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- 1995
- 1995 European Design and Test Conference (ED&TC '95)
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1995 European Design and Test Conference (ED&TC '95)
Paris, France
March 06-March 09
ISBN: 0-8186-7039-8
Table of Contents
 | Session 1A: DSP and Multimedia |
M. Kovac, Fac. of Electr. Eng., Zagreb Univ., Croatia
M. Zagar, Fac. of Electr. Eng., Zagreb Univ., Croatia
pp. 2
J.-M. Bourguet, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
T. Nancy, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
S.J. Wei, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
J. Leroy, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
R.G. Crappe, Lab. of Microelectron., Faculte Polytech. de Mons, Belgium
pp. 7
 | Session 1B: Mixed-Signal DFT |
M. Sachdev, Fac. of Electr. Eng., Delft Univ. of Technol., Netherlands
A.P. Thijssen, Fac. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 18
M. Lubaszewski, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
V. Kolarik, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
S. Mir, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
C. Nielsen, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
B. Courtois, DELET, Univ. Federal do Rio Grande do Sul, Porto Alegre, Brazil
pp. 34
 | Session 1C: Exact Methods in Architectural Timing Optimization |
Exact Methods in Architectural Timing Optimization
A.H. Timmer, Design Autom. Sect., Eindhoven Univ. of Technol., Netherlands
J.A.G. Jess, Design Autom. Sect., Eindhoven Univ. of Technol., Netherlands
pp. 42
I. Radivojevic, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
F. Brewer, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 48
N.L. Passos, Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
E.H.-M. Sha, Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 54
 | Session 2A: Circuit Partitioning |
D.J.-H. Huang, Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
A.B. Kahng, Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
pp. 60
Honghua Yang, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
D.F. Wong, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
pp. 65
B.M. Riess, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
A.A. Schoene, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
pp. 71
 | Panel Session 2B |
ATE Is Dead-Long Live Automated Test
 | Session 2C: Combinational Logic Synthesis |
Combinational Logic Synthesis
A. Bogliolo, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
M. Damiani, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
pp. 80
B. Kapoor, Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 86
R. Drechsler, Dept. of Comput. Sci., Frankfurt Univ., Germany
B. Becker, Dept. of Comput. Sci., Frankfurt Univ., Germany
pp. 91
 | Session 3A: Designs and Tools for Analogue and Mixed Signal ICs |
Designs and Tools for Analogue and Mixed Signal ICs
S. Eriksson, Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 100
A. Pletersek, Microelectron. Lab., Ljubljana Univ., Slovenia
D. Strle, Microelectron. Lab., Ljubljana Univ., Slovenia
J. Trontelj, Microelectron. Lab., Ljubljana Univ., Slovenia
pp. 105
O. Alminde, Austria Mikro Syst. Int. AG, Unterpremstatten, Austria
V. Kunc, Austria Mikro Syst. Int. AG, Unterpremstatten, Austria
M. Pauritsch, Austria Mikro Syst. Int. AG, Unterpremstatten, Austria
pp. 113
P. Veselinovic, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
D. Leenaerts, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
W. van Bokhoven, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
F. Leyn, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
F. Proesmans, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
G. Gielen, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
W. Sansen, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
pp. 119
 | Session 3B: Memory Testing |
Y. Zorian, Delft Univ. of Technol., Netherlands
pp. 133
R.D. Adams, Microelectron. Div., IBM Corp., Essex Junction, VT, USA
J. Connor, Microelectron. Div., IBM Corp., Essex Junction, VT, USA
G.S. Koch, Microelectron. Div., IBM Corp., Essex Junction, VT, USA
pp. 139
 | Session 3C: Sequential Logic Synthesis |
Sequential Logic Synthesis
L. Stok, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
I. Spillinger, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
G. Even, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 150
Z. Hasan, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
M.J. Ciesielski, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 155
 | Session 4A: High Speed Telecom Design |
High Speed Telecom Design
P. Plaza, Telefonica Investigacion y Desarrollo, Madrid, Spain
J.C. Diaz, Telefonica Investigacion y Desarrollo, Madrid, Spain
F. Calvo, Telefonica Investigacion y Desarrollo, Madrid, Spain
L. Merayo, Telefonica Investigacion y Desarrollo, Madrid, Spain
M. Zamboni, Telefonica Investigacion y Desarrollo, Madrid, Spain
P. Scarfone, Telefonica Investigacion y Desarrollo, Madrid, Spain
M. Barbini, Telefonica Investigacion y Desarrollo, Madrid, Spain
pp. 162
 | Session 4B: System Synthesis |
C.A. Valderrama, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
A. Changuel, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
P.V. Raghavan, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
M. Abid, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
T. Ben Ismail, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
A.A. Jerraya, Syst. Level Synthesis Group, Inst. Nat. Polytech. de Grenoble, France
pp. 180
F. Vahid, Dept. of Comput. Sci., California Univ., Riverside, CA, USA
D.D. Gajski, Dept. of Comput. Sci., California Univ., Riverside, CA, USA
pp. 185
 | Session 4C: Advanced DFT Techniques |
M.L. Flottes, Lab. d'Inf., de Robotique et de Microelectron., CNRS, Montpellier, France
D. Hammad, Lab. d'Inf., de Robotique et de Microelectron., CNRS, Montpellier, France
B. Rouzeyre, Lab. d'Inf., de Robotique et de Microelectron., CNRS, Montpellier, France
pp. 198
F. Fummi, Dipartimento di Elettronica, Politecnico di Milano, Italy
D. Sciuto, Dipartimento di Elettronica, Politecnico di Milano, Italy
M. Serra, Dipartimento di Elettronica, Politecnico di Milano, Italy
pp. 207
Li-Ren Huang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Sy-Yen Kuo, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Ing-Yi Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 212
 | Session 5A: Digital and System Simulation |
Digital and System Simulation
F. Pichon, RGS Div., Thomson-CSF, Gennesvilliers, France
S. Blanc, RGS Div., Thomson-CSF, Gennesvilliers, France
B. Candaele, RGS Div., Thomson-CSF, Gennesvilliers, France
pp. 218
C.A.J. van Eijk, Design Autom. Sect., Eindhoven Univ. of Technol., Netherlands
J.A.G. Jess, Design Autom. Sect., Eindhoven Univ. of Technol., Netherlands
pp. 223
Ing-Yi Chen, Dept. of Electron. Eng., Chung Yuan Christian Univ., Chung Li, Taiwan
Geng-Lin Chen, Dept. of Electron. Eng., Chung Yuan Christian Univ., Chung Li, Taiwan
Sy-Yen Kuo, Dept. of Electron. Eng., Chung Yuan Christian Univ., Chung Li, Taiwan
pp. 228
 | Session 5B: Code Generation |
R. Leupers, Dept. of Comput. Sci., Dortmund Univ., Germany
P. Marwedel, Dept. of Comput. Sci., Dortmund Univ., Germany
pp. 239
M. Strik, Philips Res. Lab., Eindhoven, Netherlands
A. Timmer, Philips Res. Lab., Eindhoven, Netherlands
J. Jess, Philips Res. Lab., Eindhoven, Netherlands
S. Note, Philips Res. Lab., Eindhoven, Netherlands
pp. 244
 | Session 5C: Sequential ATPG and Diagnosis |
Sequential ATPG and Diagnosis
T.E. Marchok, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. El-Maleh, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Maly, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Rajski, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 252
Jaehong Park, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Chanhee Oh, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
M.R. Mercer, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 262
F. Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
P. Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Rebaudengo, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Sonza Reorda, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
pp. 267
 | Session 6A: CAD Frameworks |
Y. Mathys, Semicond. Syst. Design Technol., Motorola Inc., USA
M. Morgan, Semicond. Syst. Design Technol., Motorola Inc., USA
S. Soudagar, Semicond. Syst. Design Technol., Motorola Inc., USA
pp. 274
E. Kwee-Christoph, Comput. Sci. Res. Center, Forschungszentrum Inf., Karlsruhe, Germany
F. Feldbusch, Comput. Sci. Res. Center, Forschungszentrum Inf., Karlsruhe, Germany
R. Kumar, Comput. Sci. Res. Center, Forschungszentrum Inf., Karlsruhe, Germany
A. Kunzmann, Comput. Sci. Res. Center, Forschungszentrum Inf., Karlsruhe, Germany
pp. 280
A. Kunzmann, Forschungszentrum Inf., Karlsruhe, Germany
R. Seepold, Forschungszentrum Inf., Karlsruhe, Germany
pp. 285
 | Panel Session 6B |
Simulation Versus Formal Verification
 | Session 6C: Test Generation and Testability |
Test Generation and Testability
M.H.C. Lee, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
D.L. Tao, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 303
G. Van Brakel, MESA Res. Inst., Twente Univ., Enschede, Netherlands
U. Glaser, MESA Res. Inst., Twente Univ., Enschede, Netherlands
H.G. Kerkhoff, MESA Res. Inst., Twente Univ., Enschede, Netherlands
H.T. Vierhaus, MESA Res. Inst., Twente Univ., Enschede, Netherlands
pp. 308
 | Session 7A: Applications of Symbolic Traversal Techniques |
Applications of Symbolic Traversal Techniques
J. Frossl, Inst. fur Rechnerentwurf und Fehlertoleranz, Karlsruhe Univ., Germany
T. Kropf, Inst. fur Rechnerentwurf und Fehlertoleranz, Karlsruhe Univ., Germany
pp. 314
F. Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
P. Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Sonza Reorda, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
pp. 320
O. Roig, Aizu Univ., Aizu-Wakamatsu, Japan
pp. 325
F. Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Cusinato, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
M. Ferrero, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
P. Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
pp. 333
 | Session 7B: Handling Physical Constraints in Architectural Synthesis |
Handling Physical Constraints in Architectural Synthesis
N.D. Holmes, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
D.D. Gajski, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
pp. 340
P.K. Jha, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
N.D. Dutt, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
pp. 345
A. Balboni, Res. & Dev. Lab., Italtel Telecom Co, Italy
C. Costi, Res. & Dev. Lab., Italtel Telecom Co, Italy
M. Quadrini, Res. & Dev. Lab., Italtel Telecom Co, Italy
D. Sciuto, Res. & Dev. Lab., Italtel Telecom Co, Italy
pp. 351
 | Session 7C: Self-Checking Approaches |
O. Kebichi, Reliable Integrated Syst. Group, TIMA/INPG, Grenoble, France
Y. Zorian, Reliable Integrated Syst. Group, TIMA/INPG, Grenoble, France
M. Nicolaidis, Reliable Integrated Syst. Group, TIMA/INPG, Grenoble, France
pp. 358
J.M. Tahir, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
S.S. Dlay, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
R.N.G. Naguib, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
O.R. Hinton, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
pp. 363
Jing-Jou Tang, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Kuen-Jong Lee, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Bin-Da Liu, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 372
 | Session 8A: Design Methodologies |
R. Reed, IBM Corp., Austin, TX, USA
pp. 378
M. Valle, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G. Nateri, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
D.D. Caviglia, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G.M. Bisio, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
L. Briozzo, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 385
A. Wheeler, Dept. of Electr. Eng., Arkansas Univ., USA
B. Wealand, Dept. of Electr. Eng., Arkansas Univ., USA
C. Kancler, Dept. of Electr. Eng., Arkansas Univ., USA
pp. 391
 | Session 8B: Power and Delay Issues in Logic Synthesis |
Power and Delay Issues in Logic Synthesis
J. Leijten, Philips Res. Lab., Eindhoven, Netherlands
J. Jess, Philips Res. Lab., Eindhoven, Netherlands
pp. 398
R. Murgai, Fujitsu Labs. of America Inc., San Jose, CA, USA
R.K. Brayton, Fujitsu Labs. of America Inc., San Jose, CA, USA
pp. 404
H.H.-F. Jyu, EPIC Desing Technol. Inc., Santa Clara, CA, USA
S. Malik, EPIC Desing Technol. Inc., Santa Clara, CA, USA
pp. 411
 | Session 8C: BIST Methodologies |
B. Wurth, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
K. Fuchs, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
pp. 418
C. Dufaza, Lab. d'Inf., de Robotique et de Micro-Electron., CNRS, Montpellier, France
H. Viallon, Lab. d'Inf., de Robotique et de Micro-Electron., CNRS, Montpellier, France
C. Chevalier, Lab. d'Inf., de Robotique et de Micro-Electron., CNRS, Montpellier, France
pp. 424
I. Voyiatzis, Inst. of Inf. & Telecommun., NCSR Demokritos, Athens, Greece
A. Paschalis, Inst. of Inf. & Telecommun., NCSR Demokritos, Athens, Greece
D. Nikolos, Inst. of Inf. & Telecommun., NCSR Demokritos, Athens, Greece
C. Halatsis, Inst. of Inf. & Telecommun., NCSR Demokritos, Athens, Greece
pp. 431
 | Session 9A: New Developments in Logic Representation and Verification Techniques |
New Developments in Logic Representation and Verification Techniques
B. Becker, Dept. of Comput. Sci., Frankfurt Univ., Germany
R. Drechsler, Dept. of Comput. Sci., Frankfurt Univ., Germany
pp. 438
R. Mukherjee, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
J. Jain, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
M. Fujita, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 444
 | Session 9C: Test Preparation for Mixed-Signal Systems |
Test Preparation for Mixed-Signal Systems
B. Ayari, Ecole Polytech. de Montreal, Que., Canada
pp. 458
C. Sebeke, Lab. fur Informationstechnol., Hannover Univ., Germany
J.P. Teixeira, Lab. fur Informationstechnol., Hannover Univ., Germany
M.J. Ohletz, Lab. fur Informationstechnol., Hannover Univ., Germany
pp. 464
 | Session 10A: Hierarchical Layout |
H. Schmidt, Cadlab/ASE, Paderborn Univ./Siemens Nixdorf Informationssyst. AG Joint R&D Inst., Germany
D. Theune, Cadlab/ASE, Paderborn Univ./Siemens Nixdorf Informationssyst. AG Joint R&D Inst., Germany
R. Thiele, Cadlab/ASE, Paderborn Univ./Siemens Nixdorf Informationssyst. AG Joint R&D Inst., Germany
T. Lengauer, Cadlab/ASE, Paderborn Univ./Siemens Nixdorf Informationssyst. AG Joint R&D Inst., Germany
pp. 486
M. Hayashi, Fac. of Sci. & Eng., Chuo Univ., Tokyo, Japan
pp. 492
 | Session 10B: Modeling and Design of ASIPs |
Modeling and Design of ASIPs
Jie Gong, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
D.D. Gajski, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
S. Narayan, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
pp. 498
A. Fauth, Inst. fur Tech. Inf., Tech. Univ. Berlin, Germany
J. Van Praet, Inst. fur Tech. Inf., Tech. Univ. Berlin, Germany
M. Freericks, Inst. fur Tech. Inf., Tech. Univ. Berlin, Germany
pp. 503
F. Onion, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
A. Nicolau, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
N. Dutt, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
pp. 508
 | Session 10C: Delay Testing and Diagnosis |
Delay Testing and Diagnosis
B. Kapoor, Integrated Syst. Labs., Texas Instrum. Inc., Dallas, TX, USA
pp. 516
M. Henftling, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
H. Wittman, Inst. of Electron. Design Autom., Tech. Univ. Munchen, Germany
pp. 521
P. Girard, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
C. Landrault, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
S. Pravossoudovitch, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
B. Rodriguez, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
pp. 526
 | Session 11A: New Applications of Analogue Simulation Algorithms |
New Applications of Analogue Simulation Algorithms
M. Kamon, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J. White, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 534
E. Driouk, Dept. of Microelectron., Byelorussian State Univ. of Inf. & Radioelectron., Minsk, Byelorussia
O. Jarov, Dept. of Microelectron., Byelorussian State Univ. of Inf. & Radioelectron., Minsk, Byelorussia
A. Sukhodolsky, Dept. of Microelectron., Byelorussian State Univ. of Inf. & Radioelectron., Minsk, Byelorussia
pp. 539
 | Session 11B: Design Problems in Pipelines |
Design Problems in Pipelines
R. Ernst, Tech. Univ. Braunschweig, Germany
pp. 550
M. Rahmouni, Lab. TIMA, Inst. Nat. Polytech. de Grenoble, France
A.A. Jerraya, Lab. TIMA, Inst. Nat. Polytech. de Grenoble, France
pp. 557
 | Session 11C: IDDQ Testing |
M. Dalpasso, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
M. Favalli, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
P. Olivo, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
pp. 568
M. Herzog, Inst. of Comput. Structures, Siegen Univ., Germany
J. Figueras, Inst. of Comput. Structures, Siegen Univ., Germany
J.A. Carrasco, Inst. of Comput. Structures, Siegen Univ., Germany
A. Calderon, Inst. of Comput. Structures, Siegen Univ., Germany
pp. 573
A. Rubio, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
E. Janssens, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
H. Casier, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Figueras, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
D. Mateo, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
P. De Pauw, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Segura, Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 581
 | Poster Session |
J. Crespo, Telefonica Investigacion y Desarrollo, Madrid, Spain
F. Calvo, Telefonica Investigacion y Desarrollo, Madrid, Spain
J.I. Solana, Telefonica Investigacion y Desarrollo, Madrid, Spain
R. Caravantes, Telefonica Investigacion y Desarrollo, Madrid, Spain
J.L. Conesa, Telefonica Investigacion y Desarrollo, Madrid, Spain
pp. 589
R.J. Mack, Centre for VLSI Design, Essex Univ., Colchester, UK
R.E. Massara, Centre for VLSI Design, Essex Univ., Colchester, UK
pp. 591
B. Becker, Dept. of Comput. Sci., Frankfurt Univ., Germany
R. Drechsler, Dept. of Comput. Sci., Frankfurt Univ., Germany
pp. 592
R. Rochet, Inst. Nat. Polytech. de Grenoble, France
G. Saucier, Inst. Nat. Polytech. de Grenoble, France
pp. 593
H. Selvaraj, Inst. of Telecommun., Warsaw Univ. of Technol., Poland
T. Luba, Inst. of Telecommun., Warsaw Univ. of Technol., Poland
pp. 594
T. Kage, Fujitsu Labs. Ltd., Atsugi, Japan
pp. 595
W. Pleskacz, Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Poland
W. Kuzmicz, Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Poland
pp. 598
M. Favalli, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
B. Ricco, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
L. Penza, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
pp. 599
J. Carletta, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA
C. Papachristou, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA
pp. 600
V. Szekely, Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
M. Rencz, Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
pp. 601
D. Dallet, Lab. de Microelectron., Bordeaux I Univ., Talence, France
G. Franco, Lab. de Microelectron., Bordeaux I Univ., Talence, France
P. Marchegay, Lab. de Microelectron., Bordeaux I Univ., Talence, France
C. Morandi, Lab. de Microelectron., Bordeaux I Univ., Talence, France
pp. 606
V. Zagursky, Inst. of Electron. & Comput. Sci., Acad. of Sci., Riga, Latvia
N. Semyonova, Inst. of Electron. & Comput. Sci., Acad. of Sci., Riga, Latvia
M. Sirovatkina, Inst. of Electron. & Comput. Sci., Acad. of Sci., Riga, Latvia
pp. 607
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