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- 2008
- 2008 Design, Automation and Test in Europe
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2008 Design, Automation and Test in Europe Munich, Germany March 10-March 14 ISBN: 978-3-9810801-3-1 Table of Contents
 | Papers |
Ken Choi, Illinois Institute of Technology, US pp. xliii
Giovanni De Micheli, Professor and Director of the Institute of Electrical Engineering and of the Integrated Systems Centre at EPFL, Lausanne, Switzerland pp. 1
Yonghyun Hwang, Center for Embedded Computer Systems, University of California, Irvine, 92617-2625. e-mail: yonghyuh@uci.edu
Samar Abdi, Center for Embedded Computer Systems, University of California, Irvine, 92617-2625. e-mail: sabdi@uci.edu
Daniel Gajski, Center for Embedded Computer Systems, University of California, Irvine, 92617-2625. e-mail: gajski@uci.edu pp. 3-8
Jerome Cornet, VERIMAG. Centre Équation - 2, avenue de Vignate, 38610 GI
Laurent Maillet-Contoz, STMicroelectronics, System Platforms Group., 12 rue Jules Horowitz - B.P. 217, 38019 GRENOBLE Cedex ¿ France. laurent.maillet-contoz@st.com pp. 9-14
Nicola Bombieri, Dipartimento di Informatica, Università di Verona, Italy. bombieri@sci.univr.it
Nicola Deganello, Dipartimento di Informatica, Università di Verona, Italy. deganello@sci.univr.it
Franco Fummi, Dipartimento di Informatica, Università di Verona, Italy. fummi@sci.univr.it pp. 15-20
Walter FuB, Thales Rail Signalling Solutions GesmbH, AU pp. 21-25
Jan Freuer, Robert Bosch GmbH, Automotive Electronics, Division AE/EIM3, Reutlingen, Germany
Goran Jerke, Robert Bosch GmbH, Automotive Electronics, Division AE/EIM3, Reutlingen, Germany
Joachim Gerlach, Robert Bosch GmbH, Automotive Electronics, Division AE/EIM3, Reutlingen, Germany pp. 26-31
Wido Kruijtzer, NXP Semiconductors, The Netherlands. Wido.Kruijtzer@nxp.com
Jan Stuyt, NXP Semiconductors, The Netherlands pp. 32-37
Timo Vogt, Microelectronic Systems Design Research Group, University of Kaiserslautern, 67663 Kaiserslautern, Germany. vogt@eit.uni-kl.de
Norbert Wehn, Microelectronic Systems Design Research Group, University of Kaiserslautern, 67663 Kaiserslautern, Germany. wehn@eit.uni-kl.de pp. 38-43
Ben Cope, Department of Electrical&Electronic Engineering, Imperial College London
Peter Y.K. Cheung, Department of Electrical&Electronic Engineering, Imperial College London
Wayne Luk, Department of Computing, Imperial College London pp. 44-49
Katarina Paulsson, Universität Karlsruhe (TH), Germany. paulsson@itiv.uni-karlsruhe.de
Michael Hubner, Universität Karlsruhe (TH), Germany. huebner@itiv.uni-karlsruhe.de
Jurgen Becker, Universität Karlsruhe (TH), Germany. becker@itiv.uni-karlsruhe.de pp. 50-55
B. Neumann, Chair of Electrical Engineering and Computer Systems, RWTH Aachen University, Schinkelstr. 2, 52062 Aachen, Germany. email: neumann@eecs.rwth-aachen.de
T. von Sydow, Chair of Electrical Engineering and Computer Systems, RWTH Aachen University, Schinkelstr. 2, 52062 Aachen, Germany. email: sydow@eecs.rwth-aachen.de
H. Blume, Chair of Electrical Engineering and Computer Systems, RWTH Aachen University, Schinkelstr. 2, 52062 Aachen, Germany. email: blume@eecs.rwth-aachen.de
T. G. Noll, Chair of Electrical Engineering and Computer Systems, RWTH Aachen University, Schinkelstr. 2, 52062 Aachen, Germany. email: tgn@eecs.rwth-aachen.de pp. 56-61
A. Tchegho, Institute of Electronic Design Automation, Technische Universitaet Muenchen, Munich, Germany. aurelien.tchegho@tum.de
H. Mattes, Dept. of Analog Design for Test, Infineon Technologies, Munich, Germany. heinz.mattes@infineon.com
S. Sattler, Dept. of Analog Design for Test, Infineon Technologies, Munich, Germany. sebastian.sattler@infineon.com pp. 62-67
Jeanne Tongbong, TIMA Laboratory/CNRS, 46 Av. Félix Viallet, 38031 Grenoble, France
Salvador Mir, TIMA Laboratory/CNRS, 46 Av. Félix Viallet, 38031 Grenoble, France pp. 68-73
Amir Zjajo, NXP Semiconductors Research, HighTech Campus 37, 5656 AE Eindhoven, The Netherlands. e-mail: amir.zjajo@nxp.com
Jose Pineda de Gyvez, NXP Semiconductors Research, HighTech Campus 37, 5656 AE Eindhoven, The Netherlands; Eindhoven University of Technology, Den Dolech 2, 5612 AZ Eindhoven, The Netherlands pp. 74-79
Manuel J. Barragan, Instituto de Microelectrónica de Sevilla/Centro Nacional de Microelectrónica/Consejo Superior de, Investigaciones Científicas (IMSE-CNM-CSIC)/Universidad de Sevilla, Ed. CICA-CNM,
Diego Vazquez, Instituto de Microelectrónica de Sevilla/Centro Nacional de Microelectrónica/Consejo Superior de, Investigaciones Científicas (IMSE-CNM-CSIC)/Universidad de Sevilla, Ed. CICA-CNM,
Adoracion Rueda, Instituto de Microelectrónica de Sevilla/Centro Nacional de Microelectrónica/Consejo Superior de, Investigaciones Científicas (IMSE-CNM-CSIC)/Universidad de Sevilla, Ed. CICA-CNM, pp. 80-85
Nicolas Coste, STMicroelectronics, Grenoble, France. nicolas.coste@st.com
Holger Hermanns, Saarland University, Saarbrücken, Germany. hermanns@cs.uni-sb.de
Meriem Zidouni, Bull, Les Clayes-sous-Bois, France. meriem.zidouni@bull.net pp. 88-89
Lucia Cloth, University of Twente, 7500 AE Enschede, The Netherlands. lucia@cs.utwente.nl pp. 90-91
Ying Tan, Department of Electrical and Computer Engineering, Binghamton University, State University of New York, Binghamton, New York 13902, USA. ying@binghamton.edu
Qinru Qiu, Department of Electrical and Computer Engineering, Binghamton University, State University of New York, Binghamton, New York 13902, USA. qqiu@binghamton.edu pp. 92-97
Yu Zhou, Department of EECS, Case Western Reserve University. yxz77@case.edu
Somnath Paul, Department of EECS, Case Western Reserve University. sxp190@case.edu
Swarup Bhunia, Department of EECS, Case Western Reserve University. skb21@case.edu pp. 98-103
Luca Benini, University of Bologna, Italy. luca.benini@unibo.it
Clemens Moser, Swiss Federal Institute of Technology Zurich. moser@tik.ee.ethz.ch
Lothar Thiele, Swiss Federal Institute of Technology Zurich. thiele@tik.ee.ethz.ch pp. 104-109
Almir Mutapcic, Department of Electrical Engineering, Stanford University, USA. almirm@tanford.edu
David Atienza, LSI, EPFL, Switzerland; DACYA, Complutense University of Madrid (UCM), Spain. david.atienza@epfl.ch
Rajesh Gupta, Department of Computer Science and Engineering, UCSD, USA. rgupta@ucsd.edu
Stephen Boyd, Department of Electrical Engineering, Stanford University, USA. boyd@tanford.edu
Luca Benini, DEIS, University of Bologna, Italy. lbenini@deis.unibo.it pp. 110-115
A.H. Ghamarian, Eindhoven University of Technology, Electronic Systems Group. a.h.ghamarian@tue.nl
M.C.W. Geilen, Eindhoven University of Technology, Electronic Systems Group
T. Basten, Eindhoven University of Technology, Electronic Systems Group
S. Stuijk, Eindhoven University of Technology, Electronic Systems Group pp. 116-121
Gunar Schirner, Center of Embedded Computer Systems, University of California Irvine E-mail: hschirne@uci.edu
Rainer Domer, Center of Embedded Computer Systems, University of California Irvine E-mail: doemer@uci.edu pp. 122-127
Michel Vasilevski, University Paris VI, Pierre&Marie Curie LIP6-SoC Laboratory, 75252 Paris, France, michel.vasilevski@lip6.fr
Francois Pecheux, University Paris VI, Pierre&Marie Curie LIP6-SoC Laboratory, 75252 Paris, France, francois.pecheux@lip6.fr
Nicolas Beilleau, University Paris VI, Pierre&Marie Curie LIP6-SoC Laboratory, 75252 Paris, France, nicolas.beilleau@lip6.fr
Hassan Aboushady, University Paris VI, Pierre&Marie Curie LIP6-SoC Laboratory, 75252 Paris, France, hassan.aboushady@lip6.fr
Karsten Einwich, Fraunhofer IIS/EAS, Dresden, Germany. karsten.einwich@eas.iis.fraunhofer.de pp. 134-139
Tobias Massier, Institute for Electronic Design Automation, Technische Universitaet Muenchen
Helmut Graeb, Institute for Electronic Design Automation, Technische Universitaet Muenchen
Ulf Schlichtmann, Institute for Electronic Design Automation, Technische Universitaet Muenchen pp. 140-145
Tom J Kazmierski, School of Electronics and Computer Science, University of Southampton, Southampton, SO17 1BJ, UK. tjk@ecs.soton.ac.uk
Dafeng Zhou, School of Electronics and Computer Science, University of Southampton, Southampton, SO17 1BJ, UK. dz05r@ecs.soton.ac.uk
Bashir M Al-Hashimi, School of Electronics and Computer Science, University of Southampton, Southampton, SO17 1BJ, UK. bmah@ecs.soton.ac.uk pp. 146-151
Sawal Ali, Electronics System Design Group, School of Electronics and Computer Science, University of Southampton, UK. shma05r@ecs.soton.ac.uk
Reuben Wilcock, Electronics System Design Group, School of Electronics and Computer Science, University of Southampton, UK. rw3@ecs.soton.ac.uk
Peter Wilson, Electronics System Design Group, School of Electronics and Computer Science, University of Southampton, UK. prw@ecs.soton.ac.uk
Andrew Brown, Electronics System Design Group, School of Electronics and Computer Science, University of Southampton, UK. adb@ecs.soton.ac.uk pp. 152-157
Michael GlaB, University of Erlangen-Nuremberg, Germany. glass@cs.fau.de
Martin Lukasiewycz, University of Erlangen-Nuremberg, Germany. martin.lukasiewycz@cs.fau.de
Felix Reimann, University of Erlangen-Nuremberg, Germany. felix.reimann@cs.fau.de
Jurgen Teich, University of Erlangen-Nuremberg, Germany. teich@cs.fau.de pp. 158-163
Djones Lettnin, University of Tübingen, Department of Computer Engineering - Sand 13, 72076 Tübingen - Germany; CNPq scholarship holder, Brazil. E-mail: lettnin@informatik.uni-tuebingen.de
Pradeep K. Nalla, University of Tübingen, Department of Computer Engineering - Sand 13, 72076 Tübingen - Germany. E-mail: nalla@informatik.uni-tuebingen.de
Jurgen Ruf, University of Tübingen, Department of Computer Engineering - Sand 13, 72076 Tübingen - Germany. E-mail: ruf@informatik.uni-tuebingen.de
Thomas Kropf, University of Tübingen, Department of Computer Engineering - Sand 13, 72076 Tübingen - Germany. E-mail: kropf@informatik.uni-tuebingen.de
Wolfgang Rosenstiel, University of Tübingen, Department of Computer Engineering - Sand 13, 72076 Tübingen - Germany. E-mail: rosenstiel@informatik.uni-tuebingen.de
Tobias Kirsten, NEC Electronics (Europe) GmbH, Arcadiastrasse 10, 40472 Düsseldorf - Germany. E-mail: Tobias.Kirsten@eu.necel.com
Volker Schonknecht, NEC Electronics (Europe) GmbH, Arcadiastrasse 10, 40472 Düsseldorf - Germany. E-mail: Volker.Schoenknecht@eu.necel.com
Stephan Reitemeyer, NEC Electronics (Europe) GmbH, Arcadiastrasse 10, 40472 Düsseldorf - Germany. E-mail: Stephan.Reitemeyer@eu.necel.com pp. 164-169
Bernd Stube, Mentor Graphics Corporation, System Design Division, Berlin, Germany. Bernd_Stube@mentor.com
Bernd Schroeder, Mentor Graphics Corporation, System Design Division, Berlin, Germany. Bernd_Schroeder@mentor.com
Eckart Hoene, Fraunhofer Institute for Reliability and Microintegration, System Design&Integration, Berlin, Germany. Eckart.Hoene@izm.fraunhofer.de
Andre Lissner, Fraunhofer Institute for Reliability and Microintegration, System Design&Integration, Berlin, Germany. Andre.Lissner@izm.fraunhofer.de pp. 170-175
Nicolas Alt, Technische Universität München, Lehrstuhl für Integrierte Systeme, Theresienstrasse 90, 80333 München, Germany. n.alt@mytum.de
Christopher Claus, Technische Universität München, Lehrstuhl für Integrierte Systeme, Theresienstrasse 90, 80333 München, Germany. christopher.claus@tum.de
Walter Stechele, Technische Universität München, Lehrstuhl für Integrierte Systeme, Theresienstrasse 90, 80333 München, Germany. walter.stechele@tum.de pp. 176-181
Ozgur Sinanoglu, Kuwait University, Math&Computer Science Dept., Safat, Kuwait. ozgur@sci.kuniv.edu.kw
Erik Jan Marinissen, NXP Semiconductors, Corporate Innovation&Technology, Eindhoven, The Netherlands. erik.jan.marinissen@nxp.com pp. 182-187
Anders Larsson, Embedded Systems Laboratory, Linköpings Universitet, SE-582 83 Linköping, Sweden
Erik Larsson, Embedded Systems Laboratory, Linköpings Universitet, SE-582 83 Linköping, Sweden
Krishnendu Chakrabarty, Department of Electrical and Computer Engineering, Duke University, Durham NC 27708, USA
Petru Eles, Embedded Systems Laboratory, Linköpings Universitet, SE-582 83 Linköping, Sweden
Zebo Peng, Embedded Systems Laboratory, Linköpings Universitet, SE-582 83 Linköping, Sweden pp. 188-193
P. Bernardi, Dipartimento di automatica e Informatica, Politecnico di Torino, IT
M. Sonza Reorda, Dipartimento di automatica e Informatica, Politecnico di Torino, IT pp. 194-199
Jelte Peter Vink, Eindhoven University of Technology, Eindhoven, the Netherlands. E-mail: jelte.peter.vink@philips.com
Kees van Berkel, NXP Semiconductors Research, Eindhoven, the Netherlands. E-mail: kees.van.berkel@nxp.com
Pieter van der Wolf, NXP Semiconductors Research, Eindhoven, the Netherlands. E-mail: pieter.van.der.wolf@nxp.com pp. 200-205
Sujan Pandey, NXP Semiconductors Research, Eindhoven, The Netherlands. sujan.pandey@nxp.com
Rolf Drechsler, Dept. of Computer Science, University of Bremen, Germany. drechsle@informatik.uni-bremen.de pp. 206-211
Philip K.F. Holzenspies, University of Twente, Department of Electrical Engineering, Mathematics and Computer Science, P.O. Box 217, 7500 AE Enschede, The Netherlands. p.k.f.holzenspies@utwente.nl
Johann L. Hurink, University of Twente, Department of Electrical Engineering, Mathematics and Computer Science, P.O. Box 217, 7500 AE Enschede, The Netherlands
Jan Kuper, University of Twente, Department of Electrical Engineering, Mathematics and Computer Science, P.O. Box 217, 7500 AE Enschede, The Netherlands
Gerard J.M. Smit, University of Twente, Department of Electrical Engineering, Mathematics and Computer Science, P.O. Box 217, 7500 AE Enschede, The Netherlands pp. 212-217
Sungchan Kim, School of EECS, Seoul National University, Korea. sungchan.kim@iris.snu.ac.kr
Chanik Park, Memory division, Semiconductor Business, Samsung Electronics Co., Korea. ci.park@samsung.com
Soonhoi Ha, School of EECS, Seoul National University, Korea. sha@iris.snu.ac.kr pp. 218-223
Hwisung Jung, Department of Electrical Engineering, University of Southern California, Los Angeles, CA 90089. hwijung@usc.edu
Massoud Pedram, Department of Electrical Engineering, University of Southern California, Los Angeles, CA 90089. pedram@usc.edu pp. 224-229
Clemens Moser, Swiss Federal Institute of Technology Zurich. moser@tik.ee.ethz.ch
Lothar Thiele, Swiss Federal Institute of Technology Zurich. thiele@tik.ee.ethz.ch
Luca Benini, University of Bologna. lbenini@deis.unibo.it pp. 230-235
Shaobo Liu, Department of Electrical and Computer Engineering, Binghamton University, State University of New York, Binghamton, New York 13902, USA. sliu5@binghamton.edu
Qinru Qiu, Department of Electrical and Computer Engineering, Binghamton University, State University of New York, Binghamton, New York 13902, USA. qqiu@binghamton.edu
Qing Wu, Department of Electrical and Computer Engineering, Binghamton University, State University of New York, Binghamton, New York 13902, USA. qwu@binghamton.edu pp. 236-241
Thidapat Chantem, Department of CSE, University of Notre Dame, Notre Dame, IN 46556. tchantem@nd.edu
Robert P. Dick, Department of EECS, Northwestern University, Evanston, IL 60208. dickrp@northwestern.edu
X. Sharon Hu, Department of CSE, University of Notre Dame, Notre Dame, IN 46556. shu@nd.edu pp. 288-293
Karin Avnit, The University of NSW, Sydney, Australia. kavnit@cse.unsw.edu.au
Arcot Sowmya, The University of NSW, Sydney, Australia. sowmya@cse.unsw.edu.au
S. Ramesh, GM India Science Lab, Bangalore India. rameshari1958@gmail.com
Sri Parameswaran, The University of NSW, Sydney, Australia. sridevan@cse.unsw.edu.au pp. 294-299
Arno Moonen, University of Technology, Eindhoven, The Netherlands. A.J.M.Moonen@tue.nl
Jef van Meerbergen, University of Technology, Eindhoven, The Netherlands; Philips Research, Eindhoven, The Netherlands pp. 300-305
Greg Hoover, University of California, Santa Barbara. ghoover@ece.ucsb.edu
Forrest Brewer, University of California, Santa Barbara. forrest@ece.ucsb.edu pp. 306-311
Igor Vytyaz, Oregon State University, Corvallis, Oregon, USA
Un-Ku Moon, Oregon State University, Corvallis, Oregon, USA pp. 312-317
M.M. Gourary, IPPM, Russian Academy of Sciences, 3 Sovetskaya str., Moscow, Russia
S.G. Rusakov, IPPM, Russian Academy of Sciences, 3 Sovetskaya str., Moscow, Russia, rusakov@ippm.ru
S.L. Ulyanov, IPPM, Russian Academy of Sciences, 3 Sovetskaya str., Moscow, Russia
M.M. Zharov, IPPM, Russian Academy of Sciences, 3 Sovetskaya str., Moscow, Russia
B.J. Mulvaney, Freescale Semiconductor Inc., 7700 W. Parmer Lane, Austin, Texas, USA, brian.mulvaney@freescale.com
K.K. Gullapalli, Freescale Semiconductor Inc., 7700 W. Parmer Lane, Austin, Texas, USA pp. 318-323
Sebastian Steinhorst, Department of Computer Science, University of Frankfurt/Main, Germany. steinhorst@em.cs.uni-frankfurt.de
Lars Hedrich, Department of Computer Science, University of Frankfurt/Main, Germany. hedrich@em.cs.uni-frankfurt.de pp. 324-329
Gregory Gailliard, Thales Communications S.A., Colombes, France. gregory.gailliard@fr.thalesgroup.com
Hugues Balp, Thales Communications S.A., Colombes, France. hugues.balp@fr.thalesgroup.com
Michel Sarlotte, Thales Communications S.A., Colombes, France. michel.sarlotte@fr.thalesgroup.com
Francois Verdier, ETIS Lab - UMR CNRS 8051, Cergy-Pontoise, France. verdier@ensea.fr pp. 330-335
L. Sterpone, Politecnico di Torino, Dipartimento di Automatica e Informatica, Torino, Italy. luca.sterpone@polito.it
M. Aguirre, Universidad de Sevilla, Departamento de Ingeniería Electrónica, Sevilla, Spain. aguirre@gtex10.us.es
J. Tombs, Universidad de Sevilla, Departamento de Ingeniería Electrónica, Sevilla, Spain. jon@gtex10.us.es
H. Guzman-Miranda, Universidad de Sevilla, Departamento de Ingeniería Electrónica, Sevilla, Spain. hipolito@gtex10.us.es pp. 336-341
Massimiliano Melani, Department of Information Engineering, University of Pisa, Via Caruso, 56122, Pisa, Italy
Lorenzo Bertini, SensorDynamics AG, Via Giuntini 25, I-56123 Navacchio (Pisa), Italy
Marco De Marinis, SensorDynamics AG, Via Giuntini 25, I-56123 Navacchio (Pisa), Italy
Peter Lange, Fraunhofer Institute for Silicon Technology ISIT, Fraunhoferstrasse 1, D-25524, Itzehoe, Germany
Francesco D'Ascoli, Department of Information Engineering, University of Pisa, Via Caruso, 56122, Pisa, Italy
Luca Fanucci, Department of Information Engineering, University of Pisa, Via Caruso, 56122, Pisa, Italy pp. 342-347
Drew C. Ness, University of Minnesota, Department of Scientific Computation, EECS building, 200 Union St SE, Minneapolis, MN, 55455-0167. dness@ece.umn.edu
David J. Lilja, University of Minnesota, Department of Scientific Computation, EECS building, 200 Union St SE, Minneapolis, MN, 55455-0167; University of Minnesota, Department of Electrical and Co pp. 348-353
Charu Nagpal, Department of EE, Texas A&M University, College Station TX 77843.
Rajesh Garg, Department of EE, Texas A&M University, College Station TX 77843.
Sunil P Khatri, Department of EE, Texas A&M University, College Station TX 77843. pp. 354-359
Wenjing Rao, UC San Diego, CSE Department. wrao@cs.ucsd.edu pp. 360-365
Swaroop Ghosh, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907. ghosh3@ecn.purdue.edu
Patrick Ndai, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907. pndai@ecn.purdue.edu
Kaushik Roy, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907. kaushik@ecn.purdue.edu pp. 366-371
A Dunkels, Swedish Institute of Computer Science, Kista, Sweden pp. 372
Lawrence Leinweber, Dept. of EECS, Case Western Reserve University, Cleveland, USA. lawrence.leinweber@case.edu
Swarup Bhunia, Dept. of EECS, Case Western Reserve University, Cleveland, USA pp. 373-378
Nicola Bombieri, Dipartimento di Informatica, Università di Verona, Italy. nicola.bombieri@univr.it
Franco Fummi, Dipartimento di Informatica, Università di Verona, Italy. franco.fummi@univr.it
Graziano Pravadelli, Dipartimento di Informatica, Università di Verona, Italy. graziano.pravadelli@univr.it pp. 396-401
Weixin Wu, Dept. of Electrical&Computer Engineering, Virginia Tech, Blacksburg, VA. wuw@vt.edu
Michael S. Hsiao, Dept. of Electrical&Computer Engineering, Virginia Tech, Blacksburg, VA. mhsiao@vt.edu pp. 402-407
Joao Marques-Silva, University of Southampton, Electronics&Computer Science, Southampton, UK. jpms@ecs.soton.ac.uk
Jordi Planes, University of Southampton, Electronics&Computer Science, Southampton, UK. jp3@ecs.soton.ac.uk pp. 408-413
Shan Tang, Department of Computer Science&Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong. Email: tangs@cse.cuhk.edu.hk
Qiang Xu, Department of Computer Science&Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong. Email: qxu@cse.cuhk.edu.hk pp. 414-419
Joao M. S. Silva, INESC ID, IST - TU Lisbon, Lisboa, Portugal. jmss@algos.inesc-id.pt
Joel R. Phillips, Cadence Research Labs, Cadence Design Systems, Berkeley, California, U.S.A. jrp@cadence.com
L. Miguel Silveira, INESC ID / Cadence Research Labs, IST - TU Lisbon, Lisboa, Portugal. lms@inesc-id.pt pp. 420-425
Navin Srivastava, Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106
Roberto Suaya, Mentor Graphics, 38334 St. Ismier, Grenoble, France
Kaustav Banerjee, Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106 pp. 426-431
Duo Li, Dept. of Electrical Engineering, University of California, Riverside, CA 92521. dli@ee.ucr.edu
Sheldon X.-D. Tan, Dept. of Electrical Engineering, University of California, Riverside, CA 92521. stan@ee.ucr.edu pp. 432-437
Min Li, Nomadic Embedded System Division, IMEC, Leuven, Belgium. Email: limin@imec.be
Bruno Bougard, Nomadic Embedded System Division, IMEC, Leuven, Belgium. Email: bougardb@imec.be
Weiyu Xu, Department of EE, Caltech, CA, USA. Email: weiyu@caltech.edu
David Novo, Nomadic Embedded System Division, IMEC, Leuven, Belgium. Email: novo@imec.be
Francky Catthoor, Nomadic Embedded System Division, IMEC, Leuven, Belgium. Email: catthoor@imec.be pp. 444-449
Akash Kumar, Eindhoven University of Technology, Eindhoven, The Netherlands. a.kumar@tue.nl
Kees van Berkel, Eindhoven University of Technology, Eindhoven, The Netherlands; NXP Semiconductors, Eindhoven, The Netherlands pp. 450-455
Matthias May, Microelectronic Systems Design Research Group, University of Kaiserslautern, 67663 Kaiserslautern, Germany. may@eit.uni-kl.de
Matthias Alles, Microelectronic Systems Design Research Group, University of Kaiserslautern, 67663 Kaiserslautern, Germany. alles@eit.uni-kl.de
Norbert Wehn, Microelectronic Systems Design Research Group, University of Kaiserslautern, 67663 Kaiserslautern, Germany. wehn@eit.uni-kl.de pp. 456-461
Felix Ng, Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA
Rohit Kapur, Synopsys, Inc., 700 E. Middlefield Rd., Mountain View, CA pp. 462-467
Melanie Elm, Institut für Technische Informatik, Universität Stuttgart, Pfaffenwaldring 47, D-70569 Stuttgart, Germany. elm@iti.uni-stuttgart.de
Hans-Joachim Wunderlich, Institut für Technische Informatik, Universität Stuttgart, Pfaffenwaldring 47, D-70569 Stuttgart, Germany. wu@iti.uni-stuttgart.de pp. 468-473
V. Tenentes, Computer Science Department, University of Ioannina, Greece. tenentes@uoi.gr
X. Kavousianos, Computer Science Department, University of Ioannina, Greece. kabousia@cs.uoi.gr
E. Kalligeros, Information&Communication Systems Engineering Dept., University of the Aegean, Greece. kalliger@aegean.gr pp. 474-479
Jason G. Brown, Center for Silicon System Implementation, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh PA 15213. jgbrown@ece.cmu.edu
Brian Taylor, Center for Silicon System Implementation, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh PA 15213. briant@ece.cmu.edu
R. D. Blanton, Center for Silicon System Implementation, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh PA 15213. blanton@ece.cmu.edu
Larry Pileggi, Center for Silicon System Implementation, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh PA 15213. pileggi@ece.cmu.edu pp. 480-485
Alexandre David, Center for Embedded Software Systems (CISS), Aalborg University, DK-9220 Aalborg, Denmark. adavid@cs.aau.dk
Kim G. Larsen, Center for Embedded Software Systems (CISS), Aalborg University, DK-9220 Aalborg, Denmark. kgl@cs.aau.dk
Shuhao Li, Center for Embedded Software Systems (CISS), Aalborg University, DK-9220 Aalborg, Denmark. li@cs.aau.dk
Brian Nielsen, Center for Embedded Software Systems (CISS), Aalborg University, DK-9220 Aalborg, Denmark. bnielsen@cs.aau.dk pp. 486-491
Jonas Rox, Institute of Computer and Communication Network Engineering, Technical University of Braunschweig, D-38106 Braunschweig / Germany. rox@ida.ing.tu-bs.de
Rolf Ernst, Institute of Computer and Communication Network Engineering, Technical University of Braunschweig, D-38106 Braunschweig / Germany. ernst@ida.ing.tu-bs.de pp. 492-497
L. Gheorghe, Ecole Polytechnique de Montreal, Montreal, Canada. luiza.gheorghe@polymtl.ca
F. Bouchhima, Ecole Polytechnique de Montreal, Montreal, Canada
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H. Boucheneb, Ecole Polytechnique de Montreal, Montreal, Canada pp. 498-503
Lisane B. Brisolara, Institute of Informatics- Federal University of Rio Grande do Sul. lisane@inf.ufrgs.br
Marcio F.S. Oliveira, Institute of Informatics- Federal University of Rio Grande do Sul. mfsoliveira@inf.ufrgs.br
Ricardo Redin, Institute of Informatics- Federal University of Rio Grande do Sul. rmredin@inf.ufrgs.br
Luis C. Lamb, Institute of Informatics- Federal University of Rio Grande do Sul. lamb@inf.ufrgs.br
Luigi Carro, Institute of Informatics- Federal University of Rio Grande do Sul. carro@inf.ufrgs.br
Flavio Wagner, Institute of Informatics- Federal University of Rio Grande do Sul. flavio@inf.ufrgs.br pp. 504-509
H. Kopetz, Technical University of Vienna, Wien, Austria pp. 549-554
Soheil Samii, Department of Computer and Information Science, Linköpings universitet, Sweden. sohsa@ida.liu.se
Sergiu Rafiliu, Department of Computer and Information Science, Linköpings universitet, Sweden. serra@ida.liu.se
Petru Eles, Department of Computer and Information Science, Linköpings universitet, Sweden. petel@ida.liu.se
Zebo Peng, Department of Computer and Information Science, Linköpings universitet, Sweden. zpe@ida.liu.se pp. 556-561
Bao Liu, University of California, San Diego, Computer Science and Engineering Department, 9500 Gilman Dr., La Jolla, CA 92093-0114. Email: bliu@cs.ucsd.edu pp. 562-567
Behnam Amelifard, Department of Electrical Engineering-Systems, University of Southern California, Los Angeles CA 90089. amelifar@usc.edu
Safar Hatami, Department of Electrical Engineering-Systems, University of Southern California, Los Angeles CA 90089. shatami@usc.edu
Hanif Fatemi, Department of Electrical Engineering-Systems, University of Southern California, Los Angeles CA 90089. fatemi@usc.edu
Massoud Pedram, Department of Electrical Engineering-Systems, University of Southern California, Los Angeles CA 90089. pedram@usc.edu pp. 568-573
Amit Goel, Consortium for Embedded Systems, Arizona State University, Tempe, AZ 85281, USA
Sarma Vrudhula, Consortium for Embedded Systems, Arizona State University, Tempe, AZ 85281, USA pp. 574-579
Wangyang Zhang, Dept. Computer Science&Technology, Tsinghua University, Beijing 100084, China
Wenjian Yu, Dept. Computer Science&Technology, Tsinghua University, Beijing 100084, China
Zeyi Wang, Dept. Computer Science&Technology, Tsinghua University, Beijing 100084, China
Zhiping Yu, Institute of Microelectronics, Tsinghua University, Beijing 100084, China
Rong Jiang, Cadence Design Systems Inc., San Jose, CA 95131, USA
Jinjun Xiong, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598, USA pp. 580-585
L. Miguel Silveira, INESC ID / IST / Cadence Research Labs, TU Lisbon, Portugal. lms@inesc-id.pt pp. 586-591
Min Li, Nomadic Embedded System Division, IMEC, Leuven, Belgium. Email: limin@imec.be
David Novo, Nomadic Embedded System Division, IMEC, Leuven, Belgium. Email: novo@imec.be
Bruno Bougard, Nomadic Embedded System Division, IMEC, Leuven, Belgium. Email: bougardb@imec.be
Francky Catthoor, Nomadic Embedded System Division, IMEC, Leuven, Belgium. Email: catthoor@imec.be pp. 598-603
Ralf Koenig, Universitaet Karlsruhe, Institut fuer Technik der Informationsverarbeitung. koenig@itiv.uni-karlsruhe.de
Timo Stripf, Universitaet Karlsruhe, Institut fuer Technik der Informationsverarbeitung. stripf@itiv.uni-karlsruhe.de
Juergen Becker, Universitaet Karlsruhe, Institut fuer Technik der Informationsverarbeitung. becker@itiv.uni-karlsruhe.de pp. 604-609
Philippe Bonnot, Thales Research&Technology, RD 128, 91767 Palaiseau, France. philippe.bonnot@thalesgroup.com
Fabrice Lemonnier, Thales Research&Technology, RD 128, 91767 Palaiseau, France. fabrice.lemonnier@thalesgroup.com
Gilbert Edelin, Thales Research&Technology, RD 128, 91767 Palaiseau, France. gilbert.edelin@thalesgroup.com
Gerard Gaillat, Thales Optronique SA, rue Guynemer, 78283 Guyancourt, France. gerard.gaillat@fr.thalesgroup.com
Olivier Ruch, Thales Optronique SA, rue Guynemer, 78283 Guyancourt, France. olivier.ruch@fr.thalesgroup.com
Pascal Gauget, Thales Optronique SA, rue Guynemer, 78283 Guyancourt, France. pascal.gauget@fr.thalesgroup.com pp. 610-615
Jinjun Xiong, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598. jinjun@us.ibm.com
Vladimir Zolotov, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598. zolotov@us.ibm.com
Chandu Visweswariah, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598. chandu@us.ibm.com
Peter A. Habitz, IBM Systems and Technology Group, Essex Junction, VT 05452. habitz@us.ibm.com pp. 622-627
Piet Engelke, Albert-Ludwigs-University, Institute for Computer Science, Georges-Köhler-Allee 51, 79110 Freiburg im Breisgau, Germany. engelke@informatik.uni-freiburg.de
Ilia Polian, Albert-Ludwigs-University, Institute for Computer Science, Georges-Köhler-Allee 51, 79110 Freiburg im Breisgau, Germany. polian@informatik.uni-freiburg.de
Juergen Schloeffel, NXP Semiconductors GmbH, Design Technology Center, Georg-Heyken-Str. 1, D-21147 Hamburg, Germany. juergen.schloeffel@nxp.com
Bernd Becker, Albert-Ludwigs-University, Institute for Computer Science, Georges-Köhler-Allee 51, 79110 Freiburg im Breisgau, Germany. becker@informatik.uni-freiburg.de pp. 628-633
Yen-Tzu Lin, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh PA 15213. yentzul@ece.cmu.edu
Osei Poku, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh PA 15213
Naresh K. Bhatti, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh PA 15213
R. D. Blanton, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh PA 15213. blanton@ece.cmu.edu pp. 634-639
Maarten H. Wiggers, University of Twente, Enschede, The Netherlands. m.h.wiggers@utwente.nl pp. 640-645
Minyoung Kim, School of Information and Computer Sciences, University of California, Irvine, CA 92697, USA. minyounk@ics.uci.edu
Mark-Oliver Stehr, Computer Science Laboratory, SRI International, Menlo Park, CA 94025, USA. stehr@csl.sri.com
Carolyn Talcott, Computer Science Laboratory, SRI International, Menlo Park, CA 94025, USA. clt@csl.sri.com
Nikil Dutt, School of Information and Computer Sciences, University of California, Irvine, CA 92697, USA. dutt@ics.uci.edu
Nalini Venkatasubramanian, School of Information and Computer Sciences, University of California, Irvine, CA 92697, USA. nalini@ics.uci.edu pp. 646-651
Parth Malani, Department of Electrical and Computer Engineering, Binghamton University, Binghamton, NY 13902. parth@binghamton.edu
Prakash Mukre, Department of Electrical and Computer Engineering, Binghamton University, Binghamton, NY 13902. pmukre1@binghamton.edu
Qinru Qiu, Department of Electrical and Computer Engineering, Binghamton University, Binghamton, NY 13902. qqiu@binghamton.edu
Qing Wu, Department of Electrical and Computer Engineering, Binghamton University, Binghamton, NY 13902. qwu@binghamton.edu pp. 652-657
K Glinos, ENIAC Representative, European Commission, Brussels
D Beenaert, ENIAC Representative, European Commission, Brussels
L Gide, ENIAC Representative, Thales, France pp. 658
R Wilhelm, Saarland University, Saarbrücken, Germany
R Ernst, TU Braunschweig, Braunschweig Germany pp. 659-663
Stephen M. Plaza, EECS Department, University of Michigan, Ann Arbor, MI 48109-2121. splaza@umich.edu
Igor L. Markov, EECS Department, University of Michigan, Ann Arbor, MI 48109-2121. imarkov@umich.edu
Valeria Bertacco, EECS Department, University of Michigan, Ann Arbor, MI 48109-2121. valeria@umich.edu pp. 664-669
Ilya Wagner, Advanced Computer Architecture Lab, University of Michigan, Ann Arbor, MI 48109. iwagner@umich.edu
Valeria Bertacco, Advanced Computer Architecture Lab, University of Michigan, Ann Arbor, MI 48109. valeria@umich.edu pp. 670-675
Patrice Gerin, System-Level Synthesis Group, TIMA Laboratory, 46, Av Félix Viallet, 38031 Grenoble, France
Xavier Guerin, System-Level Synthesis Group, TIMA Laboratory, 46, Av Félix Viallet, 38031 Grenoble, France
Frederic Petrot, System-Level Synthesis Group, TIMA Laboratory, 46, Av Félix Viallet, 38031 Grenoble, France pp. 676-681
Xueqi Cheng, Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA, 24061, USA. xcheng@vt.edu
Michael S. Hsiao, Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA, 24061, USA. mhsiao@vt.edu pp. 682-687
Massoud Momeni, Technische Universität Darmstadt, Department of Electrical Engineering and Information Technology, Institute of Microelectronic Systems, Karlstraße 15, D-64283 Darmstadt, Germany.
Petru Bogdan Bacinschi, Technische Universität Darmstadt, Department of Electrical Engineering and Information Technology, Institute of Microelectronic Systems, Karlstraße 15, D-64283 Darmstadt, Germany.
Manfred Glesner, Technische Universität Darmstadt, Department of Electrical Engineering and Information Technology, Institute of Microelectronic Systems, Karlstraße 15, D-64283 Darmstadt, Germany. pp. 688-693
Shun Li, ASCI&System State-Key Lab, Fudan University, Shanghai 201203, China
Hua Chen, ASCI&System State-Key Lab, Fudan University, Shanghai 201203, China
Feng Zhou, ASCI&System State-Key Lab, Fudan University, Shanghai 201203, China. fengzhou@fudan.edu.cn pp. 694-697
P. B. Bacinschi, Inst. of Microelectronic Systems, Technische Univ. Darmstadt, Karlstr. 15, 64283 Darmstadt, Germany. pbb@mes.tu-darmstadt.de
T. Murgan, Inst. of Microelectronic Systems, Technische Univ. Darmstadt, Karlstr. 15, 64283 Darmstadt, Germany
K. Koch, Infineon Technologies, Am Campeon 1-12, 85579 Neubiberg, Germany
M. Glesner, Inst. of Microelectronic Systems, Technische Univ. Darmstadt, Karlstr. 15, 64283 Darmstadt, Germany pp. 698-703
Leran Wang, School of Electronics and Computer Science, University of Southampton, UK. lw04r@ecs.soton.ac.uk
Tom J. Kazmierski, School of Electronics and Computer Science, University of Southampton, UK. tjk@ecs.soton.ac.uk
Bashir M. Al-Hashimi, School of Electronics and Computer Science, University of Southampton, UK. bmah@ecs.soton.ac.uk
Steve P. Beeby, School of Electronics and Computer Science, University of Southampton, UK. spb@ecs.soton.ac.uk
Russel N. Torah, School of Electronics and Computer Science, University of Southampton, UK. rnt@ecs.soton.ac.uk pp. 704-709
Bruno Bougard, IMEC, Kapeldreef 75, B-3001 Leuven, Belgium. E-mail: bruno.bougard@imec.be
David Novo, IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
Osman Allam, IMEC, Kapeldreef 75, B-3001 Leuven, Belgium pp. 716-721
D. Novo, IMEC vzw, Kapeldreef 75, 3001 Heverlee, Belgium; KULeuven, 3000 Leuven, Belgium. novo@imec.be
B. Bougard, IMEC vzw, Kapeldreef 75, 3001 Heverlee, Belgium. bougardb@imec.be
A. Lambrechts, IMEC vzw, Kapeldreef 75, 3001 Heverlee, Belgium; KULeuven, 3000 Leuven, Belgium. lambreca@imec.be
L. Van der Perre, IMEC vzw, Kapeldreef 75, 3001 Heverlee, Belgium. vdperre@imec.be
F. Catthoor, IMEC vzw, Kapeldreef 75, 3001 Heverlee, Belgium; KULeuven, 3000 Leuven, Belgium. catthoor@imec.be pp. 722-727
C. P. Ravikumar, Texas Instruments India Pvt. Ltd., Bangalore, India - 560 093
M. Hirech, Synopsys Inc., Mountain View, CA94043, USA
X. Wen, Kyushu Institute of Technology, Iizuka 820-8502, Japan pp. 728-733
Fabrizio Mulas, DMI-University of Cagliari, 32 Via Ospedale, Cagliari, Italy. mulas@unica.it
Michele Pittau, DMI-University of Cagliari, 32 Via Ospedale, Cagliari, Italy. pittau@unica.it
Marco Buttu, DMI-University of Cagliari, 32 Via Ospedale, Cagliari, Italy. buttu@unica.it
Salvatore Carta, DMI-University of Cagliari, 32 Via Ospedale, Cagliari, Italy. salvatore@unica.it
Andrea Acquaviva, DI-University of Verona, Strada le Grazie 15, Verona, Italy. andrea.acquaviva@univr.it
Luca Benini, DEIS - University of Bologna, V.le Risorgimento 2, Bologna, Italy. lbenini@deis.unibo.it pp. 734-739
Olivier Certner, Alchemy Project, INRIA Saclay, France. E-mail: olivier.certner@inria.fr
Zheng Li, Alchemy Project, INRIA Saclay, France. E-mail: zheng.x.li@inria.fr
Pierre Palatin, Alchemy Project, INRIA Saclay, France. E-mail: olivier.temam@inria.fr
Frederic Arzel, Laboratoire d'informatique de Paris 6, Pierre et Marie Curie University (Paris 6), France
Nathalie Drach, Laboratoire d'informatique de Paris 6, Pierre et Marie Curie University (Paris 6), France pp. 740-745
Matin Hashemi, Electrical and Computer Engineering, University of California, Davis, CA 95616, USA. hashemi@ucdavis.edu
Soheil Ghiasi, Electrical and Computer Engineering, University of California, Davis, CA 95616, USA. ghiasi@ucdavis.edu pp. 746-751
Lars Bauer, University of Karlsruhe, CES - Chair for Embedded Systems, Karlsruhe, Germany. lars.bauer@informatik.uni-karlsruhe.de
Muhammad Shafique, University of Karlsruhe, CES - Chair for Embedded Systems, Karlsruhe, Germany. shafique@informatik.uni-karlsruhe.de
Stephanie Kreutz, University of Karlsruhe, CES - Chair for Embedded Systems, Karlsruhe, Germany
Jorg Henkel, University of Karlsruhe, CES - Chair for Embedded Systems, Karlsruhe, Germany. henkel@informatik.uni-karlsruhe.de pp. 752-757
Hai Lin, Dept. of Electrical&Computer Engineering, University of Connecticut, Storrs, CT 06269. E-mail: hal06002@engr.uconn.edu
Yunsi Fei, Dept. of Electrical&Computer Engineering, University of Connecticut, Storrs, CT 06269. E-mail: yfei@engr.uconn.edu pp. 758-763
I-Wei Wu, Dept. of Computer Science, National Chiao Tung University. wuiw@cs.nctu.edu.tw, shiva.cs94g@nctu.edu.tw
Zhi-Yuan Chen, Dept. of Computer Science, National Chiao Tung University. shiva.cs94g@nctu.edu.tw
Jyh-Jiun Shann, Dept. of Computer Science, National Chiao Tung University. jjshann@cs.nctu.edu.tw, shiva.cs94g@nctu.edu.tw
Chung-Ping Chung, Dept. of Computer Science, National Chiao Tung University. cpchung@cs.nctu.edu.tw, shiva.cs94g@nctu.edu.tw pp. 764-769
Talal Bonny, University of Karlsruhe, CES - Chair for Embedded Systems, Karlsruhe, Germany. bonny@informatik.uni-karlsruhe.de
Jorg Henkel, University of Karlsruhe, CES - Chair for Embedded Systems, Karlsruhe, Germany. henkel@informatik.uni-karlsruhe.de pp. 770-775
Chao-Yue Lai, Department of Electrical Engineering, National Taiwan University, Taiwan. colby.lai@gmail.com
Chung-Yang Huang, Department of Electrical Engineering, National Taiwan University, Taiwan. ric@cc.ee.ntu.edu.tw
Kei-Yong Khoo, Cadence Design Systems, Inc., San José California, USA. khoo@cadence.com pp. 813-818
Kuntal Nanshi, Dept. of Electrical and Computer Engineering, University of Colorado at Boulder
Fabio Somenzi, Dept. of Electrical and Computer Engineering, University of Colorado at Boulder pp. 819-824
Tamarah Arons, Intel Israel Design Center. E-mail: Tamarah.Arons@intel.com
Elad Elster, Intel Israel Design Center. E-mail: Elad.Elster@intel.com
Shlomit Ozer, Intel Israel Design Center. E-mail: Shlomit.Ozer@intel.com
Jonathan Shalev, Intel Israel Design Center. E-mail: Jonathan.Shalev@intel.com
Eli Singerman, Intel Israel Design Center. E-mail: Eli.Singerman@intel.com pp. 825-830
Malay K. Ganai, NEC Labs America, Princeton, NJ 08540. malay@nec-labs.com
Aarti Gupta, NEC Labs America, Princeton, NJ 08540. agputa@nec-labs.com pp. 831-836
Tilo Meister, Dresden University of Technology, Dresden, Germany. tilo@ieee.org
Jens Lienig, Dresden University of Technology, Dresden, Germany. jens@ieee.org
Gisbert Thomke, IBM Research&Development, Boeblingen, Germany. thomke@de.ibm.com pp. 837-842
Stephane Badel, Microelectronic Systems Laboratory (LSM) EPFL, CH-1015 Lausanne. E-mail: stephane.badel@epfl.ch
Ozgur Inac, Microelectronic Systems Laboratory (LSM) EPFL, CH-1015 Lausanne
Paolo Vietti, Microelectronic Systems Laboratory (LSM) EPFL, CH-1015 Lausanne
Yusuf Leblebici, Microelectronic Systems Laboratory (LSM) EPFL, CH-1015 Lausanne pp. 843-848
Ashutosh Chakraborty, Department of Electrical and Computer Engineering, The University of Texas at Austin. ashutosh@cerc.utexas.edu
Sean X. Shi, Department of Electrical and Computer Engineering, The University of Texas at Austin. sean.shi@mail.utexas.edu
David Z. Pan, Department of Electrical and Computer Engineering, The University of Texas at Austin. dpan@ece.utexas.edu pp. 849-855
Amith Singhee, Carnegie Mellon University, Pittsburgh, PA, USA. asinghee@ece.cmu.edu
Sonia Singhal, Carnegie Mellon University, Pittsburgh, PA, USA. soniasin@ece.cmu.edu
Rob A. Rutenbar, Carnegie Mellon University, Pittsburgh, PA, USA. rutenbar@ece.cmu.edu pp. 856-861
Alonso Morgado, Instituto de Microelectrónica de Sevilla, IMSE-CNM (CSIC/Universidad de Sevilla), Edif. CICA-CNM, Avda. Reina Mercedes s/n, 41012 Sevilla, SPAIN. alonso@imse.cnm.es
Rocio del Rio, Instituto de Microelectrónica de Sevilla, IMSE-CNM (CSIC/Universidad de Sevilla), Edif. CICA-CNM, Avda. Reina Mercedes s/n, 41012 Sevilla, SPAIN. rocio@imse.cnm.es
Jose M. de la Rosa, Instituto de Microelectrónica de Sevilla, IMSE-CNM (CSIC/Universidad de Sevilla), Edif. CICA-CNM, Avda. Reina Mercedes s/n, 41012 Sevilla, SPAIN. jrosa@imse.cnm.es pp. 862-867
Markus Bingesser, austriamicrosystems AG, Rietstrasse 4, 8640 Rapperswil, Switzerland. markus.bingesser@austriamicrosystems.com
Teddy Loeliger, HSR University of Applied Sciences Rapperswil, 8640 Rapperswil, Switzerland. teddy.loeliger@hsr.ch
Werner Hinn, HSR University of Applied Sciences Rapperswil, 8640 Rapperswil, Switzerland
Johann Hauer, Fraunhofer Institute for Integrated Circuits, 91058 Erlangen, Germany. johann.hauer@iis.fraunhofer.de
Stefan Modl, Fraunhofer Institute for Integrated Circuits, 91058 Erlangen, Germany
Robert Dorn, Fraunhofer Institute for Integrated Circuits, 91058 Erlangen, Germany
Matthias Volker, Fraunhofer Institute for Integrated Circuits, 91058 Erlangen, Germany pp. 868-872
F. D'Ascoli, Dept. of Information Engineering, University of Pisa, Pisa, Italy
L. Bacciarelli, Dept. of Information Engineering, University of Pisa, Pisa, Italy
M. Melani, Dept. of Information Engineering, University of Pisa, Pisa, Italy
L. Fanucci, Dept. of Information Engineering, University of Pisa, Pisa, Italy
G. Ricotti, STMicroelectronics, Cornaredo (Milano), Italy
E. Pardi, SensorDynamics AG, Navacchio (Pisa), Italy
F. Vincis, SensorDynamics AG, Navacchio (Pisa), Italy
M. Forliti, SensorDynamics AG, Navacchio (Pisa), Italy pp. 879-884
Lei Zhang, Key Laboratory of Computer System and Architecture, Institute of Computing Technology, Chinese Academy of Sciences. zlei@ict.ac.cn
Yinhe Han, Key Laboratory of Computer System and Architecture, Institute of Computing Technology, Chinese Academy of Sciences. yinhes@ict.ac.cn
Qiang Xu, Department of Computer Science&Engineering, The Chinese University of Hong Kong. qxu@cse.cuhk.edu.hk
Xiaowei Li, Key Laboratory of Computer System and Architecture, Institute of Computing Technology, Chinese Academy of Sciences. lxw@ict.ac.cn pp. 891-896
Ramtilak Vemu, Computer Engineering Research Center, University of Texas at Austin. rvemu@cerc.utexas.edu
Abhijit Jas, Design and Technology Solutions, Intel Corporation. ajas@intel.com
Jacob A. Abraham, Computer Engineering Research Center, University of Texas at Austin. jaa@cerc.utexas.edu
Srinivas Patil, Design and Technology Solutions, Intel Corporation. spatil@intel.com
Rajesh Galivanche, Design and Technology Solutions, Intel Corporation. rgalivanche@intel.com pp. 897-902
Mihir R. Choudhury, Department of Electrical and Computer Engineering, Rice University, Houston, TX 77005. mihir@rice.edu
Kartik Mohanram, Department of Electrical and Computer Engineering, Rice University, Houston, TX 77005. kmram@rice.edu pp. 903-908
Daniel Iercan, "Politehnica" U. of Timisoara. daniel.iercan@aut.upt.ro pp. 909-914
Viacheslav Izosimov, Dept. of Computer and Information Science, Linköping University. viaiz@ida.liu.se
Paul Pop, Dept. of Informatics and Mathematical Modelling, Technical University of Denmark. Paul.Pop@imm.dtu.dk
Petru Eles, Dept. of Computer and Information Science, Linköping University. petel@ida.liu.se
Zebo Peng, Dept. of Computer and Information Science, Linköping University. zebpe@ida.liu.se pp. 915-920
Jonas Elmqvist, Department of Computer and Information Science, Linköping University, Linköping, Sweden. jonel@ida.liu.se
Simin Nadjm-Tehrani, Department of Computer and Information Science, Linköping University, Linköping, Sweden. simin@ida.liu.se pp. 921-927
Jean-Pierre Talpin, INRIA, Unité de Recherche Rennes-Bretagne-Atlantique, IRISA, Campus de Beaulieu, 35042 Rennes Cedex, France
Julien Ouy, INRIA, Unité de Recherche Rennes-Bretagne-Atlantique, IRISA, Campus de Beaulieu, 35042 Rennes Cedex, France
Loic Besnard, INRIA, Unité de Recherche Rennes-Bretagne-Atlantique, IRISA, Campus de Beaulieu, 35042 Rennes Cedex, France
Paul Le Guernic, CNRS, UMR 6074, IRISA, Campus de Beaulieu, 35042 Rennes Cedex, France pp. 928-933
Frank Badstubner, Infineon Technologies AG, DE, (PRODUKTIV+project coordination) pp. 934-935
Peter Leppelt, Institute of Microelectronic Systems, EDA Group, Leibniz University Hannover, DE
Erich Barke, Institute of Microelectronic Systems, EDA Group, Leibniz University Hannover, DE pp. 935
Axel Hahn, OFFIS, University of Oldenburg, Oldenburg, DE pp. 935-936
Slava Bulach, GmbH, Wolfgang Rosenstiel, University Tuebingen, DE
Robert Bosch, GmbH, Wolfgang Rosenstiel, University Tuebingen, DE pp. 937-938
Jacob A. Abraham, The University of Texas at Austin, Austin, Texas, U.S.A. jaa@cerc.utexas.edu pp. 940
Subhasish Mitra, Departments of Electrical Engineering and Computer Science, Stanford University, Stanford, CA pp. 941-946
Ute Wappler, Technische Universtät Dresden. ute.wappler@inf.tu-dresden.de pp. 947-952
Albrecht Mayer, Infineon Technologies, Am Campeon 1-12, 85579 Neubiberg, Germany. albrecht.mayer@infineon.com
Frank Hellwig, Infineon Technologies, Am Campeon 1-12, 85579 Neubiberg, Germany. frank.hellwig@infineon.com pp. 962-966
Luca Benini, DEIS, University of Bologna, 40136 Bologna, Italy.
Enrico Macii, DAUIN, Politecnico di Torino, 10129 Torino, Italy. pp. 967-972
Rajesh Garg, Department of Electrical&Computer Engineering, Texas A&M University, College Station TX 77843. rajeshgarg@tamu.edu
Gagandeep Mallarapu, Department of Electrical&Computer Engineering, Texas A&M University, College Station TX 77843. gagandeepm@tamu.edu
Sunil P Khatri, Department of Electrical&Computer Engineering, Texas A&M University, College Station TX 77843. sunilkhatri@tamu.edu pp. 979-984
Anca M. Molnos, NXP Semiconductors / Corporate I&T, HTC 37, Eindhoven, The Netherlands. anca.molnos@nxp.com
Marc J.M. Heijligers, NXP Semiconductors / Corporate I&T, HTC 37, Eindhoven, The Netherlands. marc.heijligers@nxp.com
Sorin D. Cotofana, Technical University of Delft, Mekelweg 4, Delft, The Netherlands. s.d.cotofana@ewi.tudelft.nl pp. 991-996
Frederic Petrot, System-Level Synthesis Group, TIMA Laboratory, 46, Av Félix Viallet, 38031 Grenoble, France pp. 997-1002
S. Ogg, University of Southampton. so04r@ecs.soton.ac.uk pp. 1003-1008
Robert Wille, Group for Computer Architecture (Prof. Dr. Rolf Drechsler), University of Bremen, 28359 Bremen, Germany. rwille@informatik.uni-bremen.de
Hoang M. Le, Group for Computer Architecture (Prof. Dr. Rolf Drechsler), University of Bremen, 28359 Bremen, Germany. hle@informatik.uni-bremen.de
Gerhard W. Dueck, Faculty of Computer Science, University of New Brunswick, Fredericton, NB, Canada. gdueck@unb.ca
Daniel GroBe, Group for Computer Architecture (Prof. Dr. Rolf Drechsler), University of Bremen, 28359 Bremen, Germany. grosse@informatik.uni-bremen.de pp. 1015-1020
Nicholas Allec, ECE Department, Queen's University, Kingston, ON K7L 3N6, Canada. nicholas.allec@ece.queensu.ca
Robert Knobel, Physics Department, Queen's University, Kingston, ON K7L 3N6, Canada. knobel@physics.queensu.ca
Li Shang, ECE Department, University of Colorado at Boulder, Boulder, CO 80309, U.S.A. li.shang@colorado.edu pp. 1021-1026
Francisco J. Rincon, DACYA/Universidad Complutense, Madrid, Spain. E-mail: francisco.rincon@fdi.ucm.es
Michele Paselli, IMEC-NL, Eindhoven, The Netherlands. E-mail: michele.paselli@imec-nl.nl
Joaquin Recas, DACYA/Universidad Complutense, Madrid, Spain. E-mail: jrecas@fis.ucm.es
Qin Zhao, IMEC-NL, Eindhoven, The Netherlands. E-mail: qin.zhao@imec-nl.nl
David Atienza, DACYA/Universidad Complutense, Madrid, Spain; LSI/EPFL, Lausanne, Switzerland. E-mail: datienza@dacya.ucm.es, david.atienza@epfl.ch
Julien Penders, IMEC-NL, Eindhoven, The Netherlands. E-mail: julien.penders@imec-nl.nl pp. 1027-1032
Alejandro Masrur, Institute for Real-Time Computer Systems, Technische Universität München, Germany. Alejandro.Masrur@rcs.ei.tum.de
Sebastian Drossler, Institute for Real-Time Computer Systems, Technische Universität München, Germany. Sebastian.Droessler@rcs.ei.tum.de
Georg Farber, Institute for Real-Time Computer Systems, Technische Universität München, Germany. Georg.Faerber@rcs.ei.tum.de pp. 1033-1038
Antonino Tumeo, Politecnico di Milano - DEI, Via Ponzio 34/5, 20133 Milano, Italy
Marco Branca, Politecnico di Milano - DEI, Via Ponzio 34/5, 20133 Milano, Italy
Lorenzo Camerini, Politecnico di Milano - DEI, Via Ponzio 34/5, 20133 Milano, Italy
Marco Ceriani, Politecnico di Milano - DEI, Via Ponzio 34/5, 20133 Milano, Italy
Gianluca Palermo, Politecnico di Milano - DEI, Via Ponzio 34/5, 20133 Milano, Italy
Donatella Sciuto, Politecnico di Milano - DEI, Via Ponzio 34/5, 20133 Milano, Italy pp. 1039-1044
Claas Diederichs, INCHRON GmbH, 14482 Potsdam, Germany. claas.diederichs@inchron.de
Ulrich Margull, 1 mal 1 Software GmbH, 90762 Fürth, Germany. margull@1mal1.com
Frank Slomka, University of Ulm, 89069 Ulm, Germany. frank.slomka@uni-ulm.de
Gerhard Wirrer, SiemensVDO AG, 93055 Regensburg. gerhard.wirrer@siemens.com pp. 1045-1050
Jason Cong, UCLA Computer Science Department, Los Angeles, CA 90095, USA. cong@cs.ucla.edu
Junjuan Xu, UCLA Computer Science Department, Los Angeles, CA 90095, USA. irene.xu@cs.ucla.edu pp. 1057-1062
Feng Wang, The Pennsylvania State University, University Park, PA, USA. fenwang@cse.psu.edu
Guangyu Sun, The Pennsylvania State University, University Park, PA, USA. gsun@cse.psu.edu
Yuan Xie, The Pennsylvania State University, University Park, PA, USA. yuanxie@cse.psu.edu pp. 1063-1068
Jarrod A. Roy, The University of Michigan, Department of EECS, 2260 Hayward Ave., Ann Arbor, MI 48109-2121
Farinaz Koushanfar, Rice University, ECE and CS Departments, 6100 South Main, Houston, TX 77005
Igor L. Markov, The University of Michigan, Department of EECS, 2260 Hayward Ave., Ann Arbor, MI 48109-2121 pp. 1069-1074
Adeel Israr, Dept. of Computer Science, TU Darmstadt, Darmstadt, Germany. israr@iss.tu-darmstadt.de
Sorin A. Huss, Dept. of Computer Science, TU Darmstadt, Darmstadt, Germany. huss@iss.tu-darmstadt.de pp. 1111-1116
Petru Eles, Dept. of Computer and Information Science, Linköping University, SE-581 83 Linköping, Sweden. petel@ida.liu.se
Viacheslav Izosimov, Dept. of Computer and Information Science, Linköping University, SE-581 83 Linköping, Sweden. viaiz@ida.liu.se
Paul Pop, Dept. of Informatics and Mathematical Modelling, Technical University of Denmark, DK-2800 Kongens Lyngby, Denmark. Paul.Pop@imm.dtu.dk
Zebo Peng, Dept. of Computer and Information Science, Linköping University, SE-581 83 Linköping, Sweden. zebpe@ida.liu.se pp. 1117-1122
Pieter van der Wolf, NXP Semiconductors Research, Eindhoven, The Netherlands. pieter.van.der.wolf@nxp.com pp. 1124-1125
Dinesh Pamunuwa, Centre for Microsystems Engineering, Department of Engineering, Lancaster University, Lancaster, UK. d.pamunuwa@lancaster.ac.uk pp. 1126-1127
Nikil Dutt, Center for Embedded Computer Systems, Donald Bren School of Information and Computer Sciences, University of California, Irvine, CA 92697-3435. dutt@uci.edu pp. 1128-1129
Jinjun Xiong, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598. jinjun@us.ibm.com
Vladimir Zolotov, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598. zolotov@us.ibm.com
Chandu Visweswariah, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598. chandu@us.ibm.com pp. 1130-1135
Sean X. Shi, Department of ECE, University of Texas, Austin TX 78712. xshi@ece.utexas.edu
Anand Ramalingam, Department of ECE, University of Texas, Austin TX 78712. anandram@ece.utexas.edu
Daifeng Wang, Department of ECE, University of Texas, Austin TX 78712. wang@ece.utexas.edu
David Z. Pan, Department of ECE, University of Texas, Austin TX 78712. dpan@ece.utexas.edu pp. 1136-1141
Andrey Mokhov, Microelectronics System Design Group, School of EECE, Newcastle University, UK. andrey.mokhov@ncl.ac.uk
Alex Yakovlev, Microelectronics System Design Group, School of EECE, Newcastle University, UK. alex.yakovlev@ncl.ac.uk pp. 1142-1147
Janar Thoguluva, NEC Laboratories America, 4 Independence Way, Princeton, NJ 08540; Alphion Corporation pp. 1148-1153
Xi Chen, Electrical Engineering and Computer Science Department, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208
Robert P. Dick, Electrical Engineering and Computer Science Department, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208
Alok Choudhary, Electrical Engineering and Computer Science Department, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208 pp. 1154-1159
Abhishek Das, Electrical Engineering and Computer Science Department, Northwestern University, Evanston IL, USA
Sanchit Misra, Electrical Engineering and Computer Science Department, Northwestern University, Evanston IL, USA
Sumeet Joshi, Department of Electronics and Electrical Communications, Indian Institute of Technology, Kharagpur, India
Joseph Zambreno, Electrical and Computer Engineering Department, Iowa State University, Ames, IA, USA
Gokhan Memik, Electrical Engineering and Computer Science Department, Northwestern University, Evanston IL, USA
Alok Choudhary, Electrical Engineering and Computer Science Department, Northwestern University, Evanston IL, USA pp. 1160-1165
Irith Pomeranz, School of Electrical&Computer Eng., Purdue University, W. Lafayette, IN 47907, U.S.A.
Sudhakar M. Reddy, Electrical&Computer Eng. Dept., University of Iowa, Iowa City, IA 52242, U.S.A. pp. 1166-1171
Jeremy Lee, ECE Department, University of Connecticut. jslee@engr.uconn.edu
Sumit Narayan, ECE Department, University of Connecticut. sumitn@engr.uconn.edu
Mike Kapralos, ECE Department, University of Connecticut. mikepk@engr.uconn.edu pp. 1172-1177
Shideh Shahidi, Department of EE-Systems, University of Southern California, Los Angeles, CA 90089. sshahidi@poisson.usc.edu
Sandeep Gupta, Department of EE-Systems, University of Southern California, Los Angeles, CA 90089. sandeep@poisson.usc.edu pp. 1178-1183
Jia Li, Key Laboratory of Computer System and Architecture, ICT, CAS, Beijing, China; Graduate University of Chinese Academy of Sciences, Beijing, China. gracelee@ict.ac.cn
Qiang Xu, Dept. of Computer Science&Engineering, The Chinese University of Hong Kong. qxu@cse.cuhk.edu.hk
Yu Hu, Key Laboratory of Computer System and Architecture, ICT, CAS, Beijing, China. huyu@ict.ac.cn, gracelee@ict.ac.cn
Xiaowei Li, Key Laboratory of Computer System and Architecture, ICT, CAS, Beijing, China. lxw@ict.ac.cn, gracelee@ict.ac.cn pp. 1184-1189
Sanghyun Park, SO&R Research Group, Seoul National University, Korea. shpark@optimizer.snu.ac.kr
Aviral Shrivastava, CML Research Group, Arizona State University, USA. Aviral.Shrivastava@asu.edu
Yunheung Paek, SO&R Research Group, Seoul National University, Korea. ypaek@snu.ac.kr pp. 1190-1195
Timothy M. Jones, Member of HiPEAC, School of Informatics, University of Edinburgh, UK. tjonesl@inf.ed.ac.uk
Sandro Bartolini, Member of HiPEAC, Dipartimento di Ingegneria dell' Informazione, Università di Siena, Italy. bartolini@dii.unisi.it
Bruno De Bus, Member of HiPEAC, Department of Electronics and Information Systems (ELIS), University of Ghent, Belgium. bruno.debus@elis.ugent.be
John Cavazos, Computer and Information Sciences, University of Delaware, USA. cavazos@cis.udel.edu
Michael F.P. O'Boyle, Member of HiPEAC, School of Informatics, University of Edinburgh, UK. mob@inf.ed.ac.uk pp. 1196-1201
Chun Jason Xue, Department of Computer Science, City University of Hong Kong; Email: jasonxue@cityu.edu.hk
Edwin H.-M. Sha, Dept. of Computer Science, the U. of Texas at Dallas, Richardson, Texas 75083, USA; Email: edsha@utdallas.edu
Zili Shao, Dept. of Computing, the Hong Kong Polytechnic U., Hong Kong; Email: cszlshao@comp.polyu.edu.hk
Meikang Qiu, U. of New Orleans; Email: qiumeikang@yahoo.com pp. 1202-1207
Antonio Carlos S. Beck, Universidade Federal do Rio Grande do Sul, Instituto de Informática - Porto Alegre/Brazil; Delft University of Technology, Computer Engineering - Delft/The Netherlands. caco@inf.uf
Mateus B. Rutzig, Universidade Federal do Rio Grande do Sul, Instituto de Informática - Porto Alegre/Brazil. mbrutzig@inf.ufrgs.br
Georgi Gaydadjiev, Delft University of Technology, Computer Engineering - Delft/The Netherlands. g.n.gaydadjiev@ewi.tudelft.nl
Luigi Carro, Universidade Federal do Rio Grande do Sul, Instituto de Informática - Porto Alegre/Brazil. carro@inf.ufrgs.br pp. 1208-1213
Krzysztof Kuchcinski, Dept. of Computer Science, Lund University, Sweden. krzysztof.kuchcinski@cs.lth.se pp. 1214-1219
Sankalita Saha, Department of Electrical and Computer Engineering and Institute for Advanced Computer Studies, University of Maryland, College Park, USA, 20742. ssaha@umd.edu
Jason Schlessman, Department of Electrical Engineering, Princeton University, Princeton, USA, 08554. jschless@princeton.edu
Sebastian Puthenpurayil, Department of Electrical and Computer Engineering and Institute for Advanced Computer Studies, University of Maryland, College Park, USA, 20742. purayil@umd.edu
Shuvra S. Bhattacharyya, Department of Electrical and Computer Engineering and Institute for Advanced Computer Studies, University of Maryland, College Park, USA, 20742. ssb@umd.edu
Wayne Wolf, Electrical and Computer Engineering Department, Georgia Institute of Technology, Atlanta, USA, 30332. wayne.wolf@ece.gatech.edu pp. 1220-1225
Ed Brinksma, Embedded Systems Institute, Eindhoven, University of Twente, Enschede, The Netherlands. ed.brinksma@esi.nl
Jozef Hooman, Embedded Systems Institute, Eindhoven, Radboud University Nijmegen, The Netherlands. jozef.hooman@esi.nl pp. 1226-1231
Chen-Ling Chou, Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. chenlinc@andrew.cmu.edu
Radu Marculescu, Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. radum@andrew.cmu.edu pp. 1232-1237
Mohammad Abdullah Al Faruque, University of Karlsruhe, CES - Chair for Embedded Systems, Karlsruhe, Germany. alfaruque@informatik.uni-karlsruhe.de
Jorg Henkel, University of Karlsruhe, CES - Chair for Embedded Systems, Karlsruhe, Germany. henkel@informatik.uni-karlsruhe.de pp. 1238-1243
Woo-Cheol Kwon, CAE Team, System LSI Division, Semiconductor Business, Samsung Electronics
Sung-Min Hong, CAE Team, System LSI Division, Semiconductor Business, Samsung Electronics
Sungjoo Yoo, CAE Team, System LSI Division, Semiconductor Business, Samsung Electronics
Byeong Min, CAE Team, System LSI Division, Semiconductor Business, Samsung Electronics
Kyu-Myung Choi, CAE Team, System LSI Division, Semiconductor Business, Samsung Electronics
Soo-Kwan Eo, CAE Team, System LSI Division, Semiconductor Business, Samsung Electronics pp. 1244-1249
Ajay K. Verma, Ecole Polytechnique Fédérale de Lausanne (EPFL), School of Computer and Communication Sciences, CH-1015 Lausanne, Switzerland. AjayKumar.Verma@epfl.ch
Philip Brisk, Ecole Polytechnique Fédérale de Lausanne (EPFL), School of Computer and Communication Sciences, CH-1015 Lausanne, Switzerland. Philip.Brisk@epfl.ch
Paolo Ienne, Ecole Polytechnique Fédérale de Lausanne (EPFL), School of Computer and Communication Sciences, CH-1015 Lausanne, Switzerland. Paolo.Ienn@epfl.ch pp. 1250-1255
Hadi Parandeh-Afshar, School of Electrical and Computer Engineering, University of Tehran, Tehran, Iran; Ecole Polytechnique Fédérale de Lausanne (EPFL), School of Computer and Communication Sciences, C
Philip Brisk, Ecole Polytechnique Fédérale de Lausanne (EPFL), School of Computer and Communication Sciences, CH-1015 Lausanne, Switzerland. e-mail: philip.brisk@epfl.ch
Paolo Ienne, Ecole Polytechnique Fédérale de Lausanne (EPFL), School of Computer and Communication Sciences, CH-1015 Lausanne, Switzerland. e-mail: paolo.ienne@epfl.ch pp. 1256-1261
Ivano Bonesana, ALaRI, Faculty of Informatics, University of Lugano, Lugano, Switzerland. bonesani@alari.ch
Marco Paolieri, ALaRI, Faculty of Informatics, University of Lugano, Lugano, Switzerland. paolierm@alari.ch
Marco D. Santambrogio, Dipartimento di Elettronica e Informazione, Politecnico di Milano, Milano, Italy. marco.santambrogio@polimi.it pp. 1262-1267
Denis Real, IETR - CELAR, 35170 Bruz, France. denis.real@dga.defense.gouv.fr
Cecile Canovas, LETTI, 38054 Grenoble Cedex 9, France. cecile.canovas@cea.fr
Jessy Clediere, LETTI, 38054 Grenoble Cedex 9, France. jessy.clediere@cea.fr
Mhamed Drissi, IETR, 35043 Rennes, France. Mhamed.Drissi@insa-rennes.fr
Frederic Valette, CELAR, 35170 Bruz, France. frederic.valette@dga.defense.gouv.fr pp. 1274-1279
Konrad J. Kulikowski, Boston University, Reliable Computing Laboratory, 8 Saint Mary's Street, Boston, MA 02215, USA. konkul@bu.edu, lark@bu.edu
Vyas Venkataraman, Boston University, Reliable Computing Laboratory, 8 Saint Mary's Street, Boston, MA 02215, USA. vyas@bu.edu, lark@bu.edu
Zhen Wang, Boston University, Reliable Computing Laboratory, 8 Saint Mary's Street, Boston, MA 02215, USA. lark@bu.edu
Alexander Taubin, Boston University, Reliable Computing Laboratory, 8 Saint Mary's Street, Boston, MA 02215, USA. taubin@bu.edu, lark@bu.edu pp. 1280-1285
Elena Dubrova, Royal Institute of Technology (KTH), Electrum 229, 164 46 Kista, Sweden. elena@imit.kth.se
Maxim Teslenko, Royal Institute of Technology (KTH), Electrum 229, 164 46 Kista, Sweden. maximt@imit.kth.se
Hannu Tenhunen, Royal Institute of Technology (KTH), Electrum 229, 164 46 Kista, Sweden. hannu@imit.kth.se pp. 1286-1291
Junfeng Fan, Katholieke Universiteit Leuven, ESAT/SCD-COSIC, Kasteelpark Arenberg 10, B-3001 Leuven-Heverlee, Belgium. Junfeng.Fan@esat.kuleuven.be
Lejla Batina, Katholieke Universiteit Leuven, ESAT/SCD-COSIC, Kasteelpark Arenberg 10, B-3001 Leuven-Heverlee, Belgium. Lejla.Batina@esat.kuleuven.be
Kazuo Sakiyama, Katholieke Universiteit Leuven, ESAT/SCD-COSIC, Kasteelpark Arenberg 10, B-3001 Leuven-Heverlee, Belgium. Kazuo.Sakiyama@esat.kuleuven.be
Ingrid Verbauwhede, Katholieke Universiteit Leuven, ESAT/SCD-COSIC, Kasteelpark Arenberg 10, B-3001 Leuven-Heverlee, Belgium. Ingrid.Verbauwhede@esat.kuleuven.be pp. 1292-1297
Ho Fai Ko, Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON L8S 4K1, Canada. Email: henryko@grads.ece.mcmaster.ca
Nicola Nicolici, Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON L8S 4K1, Canada. Email: nicola@ece.mcmaster.ca pp. 1298-1303
A. Apostolakis, Department of Informatics, University of Piraeus, Greece. andapo@unipi.gr
D. Gizopoulos, Department of Informatics, University of Piraeus, Greece. dgizop@unipi.gr
M. Psarakis, Department of Informatics, University of Piraeus, Greece. mpsarak@unipi.gr
A. Paschalis, Department of Informatics&Telecom., University of Athens, Greece. paschali@di.uoa.gr pp. 1304-1309
B. Straka, Q-Star Test, Lieven Bauwensstraat 20, B-8200 Brugge, Belgium. Phone: +32 50 319273, Fax: +32 50 312350, e-mail: info@qstar.be
H. Manhaeve, Q-Star Test, Lieven Bauwensstraat 20, B-8200 Brugge, Belgium. Phone: +32 50 319273, Fax: +32 50 312350, e-mail: info@qstar.be
J. Brenkus, Department of Microelectronics, Slovak University of Technology, Ilkovi¿ova 3, 812 19 Bratislava, Slovakia
S. Kerckenaere, Q-Star Test, Lieven Bauwensstraat 20, B-8200 Brugge, Belgium. Phone: +32 50 319273, Fax:+32 50 312350, e-mail: info@qstar.be pp. 1310-1315
M. De Matteis, Innovation Engineering Department, University of Salento - Lecce, Italy
S. D'Amico, Innovation Engineering Department, University of Salento - Lecce, Italy
A. Baschirotto, Department of Physics, University of Bicocca - Milano, Italy pp. 1316-1321
G. Gielen, Departement Elektrotechniek ESAT-MICAS, Katholieke Universiteit Leuven, Belgium. gielen@esat.kuleuven.be
P. De Wit, Departement Elektrotechniek ESAT-MICAS, Katholieke Universiteit Leuven, Belgium
E. Maricau, Departement Elektrotechniek ESAT-MICAS, Katholieke Universiteit Leuven, Belgium
J. Loeckx, Departement Elektrotechniek ESAT-MICAS, Katholieke Universiteit Leuven, Belgium
G. Groeseneken, IMEC Leuven, Belgium; KU Leuven, ESAT-MICAS Department, Belgium
M. Nafria, Universitat Autonoma de Barcelona, Spain pp. 1322-1327
Alexandre Schmid, Microelectronic Systems Laboratory (LSM), EPFL Lausanne, 1015 Switzerland
Frank K. Gurkaynak, Microelectronic Systems Laboratory (LSM), EPFL Lausanne, 1015 Switzerland
Yusuf Leblebici, Microelectronic Systems Laboratory (LSM), EPFL Lausanne, 1015 Switzerland pp. 1328-1333
Anupam Chattopadhyay, Integrated Signal Processing Systems, RWTH Aachen University 52056 Aachen, Germany. anupam@iss.rwth-aachen.de
Xiaolin Chen, Integrated Signal Processing Systems, RWTH Aachen University 52056 Aachen, Germany
Harold Ishebabi, Integrated Signal Processing Systems, RWTH Aachen University 52056 Aachen, Germany
Rainer Leupers, Integrated Signal Processing Systems, RWTH Aachen University 52056 Aachen, Germany
Gerd Ascheid, Integrated Signal Processing Systems, RWTH Aachen University 52056 Aachen, Germany
Heinrich Meyr, Integrated Signal Processing Systems, RWTH Aachen University 52056 Aachen, Germany pp. 1334-1339
Amin Farmahini-Farahani, School of Electrical and Computer Engineering, University of Tehran, Tehran 14395-515, Iran. a.farmahini@ece.ut.ac.ir
Sied Mehdi Fakhraie, School of Electrical and Computer Engineering, University of Tehran, Tehran 14395-515, Iran. fakhraie@ut.ac.ir
Saeed Safari, School of Electrical and Computer Engineering, University of Tehran, Tehran 14395-515, Iran. saeed@ut.ac.ir pp. 1340-1345
Thomas Marconi, Computer Engineering Laboratory, EEMCS, TU Delft, The Netherlands. Email: thomas@ce.et.tudelft.nl
Yi Lu, Computer Engineering Laboratory, EEMCS, TU Delft, The Netherlands. Email: yilu@ce.et.tudelft.nl
Koen Bertels, Computer Engineering Laboratory, EEMCS, TU Delft, The Netherlands. Email: k.l.m.bertels@tudelft.nl
Georgi Gaydadjiev, Computer Engineering Laboratory, EEMCS, TU Delft, The Netherlands. Email: g.n.gaydadjiev@ewi.tudelft.nl pp. 1346-1351
C. Mucci, ARCES, University of Bologna, Italy
P. Bonnot, THALES Research and Technology, France
A. Grasset, THALES Research and Technology, France
P. Millet, THALES Research and Technology, France
M. Kuehnle, ITIV, University of Karlsruhe, Germany
F. Ries, ITIV, University of Karlsruhe, Germany
M. Huebner, ITIV, University of Karlsruhe, Germany
J. Becker, ITIV, University of Karlsruhe, Germany pp. 1352-1357
Faizal A. Samman, Technische Universität Darmstadt, Institute of Microelectronic Systems, Karlstr. 15. Darmstadt, Hessen D-64283; Dept. of Electrical Engineering, the University of Hasanuddin at Mak
Thomas Hollstein, Technische Universität Darmstadt, Institute of Microelectronic Systems, Karlstr. 15. Darmstadt, Hessen D-64283. thomas.hollstein@mes.tu-darmstadt.de
Manfred Glesner, Technische Universität Darmstadt, Institute of Microelectronic Systems, Karlstr. 15. Darmstadt, Hessen D-64283. glesner@mes.tu-darmstadt.de pp. 1396-1401
Pejman Lotfi-Kamran, School of Electrical and Computer Engineering, The University of Tehran. plotf@computer.org
Masoud Daneshtalab, School of Electrical and Computer Engineering, The University of Tehran; Islamic Azad University, Parand Branch. m.daneshtalab@ece.ut.ac.ir
Caro Lucas, School of Electrical and Computer Engineering, The University of Tehran. lucas@ipm.ir
Zainalabedin Navabi, School of Electrical and Computer Engineering, The University of Tehran. navabi@ece.neu.edu pp. 1408-1413
Igor Loi, DEIS, University of Bologna, Bologna, Italy. iloi@deis.unibo.it
Luca Benini, DEIS, University of Bologna, Bologna, Italy. lbenini@deis.unibo.it pp. 1414-1419
Arseni Vitkovski, ARCES - University of Bologna, Viale Pepoli 3/2, 40123 Bologna, Italy. avitkovski@arces.unibo.it
Georgi Kuzmanov, CE/EEMCS - Delft University of Technology, Mekelweg 4, 2628 CD Delft, the Netherlands. G.K.Kuzmanov@tudelft.nl
Georgi Gaydadjiev, CE/EEMCS - Delft University of Technology, Mekelweg 4, 2628 CD Delft, the Netherlands. G.N.Gaydadjiev@tudelft.nl pp. 1420-1425
Sukhun Kang, Coordinated Science Laboratory, 1308 West Main St, Urbana, IL 61801
Rakesh Kumar, Coordinated Science Laboratory, 1308 West Main St, Urbana, IL 61801 pp. 1432-1437
Raghavendra K, Department of Computer Science and Engineering, Indian Institute of Technology-Madras, Chennai - 600036, India. raghavendra83@gmail.com
Madhu Mutyam, Department of Computer Science and Engineering, Indian Institute of Technology-Madras, Chennai - 600036, India. madhu@cse.iitm.ac.in pp. 1438-1443
R. Arteaga, Institute for Applied Microelectronics (IUMA). DIEA. University of Las Palmas de Gran Canaria, Campus Universitario de Tafira, S/N. 35017. Las Palmas de Gran Canaria, Spain. rartea
F. Tobajas, Institute for Applied Microelectronics (IUMA). DIEA. University of Las Palmas de Gran Canaria, Campus Universitario de Tafira, S/N. 35017. Las Palmas de Gran Canaria, Spain. tobaja
R. Esper-Chain, Institute for Applied Microelectronics (IUMA). DIEA. University of Las Palmas de Gran Canaria, Campus Universitario de Tafira, S/N. 35017. Las Palmas de Gran Canaria, Spain. esper@
V. de Armas, Institute for Applied Microelectronics (IUMA). DIEA. University of Las Palmas de Gran Canaria, Campus Universitario de Tafira, S/N. 35017. Las Palmas de Gran Canaria, Spain. armas@
Roberto Sarmiento, Institute for Applied Microelectronics (IUMA). DIEA. University of Las Palmas de Gran Canaria, Campus Universitario de Tafira, S/N. 35017. Las Palmas de Gran Canaria, Spain. robert pp. 1450-1455
Jeremy Buboltz, School of EECS, University of Central Florida, Orlando, FL 32816, USA. je963524@pegasus.cc.ucf.edu
Taskin Kocak, Dept. of Electrical and Electronic Engineering, University of Bristol, Bristol, BS8 1UB, UK. t.kocak@bristol.ac.uk pp. 1456-1461
Madhura Purnaprajna, Heinz Nixdorf Institute, Systems and Circuit Technology, University of Paderborn, Germany. madhurap@hni.upb.de
Christoph Puttmann, Heinz Nixdorf Institute, Systems and Circuit Technology, University of Paderborn, Germany. puttmann@hni.upb.de
Mario Porrmann, Heinz Nixdorf Institute, Systems and Circuit Technology, University of Paderborn, Germany. porrmann@hni.upb.de pp. 1462-1467
Hyun Choi, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332-0250. hyun@ece.gatech.edu
Abhijit Chatterjee, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332-0250. chat@ece.gatech.edu pp. 1468-1473
Irith Pomeranz, School of Electrical&Computer Eng., Purdue University, W. Lafayette, IN 47907, U.S.A.
Sudhakar M. Reddy, Electrical&Computer Eng. Dept., University of Iowa, Iowa City, IA 52242, U.S.A. pp. 1474-1479
A. Ney, Laboratoire d'Informatique, de Robotique et de Microélectronique de Montpellier - LIRMM, Université de Montpellier II / CNRS, 161, rue Ada - 34392 Montpellier Cedex 5, France. Emai
P. Girard, Laboratoire d'Informatique, de Robotique et de Microélectronique de Montpellier - LIRMM, Université de Montpellier II / CNRS, 161, rue Ada - 34392 Montpellier Cedex 5, France. Emai
S. Pravossoudovitch, Laboratoire d'Informatique, de Robotique et de Microélectronique de Montpellier - LIRMM, Université de Montpellier II / CNRS, 161, rue Ada - 34392 Montpellier Cedex 5, France. Emai
A. Virazel, Laboratoire d'Informatique, de Robotique et de Microélectronique de Montpellier - LIRMM, Université de Montpellier II / CNRS, 161, rue Ada - 34392 Montpellier Cedex 5, France. Emai
M. Bastian, Infineon Technologies France, 2600, route des Crêtes - 06560 Sophia-Antipolis, France. Email: magali.bastian@infineon.com
V. Gouin, Infineon Technologies France, 2600, route des Crêtes - 06560 Sophia-Antipolis, France. Email: vicent.gouin@infineon.com pp. 1480-1485
D.C. Keezer, Georgia Institute of Technology, Atlanta, Georgia USA pp. 1486-1491
M. Hohenauer, Institute for Integrated Signal Processing Systems, RWTH Aachen University, Germany
F. Engel, Institute for Integrated Signal Processing Systems, RWTH Aachen University, Germany
R. Leupers, Institute for Integrated Signal Processing Systems, RWTH Aachen University, Germany
G. Ascheid, Institute for Integrated Signal Processing Systems, RWTH Aachen University, Germany
H. Meyr, Institute for Integrated Signal Processing Systems, RWTH Aachen University, Germany
Gerrit Bette, Associated Compiler Experts bv, Amsterdam, The Netherlands pp. 1492-1497
Stephen A. Edwards, Department of Computer Science, Columbia University, New York, USA. sedwards@cs.columbia.edu
Nalini Vasudevan, Department of Computer Science, Columbia University, New York, USA. naliniv@cs.columbia.edu pp. 1498-1503
Roberto Lublinerman, Department of Computer Science and Engineering, The Pennsylvania State University, University Park, PA 16802. rluble@psu.edu
Stavros Tripakis, Cadence Research Laboratories, 2150 Shattuck Avenue, 10th Floor, Berkeley, CA 94704, USA. tripakis@cadence.com pp. 1504-1509
Fabiano Cruz, Departamento de Ciência da Computação, Universidade Federal do Amazonas. fcruz@dcc.ufam.edu.br
Raimundo Barreto, Departamento de Ciência da Computação, Universidade Federal do Amazonas. rbarreto@dcc.ufam.edu.br
Lucas Cordeiro, Departamento de Ciência da Computação, Universidade Federal do Amazonas. lcc@dcc.ufam.edu.br
Paulo Maciel, Centro de Informática (CIn), Universidade Federal de Pernambuco. prmm@cin.ufpe.br pp. 1510-1515
Atanu Chattopadhyay, McGill University, Dept. of Electrical and Computer Engineering, Montreal, Canada
Zeljko Zilic, McGill University, Dept. of Electrical and Computer Engineering, Montreal, Canada pp. 248-251
Renato Rimolo-Donadio, Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg (Germany)
Christian Schuster, Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg (Germany)
Xiaoxiong Gu, IBM T. J. Watson Research Center, Yorktown Heights, NY (USA)
Young H. Kwark, IBM T. J. Watson Research Center, Yorktown Heights, NY (USA)
Mark B. Ritter, IBM T. J. Watson Research Center, Yorktown Heights, NY (USA) pp. 252-255
Ho Fai Ko, Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON L8S 4K1, Canada. Email: henryko@grads.ece.mcmaster.ca
Nicola Nicolici, Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON L8S 4K1, Canada. Email: nicola@ece.mcmaster.ca pp. 256-259
Ken W. Batcher, Kent State University, Cisco Systems. batcher@cisco.com pp. 260-263
Yang Qu, Technical Research Centre of Finland (VTT), Kaitoväylä 1, FIN-90571 Oulu, Finland. Yang.Qu@vtt.fi
Juha-Pekka Soininen, Technical Research Centre of Finland (VTT), Kaitoväylä 1, FIN-90571 Oulu, Finland
Jari Nurmi, Tampere University of Technology, Korkeakoulunkatu 1, FIN-33720 Tampere, Finland pp. 264-267
Mian Dong, Dept. of Electrical&Computer Engineering, Rice University, Houston, TX 77005
Lin Zhong, Dept. of Electrical&Computer Engineering, Rice University, Houston, TX 77005 pp. 268-271
Ricardo Chaves, Instituto Superior Técnico/INESC-ID. Portugal; Computer Engineering Lab, TUDelft. The Netherlands.
Leonel Sousa, Instituto Superior Técnico/INESC-ID. Portugal. pp. 272-275
Trevor Meyerowitz, University of California at Berkeley, Berkeley, California, USA. tcm@eecs.berkeley.edu
Mirko Sauermann, Infineon Technologies, Munich, Germany. Mirko.Sauermann@infineon.com
Dominik Langen, Infineon Technologies, Munich, Germany. Dominik.Langen@infineon.com pp. 276-279
Chunjie Duan, Mitsubishi Electric Research Labs, 201 Broadway, Cambridge, MA USA. Email: duan@merl.com
Sunil P. Khatri, Department of Electrical Engineering, Texas A&M University, College Station, TX 77843 USA. Email: sunilkhatri@tamu.edu pp. 515-518
Francesco Redaelli, DEI, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133, Milano. francesco.redaelli@dresd.org
Marco D. Santambrogio, DEI, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133, Milano. santambr@elet.polimi.it
Donatella Sciuto, DEI, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133, Milano. sciuto@elet.polimi.it pp. 519-522
Almitra Pradhan, Dept. of ECE, University of Cincinnati, Cincinnati, OH 45219. pradhaa@ececs.uc.edu
Ranga Vemuri, Dept. of ECE, University of Cincinnati, Cincinnati, OH 45219. ranga@ececs.uc.edu pp. 523-526
Bao Liu, University of California San Diego, Computer Science and Engineering Department, 9500 Gilman Dr., La Jolla, CA 92093-0114. Email: bliu@cs.ucsd.edu pp. 527-532
Remy Kocik, COSI Lab, ESIEE Paris, France. email: r.kocik@esiee.fr
Yves Sorel, AOSTE Project-Team, INRIA Paris-Rocquencourt. email: Yves.Sorel@inria.fr
Redha Hamouche, COSI Lab, ESIEE Paris, France. email: r.hamouche@esiee.fr pp. 533-536
Wanping Zhang, Qualcomm Inc. 5775 Morehouse Dr., San Diego, CA, U.S.A.; UC San Diego, La Jolla, CA, U.S.A. wanpingz@qualcomm.com, w7zhang@ucsd.edu
Yi Zhu, UC San Diego, La Jolla, CA, U.S.A. y2zhu@ucsd.edu
Wenjian Yu, UC San Diego, La Jolla, CA, U.S.A.; Tsinghua University, Beijing 100084, China. w1yu@ucsd.edu, yu-wj@tsinghua.edu.cn
Ling Zhang, UC San Diego, La Jolla, CA, U.S.A. lizhang@ucsd.edu
Rui Shi, UC San Diego, La Jolla, CA, U.S.A. rshi@ucsd.edu
He Peng, UC San Diego, La Jolla, CA, U.S.A. hepeng@ucsd.edu
Zhi Zhu, Qualcomm Inc. 5775 Morehouse Dr., San Diego, CA, U.S.A. zzhu@qualcomm.com
Lew Chua-Eoan, Qualcomm Inc. 5775 Morehouse Dr., San Diego, CA, U.S.A. lewc@qualcomm.com
Rajeev Murgai, Fujitsu Laboratories of America, Inc., Sunnyvale, CA, U.S.A. murgai@fla.fujitsu.com
Nuriyoki Ito, Fujitsu Limited, Kawasaki, Japan. ito.nuriyoki@jp.fujitsu.com pp. 537-540
Benjamin Glas, Institut für Technik der Informationsverarbeitung, Universität Karlsruhe (TH). E-mail: glas@itiv.uni-karlsruhe.de
Alexander Klimm, Institut für Technik der Informationsverarbeitung, Universität Karlsruhe (TH). E-mail: klimm@itiv.uni-karlsruhe.de
Oliver Sander, Institut für Technik der Informationsverarbeitung, Universität Karlsruhe (TH). E-mail: sander@itiv.uni-karlsruhe.de
Klaus Muller-Glaser, Institut für Technik der Informationsverarbeitung, Universität Karlsruhe (TH). E-mail: kmg@itiv.uni-karlsruhe.de
Jurgen Becker, Institut für Technik der Informationsverarbeitung, Universität Karlsruhe (TH). E-mail: becker@itiv.uni-karlsruhe.de pp. 541-544
Frank Rogin, Fraunhofer Institute for Integrated Circuits, Division Design Automation, 01069 Dresden, Germany. frank.rogin@eas.iis.fraunhofer.de
Thomas Klotz, Fraunhofer Institute for Integrated Circuits, Division Design Automation, 01069 Dresden, Germany. thomas.klotz@eas.iis.fraunhofer.de
Gorschwin Fey, University of Bremen, Institute of Computer Science, 28359 Bremen, Germany. fey@informatik.uni-bremen.de
Rolf Drechsler, University of Bremen, Institute of Computer Science, 28359 Bremen, Germany. drechsle@informatik.uni-bremen.de
Steffen Rulke, Fraunhofer Institute for Integrated Circuits, Division Design Automation, 01069 Dresden, Germany. steffen.ruelke@eas.iis.fraunhofer.de pp. 545-548
Martin Versen, Qimonda AG, Am Campeon 1-12, D-85579 Neubiberg, Germany
Achim Schramm, Qimonda AG, Am Campeon 1-12, D-85579 Neubiberg, Germany
Jan Schnepp, Qimonda AG, Am Campeon 1-12, D-85579 Neubiberg, Germany pp. 776-779
Bastian Ristau, Vodafone Chair Mobile Communications Systems, TU Dresden, Germany. ristau@ifn.et.tu-dresden.de
Torsten Limberg, Vodafone Chair Mobile Communications Systems, TU Dresden, Germany. limberg@ifn.et.tu-dresden.de
Gerhard Fettweis, Vodafone Chair Mobile Communications Systems, TU Dresden, Germany. fettweis@ifn.et.tu-dresden.de pp. 780-783
Josef Haid, Infineon Technologies Austria AG. josef.haid@infineon.com
Bernd Zimek, Infineon Technologies Austria AG. bernd.zimek@infineon.com
Thomas Leutgeb, Infineon Technologies Austria AG. thomas.leutgeb@infineon.com
Thomas Kunemund, Infineon Technologies Austria AG. thomas.kuenemund@infineon.com pp. 784-787
M. Radetzki, Institut für Technische Informatik, Universität Stuttgart, Stuttgart, Germany. radetzki@informatik.uni-stuttgart.de
R. Salimi Khaligh, Institut für Technische Informatik, Universität Stuttgart, Stuttgart, Germany. salimi@informatik.uni-stuttgart.de pp. 788-791
Jun Wang, Institute of Computing Technology, Chinese Academy of Sciences. wangjun@ict.ac.cn
Hongbo Zeng, Institute of Computing Technology, Chinese Academy of Sciences. hbzeng@ict.ac.cn
Kun Huang, Institute of Computing Technology, Chinese Academy of Sciences. kunhuang@ict.ac.cn
Ge Zhang, Institute of Computing Technology, Chinese Academy of Sciences. gzhang@ict.ac.cn
Yan Tang, The Ohio State University. tangya@cse.ohio-state.edu pp. 792-795
Fu-Wei Chen, Department of Computer Science and Engineering, Yuan Ze University, Chungli, Taiwan 320, R.O.C. s956030@mail.yzu.edu.tw
Yi-Yu Liu, Department of Computer Science and Engineering, Yuan Ze University, Chungli, Taiwan 320, R.O.C. yyliu@saturn.yzu.edu.tw, s956030@mail.yzu.edu.tw pp. 796-799
Xiaoying Wang, Institute of Computer Science, University of Frankfurt, Germany. wang@em.informatik.uni-frankfurt.de
Lars Hedrich, Institute of Computer Science, University of Frankfurt, Germany. hedrich@em.informatik.uni-frankfurt.de pp. 800-803
Alexandre Lewicki, NXP Semiconductors, 06560 Valbonne, France; LEAT, UMR UNSA-CNRS 6071, 06560 Valbonne, France pp. 804-807
Feng Yuan, Department of Computer Science&Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong. Email: fyuan@cse.cuhk.edu.hk
Lin Huang, Department of Computer Science&Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong. Email: lhuang@cse.cuhk.edu.hk
Qiang Xu, Department of Computer Science&Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong. Email: qxu@cse.cuhk.edu.hk pp. 808-811
Simone Zezza, Politecnico di Torino, Italy. simone.zezza@polito.it
Guido Masera, Politecnico di Torino, Italy. guido.masera@polito.it pp. 1075-1078
Stephen Frechette, Riverside Research Institute, Lexington, MA 02421. sfrechette@rri-usa.org
Fabrizio Lombardi, Dept of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115. lombardi@ece.neu.edu pp. 1079-1082
M. Bao, Embedded Systems Laboratory (ESLAB), Department of Computer and Information Science, Linköping University, Sweden. g-minba@ida.liu.se
A. Andrei, Embedded Systems Laboratory (ESLAB), Department of Computer and Information Science, Linköping University, Sweden. alean@ida.liu.se
P. Eles, Embedded Systems Laboratory (ESLAB), Department of Computer and Information Science, Linköping University, Sweden. petel@ida.liu.se
Z. Peng, Embedded Systems Laboratory (ESLAB), Department of Computer and Information Science, Linköping University, Sweden. zebpe@ida.liu.se pp. 1083-1086
Lei Fang, Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA, 24061. leifang@vt.edu
Michael S. Hsiao, Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA, 24061. mhsiao@vt.edu pp. 1087-1090
Jun-Kuei Zeng, National Taiwan University, Electrical Engineering Department. yelsta89g@yahoo.com.tw
Chung-Ping Chen, National Taiwan University, Electrical Engineering Department. cchen@cc.ee.ntu.edu.tw pp. 1091-1094
Yi Lu, Computer Engineering Lab., TU Delft, The Netherlands. yilu@ce.et.tudelft.nl
Thomas Marconi, Computer Engineering Lab., TU Delft, The Netherlands. thomas@ce.et.tudelft.nl
Georgi Gaydadjiev, Computer Engineering Lab., TU Delft, The Netherlands. georgi@ce.et.tudelft.nl
Koen Bertels, Computer Engineering Lab., TU Delft, The Netherlands. k.l.m.bertels@tudelft.nl pp. 1095-1098
Hiroaki Yoshida, VLSI Design and Education Center (VDEC), University of Tokyo; CREST, Japan Science and Technology Agency
Masahiro Fujita, VLSI Design and Education Center (VDEC), University of Tokyo; CREST, Japan Science and Technology Agency pp. 1099-1102
Sudarshan Bahukudumbi, Department of Electrical and Computer Engineering, Duke University, Durham, NC 27708. Email: spb@ee.duke.edu
Krishnendu Chakrabarty, Department of Electrical and Computer Engineering, Duke University, Durham, NC 27708. Email: krish@ee.duke.edu
Richard Kacprowicz, Intel Corporation, Hillsboro, OR 97124. Email: richard.kacprowicz@intel.com pp. 1103-1106
Patrick Scheer, BMW Group, E/E Architecture, Ergonomics and HMI, Hardware Components, Munich, Germany
Ernst Schmidt, BMW Group, E/E Architecture, Ergonomics and HMI, Hardware Components, Munich, Germany
Stefan Burges, BMW Group, E/E Architecture, Ergonomics and HMI, Hardware Components, Munich, Germany pp. 1107-1110
Mark Muir, The Universtiy of Edinburgh, Mayfield Road, Edinburgh, EH9 3JL, United Kingdom. Mark.Muir@ed.ac.uk
Tughrul Arslan, The Universtiy of Edinburgh, Mayfield Road, Edinburgh, EH9 3JL, United Kingdom; Institute for System Level Integration, Alba Centre, Livingston, EH54 7EG, United Kingdom
Iain Lindsay, The Universtiy of Edinburgh, Mayfield Road, Edinburgh, EH9 3JL, United Kingdom pp. 1358-1361
Francis Wolff, Case Western Reserve University, Cleveland, Ohio 44106, USA. fxw12@case.edu
Chris Papachristou, Case Western Reserve University, Cleveland, Ohio 44106, USA. cap2@case.edu
Swarup Bhunia, Case Western Reserve University, Cleveland, Ohio 44106, USA. skb21@case.edu pp. 1362-1365
Tomokazu Yoneda, Graduate School of Information Science, Nara Institute of Science and Technology, Kansai Science City, 630-0192, Japan. yoneda@is.naist.jp
Hideo Fujiwara, Graduate School of Information Science, Nara Institute of Science and Technology, Kansai Science City, 630-0192, Japan. fujiwara@is.naist.jp pp. 1366-1369
Lan S. Bai, Northwestern University, Evanston, IL 60208. l-bai@northwestern.edu
Haris Lekatsas, Vorras Corporation, Princeton, NJ 08540. lekatsas@vorras.com
Robert P. Dick, Northwestern University, Evanston, IL 60208. dickrp@northwestern.edu pp. 1374-1377
David Y. Feinstein, Department of Computer Science and Engineering, Southern Methodist University, Dallas, TX, USA. dfeinste@engr.smu.edu
Mitchell A. Thornton, Department of Computer Science and Engineering, Southern Methodist University, Dallas, TX, USA. mitch@engr.smu.edu
D. Michael Miller, Department of Computer Science, University of Victoria, Victoria, BC, Canada. mmiller@cs.uvic.ca pp. 1378-1381
Eduardo Wenzel Briao, Universidade Federal do Rio Grande do Sul - UFRGS, Instituto de Informática, Porto Alegre, RS, Brazil. ewbriao@inf.ufrgs.br
Daniel Barcelos, Universidade Federal do Rio Grande do Sul - UFRGS, Instituto de Informática, Porto Alegre, RS, Brazil. danielb@inf.ufrgs.br
Flavio Rech Wagner, Universidade Federal do Rio Grande do Sul - UFRGS, Instituto de Informática, Porto Alegre, RS, Brazil. flavio@inf.ufrgs.br pp. 1386-1389
Pierluigi Nuzzo, IMEC, NES/Wireless, Leuven, Belgium. Pierluigi.Nuzzo@imec.be
Claudio Nani, IMEC, NES/Wireless, Leuven, Belgium; Department of Information Engineering, University of Pisa, Pisa, Italy. Claudio.Nani@imec.be
Sergio Saponara, Department of Information Engineering, University of Pisa, Pisa, Italy. s.saponara@iet.unipi.it
Luca Fanucci, Department of Information Engineering, University of Pisa, Pisa, Italy. l.fanucci@iet.unipi.it pp. 1390-1393 Usage of this product signifies your acceptance of the Terms of Use.
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