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- EDTC
- 1995
- 1995 European Design and Test Conference (ED&TC '95)
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1995 European Design and Test Conference (ED&TC '95) Paris, France March 06-March 09 ISBN: 0-8186-7039-8 Table of Contents
 | Session 1A: DSP and Multimedia |
M. Kovac, Fac. of Electr. Eng., Zagreb Univ., Croatia
M. Zagar, Fac. of Electr. Eng., Zagreb Univ., Croatia pp. 2
J.-M. Bourguet, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
T. Nancy, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
S.J. Wei, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
J. Leroy, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
R.G. Crappe, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium pp. 7
 | Session 1B: Mixed-Signal DFT |
M. Sachdev, Fac. of Electr. Eng., Delft Univ. of Technol., Netherlands
A.P. Thijssen, Fac. of Electr. Eng., Delft Univ. of Technol., Netherlands pp. 18
M. Lubaszewski, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
V. Kolarik, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
S. Mir, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
C. Nielsen, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
B. Courtois, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil pp. 34
 | Session 1C: Exact Methods in Architectural Timing Optimization |
Exact Methods in Architectural Timing Optimization
A.H. Timmer, Design Autom. Sect., Eindhoven Univ. of Technol., Netherlands
J.A.G. Jess, Design Autom. Sect., Eindhoven Univ. of Technol., Netherlands pp. 42
I. Radivojevic, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
F. Brewer, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA pp. 48
N.L. Passos, Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
E.H.-M. Sha, Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA pp. 54
 | Session 2A: Circuit Partitioning |
D.J.-H. Huang, Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
A.B. Kahng, Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA pp. 60
Honghua Yang, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
D.F. Wong, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA pp. 65
B.M. Riess, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
A.A. Schoene, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany pp. 71
 | Panel Session 2B |
ATE Is Dead-Long Live Automated Test
 | Session 2C: Combinational Logic Synthesis |
Combinational Logic Synthesis
A. Bogliolo, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
M. Damiani, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy pp. 80
B. Kapoor, Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA pp. 86
R. Drechsler, Dept. of Comput. Sci., Frankfurt Univ., Germany
B. Becker, Dept. of Comput. Sci., Frankfurt Univ., Germany pp. 91
 | Session 3A: Designs and Tools for Analogue and Mixed Signal ICs |
Designs and Tools for Analogue and Mixed Signal ICs
S. Eriksson, Dept. of Electr. Eng., Linkoping Univ., Sweden pp. 100
A. Pletersek, Microelectron. Lab., Ljubljana Univ., Slovenia
D. Strle, Microelectron. Lab., Ljubljana Univ., Slovenia
J. Trontelj, Microelectron. Lab., Ljubljana Univ., Slovenia pp. 105
O. Alminde, Austria Mikro Syst. Int. AG, Unterpremstatten, Austria
V. Kunc, Austria Mikro Syst. Int. AG, Unterpremstatten, Austria
M. Pauritsch, Austria Mikro Syst. Int. AG, Unterpremstatten, Austria pp. 113
P. Veselinovic, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
D. Leenaerts, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
W. van Bokhoven, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
F. Leyn, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
F. Proesmans, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
G. Gielen, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
W. Sansen, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands pp. 119
 | Session 3B: Memory Testing |
Y. Zorian, Delft Univ. of Technol., Netherlands pp. 133
R.D. Adams, Microelectron. Div., IBM Corp., Essex Junction, VT, USA
J. Connor, Microelectron. Div., IBM Corp., Essex Junction, VT, USA
G.S. Koch, Microelectron. Div., IBM Corp., Essex Junction, VT, USA pp. 139
 | Session 3C: Sequential Logic Synthesis |
Sequential Logic Synthesis
L. Stok, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
I. Spillinger, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
G. Even, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 150
Z. Hasan, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
M.J. Ciesielski, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA pp. 155
 | Session 4A: High Speed Telecom Design |
High Speed Telecom Design
P. Plaza, Telefonica Investigacion y Desarrollo, Madrid, Spain
J.C. Diaz, Telefonica Investigacion y Desarrollo, Madrid, Spain
F. Calvo, Telefonica Investigacion y Desarrollo, Madrid, Spain
L. Merayo, Telefonica Investigacion y Desarrollo, Madrid, Spain
M. Zamboni, Telefonica Investigacion y Desarrollo, Madrid, Spain
P. Scarfone, Telefonica Investigacion y Desarrollo, Madrid, Spain
M. Barbini, Telefonica Investigacion y Desarrollo, Madrid, Spain pp. 162
 | Session 4B: System Synthesis |
C.A. Valderrama, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
A. Changuel, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
P.V. Raghavan, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
M. Abid, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
T. Ben Ismail, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
A.A. Jerraya, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France pp. 180
F. Vahid, Dept. of Comput. Sci., California Univ., Riverside, CA, USA
D.D. Gajski, Dept. of Comput. Sci., California Univ., Riverside, CA, USA pp. 185
 | Session 4C: Advanced DFT Techniques |
M.L. Flottes, Lab. d'Inf., de Robotique et de Microelectron., CNRS, Montpellier, France
D. Hammad, Lab. d'Inf., de Robotique et de Microelectron., CNRS, Montpellier, France
B. Rouzeyre, Lab. d'Inf., de Robotique et de Microelectron., CNRS, Montpellier, France pp. 198
F. Fummi, Dipartimento di Elettronica, Politecnico di Milano, Italy
D. Sciuto, Dipartimento di Elettronica, Politecnico di Milano, Italy
M. Serra, Dipartimento di Elettronica, Politecnico di Milano, Italy pp. 207
Li-Ren Huang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Sy-Yen Kuo, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Ing-Yi Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan pp. 212
 | Session 5A: Digital and System Simulation |
Digital and System Simulation
F. Pichon, RGS Div., Thomson-CSF, Gennesvilliers, France
S. Blanc, RGS Div., Thomson-CSF, Gennesvilliers, France
B. Candaele, RGS Div., Thomson-CSF, Gennesvilliers, France pp. 218
C.A.J. van Eijk, Design Autom. Sect., Eindhoven Univ. of Technol., Netherlands
J.A.G. Jess, Design Autom. Sect., Eindhoven Univ. of Technol., Netherlands pp. 223
Ing-Yi Chen, Dept. of Electron. Eng., Chung Yuan Christian Univ., Chung Li, Taiwan
Geng-Lin Chen, Dept. of Electron. Eng., Chung Yuan Christian Univ., Chung Li, Taiwan
Sy-Yen Kuo, Dept. of Electron. Eng., Chung Yuan Christian Univ., Chung Li, Taiwan pp. 228
 | Session 5B: Code Generation |
R. Leupers, Dept. of Comput. Sci., Dortmund Univ., Germany
P. Marwedel, Dept. of Comput. Sci., Dortmund Univ., Germany pp. 239
M. Strik, Philips Res. Lab., Eindhoven, Netherlands
A. Timmer, Philips Res. Lab., Eindhoven, Netherlands
J. Jess, Philips Res. Lab., Eindhoven, Netherlands
S. Note, Philips Res. Lab., Eindhoven, Netherlands pp. 244
 | Session 5C: Sequential ATPG and Diagnosis |
Sequential ATPG and Diagnosis
T.E. Marchok, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. El-Maleh, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Maly, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Rajski, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 252
Jaehong Park, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Chanhee Oh, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
M.R. Mercer, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA pp. 262
F. Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
P. Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Rebaudengo, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Sonza Reorda, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy pp. 267
 | Session 6A: CAD Frameworks |
Y. Mathys, Semicond. Syst. Design Technol., Motorola Inc., USA
M. Morgan, Semicond. Syst. Design Technol., Motorola Inc., USA
S. Soudagar, Semicond. Syst. Design Technol., Motorola Inc., USA pp. 274
E. Kwee-Christoph, Comput. Sci. Res. Center, Forschungszentrum Inf., Karlsruhe, Germany
F. Feldbusch, Comput. Sci. Res. Center, Forschungszentrum Inf., Karlsruhe, Germany
R. Kumar, Comput. Sci. Res. Center, Forschungszentrum Inf., Karlsruhe, Germany
A. Kunzmann, Comput. Sci. Res. Center, Forschungszentrum Inf., Karlsruhe, Germany pp. 280
A. Kunzmann, Forschungszentrum Inf., Karlsruhe, Germany
R. Seepold, Forschungszentrum Inf., Karlsruhe, Germany pp. 285
 | Panel Session 6B |
Simulation Versus Formal Verification
 | Session 6C: Test Generation and Testability |
Test Generation and Testability
M.H.C. Lee, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
D.L. Tao, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA pp. 303
G. Van Brakel, MESA Res. Inst., Twente Univ., Enschede, Netherlands
U. Glaser, MESA Res. Inst., Twente Univ., Enschede, Netherlands
H.G. Kerkhoff, MESA Res. Inst., Twente Univ., Enschede, Netherlands
H.T. Vierhaus, MESA Res. Inst., Twente Univ., Enschede, Netherlands pp. 308
 | Session 7A: Applications of Symbolic Traversal Techniques |
Applications of Symbolic Traversal Techniques
J. Frossl, Inst. fur Rechnerentwurf und Fehlertoleranz, Karlsruhe Univ., Germany
T. Kropf, Inst. fur Rechnerentwurf und Fehlertoleranz, Karlsruhe Univ., Germany pp. 314
F. Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
P. Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Sonza Reorda, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy pp. 320
O. Roig, Aizu Univ., Aizu-Wakamatsu, Japan pp. 325
F. Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Cusinato, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Ferrero, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
P. Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy pp. 333
 | Session 7B: Handling Physical Constraints in Architectural Synthesis |
Handling Physical Constraints in Architectural Synthesis
N.D. Holmes, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
D.D. Gajski, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA pp. 340
P.K. Jha, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
N.D. Dutt, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA pp. 345
A. Balboni, Res. & Dev. Lab., Italtel Telecom Co, Italy
C. Costi, Res. & Dev. Lab., Italtel Telecom Co, Italy
M. Quadrini, Res. & Dev. Lab., Italtel Telecom Co, Italy
D. Sciuto, Res. & Dev. Lab., Italtel Telecom Co, Italy pp. 351
 | Session 7C: Self-Checking Approaches |
O. Kebichi, Reliable Integrated Syst. Group, TIMA/INPG, Grenoble, France
Y. Zorian, Reliable Integrated Syst. Group, TIMA/INPG, Grenoble, France
M. Nicolaidis, Reliable Integrated Syst. Group, TIMA/INPG, Grenoble, France pp. 358
J.M. Tahir, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
S.S. Dlay, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
R.N.G. Naguib, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
O.R. Hinton, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK pp. 363
Jing-Jou Tang, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Kuen-Jong Lee, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Bin-Da Liu, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan pp. 372
 | Session 8A: Design Methodologies |
R. Reed, IBM Corp., Austin, TX, USA pp. 378
M. Valle, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G. Nateri, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
D.D. Caviglia, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G.M. Bisio, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
L. Briozzo, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy pp. 385
A. Wheeler, Dept. of Electr. Eng., Arkansas Univ., USA
B. Wealand, Dept. of Electr. Eng., Arkansas Univ., USA
C. Kancler, Dept. of Electr. Eng., Arkansas Univ., USA pp. 391
 | Session 8B: Power and Delay Issues in Logic Synthesis |
Power and Delay Issues in Logic Synthesis
J. Leijten, Philips Res. Lab., Eindhoven, Netherlands
J. Jess, Philips Res. Lab., Eindhoven, Netherlands pp. 398
R. Murgai, Fujitsu Labs. of America Inc., San Jose, CA, USA
R.K. Brayton, Fujitsu Labs. of America Inc., San Jose, CA, USA pp. 404
H.H.-F. Jyu, EPIC Desing Technol. Inc., Santa Clara, CA, USA
S. Malik, EPIC Desing Technol. Inc., Santa Clara, CA, USA pp. 411
 | Session 8C: BIST Methodologies |
B. Wurth, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
K. Fuchs, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany pp. 418
C. Dufaza, Lab. d'Inf., de Robotique et de Micro-Electron., CNRS, Montpellier, France
H. Viallon, Lab. d'Inf., de Robotique et de Micro-Electron., CNRS, Montpellier, France
C. Chevalier, Lab. d'Inf., de Robotique et de Micro-Electron., CNRS, Montpellier, France pp. 424
I. Voyiatzis, Inst. of Inf. & Telecommun., NCSR Demokritos, Athens, Greece
A. Paschalis, Inst. of Inf. & Telecommun., NCSR Demokritos, Athens, Greece
D. Nikolos, Inst. of Inf. & Telecommun., NCSR Demokritos, Athens, Greece
C. Halatsis, Inst. of Inf. & Telecommun., NCSR Demokritos, Athens, Greece pp. 431
 | Session 9A: New Developments in Logic Representation and Verification Techniques |
New Developments in Logic Representation and Verification Techniques
B. Becker, Dept. of Comput. Sci., Frankfurt Univ., Germany
R. Drechsler, Dept. of Comput. Sci., Frankfurt Univ., Germany pp. 438
R. Mukherjee, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
J. Jain, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
M. Fujita, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA pp. 444
 | Session 9C: Test Preparation for Mixed-Signal Systems |
Test Preparation for Mixed-Signal Systems
B. Ayari, Ecole Polytech. de Montreal, Que., Canada pp. 458
C. Sebeke, Lab. fur Informationstechnol., Hannover Univ., Germany
J.P. Teixeira, Lab. fur Informationstechnol., Hannover Univ., Germany
M.J. Ohletz, Lab. fur Informationstechnol., Hannover Univ., Germany pp. 464
 | Session 10A: Hierarchical Layout |
H. Schmidt, Cadlab/ASE, Paderborn Univ./Siemens Nixdorf Informationssyst. AG Joint R&D Inst., Germany
D. Theune, Cadlab/ASE, Paderborn Univ./Siemens Nixdorf Informationssyst. AG Joint R&D Inst., Germany
R. Thiele, Cadlab/ASE, Paderborn Univ./Siemens Nixdorf Informationssyst. AG Joint R&D Inst., Germany
T. Lengauer, Cadlab/ASE, Paderborn Univ./Siemens Nixdorf Informationssyst. AG Joint R&D Inst., Germany pp. 486
M. Hayashi, Fac. of Sci. & Eng., Chuo Univ., Tokyo, Japan pp. 492
 | Session 10B: Modeling and Design of ASIPs |
Modeling and Design of ASIPs
Jie Gong, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
D.D. Gajski, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
S. Narayan, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA pp. 498
A. Fauth, Inst. fur Tech. Inf., Tech. Univ. Berlin, Germany
J. Van Praet, Inst. fur Tech. Inf., Tech. Univ. Berlin, Germany
M. Freericks, Inst. fur Tech. Inf., Tech. Univ. Berlin, Germany pp. 503
F. Onion, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
A. Nicolau, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
N. Dutt, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA pp. 508
 | Session 10C: Delay Testing and Diagnosis |
Delay Testing and Diagnosis
B. Kapoor, Integrated Syst. Labs., Texas Instrum. Inc., Dallas, TX, USA pp. 516
M. Henftling, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
H. Wittman, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany pp. 521
P. Girard, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
C. Landrault, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
S. Pravossoudovitch, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
B. Rodriguez, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France pp. 526
 | Session 11A: New Applications of Analogue Simulation Algorithms |
New Applications of Analogue Simulation Algorithms
M. Kamon, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J. White, Res. Lab. of Electron., MIT, Cambridge, MA, USA pp. 534
E. Driouk, Dept. of Microelectron., Byelorussian State Univ. of Inf. & Radioelectron., Minsk, Byelorussia
O. Jarov, Dept. of Microelectron., Byelorussian State Univ. of Inf. & Radioelectron., Minsk, Byelorussia
A. Sukhodolsky, Dept. of Microelectron., Byelorussian State Univ. of Inf. & Radioelectron., Minsk, Byelorussia pp. 539
 | Session 11B: Design Problems in Pipelines |
Design Problems in Pipelines
R. Ernst, Tech. Univ. Braunschweig, Germany pp. 550
M. Rahmouni, Lab. TIMA, Inst. Nat. Polytech. de Grenoble, France
A.A. Jerraya, Lab. TIMA, Inst. Nat. Polytech. de Grenoble, France pp. 557
 | Session 11C: IDDQ Testing |
M. Dalpasso, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
M. Favalli, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
P. Olivo, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy pp. 568
M. Herzog, Inst. of Comput. Structures, Siegen Univ., Germany
J. Figueras, Inst. of Comput. Structures, Siegen Univ., Germany
J.A. Carrasco, Inst. of Comput. Structures, Siegen Univ., Germany
A. Calderon, Inst. of Comput. Structures, Siegen Univ., Germany pp. 573
A. Rubio, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
E. Janssens, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
H. Casier, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Figueras, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
D. Mateo, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
P. De Pauw, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Segura, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain pp. 581
 | Poster Session |
J. Crespo, Telefonica Investigacion y Desarrollo, Madrid, Spain
F. Calvo, Telefonica Investigacion y Desarrollo, Madrid, Spain
J.I. Solana, Telefonica Investigacion y Desarrollo, Madrid, Spain
R. Caravantes, Telefonica Investigacion y Desarrollo, Madrid, Spain
J.L. Conesa, Telefonica Investigacion y Desarrollo, Madrid, Spain pp. 589
R.J. Mack, Centre for VLSI Design, Essex Univ., Colchester, UK
R.E. Massara, Centre for VLSI Design, Essex Univ., Colchester, UK pp. 591
B. Becker, Dept. of Comput. Sci., Frankfurt Univ., Germany
R. Drechsler, Dept. of Comput. Sci., Frankfurt Univ., Germany pp. 592
R. Rochet, Inst. Nat. Polytech. de Grenoble, France
G. Saucier, Inst. Nat. Polytech. de Grenoble, France pp. 593
H. Selvaraj, Inst. of Telecommun., Warsaw Univ. of Technol., Poland
T. Luba, Inst. of Telecommun., Warsaw Univ. of Technol., Poland pp. 594
T. Kage, Fujitsu Labs. Ltd., Atsugi, Japan pp. 595
W. Pleskacz, Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Poland
W. Kuzmicz, Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Poland pp. 598
M. Favalli, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
B. Ricco, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
L. Penza, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy pp. 599
J. Carletta, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA
C. Papachristou, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA pp. 600
V. Szekely, Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
M. Rencz, Dept. of Electron Devices, Tech. Univ. Budapest, Hungary pp. 601
D. Dallet, Lab. de Microelectron., Bordeaux I Univ., Talence, France
G. Franco, Lab. de Microelectron., Bordeaux I Univ., Talence, France
P. Marchegay, Lab. de Microelectron., Bordeaux I Univ., Talence, France
C. Morandi, Lab. de Microelectron., Bordeaux I Univ., Talence, France pp. 606
V. Zagursky, Inst. of Electron. & Comput. Sci., Acad. of Sci., Riga, Latvia
N. Semyonova, Inst. of Electron. & Comput. Sci., Acad. of Sci., Riga, Latvia
M. Sirovatkina, Inst. of Electron. & Comput. Sci., Acad. of Sci., Riga, Latvia pp. 607 Usage of this product signifies your acceptance of the Terms of Use.
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