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Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on (2003)
Cannes, France
Apr. 30, 2003 to Apr. 30, 2003
ISBN: 0-7803-7066-X
TABLE OF CONTENTS
Papers
M. Madou , California Univ., Irvine, CA, USA
pp. 1
O. Sigmund , Tech. Univ. Denmark, Lyngby, Denmark
pp. 2
N. Meyendorf , Dayton Univ., OH, USA
pp. 3
U. Hansen , Inst. for Microtechnol., TU Braunschweig, Germany
pp. 4-9
C. Mandelbaum , MEMSCAP, Crolles, France
S. Cases , MEMSCAP, Crolles, France
D. Bensaude , MEMSCAP, Crolles, France
L. Basteres , MEMSCAP, Crolles, France
P. Nachtergaele , MEMSCAP, Crolles, France
pp. 21-26
H.G. Kerkhoff , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
M. Acar , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
pp. 27-32
C. Germer , Inst. for Eng. Design, Tech. Univ. of Braunschweig, Germany
U. Hansen , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
H.-J. Franke , MEMSCAP, Crolles, France
S. Buttgenbach , MEMSCAP, Crolles, France
pp. 33-38
M. Knight , Dept. of Electr. & Comput. Eng., Oregon Health & Sci. Univ., Beaverton, OR, USA
B. Kaminska , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
J. House , MEMSCAP, Crolles, France
pp. 39-44
J.-P. Sommer , Dept. of Mech. Reliability & Micro Mater., Fraunhofer-Inst. for Reliability & Micro Integration, Berlin, Germany
O. Wittler , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
D. Manessis , MEMSCAP, Crolles, France
B. Michel , MEMSCAP, Crolles, France
pp. 45-49
L. Rufer , TIMA Lab., Grenoble, France
S. Mir , TIMA Lab., Grenoble, France
E. Simeu , TIMA Lab., Grenoble, France
C. Domingues , TIMA Lab., Grenoble, France
pp. 50-55
A. Endemano , Dept. of Electron. & Comput. Eng., Heriot-Watt Univ., Edinburgh, UK
J.Y. Fourniols , TIMA Lab., Grenoble, France
H. Camon , TIMA Lab., Grenoble, France
A. Marchese , TIMA Lab., Grenoble, France
S. Muratet , MEMSCAP, Crolles, France
pp. 56-63
J.L. Merino , Dept. of Electron., Barcelona Univ., Spain
S.A. Bota , TIMA Lab., Grenoble, France
J. Samitier , TIMA Lab., Grenoble, France
B. Niessen , TIMA Lab., Grenoble, France
E. Cabruja , MEMSCAP, Crolles, France
pp. 64-68
J.L. Merino , Dept. d'Electron., Barcelona Univ., Spain
R. Casanova , Dept. d'Electron., Barcelona Univ., Spain
A. Dieguez , Dept. d'Electron., Barcelona Univ., Spain
S.A. Bota , TIMA Lab., Grenoble, France
J. Samitier , MEMSCAP, Crolles, France
pp. 69-74
H. Cai , Inst. for Infocomm. Res., Singapore, Singapore
C.W. Chan , Dept. d'Electron., Barcelona Univ., Spain
C.S. Thian , Dept. d'Electron., Barcelona Univ., Spain
X.M. Zhang , TIMA Lab., Grenoble, France
C. Lu , MEMSCAP, Crolles, France
pp. 75-78
D. Peters , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
S. Rehfuss , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
R. Laur , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
H.-G. Brachtendorf , TIMA Lab., Grenoble, France
pp. 79-83
I. Sieber , Inst. fur Angewandte Inf., Forschungszentrum Karlsruhe, Germany
U. Gengenbach , Inst. fur Angewandte Inf., Forschungszentrum Karlsruhe, Germany
A. Hofmann , Inst. fur Angewandte Inf., Forschungszentrum Karlsruhe, Germany
pp. 84-89
S. Rehfuss , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
C. Gorecki , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
D. Peters , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
R. Laur , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 90-94
R.L. Moreno , Microelectron. Group, Univ. Fed. de Itajuba, Sao Paulo, Brazil
E.C. Rodrigues , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 95-98
M. Tang , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
A. Agarwal , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
J. Li , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
Q.X. Zhang , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
P. Win , MEMSCAP, Crolles, France
pp. 99-102
S. Deladi , MESA Res. Inst., Twente Univ., Enschede, Netherlands
G. Krijnen , MESA Res. Inst., Twente Univ., Enschede, Netherlands
M.C. Elwenspoek , MESA Res. Inst., Twente Univ., Enschede, Netherlands
pp. 103-107
F. Conseil , Dept. ISEN, Inst. d'Electron., Villeneuve d'Ascq, France
P. Derderian , MESA Res. Inst., Twente Univ., Enschede, Netherlands
M.-F. Ravat , MESA Res. Inst., Twente Univ., Enschede, Netherlands
D. Collard , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
L. Buchaillot , MEMSCAP, Crolles, France
pp. 108-112
Geng-Sheng Kuo , Nat. Chengchi Univ., Taipei, Taiwan
Yong Yin , MESA Res. Inst., Twente Univ., Enschede, Netherlands
pp. 113-116
G. Casinovi , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 117-120
L. Ferrario , Microelectron. Div., ITC-irst, Trento, Italy
S. Taschini , MESA Res. Inst., Twente Univ., Enschede, Netherlands
M. Emmenegger , MESA Res. Inst., Twente Univ., Enschede, Netherlands
H. Baltes , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
J.G. Korvink , MEMSCAP, Crolles, France
pp. 121-126
H.G. Teo , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
J. Singh , MESA Res. Inst., Twente Univ., Enschede, Netherlands
C. Lu , MESA Res. Inst., Twente Univ., Enschede, Netherlands
A.Q. Liu , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 127-130
C. Wang , Ind. Math. & Gravity Group, Lancaster Univ., UK
D. Liu , Ind. Math. & Gravity Group, Lancaster Univ., UK
R. Rosing , MESA Res. Inst., Twente Univ., Enschede, Netherlands
B. De Masi , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
A. Richardson , MEMSCAP, Crolles, France
pp. 131-136
N.C. Popa , Dispositifs et Instrum. en Optoeletron. et Micro-ondes, Univ. Jean Monnet, Saint-Etienne, France
A. Siblini , Dispositifs et Instrum. en Optoeletron. et Micro-ondes, Univ. Jean Monnet, Saint-Etienne, France
L. Jorat , Dispositifs et Instrum. en Optoeletron. et Micro-ondes, Univ. Jean Monnet, Saint-Etienne, France
pp. 143-148
M. Schlegel , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
G. Herrmann , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
D. Muller , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
pp. 149-153
Zheng Cui , Rutherford Appleton Lab., Chilton, UK
Chao Gong , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
Shanhong Xia , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
pp. 154-158
H. Bolte , ITEM, Bremen Univ., Germany
O. Nussen , ITEM, Bremen Univ., Germany
D. Peters , ITEM, Bremen Univ., Germany
R. Laur , ITEM, Bremen Univ., Germany
D. Richter , MEMSCAP, Crolles, France
pp. 159-163
Guangya Zhou , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
K.K.L. Cheo , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
F.E.H. Tay , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
F.E.H. Tay , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
pp. 164-169
Kaiping Zeng , Inst. for Microsyst. Technol., Freiburg Univ., Germany
Zhenyu Liu , Inst. for Microsyst. Technol., Freiburg Univ., Germany
J.G. Korvink , Inst. for Microsyst. Technol., Freiburg Univ., Germany
pp. 170-175
R. Gaddi , ARCES, Bologna Univ., Italy
pp. 176-180
E. Brusa , DIEGM, Univ. degli Studi di Udine, Italy
F. De Bona , DIEGM, Univ. degli Studi di Udine, Italy
A. Gugliotta , Inst. for Microsyst. Technol., Freiburg Univ., Germany
A. Soma , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
pp. 181-186
G. McRobbie , MicroScale Sensors, Univ. of Paisley, UK
Zaikang Ling , MicroScale Sensors, Univ. of Paisley, UK
F. Clark , MicroScale Sensors, Univ. of Paisley, UK
pp. 187-191
L. Ferrario , Microsyst. Div., ITC-irst, Povo, Italy
C. Armaroli , Microsyst. Div., ITC-irst, Povo, Italy
B. Margesin , Microsyst. Div., ITC-irst, Povo, Italy
G. Soncini , Microsyst. Div., ITC-irst, Povo, Italy
pp. 192-196
O. Nussen , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
D. Peters , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
H. Bolte , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
R. Laur , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 197-200
Chen Shi-Hao , Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
Chien Chao-Heng , Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
pp. 201-203
S. Myllymaki , Tampere Univ. of Technol., Finland
E. Ristolainen , Tampere Univ. of Technol., Finland
P. Heino , Tampere Univ. of Technol., Finland
A. Lehto , Tampere Univ. of Technol., Finland
K. Varjonen , Tampere Univ. of Technol., Finland
pp. 204-207
M. Morata , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
E. Figueras , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
I. Gracia , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
L. Fonseca , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
C. Cane , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
pp. 208-213
A. Mohamed , Electron. Res. Inst., Egypt
H. Elsimary , Electron. Res. Inst., Egypt
M. Ismail , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
pp. 214-217
Hua Li , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
Y.K. Yew , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
K.Y. Lam , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
T.Y. Ng , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
pp. 218-222
J. Laconte , Res. Center in Micro, Univ. Catholique de Louvain, Belgium
V. Wilmart , Res. Center in Micro, Univ. Catholique de Louvain, Belgium
J.-P. Raskin , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
D. Flandre , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
pp. 223-228
J. Kiihamaki , Microlelctron., VTT Inf. Technol., Finland
P. Pekko , Microlelctron., VTT Inf. Technol., Finland
H. Kattelus , Microlelctron., VTT Inf. Technol., Finland
T. Sillanpaa , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
T. Mattila , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
pp. 229-233
J. Li , Microelectron. Div., Nanyang Technol. Univ., Singapore
Q.X. Zhang , Microlelctron., VTT Inf. Technol., Finland
A.Q. Liu , Microlelctron., VTT Inf. Technol., Finland
pp. 234-238
A. Jourdain , IMEC, Leuven, Belgium
H. Ziad , Microlelctron., VTT Inf. Technol., Finland
P. De Moor , Microlelctron., VTT Inf. Technol., Finland
H.A.C. Tilmans , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
pp. 239-244
C. Rusu , MEMS Group, Imego Inst., Gothenburg, Sweden
H. Jansen , Microlelctron., VTT Inf. Technol., Finland
R. Gunn , Microlelctron., VTT Inf. Technol., Finland
A. Witvrouw , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
pp. 245-250
D.M. Allen , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
H.J.A. Almond , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
D. Boubal , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
pp. 251-254
Erik Jung , Fraunhofer-IZM, Berlin, Germany
A. Ostmann , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
M. Wiemer , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
I. Kolesnik , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
M. Hutter , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
pp. 255-260
Yigui Li , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
Di Chen , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
Jun Zhu , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
Jingquan Liu , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
Jiliang Zhang , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
pp. 261-264
R. Truckenmuller , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
P. Henzi , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
D. Herrmann , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
V. Saile , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
W.K. Schomburg , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
pp. 265-267
Guodong Hong , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
A.S. Holmes , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
M.E. Heaton , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
pp. 268-271
M. Worgull , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe AC, Germany
M. Heckele , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe AC, Germany
pp. 272-274
Hsiharng Yang , Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
Tsung-Shuin Tsai , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe AC, Germany
Reiyu Chein , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
Chia-Hua Chang , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
Jen-Chin Wu , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
pp. 275-280
L. Lorenzelli , ITC-irst Microsyst. Div., Trento, Italy
K.J. Rangra , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe AC, Germany
C. Collini , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
F. Giacomozzi , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
B. Margesin , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
pp. 281-285
T. Kobayashi , Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
X.C. Shan , Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
Y. Murakoshi , Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
R. Maeda , Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
pp. 286-289
M. Knight , Dept. of Electr. & Comput. Eng., OGI Sch. of Sci. & Eng., Beaverton, OR, USA
J. House , Dept. of Electr. & Comput. Eng., OGI Sch. of Sci. & Eng., Beaverton, OR, USA
pp. 290-294
E. Novak , Veeco Instrum., Plainvew, NY, USA
F. Pasop , Veeco Instrum., Plainvew, NY, USA
T. Browne , Veeco Instrum., Plainvew, NY, USA
pp. 295-299
M. Ichiki , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
Lulu Zhang , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
Zhen Yang , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
T. Ikehara , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
R. Maeda , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
pp. 300-303
Y. Murakoshi , Integrated Solid-State Electr. Mech. Instrum., Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
Y. Murakoshi , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
T. Shimizu , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
R. Maeda , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
pp. 304-311
F. Marty , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
S. Didelon , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
B. Mercier , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
C. Moyroud , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
T. Bourouina , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
pp. 312-317
H. Majjad , Angstrom Lab., Uppsala Univ., Sweden
M. Lindeberg , Angstrom Lab., Uppsala Univ., Sweden
M. Skupinski , Angstrom Lab., Uppsala Univ., Sweden
K. Hjort , Angstrom Lab., Uppsala Univ., Sweden
pp. 318-323
J. Schulz , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
K. Bade , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
M. Guttmann , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
L. Hahn , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
A. Janssen , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
U. Kohler , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
P. Meyer , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
F. Winkler , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 324-328
F.F. Meroni , Inst. of Mech. Syst., Eidgenossische Tech. Hochschule, Zurich, Switzerland
E. Mazza , Inst. of Mech. Syst., Eidgenossische Tech. Hochschule, Zurich, Switzerland
pp. 329-334
B. Wunderle , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
J. Auersperg , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
V. Grosser , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
E. Kaulfersch , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
O. Wittler , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
B. Michel , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 335-340
X. Lafontan , MEMSCAP, Crolles, France
J. Kuchenbecker , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
B. Guillon , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
P. Pons , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
P. Nerin , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
F. Pressecq , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
M. Dardalhon , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
S. Rigo , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 341-345
M. Moraja , SAES Getters, Lainate, Italy
M. Amiotti , SAES Getters, Lainate, Italy
pp. 346-349
Yigui Li , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Chun Hui , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Jun Zhu , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Jingquan Liu , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Y. Kanamori , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 350-352
E. Lennon , Centre de Recherches sur les Tres Basses Temperatures, CNRS, Grenoble, France
F. Ayela , Centre de Recherches sur les Tres Basses Temperatures, CNRS, Grenoble, France
pp. 353-355
Hsiharng Yang , Inst. of Precision Eng., Nat. Chung-Hsing Univ., Taichung, Taiwan
Che-Ping Lin , Centre de Recherches sur les Tres Basses Temperatures, CNRS, Grenoble, France
Ching-Kong Chao , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Cheng-Tang Pan , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
pp. 356-361
Chien Chao-Heng , Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
Chen Shi-Hao , Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
pp. 362-366
Chen Shi-Hao , Nat. Chin-Yi Inst. of Technol., Taichung, Taiwan
pp. 367-372
P.-H. Chen , Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
P.-P. Ding , Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
J.-S. Kuo , Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 373-377
P. Pal , Centre for Appl. Res. in Electron., Indian Inst. of Technol., New Delhi, India
S. Tuli , Centre for Appl. Res. in Electron., Indian Inst. of Technol., New Delhi, India
S. Chandra , Centre for Appl. Res. in Electron., Indian Inst. of Technol., New Delhi, India
pp. 378-381
M. Feldmann , Inst. for Microtechnol., Technische Univ. Braunschweig, Germany
S. Butefisch , Inst. for Microtechnol., Technische Univ. Braunschweig, Germany
S. Buttgenbach , Inst. for Microtechnol., Technische Univ. Braunschweig, Germany
pp. 382-386
A. Teverovsky , QSS Group Inc., Lanham, MD, USA
Ashok Sharma , Inst. for Microtechnol., Technische Univ. Braunschweig, Germany
pp. 387-393
Ashok Sharma , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
T.A. Harder , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Yu-Chong Tai , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 394-398
Feng-Tsai Wang , Dept. of Mech. Manuf Eng., Nat. Huwei Inst. of Technol., Yunlin, Taiwan
Chen-Siang Hsu , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
R.F. Shyu , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
C.T. Ho , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
pp. 399-401
B. Margesin , ITC-irst, Povo, Italy
A. Bagolini , ITC-irst, Povo, Italy
V. Guarnieri , ITC-irst, Povo, Italy
F. Giacomozzi , ITC-irst, Povo, Italy
A. Faes , ITC-irst, Povo, Italy
R. Pal , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
M. Decarli , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 402-405
L. Fonseca , Centro Nacional de Microelectron., Bellaterra, Spain
E. Cabruja , Centro Nacional de Microelectron., Bellaterra, Spain
C. Calaza , ITC-irst, Povo, Italy
R. Rubio , ITC-irst, Povo, Italy
J. Santander , ITC-irst, Povo, Italy
E. Figueras , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
I. Gracia , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
C. Cane , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 407-410
pp. 412-413
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