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  • 28th Annual Frontiers in Education - Vol 2 (FIE'98)
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28th Annual Frontiers in Education - Vol 2 (FIE'98)
Tempe, AZ, USA
November 04-November 07
ISBN: 0-7803-4762-5
Table of Contents
Papers
D. Baez-Villegas, Dept. de Ingenieria Electron., Univ. de las Americas, Puebla, Mexico
D. Baez-Lopez, Dept. de Ingenieria Electron., Univ. de las Americas, Puebla, Mexico
pp. 528-532
D.R. Voltmer, Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
D. Garner, Dept. de Ingenieria Electron., Univ. de las Americas, Puebla, Mexico
pp. 535-539
D. Baez-Lopez, Dept. de Ingenieria Electron., Univ. de las Americas, Puebla, Mexico
F.S. Sanchez, Dept. de Ingenieria Electron., Univ. de las Americas, Puebla, Mexico
pp. 541-546
D. Carrington, Dept. of Comput. Sci. & Electr. Eng., Queensland Univ., Brisbane, Qld., Australia
pp. 547-550
D.A. Gustafson, Dept. of Comput. & Inf. Sci., Kansas State Univ., Manhattan, KS, USA
pp. 551-553
M. Ghriga, Dept. of Comput. Sci., Long Island Univ., Brooklyn, NY, USA
P. Kabore, Dept. de Ingenieria Electron., Univ. de las Americas, Puebla, Mexico
pp. 554-559
J.R. Morgan, Dept. of Civil Eng., Texas A&M Univ., College Station, TX, USA
R.W. Bolton, Dept. de Ingenieria Electron., Univ. de las Americas, Puebla, Mexico
pp. 561-565
N.A. Pendergrass, Massachusetts Univ., Dartmouth, MA, USA
R.N. Laoulache, Massachusetts Univ., Dartmouth, MA, USA
J.P. Dowd, Massachusetts Univ., Dartmouth, MA, USA
R.E. Kowalczyk, Massachusetts Univ., Dartmouth, MA, USA
pp. 573-578
S. Hsu, Dept. of Comput. Sci. & Eng., Florida Atlantic Univ., Boca Raton, FL, USA
pp. 580-582
M. Hagler, Dept. of Electr. Eng., Texas Tech. Univ., Lubbock, TX, USA
pp. 583-586
S. Villareal, Dept. of Eng. Technol., Texas A&M Univ., College Station, TX, USA
C. Wynn, Dept. of Eng. Technol., Texas A&M Univ., College Station, TX, USA
D. Eastwood, Dept. of Eng. Technol., Texas A&M Univ., College Station, TX, USA
B. Zoghi, Dept. of Eng. Technol., Texas A&M Univ., College Station, TX, USA
pp. 588-593
Luo Yingli, North China Electr. Power Univ., Beijing, China
Zhang Jianhua, North China Electr. Power Univ., Beijing, China
Chen Xiqiang, North China Electr. Power Univ., Beijing, China
Liu Xiaofang, North China Electr. Power Univ., Beijing, China
Ma Bo, North China Electr. Power Univ., Beijing, China
Liu Lianguang, North China Electr. Power Univ., Beijing, China
Qu Henan, North China Electr. Power Univ., Beijing, China
pp. 600-604
J. Ingham, Polytech. Univ., Brooklyn, NY, USA
R.M.P. Meza, North China Electr. Power Univ., Beijing, China
G. Price, North China Electr. Power Univ., Beijing, China
pp. 605-610
H. Akiyama, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
T. Fujiyoshi, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
T. Fukusako, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
S. Katsuki, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
T. Kita, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
K. Ogata, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
M. Sasaki, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
H. Shimizu, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
pp. 611-614
Zhang Jianhua, North China Electr. Power Univ., Beijing, China
Liu Lianguang, North China Electr. Power Univ., Beijing, China
Luo Yingli, North China Electr. Power Univ., Beijing, China
Zhou Qiong, North China Electr. Power Univ., Beijing, China
Tao Hongzhu, North China Electr. Power Univ., Beijing, China
Qu Henan, North China Electr. Power Univ., Beijing, China
T.C. Yang, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
pp. 615-619
J.C. Reis, Dept. of Aerosp. Eng., Embry-Riddle Aeronaut. Univ., Prescott, AZ, USA
pp. 635-640
J.L. Chang, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
M.J. Piket-May, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
J.P. Avery, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 643-646
R.J. Roedel, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
S. El-Ghazaly, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
T.R. Rhoads, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
E. El-Sharawy, North China Electr. Power Univ., Beijing, China
pp. 647-653
R.W. Brown, Dept. of Commun. & Electr. Eng., R. Melbourne Inst. of Technol., Vic., Australia
pp. 654-656
L.B. Lancor, Dept. of Comput. Sci., Southern Connecticut State Univ., New Haven, CT, USA
B.A. Karanian, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 657-662
C.B. Weinberger, Dept. of Chem. Eng., Drexel Univ., Philadelphia, PA, USA
R. Mutharasan, Dept. of Chem. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 669-671
D. Reamon, Dept. of Mech. Eng., Stanford Univ., CA, USA
S. Sheppard, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 672-676
M. Rahkila, Lab. of Acoustics & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
M. Karjalainen, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 679-684
M.B. Joaquim, Dept. of Electr. Eng., Sao Paulo Univ., Brazil
J.C. Pereira, Dept. of Mech. Eng., Stanford Univ., CA, USA
V.A. de Oliveira, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 685-690
C.E. Wick, Dept. of Weapon & Syst. Eng., US Naval Acad., Annapolis, MD, USA
G.E. Piper, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 691-694
M.A. Yoder, Sch. of Electr. & Comput. Eng., Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
J.H. McClellan, Dept. of Mech. Eng., Stanford Univ., CA, USA
R.W. Schafer, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 695-699
I. Tomek, Jodrey Sch. of Comput. Sci., Acadia Univ., Wolfville, NS, Canada
R. Giles, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 701-704
G. Davies, Dept. of Comput., Open Univ., Milton Keynes, UK
E. Stacey, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 705-710
A. Kumar, Dept. of Eng. Math. & Comput. Sci., Louisville Univ., KY, USA
R. Pakala, Dept. of Mech. Eng., Stanford Univ., CA, USA
R.K. Ragade, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
J.P. Wong, North China Electr. Power Univ., Beijing, China
pp. 711-716
Sam Hsu, Dept. of Comput. Sci. & Eng., Florida Atlantic Univ., Boca Raton, FL, USA
A. Pandya, Dept. of Mech. Eng., Stanford Univ., CA, USA
R. Patel, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 717-721
A.A. Zaky, Arab Acad. for Sci. & Technol., Alexandria, Egypt
M.M. El-Faham, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 722-726
M. Daniels, Dept. of Comput. Syst., Uppsala Univ., Sweden
M. Petre, Dept. of Mech. Eng., Stanford Univ., CA, USA
V. Almstrum, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
L. Asplund, North China Electr. Power Univ., Beijing, China
C. Bjorkman, North China Electr. Power Univ., Beijing, China
C. Erickson, North China Electr. Power Univ., Beijing, China
B. Klein, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
M. Last, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
pp. 727-732
T. Clausen, Coll. of Eng., Telemark State Univ., Porsgrunn, Norway
pp. 733-736
E. Shiokova, Innovative Center for ODL & Multimedia, Tech. Univ. of Sophia, Bulgaria
S. Tzanova, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 737-741
V. Hawks, Manuf. Eng. & Eng. Technol., Brigham Young Univ., Provo, UT, USA
pp. 743-747
J. Griffioen, Kentucky Univ., Lexington, KY, USA
W.B. Seales, Dept. of Mech. Eng., Stanford Univ., CA, USA
W.B. Seales, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 748-753
N. Al-Holou, Dept. of Electr. & Comput. Eng., Univ. of Detroit Mercy, MI, USA
F. Ibrahim, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 754-759
Phanwoo Park, Dept. of Comput. Educ., Taegu Nat. Univ. of Educ., South Korea
K. Shirai, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 760-765
R.L. Miller, Colorado Sch. of Mines, Golden, CO, USA
B.M. Olds, Dept. of Mech. Eng., Stanford Univ., CA, USA
M.J. Pavelich, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 767-771
S. Duerden, Dept. of English, Arizona State Univ., Tempe, AZ, USA
J. Garland, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 773-777
R.A. Johnson, Dept. of Electr. Eng., Virginia Mil. Inst., Lexington, VA, USA
E. Wheeler, Dept. of Mech. Eng., Stanford Univ., CA, USA
pp. 778-782
D. Jacobson, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
J. Davis, Dept. of Mech. Eng., Stanford Univ., CA, USA
B. Licklider, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 790-794
D. Jacobson, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
J. Davis, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
B. Licklider, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 795-799
R. McCauley, Dept. of Comput. Sci., Southwestern Louisiana Univ., Lafayette, LA, USA
U. Jackson, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. 800-804
D. Cordes, Alabama Univ., Tuscaloosa, AL, USA
A. Parrish, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
B. Dixon, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
R. Borie, North China Electr. Power Univ., Beijing, China
J. Jackson, North China Electr. Power Univ., Beijing, China
D. Hale, North China Electr. Power Univ., Beijing, China
J. Hale, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
S. Sharpe, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
pp. 811-813
F.T. Gilliam, Tennessee Univ., Knoxville, TN, USA
P.G. Klukken, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
J.R. Parsons, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
C.D. Pionke, North China Electr. Power Univ., Beijing, China
T.H. Scott, North China Electr. Power Univ., Beijing, China
J.E. Seat, North China Electr. Power Univ., Beijing, China
F. Symonds, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
F.E. Weber, Dept. of Electr. & Comput. Sci., Kumamoto Univ., Japan
pp. 814-819
M.M. Whiteacre, Dept. of Eng. Technol. & Ind. Distribution, Texas A&M Univ., College Station, TX, USA
C.O. Malave, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. 820-823
D.R. Scott, Coll. of Eng. & Technol., Northern Arizona Univ., Flagstaff, AZ, USA
J.M. Hatfield, Coll. of Eng. & Technol., Northern Arizona Univ., Flagstaff, AZ, USA
pp. 831-835
G. Kortemeyer, Div. of Sci. & Math. Educ., Michigan State Univ., East Lansing, MI, USA
W. Bauer, Coll. of Eng. & Technol., Northern Arizona Univ., Flagstaff, AZ, USA
pp. 841-846
R. Goodnight, Purdue Univ., Anderson, IN, USA
G. Randolph, Purdue Univ., Anderson, IN, USA
T. Ziekel, Purdue Univ., Anderson, IN, USA
pp. 852-854
D. Culver, Watson Sch. of Eng. & Appl. Sci., State Univ. of New York, Binghamton, NY, USA
pp. 855-860
J. Reeves, Coll. of Eng., Wisconsin Univ., Madison, WI, USA
K. Hugo, Coll. of Eng., Wisconsin Univ., Madison, WI, USA
R. Heussner, Coll. of Eng., Wisconsin Univ., Madison, WI, USA
A. Hala, Coll. of Eng., Wisconsin Univ., Madison, WI, USA
B. Sarlioglu, Coll. of Eng., Wisconsin Univ., Madison, WI, USA
S. Bialek, Coll. of Eng., Wisconsin Univ., Madison, WI, USA
S. Courter, Coll. of Eng., Wisconsin Univ., Madison, WI, USA
pp. 866-869
D.W. Peters, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 872-875
R.J. Enbody, Dept. of Comput. Sci. & Eng., Michigan State Univ., East Lansing, MI, USA
pp. 878-883
G. Zhang, Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA
pp. 884-889
R. Danielson, Sch. of Eng., Santa Clara Univ., CA, USA
S. Wood, Sch. of Eng., Santa Clara Univ., CA, USA
pp. 897-902
C.E. Moron, Dept. of Comput. Sci., Univ. Fed. de Sao Carlos, Brazil
J.R.P. Ribeiro, Dept. of Comput. Sci., Univ. Fed. de Sao Carlos, Brazil
N.C. da Silva, Dept. of Comput. Sci., Univ. Fed. de Sao Carlos, Brazil
pp. 903-908
R.J. Roedel, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
S. El-Ghazaly, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
J.T. Aberle, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 921-926
R.A. Layton, Dept. of Mech. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
S. Owusu-Ofori, Dept. of Mech. Eng., North Carolina A&T State Univ., Greensboro, NC, USA
pp. 927-931
J.P. Avery, Integrated Teaching & Learning Lab., Colorado Univ., Boulder, CO, USA
J.L. Chang, Integrated Teaching & Learning Lab., Colorado Univ., Boulder, CO, USA
M.J. Piket-May, Integrated Teaching & Learning Lab., Colorado Univ., Boulder, CO, USA
J.F. Sullivan, Integrated Teaching & Learning Lab., Colorado Univ., Boulder, CO, USA
L.E. Carlson, Integrated Teaching & Learning Lab., Colorado Univ., Boulder, CO, USA
S.C. Davis, Integrated Teaching & Learning Lab., Colorado Univ., Boulder, CO, USA
pp. 932-936
J.Y. Hung, Dept. of Electr. Eng., Auburn Univ., AL, USA
S.M. Wentworth, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 937-942
S.M. Wentworth, Dept. of Comput. Sci., Western Kentucky Univ., Bowling Green, KY, USA
pp. 943-948
S. Avramov-Zamurovic, Dept. of Weapons & Syst. Eng., US Naval Acad., Annapolis, MD, USA
C. Wick, Dept. of Weapons & Syst. Eng., US Naval Acad., Annapolis, MD, USA
T. Dwan, Dept. of Weapons & Syst. Eng., US Naval Acad., Annapolis, MD, USA
pp. 949-952
L.M. Hideg, Dept. of Electr. Eng., Lawrence Technol. Univ., Southfield, MI, USA
pp. 958-962
M. Moussavi, Sch. of Technol., Johnson & Wales Univ., Providence, RI, USA
pp. 963-966
A.B. Carlson, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
W.C. Jennings, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
P.M. Schoch, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 967-970
N. Srinivas, Process & Technol. Group, CG-Smith Software Ltd., Bangalore, India
G. Smith, Process & Technol. Group, CG-Smith Software Ltd., Bangalore, India
pp. 560vol.2-xix
S. Napper, Coll. of Eng. & Sci., Louisiana Tech. Univ., Ruston, LA, USA
J. Nelson, Coll. of Eng. & Sci., Louisiana Tech. Univ., Ruston, LA, USA
B. Elmore, Coll. of Eng. & Sci., Louisiana Tech. Univ., Ruston, LA, USA
J. Carpenter, Coll. of Eng. & Sci., Louisiana Tech. Univ., Ruston, LA, USA
B. Deese, Coll. of Eng. & Sci., Louisiana Tech. Univ., Ruston, LA, USA
pp. 566vol.2-xix
Bih-Yaw Shih, Dept. of Manage Inf. Syst., Yung-Ta J. Coll. of Technol. & Commerce, Ping-Tong, Taiwan
Wan-I Lee, Coll. of Eng. & Sci., Louisiana Tech. Univ., Ruston, LA, USA
pp. 587vol.2-xix
B.G. Mobasseri, Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
Xiaoqin Fei, Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. 594vol.2-xix
W.R. Peterson, Dept. of Manuf. Eng., Western Michigan Univ., Muskegon, MI, USA
pp. 766vol.2-xix
J.E. Froyd, Dept. of Electr. & Comput. Eng., Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
pp. 865vol.2-xix
J.L.A. Hughes, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
W.E. Sayle, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 876vol.2-xix
D.J. Bagert, Dept. of Comput. Sci., Texas Tech. Univ., Lubbock, TX, USA
T.B. Hilburn, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
G.W. Hislop, Coll. of Eng. & Sci., Louisiana Tech. Univ., Ruston, LA, USA
S.A. Mengel, Coll. of Eng. & Sci., Louisiana Tech. Univ., Ruston, LA, USA
pp. 909vol.2-xix
M. Becker, Oregon Graduate Inst., Portland, OR, USA
J.F. Holmes, Oregon Graduate Inst., Portland, OR, USA
L. Meekisho, Oregon Graduate Inst., Portland, OR, USA
pp. 971vol.2-xix
Author Index (PDF)
pp. xx-xxvii
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