ISBN: 0-7695-2288-2

S. L?pez, University of Las Palmas de Gran Canaria, Spain

G. M. Callic?, University of Las Palmas de Gran Canaria, Spain

J. F. L?pez, University of Las Palmas de Gran Canaria, Spain

R. Sarmiento, University of Las Palmas de Gran Canaria, Spain

Suhaib A. Fahmy, Imperial College London, England

Peter Y. K. Cheung, Imperial College London, England

Wayne Luk, Imperial College London, England

Hendrik Eeckhaut, ELIS-PARIS, Ghent University, Belgium

Harald Devos, ELIS-PARIS, Ghent University, Belgium

Benjamin Schrauwen, ELIS-PARIS, Ghent University, Belgium

Mark Christiaens, ELIS-PARIS, Ghent University, Belgium

Dirk Stroobandt, ELIS-PARIS, Ghent University, Belgium

Artur Burchard, Philips Research Laboratories, Eindhoven, The Netherlands

Ewa Hekstra-Nowacka, Philips Research Laboratories, Eindhoven, The Netherlands

Atul Chauhan, Indian Institute of Technology, Delhi, India

W. Stechele, Technische Universit?t M?nchen

L. Alvado C?rcel, Universidad Politecnica de Valencia

S. Herrmann, Technische Universit?t M?nchen

J. Lid? Sim?, Universidad Politecnica de Valencia

Sandro V. Silva, Federal University of Rio Grande do Sul, Brazil

Sergio Bampi, Federal University of Rio Grande do Sul, Brazil

R. Elbaz, LIRMM, France

L. Torres, LIRMM, France

G. Sassatelli, LIRMM, France

P. Guillemin, STMicroeletronics

C. Anguille, STMicroeletronics

M. Bardouillet, STMicroeletronics

C. Buatois, CMP, Centre micro?lectronique de Provence Georges Charpak

J. B. Rigaud, CMP, Centre micro?lectronique de Provence Georges Charpak

Daniel Thull, STMicroelectronics, Italy

Roberto Sannino, STMicroelectronics, Italy

A. Cilardo, Universit? degli Studi di Napoli Federico II, Italy

A. Mazzeo, Universit? degli Studi di Napoli Federico II, Italy

N. Mazzocca, Universit? degli Studi di Napoli Federico II, Italy

L. Romano, Universit? degli Studi di Napoli Federico II, Italy

Kris Tiri, UC Los Angeles

Ingrid Verbauwhede, UC Los Angeles; K.U.Leuven

Shengqi Yang, Princeton University, NJ

Wayne Wolf, Princeton University, NJ

N. Vijaykrishnan, The Penn State University, University Park, PA

D. N. Serpanos, Patras University, Greece

Yuan Xie, The Penn State University, University Park, PA

Zoya Dyka, IHP, Germany

Peter Langendoerfer, IHP, Germany

Hala A. Farouk, Arab Academy for Science, Egypt

Magdy Saeb, Arab Academy for Science, Egypt

R. Pradeep, Indian Institute of Technology, Madras

S. Vinay, Indian Institute of Technology, Madras

Sanjay Burman, Indian Institute of Technology, Madras

V. Kamakoti, Indian Institute of Technology, Madras

Wayne Wolf, Princeton University

Keith Holt, Intel Corporation

Raúl Bl?zquez, Massachusetts Institute of Technology, Cambridge, MA

Fred Lee, Massachusetts Institute of Technology, Cambridge, MA

David Wentzloff, Massachusetts Institute of Technology, Cambridge, MA

Brian Ginsburg, Massachusetts Institute of Technology, Cambridge, MA

Johnna Powell, Massachusetts Institute of Technology, Cambridge, MA

Anantha Chandrakasan, Massachusetts Institute of Technology, Cambridge, MA

T. Simunic, UCSD, La Jolla, CA

Frank Kienle, University of Kaiserslautern, Germany

Torben Brack, University of Kaiserslautern, Germany

Norbert Wehn, University of Kaiserslautern, Germany

Andrew Duller, picoChip Designs Ltd., UK

Daniel Towner, picoChip Designs Ltd., UK

Gajinder Panesar, picoChip Designs Ltd., UK

Alan Gray, picoChip Designs Ltd., UK

Will Robbins, picoChip Designs Ltd., UK

I. Papaefstathiou, Foundation of Research & Technology Hellas (FORTH), Institute of Computer Science (ICS), Greece

T. Orphanoudakis, Ellemedia Technologies, Athens, Greece

G. Kornaros, Ellemedia Technologies, Athens, Greece

C. Kachris, Ellemedia Technologies, Athens, Greece

I. Mavroidis, Ellemedia Technologies, Athens, Greece

A. Nikologiannis, Ellemedia Technologies, Athens, Greece

Massimo Conti, Universit? Politecnica delle Marche, Italy

Daniele Moretti, Universit? Politecnica delle Marche, Italy

Andres Takach, Mentor Graphics

Bryan Bowyer, Mentor Graphics

Thomas Bollaert, Mentor Graphics

Andreas Raabe, Bonn University, Germany

Blazej Bartyzel, Bonn University, Germany

Joachim K. Anlauf, Bonn University, Germany

Gabriel Zachmann, Bonn University, Germany

Hannu Heusala, University of Oulu, Finland

Jussi Liedes, University of Oulu, Finland

Young-Taek Kim, Samsung Electronics Co., Ltd., Korea

Taehun Kim, Samsung Electronics Co., Ltd., Korea

Youngduk Kim, Samsung Electronics Co., Ltd., Korea

Chulho Shin, Samsung Electronics Co., Ltd., Korea

Eui-Young Chung, Samsung Electronics Co., Ltd., Korea

Kyu-Myung Choi, Samsung Electronics Co., Ltd., Korea

Jeong-Taek Kong, Samsung Electronics Co., Ltd., Korea

Soo-Kwan Eo, Samsung Electronics Co., Ltd., Korea

Wayne Lyons, ARM

A. Mayer, Infineon Technologies AG, Germany

H. Siebert, Infineon Technologies AG, Germany

K.D. McDonald-Maier, University of Kent, UK

C. Jeffrey, Lancaster University, UK

R. Cutajar, Lancaster University, UK

S. Prosser, TRW Automotive, UK

M. Lickess, TRW Automotive, UK

A. Richardson, Lancaster University, UK

S. Riches, Micro Circuit Engineering, UK

Pavel Horsky, AMI Semiconductor Czech, Czech Republic

Jan Staschulat, Institute of Computer and Communication Network Engineering, Germany

Rolf Ernst, Institute of Computer and Communication Network Engineering, Germany

Andreas Schulze, Volkswagen AG, Germany

Fabian Wolf, Volkswagen AG, Germany

Dirk Ziegenbein, Robert Bosch GmbH

Peter Braun, Validas AG

Ulrich Freund, ETAS Engineering Tools GmbH

Andreas Bauer, Institut f?r Informatik, TU M?nchen

Jan Romberg, Institut f?r Informatik, TU M?nchen

Bernhard Sch?tz, Institut f?r Informatik, TU M?nchen

Massimo Conti, Universit? Politecnica delle Marche, Italy

Steve Chappell, Celoxica Ltd, UK

Alistair Macarthur, Celoxica Ltd, UK

Dan Preston, Medius Inc., Seattle, WA

Dave Olmstead, Medius Inc., Seattle, WA

Bob Flint, BAE SYSTEMS Ventures, UK

Chris Sullivan, Celoxica Ltd, UK

L. Fanucci, IEIIT, National Research Council, Italy

A. Giambastiani, SensorDynamics AG, Italy

F. Iozzi, University of Pisa, Italy

C. Marino, University of Pisa, Italy

A. Rocchi, SensorDynamics AG, Italy

P. Amato, STMicroelectronics

N. Cesario, STMicroelectronics

M. Di Meglio, STMicroelectronics

F. Pirozzi, STMicroelectronics

Claudio Stagni, DEIS-University of Bologna

Carlotta Guiducci, DEIS-University of Bologna

Massimo Lanzoni, DEIS-University of Bologna

Luca Benini, DEIS-University of Bologna

Bruno Ricc?, DEIS-University of Bologna

Momchil Milev, Texas Instruments Inc., Tucson, AZ

Rod Burt, Texas Instruments Inc., Tucson, AZ

K.-U. Kirstein, ETH Zurich, Switzerland

J. Sedivy, Czech Technical University, Czech Republic

T. Salo, ETH Zurich, Switzerland

C. Hagleitner, IBM Research GmbH, Switzerland

T. Vancura, ETH Zurich, Switzerland

A. Hierlemann, ETH Zurich, Switzerland

Johannes Sturm, Infineon Technologies Austria AG

Martin Leifhelm, Infineon Technologies Austria AG

Harald Schatzmayr, Infineon Technologies Austria AG

Stefan Groiss, Infineon Technologies Austria AG

Horst Zimmermann, Technical University of Vienna EMST

Terje N. Andersen, Nordic Semiconductor, Trondheim, Norway

Atle Briskemyr, Nordic Semiconductor, Trondheim, Norway

Frode Telst?, Nordic Semiconductor, Trondheim, Norway

Johnny Bj?rnsen, Nordic Semiconductor, Trondheim, Norway

Thomas E. Bonnerud, Nordic Semiconductor, Trondheim, Norway

Bj?rnar Hernes, Nordic Semiconductor, Trondheim, Norway

?ystein Moldsvor, Nordic Semiconductor, Trondheim, Norway

Christoph Sandner, Infineon Technologies Austria

Martin Clara, Infineon Technologies Austria

Andreas Santner, Infineon Technologies Austria

Thomas Hartig, Infineon Technologies Austria

Franz Kuttner, Infineon Technologies Austria

P. Bernardi, Politecnico di Torino, Italy

G. Masera, Politecnico di Torino, Italy

F. Quaglio, Politecnico di Torino, Italy

M. Sonza Reorda, Politecnico di Torino, Italy

Aline Mello, PUCRS, Brazil

Leandro M?ller, PUCRS, Brazil

Ney Calazans, PUCRS, Brazil

Fernando Moraes, PUCRS, Brazil

Dan Hillman, Virtual Silicon

M. D. Galanis, University of Patras, Rio, Greece

A. Milidonis, University of Patras, Rio, Greece

G. Theodoridis, Aristotle University, Thessalonica, Greece

D. Soudris, Democritus University, Xanthi, Greece

C. E. Goutis, University of Patras, Rio, Greece

Tero Rissa, Imperial College London, UK

Adam Donlin, Xilinx Inc.

Wayne Luk, Imperial College London, UK

Michael Ullmann, Universit?t Karlsruhe (TH), Germany

Wansheng Jin, Universit?t Karlsruhe (TH), Germany

J?rgen Becker, Universit?t Karlsruhe (TH), Germany

M. Borgatti, STMicroelectronics, Agrate, Italy

A. Capello, STMicroelectronics, Agrate, Italy

U. Rossi, STMicroelectronics, Agrate, Italy

J.-L. Lambert, TNI-Valysosys, France

I. Moussa, TNI-Valysosys, France

F. Fummi, University of Verona, Italy

G. Pravadelli, University of Verona, Italy

Giuseppe Falconeri, STMicroelectronics - OCCS (On Chip Communication Systems)

Walid Naifer, STMicroelectronics - OCCS (On Chip Communication Systems)

Nizar Romdhane, STMicroelectronics - OCCS (On Chip Communication Systems)

John S. MacBeth, Verilab GmbH, Germany

Dietmar Heinz, Infineon Technologies AG, Germany

Ken Gray, Verilab GmbH, Germany

Yasushi Umezawa, Fujitsu Laboratories of America, Inc., Sunnyvale, CA

Takeshi Shimizu, Fujitsu Laboratories of America, Inc., Sunnyvale, CA

Ali Habibi, Concordia University, Canada

Asif Iqbal Ahmed, Concordia University, Canada

Otmane Ait Mohamed, Concordia University, Canada

Sofi?ne Tahar, Concordia University, Canada