ISBN: 0-89791-920-3

Naresh Maheshwari, Iowa State University, Ames

Sachin S. Sapatnekar, Iowa State University, Ames

Ellen M. Sentovich, Cadence Berkeley Labs

Horia Toma, CMA - Ecole des Mines de Paris

G?rard Berry, CMA - Ecole des Mines de Paris

Diana Marculescu, University of Southern California, Los Angeles

Radu Marculescu, University of Southern California, Los Angeles

Massoud Pedram, University of Southern California, Los Angeles

A. Semenov, University of Newcastle, England

A. Yakovlev, University of Newcastle, England

E. Pastor, Universitat Polit?cnica de Catalunya, Spain

M. A. Pe?, Universitat Polit?cnica de Catalunya, Spain

J. Cortadella, Universitat Polit?cnica de Catalunya, Spain

Luca Benini, Stanford University, CA

Enrico Macii, Politecnico di Torino, Italy

Massimo Poncino, Politecnico di Torino, Italy

I. M. Elfadel, IBM T. J. Watson Research Center, Yorktown Heights, NY

David D. Ling, IBM T. J. Watson Research Center, Yorktown Heights, NY

Kevin J. Kerns, University of Washington

Andrew T. Yang, University of Washington

Ketih Nabors, Cadence Design Systems, San Jose, CA

Tze-Ting Fang, Cadence Design Systems, San Jose, CA

Hung-Wen Chang, Cadence Design Systems, San Jose, CA

Kenneth S. Kundert, Cadence Design Systems, San Jose, CA

Jacob K. White, Massachusetts Institute of Technology, Cambridge, MA

Florentin Dartu, Carnegie Mellon University, Pittsburgh, PA

Lawrence T. Pileggi, Carnegie Mellon University, Pittsburgh, PA

Felice Balarin, Cadence Berkeley Laboratories

Alberto Sangiovanni-Vincentelli, University of California at Berkeley

Yosef G. Tirat-Gefen, Mentor Graphics Corp., Wilsonville, OR

Diogenes C. Silva, Univ. of Southern California, Los Angeles

Alice C. Parker, Univ. of Southern California, Los Angeles

Marleen Ad?, Katholieke Universiteit Leuven, Belgium

Rudy Lauwereins, Katholieke Universiteit Leuven, Belgium

J. A. Peperstraete, Katholieke Universiteit Leuven, Belgium

Stan Liao, Synopsys, Inc.

Steve Tjiang, Synopsys, Inc.

Rajesh Gupta, UC Irvine

Jerry Frenkil, Sente, Inc., Chelmsford, MA

Joon-Seo Yim, KAIST, Taejon, Korea

Yoon-Ho Hwang, KAIST, Taejon, Korea

Chang-Jae Park, KAIST, Taejon, Korea

Hoon Choi, KAIST, Taejon, Korea

Woo-Seung Yang, KAIST, Taejon, Korea

Hun-Seung Oh, KAIST, Taejon, Korea

In-Cheol Park, KAIST, Taejon, Korea

Chong-Min Kyung, KAIST, Taejon, Korea

J?rg Walter, IBM Deutschland Entwicklung GmbH, Germany

Jens Leenstra, IBM Deutschland Entwicklung GmbH, Germany

Gerhard D?ttling, IBM Deutschland Entwicklung GmbH, Germany

Bernd Leppla, IBM Deutschland Entwicklung GmbH, Germany

Hans-J?rgen M?nster, IBM Deutschland Entwicklung GmbH, Germany

Kevin Kark, IBM Corp., NY

Bruce Wile, IBM Corp., NY

Rajesh Raina, Motorola Inc., Austin, TX

Robert Bailey, Motorola Inc., Austin, TX

Charles Njinda, Advanced Micro Devices, Sunnyvale, CA

Robert Molyneaux, IBM Corporation, Austin, TX

Charlie Beh, IBM Corporation, Austin, TX

Wen-Jong Fang, Tsing Hua University, Taiwan

Allen C.-H. Wu, Tsing Hua University, Taiwan

Ti-Yen Yen, Quickturn Design Systems, Inc., Mountain View, CA

Yibin Ye, Purdue University, West Lafayette, IN

Kaushik Roy, Purdue University, West Lafayette, IN

Tai-Hung Liu, The University of Texas, Austin

Khurram Sajid, The University of Texas, Austin

Adnan Aziz, The University of Texas, Austin

Vigyan Singhal, Cadence Berkeley Labs, Berkeley, CA

Stan Liao, Advanced Technology Group, Synopsys, Inc.

Srinivas Devadas, Department of EECS, MIT

Olivier Coudert, Synopsys, Inc., Mountain View, CA

E. Aykut Dengi, Motorola Inc., Austin, TX

Ronald A. Rohrer, Carnegie Mellon University, Pittsburgh, PA

Michael W. Beattie, Carnegie Mellon University, Pittsburgh, PA

Lawrence T. Pileggi, Carnegie Mellon University, Pittsburgh, PA

Zhijiang He, Carnegie Mellon University, Pittsburgh, PA

Mustafa Celik, Carnegie Mellon University, Pittsburgh, PA

Lawrence Pileggi, Carnegie Mellon University, Pittsburgh, PA

Sharad Kapur, Bell Labs Lucent Technologies, Murray Hill, NJ

Jinsong Zhao, UC Santa Cruz, CA

Sharad Malik, Princeton University

Margaret Martonosi, Princeton University

Yau-Tsun Steven Li, Princeton University

Yanbing Li, Princeton University, NJ

Wayne Wolf, Princeton University, NJ

Rajeshkumar S. Sambandam, Level One Communications, Inc., Sacramento, CA

Xiaobo (Sharon) Hu, University of Notre Dame, IN

Kyle L. Nelson, IBM Corporation, Rochester, MN

Alok Jain, Carnegie Mellon University, Pittsburgh, PA

Randal E. Bryant, Carnegie Mellon University, Pittsburgh, PA

Manish Pandey, Science, Carnegie Mellon University Pittsburgh, PA

Richard Raimi, Motorola Inc., Austin, TX

Randal E. Bryant, Science, Carnegie Mellon University Pittsburgh, PA

Magdy S. Abadir, Motorola Inc., Austin, TX

Jae-Young Jang, University of Colorado, Boulder

Shaz Qadeer, University of California, Berkeley

Matt Kaufmann, Motorola Inc., Austin, TX

Carl Pixley, Motorola Inc., Austin, TX

James A. Rowson, Alta Group of Cadence Design Systems Inc.

Alberto Sangiovanni-Vincentelli, University of California at Berkeley

Robert H. Klenke, University of Virginia, Charlottesville

Moshe Meyassed, University of Virginia, Charlottesville

James H. Aylor, University of Virginia, Charlottesville

Barry W. Johnson, University of Virginia, Charlottesville

Ramesh Rao, University of Virginia, Charlottesville

Anup Ghosh, University of Virginia, Charlottesville

Ole Bentz, Silicon Graphics, Inc., Mountain View, CA

Jan M. Rabaey, University of California, Berkeley, CA

David Lidsky, University of California, Berkeley, CA

Srilatha Manne, University of Colorado, Boulder

Dirk Grunwald, University of Colorado, Boulder

Fabio Somenzi, University of Colorado, Boulder

Christoph Meinel, Universit?t Trier, Germany

Fabio Somenzi, University of Colorado at Boulder

Thorsten Theobald, Universit?t Trier, Germany

Youpyo Hong, University of Southern California, Los Angeles

Peter A. Beerel, University of Southern California, Los Angeles

Jerry R. Burch, Cadence Berkeley Laboratories, Berkeley, CA

Kenneth L. McMillan, Cadence Berkeley Laboratories, Berkeley, CA

Chung-Kuan Cheng, U.C.S.D., La Jolla, CA

John Lillis, U.C. Berkeley, CA

Yuji Kukimoto, University of California, Berkeley, CA

Robert K. Brayton, University of California, Berkeley, CA

Tod Amon, Southwest Texas State University, San Marcos, TX

Gaetano Borriello, University of Washington, Seattle

Taokuan Hu, Southwest Texas State University, San Marcos, TX

Jiwen Liu, Southwest Texas State University, San Marcos, TX

Peter Marwedel, Universit?t Dortmund, Germany

Ajay J. Daga, Interconnectix, a Mentor Graphics Business, Portland, OR

Peter R. Suaris, Interconnectix, a Mentor Graphics Business, Portland, OR

Barry Shackleford, Hewlett-Packard Laboratories, Palo Alto, CA; Mitsubishi Electric Company, Yokohama, Japan

Mitsuhiro Yasuda, Mitsubishi Electric Company, Yokohama, Japan

Etsuko Okushi, Mitsubishi Electric Company, Yokohama, Japan

Hisao Koizumi, Mitsubishi Electric Company, Yokohama, Japan

Hiroyuki Tomiyama, Kyushu University, Kasuga-shi, Japan

Hiroto Yasuura, Kyushu University, Kasuga-shi, Japan

Miodrag Potkonjak, University of California, Los Angeles

Kyosun Kim, University of Massachusetts, Amherst

Ramesh Karri, University of Massachusetts, Amherst

R. P. Kurshan, Bell Laboratories, Murray Hill, NJ

Andreas Kuehlmann, IBM Thomas J. Watson Research Center, Yorktown Heights, NY

Florian Krohm, IBM Thomas J. Watson Research Center, Yorktown Heights, NY

Jaijeet Roychowdhury, Bell Laboratories, Murray Hill

Michael W. Tian, University of Iowa, Iowa City

C.-J. Richard Shi, University of Iowa, Iowa City

S. Mir, Instituto de Microelectr?nica de Sevilla, Sevilla, Spain

A. Rueda, Instituto de Microelectr?nica de Sevilla, Sevilla, Spain

T. Olbrich, AMS - Austria Mikro Systeme Int. AG, Austria

E. Peral?as, Instituto de Microelectr?nica de Sevilla, Sevilla, Spain

J. L. Huertas, Instituto de Microelectr?nica de Sevilla, Sevilla, Spain

Ashok Sudarsanam, Princeton University

Stan Liao, Synopsys, Inc.

Srinivas Devadas, MIT

Markus Willems, Aachen University of Technology, Germany

Volker B?rsgens, Aachen University of Technology, Germany

Holger Keding, Aachen University of Technology, Germany

Thorsten Gr?tker, Aachen University of Technology, Germany

Heinrich Meyr, Aachen University of Technology, Germany

George Hadjiyiannis, Department of EECS, MIT

Silvina Hanono, Department of EECS, MIT

Srinivas Devadas, Department of EECS, MIT

Mark R. Hartoog, Alta Group of Cadence Design Systems, Inc.

James A. Rowson, Alta Group of Cadence Design Systems, Inc.

Prakash D. Reddy, Alta Group of Cadence Design Systems, Inc.

Soumya Desai, Alta Group of Cadence Design Systems, Inc.

Douglas D. Dunlop, Alta Group of Cadence Design Systems, Inc.

Edwin A. Harcourt, Alta Group of Cadence Design Systems, Inc.

Neeti Khullar, Alta Group of Cadence Design Systems, Inc.

H. De Man, Katholieke Universiteit Leuven/IMEC, Belgium

Robert Brodersen, Dept. of EECS University of California, Berkeley

Asim Smailagic, Carnegie Mellon University, Pittsburgh, PA

Daniel P. Siewiorek, Carnegie Mellon University, Pittsburgh, PA

Richard Martin, Carnegie Mellon University, Pittsburgh, PA

John Stivoric, Carnegie Mellon University, Pittsburgh, PA

H. T. Heineken, Level One Communications, Sacramento, CA

J. Khare, Level One Communications, Sacramento, CA

W. Maly, Carnegie Mellon University, Pittsburgh, PA

P. K. Nag, Carnegie Mellon University, Pittsburgh, PA

C. Ouyang, Carnegie Mellon University, Pittsburgh, PA

W. A. Pleskacz, Warsaw University of Technology, Poland

Mohan Guruswamy, Motorola, Inc., Austin, Texas

Robert L. Maziasz, Motorola, Inc., Austin, Texas

Daniel Dulitz, Motorola, Inc., Austin, Texas

Srilata Raman, Motorola, Inc., Austin, Texas

Venkat Chiluvuri, Motorola, Inc., Austin, Texas

Andrea Fernandez, Motorola, Inc., Austin, Texas

Larry G. Jones, Motorola, Inc., Austin, Texas

Donald G. Baltus, LSI Logic Corporation

Thomas Varga, LSI Logic Corporation

Robert C. Armstrong, LSI Logic Corporation

John Duh, Mentor Graphics Corporation

T. G. Matheson, Mentor Graphics Corporation

John F. Croix, Advanced Micro Devices, Inc., Austin, TX

D. F. Wong, The University of Texas at Austin

Jian Li, University of Illinois, Urbana-Champaign

Rajesh K. Gupta, University of California, Irvine

Inki Hong, UCLA Computer Science Department, Los Angeles, CA

Darko Kirovski, UCLA Computer Science Department, Los Angeles, CA

Miodrag Potkonjak, UCLA Computer Science Department, Los Angeles, CA

Kyosun Kim, University of Massachusetts, Amherst

Ramesh Karri, University of Massachusetts, Amherst

Miodrag Potkonjak, University of California, Los Angeles

Jeffrey Walrath, University of Cincinnati, Ohio

Ranga Vemuri, University of Cincinnati, Ohio

Subodh Gupta, University of Illinois at Urbana-Champaign

Farid N. Najm, University of Illinois at Urbana-Champaign

Chih-Shun Ding, Rockwell International Corporation, Newport Beach, CA

Qing Wu, University of Southern California, Los Angeles, CA

Cheng-Ta Hsieh, University of Southern California, Los Angeles, CA

Massoud Pedram, University of Southern California, Los Angeles, CA

Li-Pen Yuan, Univ. of Illinois at Urbana-Champaign

Chin-Chi Teng, Avant! Corporation, Sunnyvale, CA

Sung-Mo Kang, Univ. of Illinois at Urbana-Champaign

Angela Krstic, University of California, Santa Barbara

Kwang-Ting (Tim) Cheng, University of California, Santa Barbara

Claudio Passerone, Politecnico di Torino - Cadence Europeans Labs, Italy

Luciano Lavagno, Politecnico di Torino - Cadence Europeans Labs, Italy

Massimiliano Chiodo, Alta Group of Cadence Design Systems, USA

Alberto Sangiovanni-Vincentelli, University of California at Berkeley, USA

Ken Hines, University of Washington, Seattle

Gaetano Borriello, University of Washington, Seattle

Pankaj Pant, Georgia Institute of Technology

Vivek De, Intel Corp., Hillsboro, OR

Abhijit Chatterjee, Georgia Institute of Technology

James Kao, Massachusetts Institute of Technology, Cambridge

Anantha Chandrakasan, Massachusetts Institute of Technology, Cambridge

Dimitri Antoniadis, Massachusetts Institute of Technology, Cambridge

Thucydides Xanthopoulos, Massachusetts Institute of Technology, Cambridge

Yoshifumi Yaoi, Massachusetts Institute of Technology, Cambridge

Anantha Chandrakasan, Massachusetts Institute of Technology, Cambridge

Chi-Ying Tsui, Hong Kong Univ. of Science and Technology, Clear Water Bay, H.K.

Kai-Keung Chan, Hong Kong Univ. of Science and Technology, Clear Water Bay, H.K.

Qing Wu, University of Southern California, Los Angeles, CA

Chih-Shun Ding, University of Southern California, Los Angeles, CA

Massoud Pedram, University of Southern California, Los Angeles, CA

Qi Wang, University of Arizona. Tucson, AZ

Sarma B. K. Vrudhula, University of Arizona. Tucson, AZ

Shantanu Ganguly, Motorola Inc., Austin, TX

Anand Raghunathan, Princeton University, NJ

Sujit Dey, NEC USA, Princeton, NJ

Niraj K. Jhay, Princeton University, NJ

Kazutoshi Wakabayashi, NEC Corp., Tokyo, Japan

Catherine H. Gebotys, University of Waterloo, Canada

Daehong Kim, Seoul National University, Korea

Kiyoung Choi, Seoul National University, Korea

Martin Lefebvre, Cadabra Design Libraries Inc., Nepean, Ont.

David Marple, Synopsys Inc., Mountain View, CA

Carl Sechen, University of Washington, Seattle, WA

Avaneendra Gupta, University of Michigan, Ann Arbor; Intel Corporation, Santa Clara, CA

John P. Hayes, University of Michigan, Ann Arbor

Jaewon Kim, Quickturn Design Systems, Inc., Mountain View, CA

S. M. Kang, University of Illinois at Urbana-Champaign

John Lakos, Mentor Graphics Corporation, Warren, NJ

Douglas Chang, Univ. of Calif., Santa Barbara

Mike Tien-Chien Lee, Avant! Corp., Sunnyvale, CA

Malgorzata Marek-Sadowska, Univ. of Calif., Santa Barbara

Takashi Aikyo, Fujitsu Limited, Japan

Kwang-Ting Cheng, Univ. of Calif., Santa Barbara

K. H. Tsai, University of California, Santa Barbara

S. Hellebrand, University of Siegen, Germany

J. Rajski, Mentor Graphics Corporation, Wilsonville, OR

M. Marek-Sadowska, University of California, Santa Barbara

Huan-Chih Tsai, University of California, Santa Barbara

Kwang-Ting Cheng, University of California, Santa Barbara

Chih-Jen Lin, Intel Corporation, Hillsboro, OR

Sudipta Bhawmik, Lucent Technologies, Princeton, NJ

Wolfgang Meyer, Synopsys, Inc., Mountain View, CA

Andrew Seawright, Synopsys, Inc., Mountain View, CA

Fumiya Tada, Hitachi, Ltd., Japan

C. Hein, Lockheed Martin Advanced Technology Laboratories, Camden, NJ

J. Pridgen, Lockheed Martin Advanced Technology Laboratories, Camden, NJ

W. Kline, Lockheed Martin Advanced Technology Laboratories, Camden, NJ

Claus Schneider, Siemens AG, Corporate Technology, Munich

Enrico Macii, Politecnico di Torino, Italy

Massoud Pedram, University of Southern California, Los Angeles

Fabio Somenzi, University of Colorado, Boulder

Ming-Ter Kuo, Aptix Corporation, San Jose, CA

Chung-Kuan Cheng, University of California, San Diego

Wen-Jong Fang, Tsing Hua University, Taiwan

Allen C.-H. Wu, Tsing Hua University, Taiwan

Helena Krupnova, Institut National Polytechnique de Grenoble / CSI, France

Ali Abbara, Institut National Polytechnique de Grenoble / CSI, France

Gabri?le Saucier, Institut National Polytechnique de Grenoble / CSI, France

George Karypis, University of Minnesota, Minneapolis

Rajat Aggarwal, University of Minnesota, Minneapolis

Vipin Kumar, University of Minnesota, Minneapolis

Shashi Shekhar, University of Minnesota, Minneapolis

Charles J. Alpert, IBM Austin Research Laboratory, Austin, TX

Jen-Hsin Huang, Synopsys, Inc., Mountain View, CA

Andrew B. Kahng, Cadence Design Systems, Inc., San Jose, CA

Indradeep Ghosh, Princeton University, NJ

Anand Raghunathan, Princeton University, NJ

Niraj K. Jha, Princeton University, NJ

Laurence Goodby, Hewlett-Packard Company, Palo Alto, CA

Alex Orailoglu, University of California, San Diego

M. Nourani, University of Tehran, Iran

J. Carletta, Case Western Reserve University, Ohio

C. Papachristou, Case Western Reserve University, Ohio

Hemang Lavana, NC State University, Raleigh

Amit Khetawat, NC State University, Raleigh

Franc Brglez, NC State University, Raleigh

Krzysztof Kozminski, National Semiconductor Corp., Santa Clara, CA

Donald R. Cottrell, CFI, Inc., Austin, TX

Bernd Sch?rmann, University of Kaiserslautern, Germany

Joachim Altmeyer, University of Kaiserslautern, Germany

Radu Marculescu, University of Southern California, Los Angeles

Diana Marculescu, University of Southern California, Los Angeles

Massoud Pedram, University of Southern California, Los Angeles

Cheng-Ta Hsieh, University of Southern California, Los Angeles

Massoud Pedram, University of Southern California, Los Angeles

Gaurav Mehta, Intel Corporation, Santa Clara, CA

Fred Rastgar, Intel Corporation, Santa Clara, CA

Sumant Ramprasad, University of Illinois at Urbana-Champaign

Naresh R. Shanbhag, University of Illinois at Urbana-Champaign

Ibrahim N. Hajj, University of Illinois at Urbana-Champaign

Charles Alpert, IBM Austin Research Laboratory, Austin, TX

Anirudh Devgan, IBM Austin Research Laboratory, Austin, TX

Andrew B. Kahng, Cadence Design Systems, Inc., San Jose, CA

C.-W. Albert Tsao, Cadence Design Systems, Inc., San Jose, CA

Chin-Chih Chang, University of California, Los Angeles

Jason Cong, University of California, Los Angeles

Chung-Ping Chen, University of Texas, Austin

D. F. Wong, University of Texas, Austin

Irith Pomeranz, University of Iowa, Iowa City

Sudhakar M. Reddy, University of Iowa, Iowa City

Seongmoon Wang, University of Southern California, Los Angeles

Sandeep K. Gupta, University of Southern California, Los Angeles

Oriol Roig, Universitat Polit?cnica de Catalunya, Spain

Jordi Cortadella, Universitat Polit?cnica de Catalunya, Spain

Marco A. Pe?, Universitat Polit?cnica de Catalunya, Spain

Enric Pastor, Universitat Polit?cnica de Catalunya, Spain

Jason Cong, UCLA, Los Angeles, CA

Lei He, UCLA, Los Angeles, CA

Andrew B. Kahng, Cadence Design Systems, Inc., San Jose, CA

David Noice, Cadence Design Systems, Inc., San Jose, CA

Nagesh Shirali, Cadence Design Systems, Inc., San Jose, CA

Steve H.-C. Yen, Cadence Design Systems, Inc., San Jose, CA

Cristiano Forzan, SGS-THOMSON Microelectronics, Italy

Bruno Franzini, SGS-THOMSON Microelectronics, Italy

Carlo Guardiani, SGS-THOMSON Microelectronics, Italy

Howard H. Chen, Thomas J. Watson Research Center, Yorktown Heights, NY

David D. Ling, Thomas J. Watson Research Center, Yorktown Heights, NY

Jason Cong, University of California, Los Angeles

Chang Wu, University of California, Los Angeles

Rajendran Panda, Motorola, Inc., Austin, TX

Farid N. Najm, University of Illinois at Urbana-Champaign

Chau-Shen Chen, Tsing Hua University, Hsin-Chu, Taiwan

TingTing Hwang, Tsing Hua University, Hsin-Chu, Taiwan

C. L. Liu, Univ. of Illinois at Urbana-Champaign

Yi-Min Jiang, University of California, Santa Barbara

Angela Krstic, University of California, Santa Barbara

Kwang-Ting Cheng, University of California, Santa Barbara

Malgorzata Marek-Sadowska, University of California, Santa Barbara

Masako Murofushi, Semiconductor DA & TEST Engineering Center, Kawasaki, Japan

Takashi Ishioka, Semiconductor DA & TEST Engineering Center, Kawasaki, Japan

Masami Murakata, Semiconductor DA & TEST Engineering Center, Kawasaki, Japan

Takashi Mitsuhashi, Semiconductor DA & TEST Engineering Center, Kawasaki, Japan

William C. Tang, MEMS Technology Group, Pasadena, California

J. M. Karam, TIMA Lab., France

B. Courtois, TIMA Lab., France

H. Boutamine, TIMA Lab., France

P. Drake, Mentor Graphics, UK

A. Poppe, Technical University of Budapest, Hungary

V. Szekely, Technical University of Budapest, Hungary

M. Renez, Technical University of Budapest, Hungary

K. Hofmann, Darmstadt University of Technology, Germany

M. Glesner, Darmstadt University of Technology, Germany

Tamal Mukherjee, Carnegie Mellon University, Pittsburgh, PA

Gary K. Fedder, Carnegie Mellon University, Pittsburgh, PA

N. Aluru, Massachusetts Institute of Technology, Cambridge, MA

J. White, Massachusetts Institute of Technology, Cambridge, MA

J? Henkel, NEC USA, Princeton, NJ

Rolf Ernst, Technische Universit?t Braunschweig, Germany

Darko Kirovski, University of California, Los Angeles

Miodrag Potkonjak, University of California, Los Angeles

Bharat P. Dave, Princeton University, NJ

Ganesh Lakshminarayana, Princeton University, NJ

Niraj K. Jha, Princeton University, NJ

Samir Agrawal, Synopsys, Inc., Mountain View, CA

Rajesh K. Gupta, University of California, Irvine

Smita Bakshi, University of California, Davis

Daniel D. Gajski, University of California, Irvine

Wayne W.-M. Dai, University of California at Santa Cruz

William J. Grundmann, Digital Semiconductor, Hudson, MA

Dan Dobberpuhl, Digital Semiconductor, Palo Alto, CA

Randy L. Allmon, Digital Semiconductor, Hudson, MA

Nicholas L. Rethman, Digital Semiconductor, Hudson, MA

Gianpiero Cabodi, Politecnico di Torino, Italy

Paolo Camurati, Universit? di Udine, Italy

Luciano Lavagno, Politecnico di Torino, Italy

Stefano Quer, Politecnico di Torino, Italy

Gagan Hasteer, University of Illinois, Urbana

Anmol Mathur, Silicon Graphics, Mountain View, CA

Prithviraj Banerjee, Northwestern University, Evanston, IL

Aarti Gupta, CCRL, NEC USA, Princeton, NJ

Sharad Malik, Princeton University, NJ

Pranav Ashar, CCRL, NEC USA, Princeton, NJ

Jens Vygen, University of Bonn, Germany

C. J. Alpert, IBM Austin Research Laboratory, Austin, TX

T. Chan, UCLA Mathematics Dept., Los Angeles, CA

D. J.-H. Huang, UCLA Computer Science Dept., Los Angeles, CA

I. Markov, UCLA Mathematics Dept., Los Angeles, CA

K. Yan, UCLA Computer Science Dept., Los Angeles, CA

Majid Saraafzadeh, Northwestern University, Evanston, IL

David Knol, Northwestern University, Evanston, IL

Gustavo Tellez, Northwestern University, Evanston, IL

Jin Xu, University of California, San Diego

Pei-Ning Guo, University of California, San Diego

Chung-Kuan Cheng, University of California, San Diego

S. P. Levitan, University of Pittsburgh

P. J. Marchand, University of California, San Diego

T. P. Kurzweg, University of Pittsburgh

M. A. Rempel, University of Pittsburgh

D. M. Chiarulli, University of Pittsburgh

C. Fan, University of California, San Diego

F. B. McCormick, University of California, San Diego

Matthias Bauer, Siemens AG, Corporate Technology, Munich

Wolfgang Ecker, Siemens AG, Corporate Technology, Munich

Clifford Liem, Central Ramp;D, SGS-Thomson Microelectronics, France; Laboratoire TIMA, L'Insitut National Polytechnique de Grenoble, France

Marco Cornero, Central Ramp;D, SGS-Thomson Microelectronics, France

Miguel Santana, Central Ramp;D, SGS-Thomson Microelectronics, France

Pierre Paulin, Central Ramp;D, SGS-Thomson Microelectronics, France

Ahmed Jerraya, Laboratoire TIMA, L'Insitut National Polytechnique de Grenoble, France

Jean-Marc Gentit, Thomson Consumer Electronic Components, France

Jean Lopez, Thomson Consumer Electronic Components, France

Xavier Figari, Thomson Consumer Electronic Components, France

Laurent Bergher, Thomson Consumer Electronic Components, France