ISBN: 1-58113-688-9

Tom Schubert, Intel Corporation, Hillsboro, OR

Yves Mathys, Motorola Inc., Switzerland

Andr? Ch?telain, Motorola Inc., Switzerland

Klaus-Dieter Schubert, IBM

P. Gupta, University of California at San Diego

A. B. Kahng, University of California at San Diego

D. Sylvester, University of Michigan at Ann Arbor

J. Yang, University of Michigan at Ann Arbor

Yu Chen, UCLA Computer Science Dept., Los Angeles, CA

Puneet Gupta, UCSD, La Jolla, CA

Andrew B. Kahng, UCSD, La Jolla, CA

Raia T. Hadsell, SUNY Binghamton CSD, Binghamton NY

Patrick H. Madden, SUNY Binghamton CSD, Binghamton NY

Jason Cong, University of California, Los Angeles

Ashok Jagannathan, University of California, Los Angeles

Glenn Reinman, University of California, Los Angeles

Michail Romesis, University of California, Los Angeles

Luca Benini, Univ. di Bologna, Italy

Alberto Macii, Politecnico di Torino, Italy

Enrico Macii, Politecnico di Torino, Italy

Elvira Omerbegovic, BullDAST s.r.l., Torino, Italy

Massimo Poncino, Univ. di Verona, Italy

Fabrizio Pro, BullDAST s.r.l., Torino, Italy

Franco Fummi, Universit? di Verona, Italy

Paolo Gallo, Telecom Italia Lab, Torino, Italy

Stefano Martini, Universit? di Verona, Italy

Giovanni Perbellini, Universit? di Verona, Italy

Massimo Poncino, Universit? di Verona, Italy

Fabio Ricciato, Telecom Italia Lab, Torino, Italy

Robertas Damasevicius, Kaunas University of Technology

Giedrius Majauskas, Kaunas University of Technology

Vytautas Stuikys, Kaunas University of Technology

G. Kornaros, Ellemedia Technologies, Athens, Greece

I. Papaefstathiou, Ellemedia Technologies, Athens, Greece

A. Nikologiannis, Ellemedia Technologies, Athens, Greece

N. Zervos, Ellemedia Technologies, Athens, Greece

David Hwang, UCLA Electrical Engineering Department

Bo-Cheng Lai, UCLA Electrical Engineering Department

Patrick Schaumont, UCLA Electrical Engineering Department

Kazuo Sakiyama, UCLA Electrical Engineering Department

Yi Fan, UCLA Electrical Engineering Department

Shenglin Yang, UCLA Electrical Engineering Department

Alireza Hodjat, UCLA Electrical Engineering Department

Ingrid Verbauwhede, UCLA Electrical Engineering Department

Jennifer L. Wong, University of California, Los Angeles

Seapahn Megerian, University of California, Los Angeles

Miodrag Potkonjak, University of California, Los Angeles

Pieter W. Hooijmans, Philips Research Laboratories, The Netherlands

Jan Craninckx, IMEC, Leuven, Belgium

St?phane Donnay, IMEC, Leuven, Belgium

David E. Root, Agilent Technologies, Santa Rosa, CA

John Wood, Agilent Technologies, Santa Rosa, CA

Nick Tufillaro, Agilent Laboratories, Palo Alt, CA

Haifeng Qian, University of Minnesota, Minneapolis

Sani R. Nassif, IBM Austin Research Labs, Austin, TX

Sachin S. Sapatnekar, University of Minnesota, Minneapolis

Dionysios Kouroussis, University of Toronto, Ontario, Canada

Farid N. Najm, University of Toronto, Ontario, Canada

Zhengyong Zhu, University of California, San Diego

Bo Yao, University of California, San Diego

Chung-Kuan Cheng, University of California, San Diego

Haihua Su, IBM Austin Research Lab, Austin, TX

Emrah Acar, IBM Austin Research Lab, Austin, TX

Sani R. Nassif, IBM Austin Research Lab, Austin, TX

Kai Wang, University of California, Santa Barbara

Malgorzata Marek-Sadowska, University of California, Santa Barbara

Dexin Li, University of California, Irvine

Qiang Xie, University of California, Irvine

Pai H. Chou, University of California, Irvine

Woo-Cheol Kwon, Samsung Electronics Co., Ltd., Kyounggi-Do, Korea

Taewhan Kim, Korea Advanced Institute of Science & Technology, Korea

Shaoxiong Hua, University of Maryland, College Park

Gang Qu, University of Maryland, College Park

Shuvra S. Bhattacharyya, University of Maryland, College Park

Anand Ramachandran, The University of Texas at Austin

Margarida F. Jacome, The University of Texas at Austin

Alan Mishchenko, University of California, Berkeley

Xinning Wang, Intel Corporation, Hillsboro, OR

Timothy Kam, Intel Corporation, Hillsboro, OR

Alan Mishchenko, University of California, Berkeley

Tsutomu Sasao, Kyushu Institute of Technology, Japan

Yunjian Jiang, University of California, Berkeley

Slobodan Matic, University of California, Berkeley

Robert K. Brayton, University of California, Berkeley

Stephen A. Edwards, Columbia University, New York, NY

Marc D. Riedel, California Institute of Technology

Jehoshua Bruck, California Institute of Technology

Saibal Mukhopadhyay, Purdue University, West Lafayette, IN

Arijit Raychowdhury, Purdue University, West Lafayette, IN

Kaushik Roy, Purdue University, West Lafayette, IN

Dongwoo Lee, University of Michigan, Ann Arbor, MI

Wesley Kwong, University of Michigan, Ann Arbor, MI

David Blaauw, University of Michigan, Ann Arbor, MI

Dennis Sylvester, University of Michigan, Ann Arbor, MI

Changbo Long, University of Wisconsin, Madison

Lei He, UCLA

Y-F. Tsai, Penn State University

D. Duarte, LTD, Intel Corporation

N. Vijaykrishnan, Penn State University

M. J. Irwin, Penn State University

Dongwoo Lee, University of Michigan, Ann Arbor, MI

David Blaauw, University of Michigan, Ann Arbor, MI

Giancarlo Beraudo, University of Illinois at Chicago

John Lillis, University of Illinois at Chicago

Chao-Yang Yeh, University of California, Santa Barbara

Malgorzata Marek-Sadowska, University of California, Santa Barbara

Jason Cong, University of California, Los Angeles

Xin Yuan, University of California, Los Angeles

Sung-Woo Hur, Donga University

Tung Cao, Intel Corporation

Karthik Rajagopal, Intel Corporation

Yegna Parasuram, Intel Corporation

Amit Chowdhary, Intel Corporation

Vladimir Tiourin, Intel Corporation

Bill Halpin, Syracuse Univ. and Intel Corporation

Zhanhai Qin, Synopsys, Incorporation

Chung-Kuan Cheng, Univ. of California, San Diego

Chirayu S. Amin, Northwestern Univ., Evanston, IL

Masud H. Chowdhury, Northwestern Univ., Evanston, IL

Yehea I. Ismail, Northwestern Univ., Evanston, IL

Shizhong Mei, Northwestern University, Evanston, IL

Chirayu Amin, Northwestern University, Evanston, IL

Yehea I. Ismail, Northwestern University, Evanston, IL

Emad Gad, Carleton University, Ontario, Canada

Michel Nakhla, Carleton University, Ontario, Canada

Radoslaw Szymanek, Lund University, Sweden

Krzysztof Kuchcinski, Lund University, Sweden

Greg Stitt, University of California, Riverside

Roman Lysecky, University of California, Riverside

Frank Vahid, UC Irvine; University of California, Riverside

Kubilay Atasu, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland

Laura Pozzi, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland

Paolo Ienne, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland

Achim Nohl, CoWare, Inc., San Jose, CA

Volker Greive, CoWare, Inc., San Jose, CA

Gunnar Braun, CoWare, Inc., San Jose, CA

Andreas Hoffmann, CoWare, Inc., San Jose, CA

Rainer Leupers, Aachen University of Technology (RWTH), Aachen, Germany

Oliver Schliebusch, Aachen University of Technology (RWTH), Aachen, Germany

Heinrich Meyr, Aachen University of Technology (RWTH), Aachen, Germany

Gary H. Bernstein, University of Notre Dame, IN

Christoph Wasshuber, Texas Instruments, Dallas, TX

Islamshah Amlani, Motorola Labs, Tempe, AZ

Ruth Zhang, Motorola Labs, Tempe, AZ

John Tresek, Motorola Labs, Tempe, AZ

Larry Nagahara, Motorola Labs, Tempe, AZ

Raymond K. Tsui, Motorola Labs, Tempe, AZ

Alon Gluska, Intel Israel, Haifa

Shai Fine, IBM Research Laboratory in Haifa, Israel

Avi Ziv, IBM Research Laboratory in Haifa, Israel

Nikhil Jayakumar, University of Colorado at Boulder

Mitra Purandare, University of Colorado at Boulder

Fabio Somenzi, University of Colorado at Boulder

Jun Yuan, Motorola Inc., Austin, TX

Ken Albin, Motorola Inc., Austin, TX

Adnan Aziz, University of Texas at Austin

Carl Pixley, Synopsys, Hillsboro, OR

Samar Abdi, University of California Irvine

Dongwan Shin, University of California Irvine

Daniel Gajski, University of California Irvine

Haris Lekatsas, NEC Labs America, Princeton, New Jersey; Vorras Corporation, Princeton, New Jersey

J? Henkel, NEC Labs America, Princeton, New Jersey

Srimat Chakradhar, NEC Labs America, Princeton, New Jersey

Venkata Jakkula, NEC Labs America, Princeton, New Jersey

Murugan Sankaradass, NEC Labs America, Princeton, New Jersey

Trevor Meyerowitz, UC Berkeley, CA

Claudio Pinello, UC Berkeley, CA

Alberto Sangiovanni-Vincentelli, UC Berkeley, CA

D. Michael Miller, University of Victoria, Canada

Dmitri Maslov, University of New Brunswick, Canada

Gerhard W. Dueck, University of New Brunswick, Canada

Stephen S. Bullock, The University of Michigan, Ann Arbor

Igor L. Markov, The University of Michigan, Ann Arbor

Arash Saifhashemi, Amirkabir University of Technology

Hossein Pedram, Amirkabir University of Technology

Roman Lysecky, University of California, Riverside

Frank Vahid, University of California, Riverside

Shekhar Borkar, Circuit Research, Intel Labs, Hillsboro, OR

Tanay Karnik, Circuit Research, Intel Labs, Hillsboro, OR

Siva Narendra, Circuit Research, Intel Labs, Hillsboro, OR

Jim Tschanz, Circuit Research, Intel Labs, Hillsboro, OR

Ali Keshavarzi, Circuit Research, Intel Labs, Hillsboro, OR

Vivek De, Circuit Research, Intel Labs, Hillsboro, OR

Chandu Visweswariah, IBM Thomas J. Watson Research Center, Yorktown Heights, NY

Aseem Agarwal, University of Michigan, Ann Arbor, MI

David Blaauw, University of Michigan, Ann Arbor, MI

Vladimir Zolotov, Motorola, Inc., Austin, TX

Sarma Vrudhula, University of Arizona, Tucson, AZ

Serdar Tasiran, Ko? University, Istanbul, Turkey

Yuan Yu, Microsoft Research, Mountain View, CA

Brannon Batson, Intel Corporation, Santa Clara, CA

Yu-Chin Hsu, Novas Software Inc., San Jose, CA

Bassam Tabbara, Novas Software Inc., San Jose, CA

Yirng-An Chen, Novas Software Inc., San Jose, CA

Furshing Tsai, Novas Software Inc., San Jose, CA

Edmund Clarke, Carnegie Mellon University, Pittsburgh, PA

Daniel Kroening, Carnegie Mellon University, Pittsburgh, PA

Karen Yorav, Carnegie Mellon University, Pittsburgh, PA

Renate Henftling, Infineon Technologies AG, Munich, Germany

Andreas Zinn, Infineon Technologies AG, Munich, Germany

Matthias Bauer, Infineon Technologies AG, Munich, Germany

Martin Zambaldi, Infineon Technologies AG, Munich, Germany

Wolfgang Ecker, Infineon Technologies AG, Munich, Germany

Kanak Agarwal, University of Michigan

Dennis Sylvester, University of Michigan

David Blaauw, University of Michigan

Charles J. Alpert, IBM Corp., Austin, Texas

Frank Liu, IBM Corp., Austin, Texas

Chandramouli Kashyap, IBM Corp., Austin, Texas

Anirudh Devgan, IBM Corp., Austin, Texas

John F. Croix, Silicon Metrics Corporation, Austin, Texas

D. F. Wong, University of Illinois at Urbana-Champaign

Bhavana Thudi, University of Michigan, Ann Arbor, MI

David Blaauw, University of Michigan, Ann Arbor, MI

Jeffry T Russell, University of Texas at Austin

Margarida F Jacome, University of Texas at Austin

Andy D. Pimentel, University of Amsterdam, The Netherlands

Cagkan Erbas, University of Amsterdam, The Netherlands

JoAnn M. Paul, Carnegie Mellon University, Pittsburgh, PA

Alex Bobrek, Carnegie Mellon University, Pittsburgh, PA

Jeffrey E. Nelson, Carnegie Mellon University, Pittsburgh, PA

Joshua J. Pieper, Carnegie Mellon University, Pittsburgh, PA

Donald E. Thomas, Carnegie Mellon University, Pittsburgh, PA

Satya Kiran, Indian Institute of Technology Delhi

M.N. Jayram, Philips Research, Eindhoven, Netherlands

Pradeep Rao, Indian Institute of Science, Bangalore, India

S. K. Nandy, Indian Institute of Science, Bangalore, India

Greg Spirakis, Intel Corporation, Santa Clara, CA

Akira Matsuzawa, Tokyo Institute of Technology, Japan

Philippe Magarshack, Central R&D, STMicroelectronics, France

Pierre G. Paulin, Central R&D, STMicroelectronics, France

Sanjit A. Seshia, Carnegie Mellon University, Pittsburgh, PA

Shuvendu K. Lahiri, Carnegie Mellon University, Pittsburgh, PA

Randal E. Bryant, Carnegie Mellon University, Pittsburgh, PA

Amit Goel, Carnegie Mellon University, Pittsburgh, PA

Gagan Hasteer, Innologic Systems, San Jose, CA

Randal E. Bryant, Carnegie Mellon University, Pittsburgh, PA

Feng Lu, University of California at Santa Barbara

Li-C. Wang, University of California at Santa Barbara

K.-T. (Tim) Cheng, University of California at Santa Barbara

John Moondanos, INTEL Corporation

Ziyad Hanna, INTEL Corporation

Kelvin Ng, University of British Columbia, Vancouver, BC

Mukul R Prasad, Fujitsu Laboratories of America, Sunnyvale, CA

Rajarshi Mukherjee, Fujitsu Laboratories of America, Sunnyvale, CA

Jawahar Jain, Fujitsu Laboratories of America, Sunnyvale, CA

Giovanni Agosta, Politecnico di Milano Italy

Francesco Bruschi, Politecnico di Milano Italy

Donatella Sciuto, Politecnico di Milano Italy

Marek Jersak, Technical University of Braunschweig, Germany

Rolf Ernst, Technical University of Braunschweig, Germany

Xi Chen, University of California at Riverside

Harry Hsieh, University of California at Riverside

Felice Balarin, Cadence Berkeley Laboratories, Berkeley, CA

Yosinori Watanabe, Cadence Berkeley Laboratories, Berkeley, CA

Xianfeng Li, National University of Singapore

Tulika Mitra, National University of Singapore

Abhik Roychoudhury, National University of Singapore

Peng Li, Carnegie Mellon University, Pittsburgh, Pennsylvania

Lawrence T. Pileggi, Carnegie Mellon University, Pittsburgh, Pennsylvania

Xin Li, Carnegie Mellon University, Pittsburgh, PA

Peng Li, Carnegie Mellon University, Pittsburgh, PA

Yang Xu, Carnegie Mellon University, Pittsburgh, PA

Lawrence T. Pileggi, Carnegie Mellon University, Pittsburgh, PA

Ning Dong, University of Minnesota

Jaijeet Roychowdhury, University of Minnesota

Dmitry Vasilyev, Massachusetts Institute of Technology, Cambridge

Michal Rewienski, Massachusetts Institute of Technology, Cambridge

Jacob White, Massachusetts Institute of Technology, Cambridge

Claire Fang Fang, Carnegie Mellon University

Rob A. Rutenbar, Carnegie Mellon University

Markus P?schel, Carnegie Mellon University

Tsuhan Chen, Carnegie Mellon University

Manish Amde, Indian Institute of Technology, Bombay, India

Ivan Blunno, Politecnico di Torino, Torino, Italy

Christos P. Sotiriou, FORTH, Heraklion, Greece

Catherine G. Wong, California Institute of Technology, Pasadena

Alain J. Martin, California Institute of Technology, Pasadena

Byoungro So, University of Southern California / Information Sciences Institute, Marina del Rey, California

Pedro C. Diniz, University of Southern California / Information Sciences Institute, Marina del Rey, California

Mary W. Hall, University of Southern California / Information Sciences Institute, Marina del Rey, California

Robert M. Senger, University of Michigan, Ann Arbor, Michigan

Eric D. Marsman, University of Michigan, Ann Arbor, Michigan

Michael S. McCorquodale, University of Michigan, Ann Arbor, Michigan

Fadi H. Gebara, University of Michigan, Ann Arbor, Michigan

Keith L. Kraver, University of Michigan, Ann Arbor, Michigan

Matthew R. Guthaus, University of Michigan, Ann Arbor, Michigan

Richard B. Brown, University of Michigan, Ann Arbor, Michigan

Charlotte Y. Lau, Microsystems Technology Laboratory, MIT

Michael H. Perrott, Microsystems Technology Laboratory, MIT

Payam Heydari, University of California, Irvine

V. Vasudevan, Indian Institute of Technology-Madras

M. Ramakrishna, Indian Institute of Technology-Madras

Alicia Manthe, University of Washington, Seattle

Zhao Li, University of Washington, Seattle

C.-J. Richard Shi, University of Washington, Seattle

Li Chen, University of California at San Diego

Srivaths Ravi, NEC Laboratories America, Inc., Princeton, NJ

Anand Raghunathan, NEC Laboratories America, Inc., Princeton, NJ

Sujit Dey, University of California at San Diego

Wei Li, Univ. of Iowa, Iowa City

Chaowen Yu, Univ. of Iowa, Iowa City

Sudhakar M. Reddy, Univ. of Iowa, Iowa City

Irith Pomeranz, Purdue University, West Lafayette, IN

Ahmad A. Al-Yamani, Stanford University, CA

Edward J. McCluskey, Stanford University, CA

Peter Wohl, Synopsys Inc., Williston, VT

John A. Waicukauski, Synopsys Inc., Tualatin, OR

Sanjay Patel, Synopsys Inc., Beaverton, OR

Minesh B. Amin, Synopsys Inc., Mountain View, CA

Marcelo Negreiros, Universidade Federal do Rio Grande do Sul - PPGC, Porto Alegre, RS, Brazil

Luigi Carro, Universidade Federal do Rio Grande do Sul - PPGC, Porto Alegre, RS, Brazil

Altamiro Amadeu Susin, Universidade Federal do Rio Grande do Sul - PPGC, Porto Alegre, RS, Brazil

Bo Hu, Univ. of CA, Santa Barbara

Yosinori Watanabe, Cadence Berkeley Labs, CA

Alex Kondratyev, Cadence Berkeley Labs, CA

Malgorzata Marek-Sadowska, Univ. of CA, Santa Barbara

Weiping Shi, Texas A&M University, College Station, TX

Zhuo Li, Texas A&M University, College Station, TX

Maged Ghoneima, Northwestern University

Yehea Ismail, Northwestern University

Jihong Ren, University of British Columbia

Mark Greenstreet, University of British Columbia

Pongstorn Maidee, University of Minnesota, Minneapolis

Cristinel Ababei, University of Minnesota, Minneapolis

Kia Bazargan, University of Minnesota, Minneapolis

Seda Ogrenci Memik, UCLA

Gokhan Memik, UCLA

Roozbeh Jafari, UCLA

Eren Kursun, UCLA

Heidi E. Ziegler, University of Southern California / Information Sciences Institute, Marina del Rey, CA

Mary W. Hall, University of Southern California / Information Sciences Institute, Marina del Rey, CA

Pedro C. Diniz, University of Southern California / Information Sciences Institute, Marina del Rey, CA

Adam Kaplan, University of California, Los Angeles

Philip Brisk, University of California, Los Angeles

Ryan Kastner, University of California, Santa Barbara

Monica Donno, BullDAST s.r.l., Torino, Italy

Alessandro Ivaldi, Politecnico di Torino, Italy

Luca Benini, Universit? di Bologna, Italy

Enrico Macii, Politecnico di Torino, Italy

Rizwan Bashirullah, North Carolina State University, Raleigh, NC

Wentai Liu, University of California, Santa Cruz

Ralph K. Cavin, Research Triangle Park, NC

Tali Moreshet, Brown University, Providence, RI

R. Iris Bahar, Brown University, Providence, RI

Reinaldo A. Bergamaschi, IBM T. J. Watson Research Center Yorktown, Heights, NY

Yunjian W. Jiang, University of California, Berkeley

Alireza Ejlali, Sharif University of technology, Tehran, Iran

Seyed Ghassem Miremadi, Sharif University of technology, Tehran, Iran

Fernanda Lima, Universidade Federal do Rio Grande do Sul

Luigi Carro, Universidade Federal do Rio Grande do Sul

Ricardo Reis, Universidade Federal do Rio Grande do Sul

Joan Carletta, The University of Akron, OH

Robert Veillette, The University of Akron, OH

Frederick Krach, The University of Akron, OH

Zhengwei Fang, The University of Akron, OH

Xijiang Lin, Mentor Graphics Corp., Wilsonville, OR

Rob Thompson, Mentor Graphics Corp., Wilsonville, OR

A. Krstic, University of California, Santa Barbara

L.-C. Wang, University of California, Santa Barbara

K.-T. Cheng, University of California, Santa Barbara

J.-J. Liou, Tsing-Hua University, Taiwan

T. M. Mak, Intel Corporation, Santa Clara, CA

Yu Huang, Mentor Graphics Co., Waltham, MA

Wu-Tung Cheng, Mentor Graphics Co., Wilsonville, OR

Mehdi Baradaran Tahoori, Stanford University

Frank O'Mahony, Stanford University, CA

C. Patrick Yue, Aeluros, Inc., Mountain View, CA

Mark A. Horowitz, Stanford University, CA

S. Simon Wong, Stanford University, CA

John G. Maneatis, True Circuits, Inc., Los Altos, CA

Jaeha Kim, True Circuits, Inc., Los Altos, CA

Iain McClatchie, True Circuits, Inc., Los Altos, CA

Jay Maxey, Texas Instruments Incorporated, Dallas, TX

Manjusha Shankaradas, Texas Instruments Incorporated, Dallas, TX

M. Borgatti, STMicroelectronics, Central R&D, Agrate Brianza, Italy

L. Cal?, STMicroelectronics, Central R&D, Agrate Brianza, Italy

G. De Sandre, STMicroelectronics, Central R&D, Agrate Brianza, Italy

B. For?, STMicroelectronics, Central R&D, Agrate Brianza, Italy

D. Iezzi, STMicroelectronics, Central R&D, Agrate Brianza, Italy

F. Lertora, STMicroelectronics, Central R&D, Agrate Brianza, Italy

G. Muzzi, STMicroelectronics, Central R&D, Agrate Brianza, Italy

M. Pasotti, STMicroelectronics, Central R&D, Agrate Brianza, Italy

M. Poles, STMicroelectronics, Central R&D, Agrate Brianza, Italy

P. L. Rolandi, STMicroelectronics, Central R&D, Agrate Brianza, Italy

Yiu-Hing Chan, IBM Server Group, Poughkeepsie, NY

Prabhakar Kudva, IBM TJ Watson Research Center, Yorktown Heights, NY

Lisa Lacey, IBM TJ Watson Research Center, Yorktown Heights, NY

Greg Northrop, IBM TJ Watson Research Center, Yorktown Heights, NY

Thomas Rosser, IBM Server Group, Austin, TX

Hisashige Ando, Fujitsu Ltd. Kawasaki, Japan

Yuuji Yoshida, Fujitsu Ltd. Kawasaki, Japan

Aiichiro Inoue, Fujitsu Ltd. Kawasaki, Japan

Itsumi Sugiyama, Fujitsu Ltd. Kawasaki, Japan

Takeo Asakawa, Fujitsu Ltd. Kawasaki, Japan

Kuniki Morita, Fujitsu Ltd. Kawasaki, Japan

Toshiyuki Muta, Fujitsu Ltd. Kawasaki, Japan

Tsuyoshi Motokurumada, Fujitsu Ltd. Kawasaki, Japan

Seishi Okada, Fujitsu Ltd. Kawasaki, Japan

Hideo Yamashita, Fujitsu Ltd. Kawasaki, Japan

Yoshihiko Satsukawa, Fujitsu Ltd. Kawasaki, Japan

Akihiko Konmoto, Fujitsu Ltd. Kawasaki, Japan

Ryouichi Yamashita, Fujitsu Ltd. Kawasaki, Japan

Hiroyuki Sugiyama, Fujitsu Ltd. Kawasaki, Japan

Jason Stinson, Intel Corporation, Santa Clara, CA

Stefan Rusu, Intel Corporation, Santa Clara, CA

Zhenhai Zhu, Massachusetts Institute of Technology, Cambridge

Ben Song, Massachusetts Institute of Technology, Cambridge

Jacob White, Massachusetts Institute of Technology, Cambridge

Hao Yu, UCLA

Lei He, UCLA

D. Goren, IBM Haifa Research and Development Labs, Israel

M. Zelikson, IBM Haifa Research and Development Labs, Israel

R. Gordin, IBM Haifa Research and Development Labs, Israel

I. A. Wagner, IBM Haifa Research and Development Labs, Israel

A. Barger, IBM Haifa Research and Development Labs, Israel

A. Amir, IBM Haifa Research and Development Labs, Israel

B. Livshitz, IBM Haifa Research and Development Labs, Israel

A. Sherman, IBM Haifa Research and Development Labs, Israel

Y. Tretiakov, IBM Design Automation Dept., Burlington

R. Groves, IBM SiGe Model Development, East Fishkill

J. Park, IBM SiGe Model Development, East Fishkill

D. Jordan, IBM Design Automation Dept., Burlington

S. Strang, IBM Design Automation Dept., Burlington

R. Singh, IBM Design Automation Dept., Burlington

C. Dickey, IBM Design Automation Dept., Burlington

D. Harame, IBM Design Automation Dept., Burlington

Guoan Zhong, Purdue University, West Lafayette, IN

Cheng-Kok Koh, Purdue University, West Lafayette, IN

Venkataramanan Balakrishnan, Purdue University, West Lafayette, IN

Kaushik Roy, Purdue University, West Lafayette, IN

Wenjing Rao, UC San Diego

Ismet Bayraktaroglu, Sun Microsystem

Alex Orailoglu, UC San Diego

Anuja Sehgal, Duke University, Durham, NC

Vikram Iyengar, IBM Microelectronics, Essex Jct, VT

Mark D. Krasniewski, Duke University, Durham, NC

Krishnendu Chakrabarty, Duke University, Durham, NC

Dong Xiang, Tsinghua University, Beijing, China

Shan Gu, Tsinghua University, Beijing, China

Jia-Guang Sun, Tsinghua University, Beijing, China

Yu-liang Wu, The Chinese Univ. of Hong Kong, Shatin N.T., Hong Kong

Irith Pomeranz, Purdue University, W. Lafayette, IN

Sudhakar M. Reddy, University of Iowa, Iowa City

Wai Sum Mong, University of Toronto, Ontario, Canada

Jianwen Zhu, University of Toronto, Ontario, Canada

Mehrdad Reshadi, University of California, Irvine

Prabhat Mishra, University of California, Irvine

Nikil Dutt, University of California, Irvine

Wei Qin, Princeton University, NJ

Sharad Malik, Princeton University, NJ

David E. Lackey, IBM Microelectronics Division, Essex Junction, VT

Paul S. Zuchowski, IBM Microelectronics Division, Essex Junction, VT

Juergen Koehl, IBM Microelectronics Division, Essex Junction, VT

Clive Bittlestone, Texas Instruments Inc. Dallas Texas

Anthony Hill, Texas Instruments Inc. Dallas Texas

Vipul Singhal, Texas Instruments Inc. Dallas Texas

N.V. Arvind, Texas Instruments Inc. Dallas Texas

L. Pileggi, Carnegie Mellon University, Pittsburgh, Pennsylvania

H. Schmit, Carnegie Mellon University, Pittsburgh, Pennsylvania

A. J. Strojwas, Carnegie Mellon University, Pittsburgh, Pennsylvania

P. Gopalakrishnan, Carnegie Mellon University, Pittsburgh, Pennsylvania

V. Kheterpal, Carnegie Mellon University, Pittsburgh, Pennsylvania

A. Koorapaty, Carnegie Mellon University, Pittsburgh, Pennsylvania

C. Patel, Carnegie Mellon University, Pittsburgh, Pennsylvania

V. Rovner, Carnegie Mellon University, Pittsburgh, Pennsylvania

K. Y. Tong, Carnegie Mellon University, Pittsburgh, Pennsylvania

Ruchir Puri, IBM Research, Yorktown Hts, NY

Leon Stok, IBM Research, Yorktown Hts, NY

John Cohn, IBM Microelectronics, Essex Jn, VT

David Kung, IBM Research, Yorktown Hts, NY

David Pan, IBM Research, Yorktown Hts, NY

Dennis Sylvester, University of Michigan, Ann Arbor, MI

Ashish Srivastava, University of Michigan, Ann Arbor, MI

Sarvesh Kulkarni, University of Michigan, Ann Arbor, MI

Hongyu Chen, University of California, San Diego

Chung-Kuan Cheng, University of California, San Diego

Nan-Chi Chou, Mentor Graphics Corporation, San Jose, CA

Andrew B. Kahng, University of California, San Diego

John F. MacDonald, Mentor Graphics Corporation, San Diego, CA

Peter Suaris, Mentor Graphics Corporation, Wilsonville, OR

Bo Yao, University of California, San Diego

Zhengyong Zhu, University of California, San Diego

Bo Hu, Univ. of California, Santa Barbara

Malgorzata Marek-Sadowska, Univ. of California, Santa Barbara

Yuchun Ma, Tsinghua University, Beijing, China

Xianlong Hong, Tsinghua University, Beijing, China

Sheqin Dong, Tsinghua University, Beijing, China

Song Chen, Tsinghua University, Beijing, China

Yici Cai, Tsinghua University, Beijing, China

C. K. Cheng, University of California, San Diego

Jun Gu, Science & Technology University of Hong Kong

Hsun-Cheng Lee, Synopsys Inc., Taipei, Taiwan

Yao-Wen Chang, National Taiwan University, Taipei, Taiwan

Jer-Ming Hsu, National Center for High-Performance Computing, Hsinchu, Taiwan

Hannah H. Yang, Intel Corporation, Hillsboro, OR

Robert Damiano, Synopsys, Inc., Hillsboro, OR

James Kukula, Synopsys, Inc., Hillsboro, OR

Aarti Gupta, NEC Labs America, Princeton, NJ

Malay Ganai, NEC Labs America, Princeton, NJ

Chao Wang, University of Colorado, Boulder

Zijiang Yang, NEC Labs America, Princeton, NJ

Pranav Ashar, NEC Labs America, Princeton, NJ

Donald Chai, University of California at Berkeley

Andreas Kuehlmann, Cadence Berkeley Labs, Berkeley, CA

Fadi A. Aloul, University of Michigan

Igor L. Markov, University of Michigan

Karem A. Sakallah, University of Michigan

Hyeong-Ju Kang, KAIST, Korea

In-Cheol Park, KAIST, Korea

Gilles-Eric Descamps, Silicon Access Networks Inc., San Jose, CA

Satish Bagalkotkar, Silicon Access Networks Inc., San Jose, CA

Subramanian Ganesan, Silicon Access Networks Inc., San Jose, CA

Satish Iyengar, Silicon Access Networks Inc., San Jose, CA

Alain Pirson, Silicon Access Networks Inc., San Jose, CA

Kaijian Shi, Professional Services, Synopsys Inc., Dallas, TX

Graig Godwin, Texas Instruments, Inc., Dallas, TX

Imad A. Ferzli, University of Toronto, Ontario, Canada

Farid N. Najm, University of Toronto, Ontario, Canada

Donald Chai, University of California, Berkeley

Alex Kondratyev, Cadence Berkeley Labs, Berkeley, CA

Yajun Ran, University of California, Santa Barbara

Kenneth H. Tseng, Cadence Design Systems, San Jose, CA

Yosinori Watanabe, Berkeley, CA 94704

Malgorzata Marek-Sadowska, University of California, Santa Barbara

Ken Tseng, Cadence Design Systems

Vinod Kariat, Cadence Design Systems