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Data Compression Conference (DCC '95) Snowbird, Utah March 28-March 30 ISBN: 0-8186-7012-6 Table of Contents
 | Session 1 |
P.A. Chou, Comput. Syst. Lab., Stanford Univ., CA, USA pp. 3
V.K. Goyal, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
M. Vetterli, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
N.T. Thao, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA pp. 13
K. Rose, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA pp. 42
 | Session 2 |
J.G. Cleary, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
W.J. Teahan, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
I.H. Witten, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand pp. 52
E.S. Ristad, Dept. of Comput. Sci., Princeton Univ., NJ, USA pp. 62
S. Bunton, Dept. of Comput. Sci. & Eng., Washington Univ., Seattle, WA, USA pp. 72
M. Feder, Dept. of Electr. Eng., Tel Aviv Univ., Israel
N. Merhav, Dept. of Electr. Eng., Tel Aviv Univ., Israel pp. 82
S. Forchhammer, Inst. of Telecommun., Tech. Univ. Denmark, Lyngby, Denmark
J. Rissanen, Inst. of Telecommun., Tech. Univ. Denmark, Lyngby, Denmark pp. 92
 | Session 3 |
B. Fowler, Inf. Syst. Lab., Stanford Univ., CA, USA
R. Arps, Inf. Syst. Lab., Stanford Univ., CA, USA
D. Yang, Inf. Syst. Lab., Stanford Univ., CA, USA pp. 102
R.M. Gray, Inf. Syst. Lab., Stanford Univ., CA, USA pp. 112
R.R. Estes, Jr., Center for Image Process. & Integrated Comput., California Univ., Davis, CA, US
V.R. Algazi, Center for Image Process. & Integrated Comput., California Univ., Davis, CA, US pp. 122
Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
Yonggang Fang, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada pp. 132
K. Culik, II, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
J. Kari, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA pp. 142
 | Session 4 |
H. Nagumo, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
Mi Lu, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
K. Watson, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA pp. 162
D. Belinskaya, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
S. DeAgostino, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
J.A. Storer, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA pp. 172
Kar-Ming Cheung, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
A. Kiely, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA pp. 182
A. Moffat, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
A. Turpin, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
J. Katajainen, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia pp. 192
A. Moffat, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
R. Neal, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
I.H. Witten, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia pp. 202
 | Session 5 |
A. Zandi, RICOH California Res. Center, Menlo Park, CA, USA
J.D. Allen, RICOH California Res. Center, Menlo Park, CA, USA
M. Boliek, RICOH California Res. Center, Menlo Park, CA, USA pp. 212
D. Saupe, Inst. fur Inf., Freiburg Univ., Germany pp. 222
G. Davis, Dept. of Math., Dartmouth Coll., Hanover, NH, USA pp. 232
J. Kominek, Dept. of Comput. Sci., Waterloo Univ., Ont., Canada pp. 242
C.F. Barnes, Georgia Tech. Res. Inst., Atlanta, GA, USA pp. 252
 | Session 6 |
G. Louchard, Lab. d'Inf. Theorique, Univ. Libre de Bruxelles, Belgium
W. Szpankowski, Lab. d'Inf. Theorique, Univ. Libre de Bruxelles, Belgium pp. 262
D.T. Hoang, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
P.M. Long, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
J.S. Vitter, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA pp. 272
Shenfeng Chen, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
J.H. Reif, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA pp. 282
Chia-Yuan Teng, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 292
 | Session 7 |
Zheng Gao, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Feng Chen, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Belzer, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA pp. 312
M. Livny, Dept. of Comput. Sci., Wisconsin Univ., Madison, WI, USA pp. 332
M. Crouse, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
Kannan Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA pp. 342
A. Docef, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
W.C. Chung, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA pp. 352
 | Session 8 |
K.S. Prashant, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
V.J. Mathews, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
P.J. Hahn, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA pp. 371
W.C. Chung, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA pp. 381
A. Nosratinia, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA pp. 391
J.V. Gisladottir, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA pp. 401
R. Neff, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
A. Zakhor, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 411
 | Poster Session |
M. Gamez Lau, Int. Center for Inf. & Electron., INTEREVM, Mosocw, Russia
P. Goga, Int. Center for Inf. & Electron., INTEREVM, Mosocw, Russia pp. 422
J.A. Storer, Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA pp. 423
M. Datcu, DLR, German Aerosp. Res. Establ., Wessling, Germany
G. Schwarz, DLR, German Aerosp. Res. Establ., Wessling, Germany
K. Schmidt, DLR, German Aerosp. Res. Establ., Wessling, Germany
C. Reck, DLR, German Aerosp. Res. Establ., Wessling, Germany pp. 424
R. Brown, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
A.F. Boden, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA pp. 426
A.F. Boden, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA pp. 427
K. Pawlikowski, Dept. of Comput. Sci., Canterbury Univ., Christchurch, New Zealand
T. Bell, Dept. of Comput. Sci., Canterbury Univ., Christchurch, New Zealand
H. Emberson, Dept. of Comput. Sci., Canterbury Univ., Christchurch, New Zealand
P. Ashton, Dept. of Comput. Sci., Canterbury Univ., Christchurch, New Zealand pp. 430
Bongjin Jung, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
W.P. Burleson, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA pp. 431
J. Kanai, ISRI, UNLV, Las Vegas, NV, USA
G. Nagy, ISRI, UNLV, Las Vegas, NV, USA
H. Bunke, ISRI, UNLV, Las Vegas, NV, USA pp. 432
A. Mehes, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K. Zeger, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA pp. 433
S.P. Kim, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
X. Ginesta, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA pp. 434
Junchen Du, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
S.P. Kim, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA pp. 435
C.W. Barrett, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
R.L. Frost, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA pp. 436
Chi-Hung Chi, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Chi-Kwun Kan, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Kwok-Shing Cheng, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Ling Wong, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong pp. 437
M. Aizu, Dai Nippon Printing Co. Ltd., Tokyo, Japan
O. Nakagawa, Dai Nippon Printing Co. Ltd., Tokyo, Japan
M. Takagi, Dai Nippon Printing Co. Ltd., Tokyo, Japan pp. 439
A. Sri-Krishna, Center for Adv. Comput. Studies, Univ. of Southwestern Louisiana, Lafayette, LA, USA
Cheehung Chu, Center for Adv. Comput. Studies, Univ. of Southwestern Louisiana, Lafayette, LA, USA
M. Bayoumi, Center for Adv. Comput. Studies, Univ. of Southwestern Louisiana, Lafayette, LA, USA pp. 441
J. Tarhio, Dept. of Comput. Sci., Helsinki Univ., Finland pp. 442
M.J. Ruf, German Aerosp. Res. Establ., Wessling, Germany pp. 443
M.W. Maier, Dept. of Electr. & Comput. Eng., Alabama Univ., Huntsville, AL, USA pp. 444
J. Kovacevic, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
R.J. Safranek, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
E.M. Yeh, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA pp. 446
A. Kiely, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
F. Pollara, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA pp. 447
J. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
R. Jain, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Belzer, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
W. Boring, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
C. Chien, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
C. Jones, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Liao, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
S. Molloy, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
S. Nazareth, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Schoner, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Short, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA pp. 448
G. Galvagno, Dipartimento di Elettronica e Inf., Padova Univ., Italy
G.A. Mian, Dipartimento di Elettronica e Inf., Padova Univ., Italy
R. Rinaldo, Dipartimento di Elettronica e Inf., Padova Univ., Italy pp. 449
A.G. Al-Araj, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
K. Sayood, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA pp. 450
M. Bauer, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
K. Sayood, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA pp. 451
K. Sayood, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA pp. 452
Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada pp. 453
V. Nuri, Los Alamos Nat. Lab., NM, USA pp. 454
S. Kwong, Dept. of Comput. Sci., City Univ. of New York, NY, USA
K.F Man, Dept. of Comput. Sci., City Univ. of New York, NY, USA pp. 455
N.D. Memon, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
K. Sayood, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA pp. 457
J.E. Fowler, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R. Yagel, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA pp. 458
A. Bist, Rockwell Int. Corp., Newport Beach, CA, USA pp. 459
K. Ferens, Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
W. Kinsner, Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada pp. 460
W. Kinsner, Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
L. Wall, Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada pp. 461
A. Bookstein, Center for Inf. & Language Studies, Chicago Univ., IL, USA
S.T. Klein, Center for Inf. & Language Studies, Chicago Univ., IL, USA
T. Raita, Center for Inf. & Language Studies, Chicago Univ., IL, USA
P. Lankinen, Center for Inf. & Language Studies, Chicago Univ., IL, USA
C.W. Sze, Center for Inf. & Language Studies, Chicago Univ., IL, USA pp. 462
T. Acharya, Inst. of Syst. Res., Maryland Univ., College Park, MD, USA
A. Mukherjee, Inst. of Syst. Res., Maryland Univ., College Park, MD, USA pp. 463
P.M. Fenwick, Dept. of Comput. Sci., Auckland Univ., New Zealand
S.A. Woolford, Dept. of Comput. Sci., Auckland Univ., New Zealand pp. 465
J. Vaisey, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
M. Trumbo, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada pp. 466
Shen-Chuan Tai, Inst. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan pp. 467
Tong Lai Yu, Dept. of Comput. Sci., California State Univ., San Bernardino, CA, USA pp. 468
O. Kiselyov, Dept. of Comput. Sci., North Texas Univ., Denton, TX, USA
P. Fisher, Dept. of Comput. Sci., North Texas Univ., Denton, TX, USA pp. 470
H. Raittinen, Dept. of Electr. Eng., Tampere Univ. of Technol., Finland
K. Kaski, Dept. of Electr. Eng., Tampere Univ. of Technol., Finland pp. 471
S. Bhattacharjee, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Kharagpur, India
J. Bhattacharya, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Kharagpur, India
P.P. Chaudhuri, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Kharagpur, India pp. 472
Y. Okada, Holography & Color Imaging Lab., Fujitsu Labs. Ltd., Japan
N. Satoh, Holography & Color Imaging Lab., Fujitsu Labs. Ltd., Japan
K. Murashita, Holography & Color Imaging Lab., Fujitsu Labs. Ltd., Japan
S. Yoshida, Holography & Color Imaging Lab., Fujitsu Labs. Ltd., Japan pp. 473
W.K. Ng, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
C.V. Ravishankar, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 474
Jianhua Lin, Div. of Comput. Sci., Eastern Connecticut State Univ., Willimantic, CT, USA pp. 477
Kwok Wing Sum, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
R.D. Murch, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong pp. 478
H.J. Lee, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
J.C. Liu, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
A.K. Chan, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
C.K. Chui, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA pp. 479
J.G. Cleary, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand
W.J. Teahan, Dept. of Comput. Sci., Waikato Univ., Hamilton, New Zealand pp. 480
M.J. Turner, Image Res. Centre, De Montfort Univ., Leicester, UK pp. 481
D.E. Tamir, Comput. Sci. Program, Florida Inst. of Technol., Melbourne, FL, USA
Chi-Yeon Park, Comput. Sci. Program, Florida Inst. of Technol., Melbourne, FL, USA
Wook-Sung Yoo, Comput. Sci. Program, Florida Inst. of Technol., Melbourne, FL, USA pp. 482
A. Mohammed, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA
K. Sayood, Dept. of Electr. Eng., Nebraska Univ., Lincoln, NE, USA pp. 483
G. Kedem, Dept. of Comput. Sci. & Electr. Eng., North Carolina Univ., Durham, NC, USA
T. Alexander, Dept. of Comput. Sci. & Electr. Eng., North Carolina Univ., Durham, NC, USA pp. 484 Usage of this product signifies your acceptance of the Terms of Use.
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