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36th Annual Conference on Design Automation (DAC'99)
New Orleans, Louisiana, United States
June 21-June 25
ISBN: 1-58113-109-7
Table of Contents
Papers
Jing-Rebecca Li, Massachusetts Institute of Technology, Cambridge, MA
Frank Wang, Massachusetts Institute of Technology, Cambridge, MA
Jacob White, Massachusetts Institute of Technology, Cambridge, MA
pp. 1-6
Chung-Ping Chen, Strategic CAD Labs, Intel Corp., Hillsboro, Oregon
R. F. Wong, University of Texas at Austin
pp. 7-12
Pavan K. Gunupudi, Carleton University, Ottawa, Canada
Michel S. Nakhla, Carleton University, Ottawa, Canada
pp. 13-16
Why is ATPG Easy? (Abstract)
Mukul R. Prasad, University of California, Berkeley, CA
Philip Chong, University of California, Berkeley, CA
Kurt Keutzer, University of California, Berkeley, CA
pp. 22-28
Rolf Drechsler, Albert-Ludwigs-University, Germany
Wolfgang G?nther, Albert-Ludwigs-University, Germany
pp. 29-32
Gang Qu, University of California, Los Angeles, CA
Jennifer L. Wong, University of California, Los Angeles, CA
Miodrag Potkonjak, University of California, Los Angeles, CA
pp. 33-36
Ali Dasdan, University of Illinois, Urbana, IL
Sandy S. Irani, University of California, Irvine, CA
Rajesh K. Gupta, University of California, Irvine, CA
pp. 37-42
Daniel D. Gajski, University of California, Irvine
pp. 43-43
Pai Chou, Consystant Design Technologies, Inc., Seattle, WA
Ross Ortega, University of Washington, Seattle, WA
Ken Hines, University of Washington, Seattle, WA
Kurt Partridge, University of Washington, Seattle, WA
Gaetano Borriello, University of Washington, Seattle, WA
pp. 44-49
Marcello Dalpasso, DEI - Universit? di Padova, Italy
Alessandro Bogliolo, DEIS - Universit? di Bologna, Italy
Luca Benini, DEIS - Universit? di Bologna, Italy
pp. 50-55
Ganesh Lakshminarayana, CCRL-NEC USA
Anand Raghunathan, CCRL-NEC USA
Kamal S. Khouri, Princeton University
Niraj K. Jha, Princeton University
Sujit Dey, Univ. of California, San Diego
pp. 56-61
Chingwei Yeh, Nat'l Chung-Cheng Univ., Taiwan
Yin-Shuin Kang, Nat'l Chung-Cheng Univ., Taiwan
Shan-Jih Shieh, Nat'l Chung-Cheng Univ., Taiwan
Jinn-Shyan Wang, Nat'l Chung-Cheng Univ., Taiwan
pp. 62-67
Chingwei Yeh, Nat'l Chung-Cheng Univ., Taiwan
Min-Cheng Chang, Nat'l Chung-Cheng Univ., Taiwan
Shih-Chieh Chang, Nat'l Chung-Cheng Univ., Taiwan
Wen-Bone Jone, Nat'l Chung-Cheng Univ., Taiwan
pp. 68-71
Xiang-Dong Tan, University of Washington, Seattle, WA
C.-J. Richard Shi, University of Washington, Seattle, WA
Dragos Lungeanu, University of Washington, Seattle, WA
Jyh-Chwen Lee, Avant! Corporation, Fremont, CA
Li-Pen Yuan, Avant! Corporation, Fremont, CA
pp. 78-83
Jiang Hu, University of Minnesota, MN
Sachin S. Sapatnekar, University of Minnesota, MN
pp. 84-89
Hui-Ru Jiang, National Chiao Tung University, Taiwan
Jing-Yang Jou, National Chiao Tung University, Taiwan
Yao-Wen Chang, National Chiao Tung University, Taiwan
pp. 90-95
Hai Zhou, University of Texas, Austin
D. F. Wong, University of Texas, Austin
I-Min Liu, University of Texas, Austin
Adnan Aziz, University of Texas, Austin
pp. 96-99
Prashant Saxena, Intel Corporation, Hillsboro, OR
C. L. Liu, National Tsing Hua University, Taiwan
pp. 100-103
Erik Brunvand, University of Utah, SLC
Steven Nowick, Columbia University, New York
Kenneth Yun, University of California, San Diego
pp. 104-109
Alex Kondratyev, Univ. of Aizu, Japan
Jordi Cortadella, Univ. Polit?cnica, Catalunya, Spain
Michael Kishinevsky, Intel Corp., USA
Luciano Lavagno, Univ. of Udine, Italy
Alexander Yakovlev, Univ. of Newcastle upon Tyne, UK
pp. 110-115
Ken Stevens, Intel Corporation, Hillsboro, OR
Shai Rotem, Intel Corporation, Hillsboro, OR
Steven M. Burns, Intel Corporation, Hillsboro, OR
Jordi Cortadella, Universitat Polit?cnica de Catalunya, Barcelona, Spain
Ran Ginosar, Intel Corporation, Hillsboro, OR; VLSI Systems Research Center, Technion, Haifa, Israel
Michael Kishinevsky, Intel Corporation, Hillsboro, OR
Marly Roncken, Intel Corporation, Hillsboro, OR
pp. 116-121
L. Benini, Universit? di Bologna, Italy
A. Macii, Politecnico di Torino, Italy
E. Macii, Politecnico di Torino, Italy
M. Poncino, Politecnico di Torino, Italy
R. Scarsi, Politecnico di Torino, Italy
pp. 128-133
Youngsoo Shin, Seoul National University, Korea
Kiyoung Choi, Seoul National University, Korea
pp. 134-139
Wen-Tsong Shiue, Arizona State University, Tempe, AZ
Chaitali Chakrabarti, Arizona State University, Tempe, AZ
pp. 140-145
Ravi Sharma, Lucent Technologies, Freehold, NJ
pp. 146-150
David Stepner, Integrated Systems, Inc, Sunnyvale, CA
Nagarajan Rajan, Integrated Systems, Inc, Sunnyvale, CA
David Hui, Integrated Systems, Inc, Sunnyvale, CA
pp. 151-156
Ken Arnold, Sun Microsystems, Inc., Burlington, MA
pp. 157-162
Dennis Abts, Silicon Graphics Inc., Chippewa Falls, WI
Mike Roberts, Silicon Graphics Inc., Chippewa Falls, WI
pp. 163-168
Jian Shen, The University of Texas at Austin
Jacob Abraham, The University of Texas at Austin
Dave Baker, Equator Technologies Inc., Austin, Texas
Tony Hurson, Equator Technologies Inc., Austin, Texas
Martin Kinkade, Equator Technologies Inc., Austin, Texas
Gregorio Gervasio, Equator Technologies Inc., Austin, Texas
Chen-chau Chu, Equator Technologies Inc., Austin, Texas
Guanghui Hu, Equator Technologies Inc., Austin, Texas
pp. 169-174
Shmuel Ur, IBM Haifa Research Lab
Yoav Yadin, IBM Haifa Research Lab
pp. 175-180
You-Sung Chang, KAIST, Taejon, Korea
Seungjong Lee, KAIST, Taejon, Korea
In-Cheol Park, KAIST, Taejon, Korea
Chong-Min Kyung, KAIST, Taejon, Korea
pp. 181-184
David Van Campenhout, The University of Michigan, Ann Arbor, MI
Trevor Mudge, The University of Michigan, Ann Arbor, MI
John P. Hayes, The University of Michigan, Ann Arbor, MI
pp. 185-188
Laurent Fournier, IBM Research Lab in Haifa
Anatoly Koyfman, IBM Research Lab in Haifa
Moshe Levinger, IBM Research Lab in Haifa
pp. 189-194
Ying Liu, Carnegie Mellon University, Pittsburgh, PA
Lawrence T. Pileggi, Carnegie Mellon University, Pittsburgh, PA
Andrzej J. Strojwas, Carnegie Mellon University, Pittsburgh, PA
pp. 201-206
Carlos P. Coelho, INESC / Cadence European Laboratories, Portugal
Joel R. Phillips, Cadence Design Systems, San Jose, CA
L. Miguel Silveira, INESC / Cadence European Laboratories, Portugal
pp. 207-212
Jianwen Zhu, University of California, Irvine, CA
Daniel D. Gajski, University of California, Irvine, CA
pp. 219-224
Marek Perkowski, Portland State University, Oregon
Rahul Malvi, Portland State University, Oregon
Stan Grygiel, Portland State University, Oregon
Mike Burns, Portland State University, Oregon
Alan Mishchenko, Portland State University, Oregon
pp. 225-230
Xun Liu, University of Michigan, Ann Arbor
Marios C. Papaefthymiou, University of Michigan, Ann Arbor
Eby G. Friedman, University of Rochester, New York
pp. 231-236
Klaus Eckl, Technical Univ. of Munich, Germany
Jean Christophe Madre, Synopsys, Inc., France
Peter Zepter, Synopsys Inc., Mountain View, CA
Christian Legl, Technical Univ. of Munich, Germany
pp. 237-242
L. Benini, Universit? di Bologna, Italy
G. De Micheli, Stanford University, CA
E. Macii, Politecnico di Torino, Italy
G. Odasso, Politecnico di Torino, Italy
M. Poncino, Politecnico di Torino, Italy
pp. 247-252
Joseph A. Fisher, Hewlett-Packard Laboratories Cambridge, Cambridge, MA
pp. 253-257
Samuel P. Harbison, Texas Instruments, Monroeville, PA
pp. 258-259
Hsiao-Pin Su, Tsing Hua University, Taiwan; Taiwan Semiconductor Manufacturing Company, Ltd., Taiwan
Allen C.-H. Wu, Tsing Hua University, Taiwan
Youn-Long Lin, Tsing Hua University, Taiwan
pp. 262-267
Pei-Ning Guo, Mentor Graphics Corp., San Jose, CA
Chung-Kuan Cheng, Mentor Graphics Corp., San Jose, CA
Takeshi Yoshimura, NEC Corp., Japan
pp. 268-273
Florin Balasa, Conexant Systems, Newport Beach, CA
Koen Lampaert, Conexant Systems, Newport Beach, CA
pp. 274-279
Sanghun Park, Seoul National University, Korea
Kiyoung Choi, Seoul National University, Korea
pp. 286-291
Steve Haynal, University of California, Santa Barbara
Forrest Brewer, University of California, Santa Barbara
pp. 292-295
Luiz C. V. dos Santos, Eindhoven University of Technology, The Netherlands
Jochen A. G. Jess, Eindhoven University of Technology, The Netherlands
pp. 296-299
Yatin Hoskote, Intel Corp.
Timothy Kam, Intel Corp.
Pei-Hsin Ho, Synopsys, Inc.
Xudong Zhao, Intel Corp.
pp. 300-305
Gianpiero Cabodi, Politecnico di Torino, Italy
Paolo Camurati, Politecnico di Torino, Italy
Stefano Quer, Politecnico di Torino, Italy
pp. 306-311
Shankar G. Govindaraju, Stanford University, CA
David L. Dill, Stanford University, CA
Jules P. Bergmann, Stanford University, CA
pp. 312-316
A. Biere, Carnegie Mellon University, Pittsburgh, PA; Verysys Design Automation, Inc., Fremont, CA
A. Cimatti, Istituto per la Ricerca Scientifica e Tecnolgica (IRST), Italy
E. M. Clarke, Carnegie Mellon University, Pittsburgh, PA; Verysys Design Automation, Inc., Fremont, CA
M. Fujita, Fujitsu Laboratories of America, Inc., Sunnyvale, CA
Y. Zhu, Carnegie Mellon University, Pittsburgh, PA; Verysys Design Automation, Inc., Fremont, CA
pp. 317-320
L. Nachtergaele, IMEC, Leuven, Belgium
B. Vanhoof, IMEC, Leuven, Belgium
M. Pe?, IMEC, Leuven, Belgium
G. Lafruit, IMEC, Leuven, Belgium
J. Bormans, IMEC, Leuven, Belgium
I. Bolsens, IMEC, Leuven, Belgium
pp. 333-336
Patrick Schaumont, IMEC vzw, Belgium
Radim Cmar, IMEC vzw, Belgium
Serge Vernalde, IMEC vzw, Belgium
Marc Engels, IMEC vzw, Belgium
pp. 337-340
George Karypis, University of Minnesota, Minneapolis
Vipin Kumar, University of Minnesota, Minneapolis
pp. 343-348
Andrew E. Caldwell, UCLA Computer Science Department, Los Angeles, CA
Andrew B. Kahng, UCLA Computer Science Department, Los Angeles, CA
Andrew A. Kennings, Cypress Semiconductor, Beaverton, OR
Igor L. Markov, UCLA Computer Science Department, Los Angeles, CA
pp. 349-354
Andrew E. Caldwell, UCLA Computer Science Department, Los Angeles, CA
Andrew B. Kahng, UCLA Computer Science Department, Los Angeles, CA
Igor L. Markov, UCLA Computer Science Department, Los Angeles, CA
pp. 355-359
Sung-Woo Hur, University of Illinois at Chicago
John Lillis, University of Illinois at Chicago
pp. 360-366
Sumit Roy, Cadence Design Systems, Santa Clara, CA
Krishna Belkhale, Cadence Design Systems, Santa Clara, CA
Prithvirai Banerjee, Northwestern University, Evanston, IL
pp. 367-372
Jason Cong, University of California, Los Angeles
Yean-Yow Hwang, University of California, Los Angeles
Songjie Xu, University of California, Los Angeles
pp. 373-378
Priyadarshan Patra, Intel Corporation, Hillsboro, OR
Unni Narayanan, Intel Corporation, Santa Clara, CA
pp. 379-384
Malay K. Ganai, The University of Texas at Austin
Adnan Aziz, The University of Texas at Austin
Andreas Kuehlmann, IBM Thomas J. Watson Research Center, Yorktown Heights, NY
pp. 385-390
Valeria Bertacco, Synopsys, Inc., Palo Alto, CA
Maurizio Damiani, Synopsys, Inc., Mountain View, CA
Stefano Quer, Synopsys, Inc., Mountain View, CA
pp. 391-396
Miroslav N. Velev, Carnegie Mellon University, Pittsburgh, PA
Randal E. Bryant, Carnegie Mellon University, Pittsburgh, PA
pp. 397-401
Mark D. Aagaard, Intel Corporation, Hillsboro, OR
Robert B. Jones, Intel Corporation, Hillsboro, OR
Carl-Johan H. Seger, Intel Corporation, Hillsboro, OR
pp. 402-407
Christopher Inacio, Carnegie Mellon University, Pittsburgh, PA
Herman Schmit, Carnegie Mellon University, Pittsburgh, PA
David Nagle, Carnegie Mellon University, Pittsburgh, PA
Andrew Ryan, Carnegie Mellon University, Pittsburgh, PA
Donald E. Thomas, Carnegie Mellon University, Pittsburgh, PA
Yingfai Tong, Carnegie Mellon University, Pittsburgh, PA
Ben Klass, Carnegie Mellon University, Pittsburgh, PA
pp. 408-413
X. Hu, University of Notre Dame, IN
G. W. Greenwood, Western Michigan University, Kalamazoo, MI
S. Ravichandran, Western Michigan University, Kalamazoo, MI
G. Quan, University of Notre Dame, IN
pp. 414-419
Benoit Clement, STMicroelectronics, France
Richard Hersemeule, STMicroelectronics, France
Etienne Lantreibecq, STMicroelectronics, France
Bernard Ramanadin, STMicroelectronics, San Jose, CA
Pierre Coulomb, STMicroelectronics, France
Francois Pogodalla, STMicroelectronics, France
pp. 420-424
Johann Notbauer, Siemens, Austria
Thomas Albrecht, Siemens, Austria
Georg Niedrist, Siemens, Austria
Stefan Rohringer, Siemens Semiconductors, Austria
pp. 425-428
Liqiong Wei, Purdue University, W. Lafayette, IN
Zhanping Chen, Purdue University, W. Lafayette, IN
Kaushik Roy, Purdue University, W. Lafayette, IN
Yibin Ye, Intel Corp., Hillsboro, OR
Vivek De, Intel Corp., Hillsboro, OR
pp. 430-435
Supamas Sirichotiyakul, Advanced Tools, Motorola Inc., Austin, TX
Tim Edwards, Advanced Tools, Motorola Inc., Austin, TX
Chanhee Oh, Advanced Tools, Motorola Inc., Austin, TX
Jingyan Zuo, Advanced Tools, Motorola Inc., Austin, TX
Abhijit Dharchoudhury, Advanced Tools, Motorola Inc., Austin, TX
Rajendran Panda, Advanced Tools, Motorola Inc., Austin, TX
David Blaauw, Advanced Tools, Motorola Inc., Austin, TX
pp. 436-441
Mark C. Johnson, Rose-Hulman Institute of Technology, Terre Haute, IN
Dinesh Somasekhar, Purdue University, West Lafayette, IN
Kaushik Roy, Purdue University, West Lafayette, IN
pp. 442-445
A. R. Conn, IBM Thomas J. Watson Research Center, Yorktown Heights, NY
I. M. Elfadel, IBM Thomas J. Watson Research Center, Yorktown Heights, NY
W. W. Molzen, Jr., IBM Thomas J. Watson Research Center, Yorktown Heights, NY
P. R. O'Brien, IBM Electronic Design Automation, Austin, TX
P. N. Strenski, IBM Thomas J. Watson Research Center, Yorktown Heights, NY
C. Visweswariah, IBM Thomas J. Watson Research Center, Yorktown Heights, NY
C. B. Whan, IBM Thomas J. Watson Research Center, Yorktown Heights, NY
pp. 452-459
Jason Cong, University of California, Los Angeles
Honching Li, University of California, Los Angeles
Chang Wu, University of California, Los Angeles
pp. 460-465
Arindam Mukherjee, University of California, Santa Barbara
Ranganathan Sudhakar, Stanford University, CA
Malgorzata Marek-Sadowska, University of California, Santa Barbara
Stephen I. Long, University of California, Santa Barbara
pp. 466-471
Amir H. Salek, University of Southern California, Los Angeles
Jinan Lou, University of Southern California, Los Angeles
Massoud Pedram, University of Southern California, Los Angeles
pp. 472-478
Charles J. Alpert, IBM Austin Research Laboratory, Austin, TX
Anirudh Devgan, IBM Austin Research Laboratory, Austin, TX
Stephen T. Quay, IBM Server Group, Austin, TX
pp. 479-484
Real G. Pomerleau, North Carolina State University, Raleigh, NC
Paul D. Frazon, North Carolina State University, Raleigh, NC
Griff L. Bilbro, North Carolina State University, Raleigh, NC
pp. 497-501
Jason Cong, University of California, Los Angeles
David Zhigang Pan, University of California, Los Angeles
pp. 507-510
Luciano Lavagno, Cadence Berkeley Laboratories, Berkeley, CA
Ellen Sentovich, Cadence Berkeley Laboratories, Berkeley, CA
pp. 511-516
K. Richter, IDA / TU Braunschweig, Germany
D. Ziegenbein, IDA / TU Braunschweig, Germany
R. Ernst, IDA / TU Braunschweig, Germany
L. Thiele, TIK / ETH Z?rich, Switzerland
J. Teich, DATE / UNI Paderborn, Germany
pp. 517-522
Vex - A CAD Toolbox (Abstract)
Jules P. Bergmann, Stanford University, CA
Mark A. Horowitz, Stanford University, CA
pp. 523-528
Juan Antonio Carballo, University of Michigan, Ann Arbor, MI
Stephen W. Director, University of Michigan, Ann Arbor, MI
pp. 529-534
Johannes Tausch, Southern Methodist University, Dallas, TX
Jacob White, MIT, Cambridge, MA
pp. 537-542
Vikram Jandhyala, Ansoft Corporation, Pittsburgh PA
Scott Savage, Ansoft Corporation, Pittsburgh PA
Eric Bracken, Ansoft Corporation, Pittsburgh PA
Zoltan Cendes, Ansoft Corporation, Pittsburgh PA
pp. 543-548
Tong Li, Silicon Perspective Corp., Santa clara, CA
Ching-Han Tsai, University of Illinois at Urbana-Champaign
Elyse Rosenbaum, University of Illinois at Urbana-Champaign
Sung-Mo (Steve) Kang, University of Illinois at Urbana-Champaign
pp. 549-554
Qinru Qiu, University of Southern California, Los Angeles
Massoud Pedram, University of Southern California, Los Angeles
pp. 555-561
Mauro Chinosi, Central R&D DAIS, SGS-THOMSON Agrate B. (MI), Italy
Roberto Zafalon, Central R&D DAIS, SGS-THOMSON Agrate B. (MI), Italy
Carlo Guardiani, Central R&D DAIS, SGS-THOMSON Agrate B. (MI), Italy
pp. 562-567
Milos Ercegovac, University of California, Los Angeles
Darko Kirovski, University of California, Los Angeles
Miodrag Potkonjak, University of California, Los Angeles
pp. 568-573
Daniel Geist, IBM Haifa Research Lab, Haifa, Israel
Giora Biran, IBM Haifa Research Lab, Haifa, Israel
Tamara Arons, IBM Haifa Research Lab, Haifa, Israel
Michael Slavkin, IBM Haifa Research Lab, Haifa, Israel
Yvgeny Nustov, IBM Haifa Research Lab, Haifa, Israel
Monica Farkas, IBM Haifa Research Lab, Haifa, Israel
Karen Holtz, IBM Haifa Research Lab, Haifa, Israel
Andy Long, IBM Field Design Center, Essex Junction, VT
Dave King, IBM Field Design Center, Essex Junction, VT
Steve Barret, IBM Field Design Center, Essex Junction, VT
pp. 574-579
Ing-Jer Huang, National Sun Yat-sen University, Taiwan
Tai-An Lu, National Sun Yat-sen University, Taiwan
pp. 580-585
C. A. Papachristou, Case Western Reserve University, Cleveland, OH
F. Martin, Case Western Reserve University, Cleveland, OH
M. Nourani, Case Western Reserve University, Cleveland, OH
pp. 586-591
Imed Moussa, TIMA laboratory, France
Zoltan Sugar, TIMA laboratory, France
Rodolph Suescun, AREXSYS, France
Mario Diaz-Nava, STMicroelectronics, France
Marco Pavesi, Italtel, Italy
Salvatore Crudo, Italtel, Italy
Luca Gazi, Italtel, Italy
Ahmed Amine Jerraya, TIMA laboratory, France
pp. 598-603
Darko Kirovski, University of California, Los Angeles
Miodrag Potkonjak, University of California, Los Angeles
pp. 604-609
Andr? DeHon, University of California at Berkeley
John Wawrzynek, University of California at Berkeley
pp. 610-615
Meenakshi Kaul, University of Cincinnati, OH
Ranga Vemuri, University of Cincinnati, OH
Sriram Govindarqjan, University of Cincinnati, OH
Iyad Ouaiss, University of Cincinnati, OH
pp. 616-622
Alexandro M. S. Ad?rio, Federal University at Porto Alegre, Brazil
Eduardo L. Roehe, Federal University at Porto Alegre, Brazil
Sergio Bampi, Federal University at Porto Alegre, Brazil
pp. 623-628
Onuttom Narayan, University of California, Santa Cruz
Jaijeet Roychowdhury, Bell Laboratories, Murray Hill
pp. 629-634
Dan Feng, Cadence Design Systems, San Jose, CA
Joel Phillips, Cadence Design Systems, San Jose, CA
Keith Nabors, Cadence Design Systems, San Jose, CA
Ken Kundert, Cadence Design Systems, San Jose, CA
Jacob White, Massachusetts Institute of Technology, Cambridge, MA
pp. 635-640
Ognen J. Nastov, Motorola, Inc., Austin, TX
Jacob K. White, Massachusetts Institute of Technology, Cambridge, MA
pp. 641-646
Raghuram S. Tupuri, Advanced Micro Devices, Austin Texas
Arun Krishnamachary, The University of Texas at Austin
Jacob A. Abraham, The University of Texas at Austin
pp. 647-652
Ruifeng Guo, University of Iowa, Iowa City
Sudhakar M. Reddy, University of Iowa, Iowa City
Irith Pomeranz, University of Iowa, Iowa City
pp. 653-658
Vamsi Boppana, Fujitsu Laboratories of America, Inc., Sunnyvale, CA
Rajarshi Mukherjee, Fujitsu Laboratories of America, Inc., Sunnyvale, CA
Jawahar Jain, Fujitsu Laboratories of America, Inc., Sunnyvale, CA
Masahiro Fujita, Fujitsu Laboratories of America, Inc., Sunnyvale, CA
Pradeep Bollineni, Iowa State University, Ames, IA
pp. 660-665
Farzan Fallah, Fujitsu Labs. of America, Inc., Sunnyvale, CA
Pranav Ashar, NEC USA, Princeton
Srinivas Devadas, MIT, Cambridge
pp. 666-671
Lionel Bening, Hewlett-Packard Company, Richardson, TX
pp. 672-677
Cordula Hansen, Forschungszentrum Informatik (FZI) at the University of Karlsruhe
Francisco Nascimento, University of T?bingen
Wolfgang Rosenstiel, University of T?bingen and FZI
pp. 678-683
Miron Abramovici, Bell Labs - Lucent Technologies, Murray Hill, NJ
Jose T. de Sousa, Bell Labs - Lucent Technologies, Murray Hill, NJ
Daniel Saab, Case Western Reserve University, Cleveland, Ohio
pp. 684-690
Fatih Kocan, Case Western Reserve University, Cleveland, Ohio
Daniel G. Saab, Case Western Reserve University, Cleveland, Ohio
pp. 691-696
Xiaohan Zhu, University of California, San Diego
Bill Lin, University of California, San Diego
pp. 697-702
D. J. Eaglesham, Bell Labs, Lucent Technologies, Murray Hill, NJ
pp. 703-708
C. T. Chuang, IBM T. J. Watson Research Center, Yorktown Heights, NY
R. Puri, IBM T. J. Watson Research Center, Yorktown Heights, NY
pp. 709-714
Yehea I. Ismail, University of Rochester, New York
Eby G. Friedman, University of Rochester, New York
Jose L. Neves, IBM Microelectronics, East Fishkill, New York
pp. 715-720
Yehea I. Ismail, University of Rochester, New York
Eby G. Friedman, University of Rochester, New York
pp. 721-724
Abdallah Tabbara, University of California, Berkeley, CA
Robert K. Brayton, University of California, Berkeley, CA
A. Richard Newton, University of California, Berkeley, CA
pp. 725-730
Hakan Yalcin, Cadence Design Systems, San Jose, CA
Mohammad Mortazavi, Cadence Design Systems, San Jose, CA
Robert Palermo, Cadence Design Systems, San Jose, CA
Cyrus Bamji, Cadence Design Systems, San Jose, CA
Karem Sakallah, University of Michigan, Ann Arbor
pp. 731-736
Richard Raimi, Motorola Corp., Austin, TX
Jacob Abraham, The University of Texas at Austin
pp. 737-741
Han Bin Kim, Virginia Tech, Blacksburg
Dong Sam Ha, Virginia Tech, Blacksburg
Takeshi Takahashi, Advantest Lab. Ltd., Japan
pp. 742-747
Huan-Chih Tsai, University of California, Santa Barbara
Kwang-Ting Cheng, University of California, Santa Barbara
Sudipta Bhawmik, Lucent Technologies, Princeton, NJ
pp. 748-753
Yi-Min Jiang, University of California, Santa Barbara
Kwang-Ting Cheng, University of California, Santa Barbara
pp. 760-765
Joon-Seo Yim, LG Corporate Institute of Technology, Korea
Seong-Ok Bae, LG Corporate Institute of Technology, Korea
Chong-Min Kyung, KAIST, Korea
pp. 766-771
Ramesh Harjani, University of Minnesota, Minneapolis
Bapiraju Vinnakota, University of Minnesota, Minneapolis
pp. 772-777
Patrick Schaumont, IMEC vzw, Belgium
Radim Cmar, IMEC vzw, Belgium
Serge Vernalde, IMEC vzw, Belgium
Marc Engels, IMEC vzw, Belgium
Ivo Bolsens, IMEC vzw, Belgium
pp. 784-789
Tommy Kuhn, University of T?bingen, Germany
Wolfgang Rosenstiel, University of T?bingen, Germany
Udo Kebschull, University of Leipzig, Germany
pp. 790-793
Josef Fleischmann, Technical University of Munich, Germany
Klaus Buchenrieder, Siemens AG, Germany
Rainer Kress, Siemens AG, Germany
pp. 794-797
Andrew B. Kahng, UCLA Department of Computer Science
Y. C. Pati, Numerical Technologies, Inc., Santa Clara, CA
pp. 799-804
Marco Sgroi, University of California, Berkeley, CA
Luciano Lavagno, Cadence Design Systems
Yosinori Watanabe, Cadence Design Systems
Alberto Sangiovanni-Vincentelli, University of California, Berkeley, CA
pp. 805-810
Ying Zhao, Princeton University, New Jersey
Sharad Malik, Princeton University, New Jersey
pp. 811-816
Steven Bashford, University of Dortmund, Germany
Rainer Leupers, University of Dortmund, Germany
pp. 817-822
Alain Pegatoquet, VLSI Technology, France
Emmanuel Gresset, VLSI Technology, France
Michel Auguin, Universit? de Nice, France
Luc Bianco, Universit? de Nice, France
pp. 823-826
Asawaree Kalavade, Lucent Technologies, Murray Hill, NJ
Joe Othmer, Lucent Technologies, NJ
Bryan Ackland, Lucent Technologies, NJ
K. J. Singh, Lucent Technologies, NJ
pp. 827-830
Andrew E. Caldwell, UCLA Computer Science Dept.
Hyun-Jin Choi, UCLA Computer Science Dept.
Andrew B. Kahng, UCLA Computer Science Dept.
Stefanus Mantik, UCLA Computer Science Dept.
Miodrag Potkonjak, UCLA Computer Science Dept.
Gang Qu, UCLA Computer Science Dept.
Jennifer L. Wong, UCLA Computer Science Dept.
pp. 843-848
Inki Hong, Synopsys, Inc., Mountain View, CA; University of California, Los Angeles, CA
Miodrag Potkonjak, University of California, Los Angeles, CA
pp. 849-854
James Goodman, Massachusetts Institute of Technology, Cambridge, MA
Anantha Chandrakasan, Massachusetts Institute of Technology, Cambridge, MA
Abram P. Dancy, SynQor, Hudson, MA
pp. 855-860
Massoud Pedram, University of Southern California, Los Angeles
Qing Wu, University of Southern California, Los Angeles
pp. 861-866
Tajana Simunic, Stanford University, Italy
Luca Benini, Stanford University, Italy
Giovanni De Micheli, Stanford University, Italy
pp. 867-872
A. Hemani, KTH, Sweden
T. Meincke, KTH, Sweden
S. Kumar, Indian Institute of Technology, New Delhi, India
A. Postula, University of Queensland, Brisbane, Australia
T. Olsson, Lund University, Sweden
P. Nilsson, Lund University, Sweden
J. Oberg, KTH, Sweden
P. Ellervee, KTH, Sweden
D. Lundqvist, Ericsson Radio Systems AB, Stockholm, Sweden
pp. 873-878
Timothy P. Kurzweg, University of Pittsburgh, PA
Steven P. Levitan, University of Pittsburgh, PA
Philippe J. Marchand, University of California, San Diego
Jose A. Martinez, University of Pittsburgh, PA
Kurt R. Prough, University of Pittsburgh, PA
Donald M. Chiarulli, University of Pittsburgh, PA
pp. 879-884
Kaustav Banerjee, University of California, Berkeley, CA
Amit Mehrotra, University of California, Berkeley, CA
Alberto Sangiovanni-Vincentelli, University of California, Berkeley, CA
Chenming Hu, University of California, Berkeley, CA
pp. 885-891
D. Allen, IBM Corporation, Rochester, MN
D. Behrends, IBM Corporation, Rochester, MN
B. Stanisic, IBM Corporation, Rochester, MN
pp. 892-897
Gangadhar Konduri, Massachusetts Institute of Technology, Cambridge, MA
Anantha Chandrakasan, Massachusetts Institute of Technology, Cambridge, MA
pp. 898-903
Phillip Restle, IBM T. J. Watson Research Center, Yorktown Heights, NY
Albert Ruehli, IBM T. J. Watson Research Center, Yorktown Heights, NY
Steven G. Walker, IBM T. J. Watson Research Center, Yorktown Heights, NY
pp. 904-909
M. Kamon, Massachusetts Institute of Technology, Cambridge, MA
N. Marques, Massachusetts Institute of Technology, Cambridge, MA
Y. Massoud, Massachusetts Institute of Technology, Cambridge, MA
L. Silveira, Massachusetts Institute of Technology, Cambridge, MA
J. White, Massachusetts Institute of Technology, Cambridge, MA
pp. 910-914
Michael W. Beattie, Carnegie Mellon University, Pittsburgh, PA
Lawrence T. Pileggi, Carnegie Mellon University, Pittsburgh, PA
pp. 915-920
Shannon V. Morton, Compaq Computer Corporation, Shrewsbury, MA
pp. 921-926
George Hadjiyiannis, Massachusetts Institute of Technology, Cambridge, MA
Pietro Russo, Massachusetts Institute of Technology, Cambridge, MA
Srinivas Devadas, Massachusetts Institute of Technology, Cambridge, MA
pp. 927-932
Stefan Pees, Aachen University of Technology, Germany
Andreas Hoffmann, Aachen University of Technology, Germany
Vojin Zivojnovic, AXYS Design Automation, Inc., Irvine, CA
Heinrich Meyr, Aachen University of Technology, Germany
pp. 933-938
Hoon Choi, Korea Advanced Institute of Science and Technology, Taejon, Korea
Ju Hwan Yi, Korea Advanced Institute of Science and Technology, Taejon, Korea
Jong-Yeol Lee, Korea Advanced Institute of Science and Technology, Taejon, Korea
In-Cheol Park, Korea Advanced Institute of Science and Technology, Taejon, Korea
Chong-Min Kyung, Korea Advanced Institute of Science and Technology, Taejon, Korea
pp. 939-944
Michael Krasnicki, Carnegie Mellon University, Pittsburgh, Pennsylvania
Rodney Phelps, Carnegie Mellon University, Pittsburgh, Pennsylvania
Rob A. Rutenbar, Carnegie Mellon University, Pittsburgh, Pennsylvania
L. Richard Carley, Carnegie Mellon University, Pittsburgh, Pennsylvania
pp. 945-950
Alex Doboli, University of Cincinnati, OH
Adrian Nunez-Aldana, University of Cincinnati, OH
Nagu Dhanwada, University of Cincinnati, OH
Sree Ganesan, University of Cincinnati, OH
Ranga Vemuri, University of Cincinnati, OH
pp. 951-957
Walter Daems, Katholieke Universiteit Leuven, Belgium
Georges Gielen, Katholieke Universiteit Leuven, Belgium
Willy Sansen, Katholieke Universiteit Leuven, Belgium
pp. 958-963
Lisa Guerra, Conexant Systems, Newport Beach, CA
Joachim Fitzner, AXYS GmbH, Germany
Dipankar Talukdar, Conexant Systems, Newport Beach, CA
Chris Schl?ger, AXYS GmbH, Germany
Bassam Tabbara, UC Berkeley EECS Dept.
Vojin Zivojnovic, AXYS GmbH, Germany
pp. 964-969
Mike Benjamin, STMicroelectronics, UK
Daniel Geist, IBM Science and Technology, Haifa, Israel
Alan Hartman, IBM Science and Technology, Haifa, Israel
Yaron Wolfsthal, IBM Science and Technology, Haifa, Israel
Gerard Mas, STMicroelectronics, Meylan, France
Ralph Smeets, STMicroelectronics, Meylan, France
pp. 970-975
Wanli Jiang, University of Minnesota, Minneapolis
Bapiraju Vinnakota, University of Minnesota, Minneapolis
pp. 976-981
C. Patrick Yue, T-Span Systems Corporation, Palo Alto, CA
S. Simon Wong, Stanford University, Stanford, CA
pp. 982-987
N. R. Belk, Bell Laboratories, Lucent Technologies, Holmdel NJ
M. R. Frei, Bell Laboratories, Lucent Technologies, Murray Hill, NJ
M. Tsai, Bell Laboratories, Lucent Technologies, Murray Hill, NJ
A. J. Becker, Bell Laboratories, Lucent Technologies, Murray Hill, NJ
K. L. Tokuda, Bell Laboratories, Lucent Technologies, Murray Hill, NJ
pp. 988-993
Maria del Mar Hershenson, Stanford University, Stanford CA
Sunderarajan S. Mohan, Stanford University, Stanford CA
Stephen P. Boyd, Stanford University, Stanford CA
Thomas H. Lee, Stanford University, Stanford CA
pp. 994-998
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