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Los Angeles, CA
June 5, 2000 to June 9, 2000
ISBN: 1-58113-1897-9
pp: 79-84
Sudhakar Muddu , Silicon Graphics, Inc., Mountain View, CA
Egino Sarto , 3dfx Interactive, Inc., San Jose, CA
Andrew B. Kahng , UCLA Computer Science Dept., Los Angeles, CA
ABSTRACT
We revisit a basic element of modern signal integrity analysis, the modeling of worst-case coupling capacitance effects within a switch factor (SF) based methodology. We show that the exact SF is a function of the ratio of slew times of both aggressor and victim interconnect voltages. Our main result is that 2C{c} (or, SF=2), where C{c} is the static coupling capacitance, is not a correct upper bound when calculating interconnect delay in presence of crosstalk: we show that for signals modeled as finite ramps the worst case is SF = 3. This has implications for almost all signal integrity methodologies, e.g., window-based approaches that iteratively determine worst-case coupling effects. We have tested our result in a worst-case delay analysis methodology by transforming the coupled RC network to an RC network where each coupling capacitance C is replaced by a capacitance 3C to ground. SPICE simulation confirms the accuracy of worst-case delay estimates produced using SF = 3. Delay with SF = 3 can still be underestimating because of exponential waveforms.
CITATION
Sudhakar Muddu, Egino Sarto, Andrew B. Kahng, "On Switch Factor Based Analysis of Coupled RC Interconnects", DAC, 2000, Design Automation Conference, Design Automation Conference 2000, pp. 79-84, doi:10.1109/DAC.2000.855281
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