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  • Data Compression Conference (DCC '96)
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Data Compression Conference (DCC '96)
Snowbird, UT
March 31-April 03
ISBN: 0-8186-7358-3
Table of Contents
Session 1
N. Chaddha, Inf. Syst. Lab., Stanford Univ., CA, USA
K. Perlmutter, Inf. Syst. Lab., Stanford Univ., CA, USA
R.M. Gray, Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 23
T. Linder, Dept. of Math. & Comput. Sci., Tech. Univ. Budapest, Hungary
G. Lugosi, Dept. of Math. & Comput. Sci., Tech. Univ. Budapest, Hungary
K. Zeger, Dept. of Math. & Comput. Sci., Tech. Univ. Budapest, Hungary
pp. 33
O.K. Al-Shaykh, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 43
Session 2
W.J. Teahan, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
J.G. Cleary, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
pp. 53
C.G. Nevill-Manning, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
I.H. Witten, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
D.R. Olsen, Jr., Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
J.A. Storer, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
M. Cohn, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
pp. 63
Free energy coding (Abstract)
B.J. Frey, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
G.E. Hinton, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 73
A. Moffat, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
L. Stuiver, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
pp. 82
G. Louchard, Dept. d'Inf., Univ. Libre de Bruxelles, Belgium
W. Szpankowski, Dept. d'Inf., Univ. Libre de Bruxelles, Belgium
pp. 92
Session 3
Xuguang Yang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 112
O.G. Guleryuz, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 122
Session 4
M.J. Weinberger, Hewlett-Packard Co., Palo Alto, CA, USA
G. Seroussi, Hewlett-Packard Co., Palo Alto, CA, USA
G. Sapiro, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 140
Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
pp. 150
Session 5
A. Moffat, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
A. Turpin, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
pp. 170
M. Cohn, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
R. Khazan, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
pp. 180
P. Franaszek, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Robinson, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Thomas, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 200
Session 6
N. Chaddha, Inf. Syst. Lab., Stanford Univ., CA, USA
P.A. Chou, Inf. Syst. Lab., Stanford Univ., CA, USA
R.M. Gray, Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 220
H. Jafarkhani, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 230
Ping Wah Wong, Hewlett-Packard Co., Palo Alto, CA, USA
N. Moayeri, Hewlett-Packard Co., Palo Alto, CA, USA
C. Herley, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 240
H. Brunk, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 250
Session 7
M.J. Slyz, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 260
B. Martins, Dept. of Telecommun., Tech. Univ., Lyngby, Denmark
S. Forchhammer, Dept. of Telecommun., Tech. Univ., Lyngby, Denmark
pp. 270
K. Culik, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
V. Valenta, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
pp. 280
A. Broder, Digital Syst. Res. Center, Palo Alto, CA, USA
M. Mitzenmacher, Digital Syst. Res. Center, Palo Alto, CA, USA
pp. 300
Session 8
C.L. Nash, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.A. Olshen, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.M. Gray, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 310
H.S. Malvar, PictureTel Corp., Danvers, MA, USA
G.J. Sullivan, PictureTel Corp., Danvers, MA, USA
G.W. Wornell, PictureTel Corp., Danvers, MA, USA
pp. 320
P.J. Hahn, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
V.J. Mathews, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 340
A. Ortega, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 349
Session 9
V. Ratnakar, Dept. of Comput. Sci., Wisconsin Univ., Madison, WI, USA
M. Livny, Dept. of Comput. Sci., Wisconsin Univ., Madison, WI, USA
pp. 379
Session 10
B. Usevitch, Dept. Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
pp. 387
J.D. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
R.A. Ergas, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
P.L. Donoho, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 396
(Abstract)
pp. 396
Chia-Yuan Teng, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 406
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