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Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'03)
A new electroforming technology in aid of pressure for LIGA process
Cannes, France
April 30-April 30
ISBN: 0-7803-7066-X
| ASCII Text | x | ||
| Hsiharng Yang, Tsung-Shuin Tsai, Reiyu Chein, Chia-Hua Chang, Jen-Chin Wu, "A new electroforming technology in aid of pressure for LIGA process," Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on, pp. 275-280, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'03), 2003. | |||
| BibTex | x | ||
| @article{ 10.1109/DTIP.2003.1287052, author = {Hsiharng Yang and Tsung-Shuin Tsai and Reiyu Chein and Chia-Hua Chang and Jen-Chin Wu}, title = {A new electroforming technology in aid of pressure for LIGA process}, journal ={Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on}, volume = {0}, year = {2003}, isbn = {0-7803-7066-X}, pages = {275-280}, doi = {http://doi.ieeecomputersociety.org/10.1109/DTIP.2003.1287052}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - CONF JO - Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on TI - A new electroforming technology in aid of pressure for LIGA process SN - 0-7803-7066-X SP275 EP280 A1 - Hsiharng Yang, A1 - Tsung-Shuin Tsai, A1 - Reiyu Chein, A1 - Chia-Hua Chang, A1 - Jen-Chin Wu, PY - 2003 VL - 0 JA - Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on ER - | |||
New microelectroforming technique using air pressure assistance in the electrolyte is introduced. The theoretical model and experiments are reported in this paper. It shows that the pressurized electrolyte reduces hydrogen bubbles formation and defects existing on substrate surface. High pressure in the electrolyte limits bubbles formation in electroforming. It also results in good throwing power from the experimental samples observation. The edges of the electroformed workpiece using the pressurized method are smoother than the conventional electroforming. Metallurgical grains are finer when high pressures applied in the electrolyte based on SEM micrographs. The pressurized electroforming can increase the allowable current density, which can shorten plating time in the LIGA process. High growth rate due to a large applied current density results in large grains of electroforming microstructures, but the surface morphology of the pressurized electroforming is also improved comparing with the conventional method.
Citation:
Hsiharng Yang, Tsung-Shuin Tsai, Reiyu Chein, Chia-Hua Chang, Jen-Chin Wu, "A new electroforming technology in aid of pressure for LIGA process," dtip, pp.275-280, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'03), 2003
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