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Data Compression Conference (DCC '96) Snowbird, UT March 31-April 03 ISBN: 0-8186-7358-3 Table of Contents
 | Session 1 |
N. Chaddha, Inf. Syst. Lab., Stanford Univ., CA, USA
R.M. Gray, Inf. Syst. Lab., Stanford Univ., CA, USA pp. 23
T. Linder, Dept. of Math. & Comput. Sci., Tech. Univ. Budapest, Hungary
G. Lugosi, Dept. of Math. & Comput. Sci., Tech. Univ. Budapest, Hungary
K. Zeger, Dept. of Math. & Comput. Sci., Tech. Univ. Budapest, Hungary pp. 33
O.K. Al-Shaykh, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA pp. 43
 | Session 2 |
W.J. Teahan, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
J.G. Cleary, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand pp. 53
I.H. Witten, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
D.R. Olsen, Jr., Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
J.A. Storer, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
M. Cohn, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand pp. 63
B.J. Frey, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
G.E. Hinton, Dept. of Electr. Eng., Toronto Univ., Ont., Canada pp. 73
A. Moffat, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
L. Stuiver, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia pp. 82
G. Louchard, Dept. d'Inf., Univ. Libre de Bruxelles, Belgium pp. 92
 | Session 3 |
Xuguang Yang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA pp. 112
O.G. Guleryuz, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA pp. 122
 | Session 4 |
G. Sapiro, Hewlett-Packard Co., Palo Alto, CA, USA pp. 140
Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada pp. 150
 | Session 5 |
H. Yokoo, Dept. of Comput. Sci., Gunma Univ., Japan pp. 160
A. Moffat, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
A. Turpin, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia pp. 170
M. Cohn, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
R. Khazan, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA pp. 180
P. Franaszek, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Robinson, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Thomas, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 200
 | Session 6 |
P.G. Howard, Visual Commun. Res., AT&T Bell Labs., Holmdel, NJ, USA pp. 210
N. Chaddha, Inf. Syst. Lab., Stanford Univ., CA, USA
P.A. Chou, Inf. Syst. Lab., Stanford Univ., CA, USA
R.M. Gray, Inf. Syst. Lab., Stanford Univ., CA, USA pp. 220
H. Jafarkhani, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA pp. 230
N. Moayeri, Hewlett-Packard Co., Palo Alto, CA, USA
C. Herley, Hewlett-Packard Co., Palo Alto, CA, USA pp. 240
H. Brunk, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA pp. 250
 | Session 7 |
M.J. Slyz, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 260
B. Martins, Dept. of Telecommun., Tech. Univ., Lyngby, Denmark pp. 270
K. Culik, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
V. Valenta, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA pp. 280
A. Broder, Digital Syst. Res. Center, Palo Alto, CA, USA pp. 300
 | Session 8 |
C.L. Nash, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.A. Olshen, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.M. Gray, Dept. of Electr. Eng., Stanford Univ., CA, USA pp. 310
P.J. Hahn, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
V.J. Mathews, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA pp. 340
A. Ortega, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA pp. 349
 | Session 9 |
U. Hafner, Lehrstuhl fur Inf., Wurzburg Univ., Germany pp. 359
V. Ratnakar, Dept. of Comput. Sci., Wisconsin Univ., Madison, WI, USA
M. Livny, Dept. of Comput. Sci., Wisconsin Univ., Madison, WI, USA pp. 379
 | Session 10 |
B. Usevitch, Dept. Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA pp. 387
J.D. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
R.A. Ergas, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
P.L. Donoho, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA pp. 396
Chia-Yuan Teng, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 406 Usage of this product signifies your acceptance of the Terms of Use.
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