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2000 IEEE International Workshop on Defect Based Testing
Montreal, Canada
April 30-April 30
ISBN: 0-7695-0637-2
Table of Contents
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Session 1: Deep Sub-Micron IDDQ Testing
Y. Tsiatouhas, ISD S.A., Chalandri, Greece; University of Patras, Greece
Y. Moisiadis, Uniersity of Athens, Athens, Greece
Th. Haniotakis, Uniersity of Athens, Athens, Greece; University of Patras, Greece
D. Nikolos, University of Patras, Greece
A. Arapoyanni, Uniersity of Athens, Athens, Greece
pp. 9
Session 2: Defect Oriented Testing
J. Khare, Level One Communications,Sacramento, CA
H. T. Heineken, Level One Communications,Sacramento, CA
pp. 23
A. Rao, PalmChip Corporation, Loveland, CO
A. P. Jayasumana, Colorado State University, Fort Collins
Y. K. Malaiya, Colorado State University, Fort Collins
pp. 30
Session 3: Current Measurement And Yield
Hugo Cheung, Burr-Brown Corporation, Tucson, AZ
Sandeep K. Gupta, University of Southern California, Los Angeles, CA
pp. 45
Patricia A. Smith, Sandia National Laboratories, Albuquerque, NM
David V. Campbell, Sandia National Laboratories, Albuquerque, NM
pp. 51
M. Rosales, Balearic Islands University, Spain
I. de Pa?, Balearic Islands University, Spain
J. Segura, Balearic Islands University, Spain
C. F. Hawkins, The University of New Mexico and Sandia National Labs.
J. Soden, Sandia National Labs.
pp. 57
Session 4: Current and Voltage Test Techniques
Masaki Hashizume, The Univ. of Tokushima, Japan
Hiroshi Hoshika, The Univ. of Tokushima, Japan
Hiroyuki Yotsuyanagi, The Univ. of Tokushima, Japan
Takeomi Tamesada, The Univ. of Tokushima, Japan
pp. 70
Cecilia Metra, D.E.I.S. University of Bologna, Italy
Michele Favalli, D.I. University of Ferrara, Italy
Bruno Ricc?, D.E.I.S. University of Bologna, Italy
pp. 76
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