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  • 2004
  • Design, Automation and Test in Europe Conference and Exhibition Designers? Forum (DATE'04)
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Design, Automation and Test in Europe Conference and Exhibition Designers? Forum (DATE'04)
Paris, France
February 16-February 20
ISBN: 0-7695-2085-5
Table of Contents
Introduction
2D: Hot Topic — From Working Design Flow to Working Chips: Dependencies and Impacts of Methodology Decisions
null
Veikko Loukusa, Nokia Mobile Phones Ltd.
Helena Pohjonen, Nokia Mobile Phones Ltd.
Antti Ruha, Nokia Mobile Phones Ltd.
Tarmo Ruotsalainen, Nokia Mobile Phones Ltd.
Olli Varkki, Nokia Mobile Phones Ltd.
pp. 30003
3D: Analogue and RF Design
null
Ad?o A. S. J?nior, Universidade Federal do Rio Grande do Sul
Luigi Carro, Universidade Federal do Rio Grande do Sul
pp. 30010
Yiming Chen, IBM Microelectronics Division
Xiaojuen Yuan, IBM Microelectronics Division
David Scagnelli, IBM Microelectronics Division BTV
James Mecke, IBM Microelectronics Division
Jeff Gross, IBM Microelectronics Division BTV
David Harame, IBM Microelectronics Division BTV
pp. 30022
4D: Platform and IP Design
null
Alex Panato, Universidade Federal do Rio Grande do Sul
Sandro Silva, Universidade Federal do Rio Grande do Sul
Fl?vio Wagner, Universidade Federal do Rio Grande do Sul
Marcelo Johann, Universidade Federal do Rio Grande do Sul
Ricardo Reis, Universidade Federal do Rio Grande do Sul
Sergio Bampi, Universidade Federal do Rio Grande do Sul
pp. 30052
Luigi Dadda, ALaRI-USI and Politecnico di Milano
Marco Macchetti, Politecnico di Milano
Jeff Owen, ST Microelectronics NV
pp. 30070
Chang Hong Lin, Princeton University
Yuan Xie, Pennsylvania State University
Wayne Wolf, Princeton University
pp. 30076
Mauro Cocco, Silicon Hive
John Dielissen, Philips Research
Marc Heijligers, Philips Research
Andries Hekstra, Philips Research
Jos Huisken, Silicon Hive
pp. 30088
5D: Design Verification and Test
null
Stephen Schmitt, Eberhard-Karls-University of Tuebingen
Wolfgang Rosenstiel, Eberhard-Karls-University of Tuebingen and Forschungszentrum Informatik
pp. 30096
Sandeep Kumar Goel, Philips Research Laboratories
Kuoshu Chiu, Philips Semiconductors
Erik Jan Marinissen, Philips Research Laboratories
Toan Nguyen, Philips Semiconductors
Steven Oostdijk, Philips Semiconductors
pp. 30108
Xi Chen, University of California, at Riverside
Yan Luo, University of California, at Riverside
Harry Hsieh, University of California, at Riverside
Laxmi Bhuyan, University of California, at Riverside
Felice Balarin, Cadence Berkeley Laboratories
pp. 30126
6D: Design Methodology
null
I. M. Elfadel, IBM T. J. Watson Research Center
A. Deutsch, IBM T. J. Watson Research Center
G. Kopcsay, IBM T. J. Watson Research Center
B. Rubin, IBM T. J. Watson Research Center
H. Smith, IBM Systems Division
pp. 30144
J. Ruiz-Amaya, Instituto de Microelectr?nica de Sevilla
J.M. de la Rosa, Instituto de Microelectr?nica de Sevilla
F. Medeiro, Instituto de Microelectr?nica de Sevilla
F.V. Fern?ndez, Instituto de Microelectr?nica de Sevilla
R. del R?, Instituto de Microelectr?nica de Sevilla
B. P?rez-Verd?, Instituto de Microelectr?nica de Sevilla
A. Rodr?guez-V?zquez, Instituto de Microelectr?nica de Sevilla
pp. 30150
Oliver Schliebusch, Aachen University of Technology
A. Chattopadhyay, Aachen University of Technology
R. Leupers, Aachen University of Technology
G. Ascheid, Aachen University of Technology
H. Meyr, Aachen University of Technology
Mario Steinert, Infineon Technologies
Gunnar Braun, CoWare, Inc.
Achim Nohl, CoWare, Inc.
pp. 30156
7D: Network Design
null
Franco Fummi, Università di Verona
Stefano Martini, Embedded Systems Design Center
Giovanni Perbellini, Embedded Systems Design Center
Massimo Poncino, Università di Verona
Fabio Ricciato, Telecom Italia Lab
Maura Turolla, Telecom Italia Lab
pp. 30168
Marcello Coppola, ST Microelectronics
Stephane Curaba, ST Microelectronics
Miltos D. Grammatikakis, ISD S.A. and TEI-Crete
Giuseppe Maruccia, ST Microelectronics
Francesco Papariello, ST Microelectronics
pp. 30174
I. Papaefstathiou, Foundation of Research & Technology Hellas
G. Kornaros, Ellemedia Technologies
N. Zervos, Ellemedia Technologies
pp. 30186
Friedbert Berens, STMicroelectronics N.V.
Gerd Kreiselmaier, University of Kaiserslautern
Norbert Wehn, University of Kaiserslautern
pp. 30192
8D: Reconfigurable Architecture
null
A. Cilardo, Università degli Studi di Napoli Federico II
A. Mazzeo, Università degli Studi di Napoli Federico II
L. Romano, Università degli Studi di Napoli Federico II
G. P. Saggese, Università degli Studi di Napoli Federico II
pp. 30206
Hala Farouk, Arab Academy for Science, Technology & Maritime Transport
Magdy Saeb, Arab Academy for Science, Technology & Maritime Transport
pp. 30212
W.W.S. Chu, Imperial College London
R.G. Dimond, Imperial College London
S. Perrott, Imperial College London
S.P. Seng, Imperial College London
W. Luk, Imperial College London
pp. 30236
Marcos R. Boschetti, Federal University of Rio Grande do Sul
Ivan S. Silva, Federal University of Rio Grande do Norte
Sergio Bampi, Federal University of Rio Grande do Sul
pp. 30242
Djones Lettnin, T?bingen University
Axel Braun, T?bingen University
Martin Bodgan, T?bingen University
Joachim Gerlach, T?bingen University
Wolfgang Rosenstiel, T?bingen University
pp. 30248
9D: Constrained and Domain Specific Architectures
null
S. Blanc, Polytechnic University of Valencia
J. Gracia, Polytechnic University of Valencia
P. J. Gil, Polytechnic University of Valencia
pp. 30256
Thorsten Schubert, OFFIS Research Institute
Jürgen Hanisch, Robert Bosch GmbH
Joachim Gerlach, Robert Bosch GmbH
Jens-E. Appell, OFFIS Research Institute
Wolfgang Nebel, OFFIS Research Institute
pp. 30262
Beibei Ren, University of California at Santa Cruz
Anru Wang, University of California at Santa Cruz
Joyopriya Bakshi, University of California at Santa Cruz
Kai Liu, University of California at Santa Cruz
Wei Li, University of California at Santa Cruz
Wayne Dai, University of California at Santa Cruz
pp. 30280
10D: Low Power Design
null
U. Neffe, Graz University of Technology
K. Rothbart, Graz University of Technology
Ch. Steger, Graz University of Technology
R. Weiss, Graz University of Technology
E. Rieger, Philips Semiconductors
A. M?hlberger, Philips Semiconductors
pp. 30300
C. Brandolese, Politecnico di Milano
W. Fornaciari, Politecnico di Milano
F. Salice, Politecnico di Milano
D. Sciuto, Politecnico di Milano
pp. 30306
F. Menichelli, University of Rome "La Sapienza"
M. Olivieri, University of Rome "La Sapienza"
L. Benini, University of Bologna
M. Donno, Bulldast s.r.l
L. Bisdounis, Intracom S.A.
pp. 30312
IP2
Kathy Werner, Mentor Graphics Corporation
pp. 30330
Stephen Bailey, Model Technology, a Mentor Graphics Company
Erich Marschner, Cadence Design Systems
J. Bhasker, eSilicon Corporation
Jim Lewis, SynthWorks
Peter Ashenden, Ashenden Designs Pty Ltd
pp. 30332
IP3
B. Hecker, ELA Medical
M. Chavassieux, ELA Medical
M. Laflutte, ELA Medical
E Beguin, ELA Medical
L. Lagasse, EFREI
J. Oudinot, Mentor Graphics
pp. 30338
IP5
F. Fummi, Università di Verona
S. Martini, Embedded Systems Design Center
M. Monguzzi, Sitek S.p.A.
G. Perbellini, Embedded Systems Design Center
M. Poncino, Università di Verona
pp. 30342
Author Index
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