11-T1A/16
D.J. Ahlgen, Dept. of Eng., Trinity Coll., Hartford, CT, USA
pp. T1A/17-T1A/22
J.A. Orr, Dept. of Electr. & Comput. Eng., Worcester Polytech. Inst., MA, USA
pp. T1A/7-T1A10
A. Klinger, Sch. of Eng. & Appl. Sci., California Univ., Los Angeles, CA, USA
pp. T1B/1-T1B/6
K.J. McDermott, Sch. of Electr. & Inf. Eng., Univ. of South Australia, Mawson Lakes, SA, Australia
pp. T1B/11-T1B/15
H. Detloff, Coll. of Eng. & Technol., Nebraska Univ., Omaha, NE, USA
pp. T1B/16-T1B/21
M. Huth, Dept. of Comput. & Inf. Sci., Kansas State Univ., Manhattan, KS, USA
pp. T1C/1-T1C/6
D. Gustafson, Dept. of Comput. & Inf. Sci., Kansas State Univ., Manhattan, KS, USA
pp. T1C/19-T1C/20
R.L. Upchurch, CIS Dept., Massachusetts Univ., North Dartmouth, MA, USA
pp. T1C/7-T1C12
H. Hodge, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. T1D/1-T1D/6
R.P. Cook, Dept. of Comput. Sci., Mississippi Univ., MS, USA
pp. T1E/1-T1E/6
A. McKenna, Graduate Group in Eng., Sci., & Math. Educ., California Univ., Berkeley, CA, USA
pp. T1F/9T1F/8
M. Urban-Lurain, Dept. of Comput. Sci. & Eng., Michigan State Univ., East Lansing, MI, USA
pp. T2B/7-T2B11
P. Brazier, Dept. of Comput. Sci., Texas Univ., Edinburg, TX, USA
pp. T2C/13-T2C/17
Juan Wang, Dept. of Comput. Sci. & Inf. Syst., Nebraska Univ., Kearney, NE, USA
pp. T2C/7-T2C/8
D. Rosca, Dept. of Software & Electr. Eng., Monmouth Univ., NJ, USA
pp. T2C/9-T2C12
E.C. Shaffer, Dept. of Electr. Eng. & Comput. Sci., US Mil. Acad., West Point, NY, USA
pp. T2D/17-T2D/22
S.R. Smith, Dept. of Electr. & Comput. Eng., Southern Illinois Univ., Edwardsville, IL, USA
pp. T2D/23T2D/22
J.A. Pearce, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. T2F/1-T2F/3
J.L. Newcomer, Dept. of Eng. Technol., Washington Univ., Bellingham, WA, USA
pp. T3A/16-T3A/21
F. Azadivar, Dept. of Ind. & Manuf. Syst. Eng., Kansas State Univ., Manhattan, KS, USA
pp. T3B/1-T3B/5
H. Andersson, Chalmers Medialab, Chalmers Univ. of Technol., Goteborg, Sweden
pp. T3B/6T3B/5
B.P. Butz, Intelligent Syst. Application Center, Temple Univ., Philadelphia, PA, USA
pp. T3D/11-T3D/16
D.A. Gustafson, Dept. of Comput. & Inf. Sci., Kansas State Univ., Manhattan, KS, USA
pp. T3D/7-T3D10
D.T. Stephenson, Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. T3E/18-T3E/21
Y. Morton, Dept. of Manuf. Eng., Miami Univ., Oxford, OH, USA
pp. T3F/8-T3F11
A. Velez, Dept. of Civil & Environ. Eng., Michigan State Univ., East Lansing, MI, USA
pp. T3G/12T3G/6
D.W. Petr, Dept. of Electr. Eng. & Comput. Sci., Kansas Univ., Lawrence, KS, USA
pp. T4B/1-T4B/6
G.B. Lush, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
pp. T4B/17T4B/16
W.B. Kuhn, Dept. of Electr. & Comput. Eng., Kansas State Univ., Manhattan, KS, USA
pp. T4B/7T4B/16
R.H. Brown, Dept. of Comput. & Inf. Sci., Rensselaer Polytech. Inst., Troy, NY, USA
pp. T4E/10-T4E/15
T.W. Schultz, Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. T4G/1-T4G/6
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