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Proceedings. Design, Automation and Test in Europe (2005)
Munich, Germany
March 7, 2005 to March 11, 2005
ISBN: 0-7695-2288-2
TABLE OF CONTENTS
Introduction
1D: Media and Signal Processing
G. M. Callic? , University of Las Palmas de Gran Canaria, Spain
J. F. L?pez , University of Las Palmas de Gran Canaria, Spain
S. L?pez , University of Las Palmas de Gran Canaria, Spain
pp. 2-7
Peter Y. K. Cheung , Imperial College London, England
Suhaib A. Fahmy , Imperial College London, England
pp. 8-13
Harald Devos , ELIS-PARIS, Ghent University, Belgium
Benjamin Schrauwen , ELIS-PARIS, Ghent University, Belgium
Mark Christiaens , ELIS-PARIS, Ghent University, Belgium
Dirk Stroobandt , ELIS-PARIS, Ghent University, Belgium
pp. 14-19
Ewa Hekstra-Nowacka , Philips Research Laboratories, Eindhoven, The Netherlands
Artur Burchard , Philips Research Laboratories, Eindhoven, The Netherlands
pp. 20-25
W. Stechele , Technische Universit?t M?nchen
L. Alvado C?rcel , Universidad Politecnica de Valencia
S. Herrmann , Technische Universit?t M?nchen
J. Lid? Sim? , Universidad Politecnica de Valencia
pp. 26-31
Sandro V. Silva , Federal University of Rio Grande do Sul, Brazil
Sergio Bampi , Federal University of Rio Grande do Sul, Brazil
pp. 32-37
2D: Secure and Embedded Security Systems
L. Torres , LIRMM, France
G. Sassatelli , LIRMM, France
P. Guillemin , STMicroeletronics
C. Anguille , STMicroeletronics
M. Bardouillet , STMicroeletronics
C. Buatois , CMP, Centre micro?lectronique de Provence Georges Charpak
J. B. Rigaud , CMP, Centre micro?lectronique de Provence Georges Charpak
pp. 40-45
Daniel Thull , STMicroelectronics, Italy
Roberto Sannino , STMicroelectronics, Italy
pp. 46-51
A. Mazzeo , Universit? degli Studi di Napoli Federico II, Italy
N. Mazzocca , Universit? degli Studi di Napoli Federico II, Italy
A. Cilardo , Universit? degli Studi di Napoli Federico II, Italy
pp. 52-57
Kris Tiri , UC Los Angeles
Ingrid Verbauwhede , UC Los Angeles; K.U.Leuven
pp. 58-63
Wayne Wolf , Princeton University, NJ
Shengqi Yang , Princeton University, NJ
D. N. Serpanos , Patras University, Greece
Yuan Xie , The Penn State University, University Park, PA
pp. 64-69
Interactive Presentations
S. Vinay , Indian Institute of Technology, Madras
Sanjay Burman , Indian Institute of Technology, Madras
V. Kamakoti , Indian Institute of Technology, Madras
pp. 82-83
3D: Hot Topic - MPSoC Platforms for Mobile Multimedia
Wayne Wolf , Princeton University
pp. 86-89
4D: Hot Topic - Low-Power Wireless LANs: Past, Present and Future
Keith Holt , Intel Corporation
pp. 92-93
Fred Lee , Massachusetts Institute of Technology, Cambridge, MA
David Wentzloff , Massachusetts Institute of Technology, Cambridge, MA
Raúl Bl?zquez , Massachusetts Institute of Technology, Cambridge, MA
Johnna Powell , Massachusetts Institute of Technology, Cambridge, MA
Anantha Chandrakasan , Massachusetts Institute of Technology, Cambridge, MA
pp. 94-95
T. Simunic , UCSD, La Jolla, CA
pp. 96-97
5D: Wireless Communication and Networking
Torben Brack , University of Kaiserslautern, Germany
Frank Kienle , University of Kaiserslautern, Germany
pp. 100-105
Andrew Duller , picoChip Designs Ltd., UK
Daniel Towner , picoChip Designs Ltd., UK
Gajinder Panesar , picoChip Designs Ltd., UK
Alan Gray , picoChip Designs Ltd., UK
Will Robbins , picoChip Designs Ltd., UK
pp. 106-111
T. Orphanoudakis , Ellemedia Technologies, Athens, Greece
G. Kornaros , Ellemedia Technologies, Athens, Greece
C. Kachris , Ellemedia Technologies, Athens, Greece
I. Mavroidis , Ellemedia Technologies, Athens, Greece
A. Nikologiannis , Ellemedia Technologies, Athens, Greece
pp. 112-117
Massimo Conti , Universit? Politecnica delle Marche, Italy
Daniele Moretti , Universit? Politecnica delle Marche, Italy
pp. 118-123
Bryan Bowyer , Mentor Graphics
Thomas Bollaert , Mentor Graphics
pp. 124-129
Andreas Raabe , Bonn University, Germany
Blazej Bartyzel , Bonn University, Germany
Joachim K. Anlauf , Bonn University, Germany
Gabriel Zachmann , Bonn University, Germany
pp. 130-135
Interactive Presentations
Hannu Heusala , University of Oulu, Finland
Jussi Liedes , University of Oulu, Finland
pp. 136-137
Taehun Kim , Samsung Electronics Co., Ltd., Korea
Youngduk Kim , Samsung Electronics Co., Ltd., Korea
Chulho Shin , Samsung Electronics Co., Ltd., Korea
Eui-Young Chung , Samsung Electronics Co., Ltd., Korea
Kyu-Myung Choi , Samsung Electronics Co., Ltd., Korea
Jeong-Taek Kong , Samsung Electronics Co., Ltd., Korea
Soo-Kwan Eo , Samsung Electronics Co., Ltd., Korea
pp. 138-139
6D: Automotive
H. Siebert , Infineon Technologies AG, Germany
K.D. McDonald-Maier , University of Kent, UK
pp. 148-152
C. Jeffrey , Lancaster University, UK
R. Cutajar , Lancaster University, UK
S. Prosser , TRW Automotive, UK
M. Lickess , TRW Automotive, UK
A. Richardson , Lancaster University, UK
S. Riches , Micro Circuit Engineering, UK
pp. 153-158
Pavel Horsky , AMI Semiconductor Czech, Czech Republic
pp. 159-164
Rolf Ernst , Institute of Computer and Communication Network Engineering, Germany
Andreas Schulze , Volkswagen AG, Germany
Jan Staschulat , Institute of Computer and Communication Network Engineering, Germany
pp. 165-170
Peter Braun , Validas AG
Ulrich Freund , ETAS Engineering Tools GmbH
Andreas Bauer , Institut f?r Informatik, TU M?nchen
Jan Romberg , Institut f?r Informatik, TU M?nchen
Dirk Ziegenbein , Robert Bosch GmbH
pp. 171-177
Interactive Presentation
Massimo Conti , Universit? Politecnica delle Marche, Italy
pp. 177-178
7D: Sensors
Alistair Macarthur , Celoxica Ltd, UK
Dan Preston , Medius Inc., Seattle, WA
Dave Olmstead , Medius Inc., Seattle, WA
Bob Flint , BAE SYSTEMS Ventures, UK
Chris Sullivan , Celoxica Ltd, UK
pp. 180-185
A. Giambastiani , SensorDynamics AG, Italy
L. Fanucci , IEIIT, National Research Council, Italy
C. Marino , University of Pisa, Italy
A. Rocchi , SensorDynamics AG, Italy
pp. 186-191
N. Cesario , STMicroelectronics
M. Di Meglio , STMicroelectronics
F. Pirozzi , STMicroelectronics
pp. 192-197
Carlotta Guiducci , DEIS-University of Bologna
Massimo Lanzoni , DEIS-University of Bologna
Luca Benini , DEIS-University of Bologna
Bruno Ricc? , DEIS-University of Bologna
pp. 198-203
8D: Best of ESSCIRC 2004
J. Sedivy , Czech Technical University, Czech Republic
T. Salo , ETH Zurich, Switzerland
K.-U. Kirstein , ETH Zurich, Switzerland
T. Vancura , ETH Zurich, Switzerland
A. Hierlemann , ETH Zurich, Switzerland
pp. 210-214
Martin Leifhelm , Infineon Technologies Austria AG
Johannes Sturm , Infineon Technologies Austria AG
Stefan Groiss , Infineon Technologies Austria AG
Horst Zimmermann , Technical University of Vienna EMST
pp. 215-218
Atle Briskemyr , Nordic Semiconductor, Trondheim, Norway
Frode Telst? , Nordic Semiconductor, Trondheim, Norway
Johnny Bj?rnsen , Nordic Semiconductor, Trondheim, Norway
Thomas E. Bonnerud , Nordic Semiconductor, Trondheim, Norway
Terje N. Andersen , Nordic Semiconductor, Trondheim, Norway
?ystein Moldsvor , Nordic Semiconductor, Trondheim, Norway
pp. 219-222
Martin Clara , Infineon Technologies Austria
Christoph Sandner , Infineon Technologies Austria
Thomas Hartig , Infineon Technologies Austria
Franz Kuttner , Infineon Technologies Austria
pp. 223-226
9D: IP-Reuse and Reconfigurable Systems
P. Bernardi , Politecnico di Torino, Italy
G. Masera , Politecnico di Torino, Italy
F. Quaglio , Politecnico di Torino, Italy
M. Sonza Reorda , Politecnico di Torino, Italy
pp. 228-233
Aline Mello , PUCRS, Brazil
Leandro M?ller , PUCRS, Brazil
Ney Calazans , PUCRS, Brazil
Fernando Moraes , PUCRS, Brazil
pp. 234-239
A. Milidonis , University of Patras, Rio, Greece
G. Theodoridis , Aristotle University, Thessalonica, Greece
D. Soudris , Democritus University, Xanthi, Greece
C. E. Goutis , University of Patras, Rio, Greece
pp. 247-252
Adam Donlin , Xilinx Inc.
Tero Rissa , Imperial College London, UK
pp. 253-258
Wansheng Jin , Universit?t Karlsruhe (TH), Germany
J?rgen Becker , Universit?t Karlsruhe (TH), Germany
pp. 259-264
10D: Design Verification
A. Capello , STMicroelectronics, Agrate, Italy
U. Rossi , STMicroelectronics, Agrate, Italy
J.-L. Lambert , TNI-Valysosys, France
I. Moussa , TNI-Valysosys, France
F. Fummi , University of Verona, Italy
G. Pravadelli , University of Verona, Italy
pp. 266-271
Giuseppe Falconeri , STMicroelectronics - OCCS (On Chip Communication Systems)
Walid Naifer , STMicroelectronics - OCCS (On Chip Communication Systems)
Nizar Romdhane , STMicroelectronics - OCCS (On Chip Communication Systems)
pp. 272-277
John S. MacBeth , Verilab GmbH, Germany
Dietmar Heinz , Infineon Technologies AG, Germany
Ken Gray , Verilab GmbH, Germany
pp. 278-283
Yasushi Umezawa , Fujitsu Laboratories of America, Inc., Sunnyvale, CA
pp. 284-289
Asif Iqbal Ahmed , Concordia University, Canada
Otmane Ait Mohamed , Concordia University, Canada
Ali Habibi , Concordia University, Canada
pp. 290-295
Author Index (PDF)
pp. 296-297
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