• D
  • DAC
  • 1996
  • 33rd Annual Conference on Design Automation (DAC'96)
Advanced Search 
33rd Annual Conference on Design Automation (DAC'96)
Las Vegas, Nevada
June 03-June 07
ISBN: 0-89791-833-9
Table of Contents
Papers
Mattan Kamon, Massachusetts Institute of Technology, Cambridge, Massachusetts
Steve S. Majors, Harris Semiconductor, Melbourne, Florida
pp. 2-7
Janardhan H. Satyanarayana, University of Minnesota, Minneapolis
Keshab K. Parhi, University of Minnesota, Minneapolis
pp. 9-14
Sasan Iman, University of Southern California, Los Angeles
Massoud Pedram, University of Southern California, Los Angeles
pp. 21-26
David Lidsky, University of California, Berkeley
Jan M. Rabaey, University of California, Berkeley
pp. 27-32
Raul Camposano, Synopsys, Inc. Mountain View, CA
pp. 33-34
E. Ercanli, Case Western Reserve University, Cleveland, Ohio
C. Papachristou, Case Western Reserve University, Cleveland, Ohio
pp. 35-40
Mahesh Mehendale, Texas Instrumentals (India) Ltd., Bangalore, India
G. Venkatesh, Indian Institute of Technology, Powai, India
S. D. Sherlekar, Indian Institute of Technology, Powai, India
pp. 41-46
Chuck Monahan, University of California, Santa Barbara
Forrest Brewer, University of California, Santa Barbara
pp. 47-50
Jian Li, University of Illinois, Urbana-Champaign
Rajesh K. Gupta, University of Illinois, Urbana-Champaign
pp. 51-54
Eric Verlind, IMEC, Leuven, Belgium
Gjalt de Jong, IMEC, Leuven, Belgium
Bill Lin, IMEC, Leuven, Belgium
pp. 55-58
Alexei Semenov, University of Newcastle, England
Alexandre Yakovlev, University of Newcastle, England
pp. 59-62
Jordi Cortadella, Univ. Politecnica de Catalunya, Barcelona, Spain
Michael Kishinevsky, The University of Aizu, Japan
Alex Kondratyev, The University of Aizu, Japan
Luciano Lavagno, Politecnico di Torino, Italy
Alex Yakovlev, University of Newcastle upon Tyne, United Kingdom
pp. 63-66
Prabhakar Kudva, IBM T.J. Watson Research Center, Yorktown Heights
Ganesh Gopalakrishnan, University of Utah
Hans Jacobson, University of Utah
pp. 67-70
Michael Theobald, Columbia University, New York, NY
Steven M. Nowick, Columbia University, New York, NY
Tao Wu, Columbia University, New York, NY
pp. 71-76
Prabhakar Kudva, IBM T.J. Watson Research Center, Yorktown Heights
Ganesh Gopalakrishnan, University of Utah
Hans Jacobson, University of Utah
Steven M. Nowick, Columbia University
pp. 77-82
Frank M. Johannes, Technical University of Munich, Germany
pp. 83-87
Jianmin Li, University of California, San Diego
John Lillis, University of California, San Diego
Lung-Tien Liu, University of California, San Diego
Chung-Kuan Cheng, University of California, San Diego
pp. 88-93
Michael Hutton, University of Toronto, Ontario
J. P. Grossman, University of Toronto, Ontario
Jonathan Rose, University of Toronto, Ontario
Derek Corneil, University of Toronto, Ontario
pp. 94-99
Shantanu Dutt, University of Minnesota, Minneapolis
Wenyong Deng, University of Minnesota, Minneapolis
pp. 100-105
Alberto L. Sangiovanni-Vincentelli, University of California - Berkeley CA
Patrick C. McGeer, Cadence Berkeley Laboratories - Berkeley CA
Alexander Saldanha, Cadence Berkeley Laboratories - Berkeley CA
pp. 106-111
Anantha Chandrakasan, Massachusetts Institute of Technology, Cambridge
Isabel Yang, Massachusetts Institute of Technology, Cambridge
Carlin Vieri, Massachusetts Institute of Technology, Cambridge
Dimitri Antoniadis, Massachusetts Institute of Technology, Cambridge
pp. 113-118
Bernhard Wunder, Universit?t Karlsruhe, Germany
Gunther Lehmann, Universit?t Karlsruhe, Germany
Klaus D. M?ller-Glaser, Universit?t Karlsruhe, Germany
pp. 119-124
Kenneth D. Wagner, Synopsys, Inc., Mountain View, CA
Sujit Dey, NEC USA, Inc., Princeton, NJ
pp. 131-136
Balakrishnan Iyer, University of Massachusetts at Amherst, MA
Ramesh Karri, University of Massachusetts at Amherst, MA
pp. 137-142
Ishwar Parulkar, University of Southern California, Los Angeles
Sandeep K. Gupta, University of Southern California, Los Angeles
Melvin A. Breuer, University of Southern California, Los Angeles
pp. 143-148
Shi-Yu Huang, Univ. of California, Santa Barbara
Kuang-Chien Chen, Fujitsu Labs of America, Santa Clara, CA
Kwang-Ting Cheng, Univ. of California, Santa Barbara
Tien-Chien Lee, Fujitsu Labs of America, Santa Clara, CA
pp. 161-164
Chi-ying Tsui, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong
Radu Marculescu, University of Southern California, Los Angeles, CA
Diana Marculescu, University of Southern California, Los Angeles, CA
Massoud Pedram, University of Southern California, Los Angeles, CA
pp. 165-168
Idalina Videira, INESC - Instituto de Engenharia de Sistemas e Computadores, Portugal
Paulo Ver?ssimo, INESC - Instituto de Engenharia de Sistemas e Computadores, Portugal
Helena Sarmento, INESC - Instituto de Engenharia de Sistemas e Computadores, Portugal
pp. 169-174
Peter R. Sutton, Carnegie Mellon University, Pittsburgh PA
Stephen W. Director, Carnegie Mellon University, Pittsburgh PA
pp. 175-180
John W. Hagerman, Carnegie Mellon University, Pittsburgh, PA
Stephen W. Director, Carnegie Mellon University, Pittsburgh, PA
pp. 181-184
Eric W. Johnson, University of Notre Dame, IN
Luis A. Castillo, University of Notre Dame, IN
Jay B. Brockman, University of Notre Dame, IN
pp. 185-188
Richard Rudell, Synopsys, Inc., Mountain View, CA
pp. 191-196
Olivier Coudert, Synopsys Inc., Mountain View, CA
pp. 197-202
Chih-Ang Chen, University of Southern California, Los Angeles
Sandeep K. Gupta, University of Southern California, Los Angeles
pp. 209-214
Irith Pomeranz, University of Iowa, Iowa City
Sudhakar M. Reddy, University of Iowa, Iowa City
pp. 215-220
Paolo Miliozzi, University of California, Berkeley, CA
Iasson Vassiliou, University of California, Berkeley, CA
Edoardo Charbon, University of California, Berkeley, CA
Enrico Malavasi, Cadence Design Systems, Inc., CA
Alberto L. Sangiovanni-Vincentelli, University of California, Berkeley, CA
pp. 227-232
Carsten Borchers, University of Hanover, Germany
Lars Hedrich, University of Hanover, Germany
Erich Barke, University of Hanover, Germany
pp. 237-240
Chien-Chung Tsai, Mentor Graphics Corporation, Wilsonville, OR
Malgorzata Marek-Sadowska, University of California, Santa Barbara, CA
pp. 242-247
Jeffery P. Hansen, Toshiba ULSI Research Laboratories, Japan
Masatoshi Sekine, Toshiba ULSI Research Laboratories, Japan
pp. 248-253
Shashidhar Thakur, Synopsys Inc., Mountainview, CA
D. F. Wong, University of Texas at Austin
Shankar Krishnamoorthy, Synopsys Inc., Mountainview, CA
pp. 254-257
Shi-Yu Huang, U. of California, Santa Barbara
Kuang-Chien Chen, Fujitsu Labs of America, Santa Clara, CA
Kwang-Ting Cheng, U. of California, Santa Barbara
pp. 258-261
Chau-Shen Chen, Tsing Hua University, Taiwan
Kuang-Hui Lin, Tsing Hua University, Taiwan
TingTing Hwang, Tsing Hua University, Taiwan
pp. 262-267
Chih-chang Lin, Mentor Graphics, San Jose, CA
Malgorzata Marek-Sadowska, Univ. of California, Santa Barbara, CA
Kwang-Ting Cheng, Univ. of California, Santa Barbara, CA
Mike Tien-Chien Lee, Fujitsu Lab. of America, Santa Clara, CA
pp. 268-273
Huoy-Yu Liou, University of California, San Diego
Ting-Ting Y. Lin, University of California, San Diego
Chung-Kuan Cheng, University of California, San Diego
pp. 274-279
J. S. Roychowdhury, AT&T Bell Laboratories, Murray Hill, NJ
R. C. Melville, AT&T Bell Laboratories, Murray Hill, NJ
pp. 286-291
Ricardo Telichevesky, Cadence Design Systems, San Jose California
Ken Kundert, Cadence Design Systems, San Jose California
Jacob White, Massachusetts Institute of Technology, Cambridge, Massachusetts
pp. 292-297
L. Richard Carley, Carnegie Mellon University, Pittsburgh, PA
Georges G. E. Gielen, Katholieke Universiteit Leuven, Belgium
Rob A. Rutenbar, Carnegie Mellon University, Pittsburgh, PA
Willy M. C. Sansen, Katholieke Universiteit Leuven, Belgium
pp. 298-303
Anoosh Hosseini, Silicon Graphics Inc., Mountain View, CA
Dimitrios Mavroidis, Silicon Graphics Inc., Mountain View, CA
Pavlos Konas, Silicon Graphics Inc., Mountain View, CA
pp. 305-310
Val Popescu, Metaflow Technologies, Inc., La Jolia, CA
Bill McNamara, Zycad Corporation, Irvine, CA
pp. 311-314
Gopi Ganapathy, Advanced Micro Devices, Austin, TX
Ram Narayan, Advanced Micro Devices, Austin, TX
Glenn Jorden, Advanced Micro Devices, Austin, TX
Denzil Fernandez, Advanced Micro Devices, Austin, TX
Ming Wang, Quickturn Design Systems, Mountain View, CA
Jim Nishimura, Quickturn Design Systems, Mountain View, CA
pp. 315-318
James Monaco, Somerset Design Center, Austin, TX
David Holloway, Somerset Design Center, Austin, TX
Rajesh Raina, Somerset Design Center, Austin, TX
pp. 319-324
Anand Raghunathan, Princeton University, NJ
Sujit Dey, NEC USA, Inc., Princeton, NJ
Niraj K. Jha, Princeton University, NJ
pp. 331-336
Jos? Monteiro, MIT, Cambridge, MA
Srinivas Devadas, MIT, Cambridge, MA
Pranav Ashar, NEC USA, Princeton, NJ
Ashutosh Mauskar, Synopsys, Inc., Mountain View, CA
pp. 349-352
Aurobindo Dasgupta, University of Massachusetts, Amherst, MA
Ramesh Karri, University of Massachusetts, Amherst, MA
pp. 353-356
Byron Krauter, IBM Corp., Austin, TX
Yu Xia, AMD Corp., Austin, TX
Aykut Dengi, SEMATECH Inc., Austin, TX
Lawrence T. Pileggi, Carnegie Mellon University, Pittsburgh, PA
pp. 357-362
N. R. Aluru, Massachusetts Institute of Technology, Cambridge, MA
V. B. Nadkarni, Massachusetts Institute of Technology, Cambridge, MA
J. White, Massachusetts Institute of Technology, Cambridge, MA
pp. 363-366
Weikai Sun, University of California, Santa Cruz
Wayne Wei-Ming Dai, University of California, Santa Cruz
Wei Hong, Southeast Uni., Nanjing, PRC
pp. 371-376
Joel R. Phillips, MIT Department of EECS, Cambridge, MA
Eli Chiprout, IBM T. J. Watson Research Center, Yorktown Heights, NY
David D. Ling, IBM T. J. Watson Research Center, Yorktown Heights, NY
pp. 377-382
Joe G. Xi, University of California, Santa Cruz
Wayne W.-M. Dai, University of California, Santa Cruz
pp. 383-388
Madhav P. Desai, Digital Equipment Corporation, Hudson, MA
Radenko Cvijetic, Digital Equipment Corporation, Hudson, MA
James Jensen, Digital Equipment Corporation, Hudson, MA
pp. 389-394
Jaewon Oh, University of Southern California, Los Angeles, CA
Iksoo Pyo, Intel Corporation, Hillsboro, OR
Massoud Pedram, University of Southern California, Los Angeles, CA
pp. 401-404
Chung-Ping Chen, University of Texas, Austin, Texas
Yao-Wen Chang, University of Texas, Austin, Texas
D. F. Wong, University of Texas, Austin, Texas
pp. 405-408
Robert C. Hutchins, SMC (Standard Microsystems), Irvine, CA
Shankar Hemmady, Guru Technologies Inc., Cupertino, CA
pp. 409-414
K. D. Jones, Rambus Inc., Mountain View, CA
J. P. Privitera, Rambus Inc., Mountain View, CA
pp. 415-420
Fran?oise Casaubieilh, SGS-THOMSON Microelectronics
Anthony McIsaac, SGS-THOMSON Microelectronics
Mike Benjamin, SGS-THOMSON Microelectronics
Mike Bartley, SGS-THOMSON Microelectronics
Fran?ois Pogodalla, SGS-THOMSON Microelectronics
Fr?d?ric Rocheteau, SGS-THOMSON Microelectronics
Mohamed Belhadj, SGS-THOMSON Microelectronics
Jeremy Eggleton, SGS-THOMSON Microelectronics
G?rard Mas, SGS-THOMSON Microelectronics
Geoff Barrett, SGS-THOMSON Microelectronics
Christian Berthet, SGS-THOMSON Microelectronics
pp. 421-426
S. Brown, University of Toronto, Canada
N. Manjikian, University of Toronto, Canada
Z. Vranesic, University of Toronto, Canada
S. Caranci, University of Toronto, Canada
A. Grbic, University of Toronto, Canada
R. Grindley, University of Toronto, Canada
M. Gusat, University of Toronto, Canada
K. Loveless, University of Toronto, Canada
Z. Zilic, University of Toronto, Canada
S. Srbljic, University of Toronto, Canada
pp. 427-432
Alessandro Bogliolo, CSL - Stanford University, CA
Luca Benini, CSL - Stanford University, CA
Bruno Ricc?, DEIS - University of Bologna
pp. 433-438
David Ihsin Cheng, Mentor Graphics Corp., San Jose, CA
Kwang-Ting Cheng, Univ. of California, Santa Barbara, CA
Deborah C. Wang, LSI Logic Corp., Milpitas, CA
Malgorzata Marek-Sadowska, Univ. of California, Santa Barbara, CA
pp. 439-444
Yong Je Lim, University of Washington, Seattle, WA
Kyung-Im Son, University of Washington, Seattle, WA
Heung-Joon Park, University of Washington, Seattle, WA
Mani Soma, University of Washington, Seattle, WA
pp. 445-450
Sunil P. Khatri, University of California, Berkeley, CA
Amit Narayan, University of California, Berkeley, CA
Sriram C. Krishnan, University of California, Berkeley, CA
Kenneth L. McMillan, Cadence Berkeley Laboratories, Berkeley, CA
Robert. K. Brayton, University of California, Berkeley, CA
A. Sangiovanni-Vincentelli, University of California, Berkeley, CA
pp. 451-456
Mahesh A. Iyer, Synopsys, Inc., Mountain View, CA
David E. Long, Lucent Technologies - Bell Labs., Murray Hill, NJ
Miron Abramovici, Lucent Technologies - Bell Labs., Murray Hill, NJ
pp. 457-462
Hiroyuki Higuchi, Fujitsu Laboratories Ltd., Japan
Yusuke Matsunaga, Fujitsu Laboratories Ltd., Japan
pp. 463-466
Fabrizio Ferrandi, Politecnico di Milano, Italy
Franco Fummi, Politecnico di Milano, Italy
Enrico Macii, Politecnico di Torino, Italy
Massimo Poncino, Politecnico di Torino, Italy
Donatella Sciuto, Politecnico di Milano, Italy
pp. 467-470
Andreas Koch, Tech. Univ. of Braunschweig, Germany
pp. 471-476
Ming-Ter Kuo, University of California, San Diego
Lung-Tien Liu, AT&T Bell Laboratories, Murray Hill, New Jersey
Chung-Kuan Cheng, University of California, San Diego
pp. 477-482
Danny Z. Chen, University of Notre Dame, IN
Xiaobo (Sharon) Hu, Western Michigan University, MI
pp. 483-486
Chung-Ping Chen, University of Texas, Austin, Texas
Yao-Ping Chen, University of Texas, Austin, Texas
D. F. Wong, University of Texas, Austin, Texas
pp. 487-490
Tetsuya Fujimoto, Sharp Corporation, Japan
Takashi Kambe, Sharp Corporation, Japan
pp. 491-496
Hisakazu Edamatsu, Matsushita Electric Industrial, Co., Ltd., Japan
Satoshi Ikawa, Matsushita Electric Industrial, Co., Ltd., Japan
Katsuya Hasegawa, Matsushita Electric Industrial, Co., Ltd., Japan
pp. 497-502
Yasunori Miyahara, Toshiba Corp., Japan
Yoshitomo Oumi, Toshiba Corp., Japan
Seijiro Moriyama, Toshiba Corp., Japan
pp. 503-508
Mike Murray, Acuson, Mountain View, CA
Yatin Trivedi, Seva Technologies, Fremont, CA
Uwe B. Meding, Concurrent CAE Solutions, Santa Clara, CA
Bill McCaffrey, High Level Design Systems, Santa Clara, CA
Bill Berg, Mentor Graphics, Wilsonville, OR
Ted Vucurevich, Cadence Design Systems, San Jose, CA
pp. 509-514
Jay K. Adams, Synopsys, Inc., Mountain View, CA
Donald E. Thomas, Carnegie Mellon University, Pittsburgh, PA
pp. 515-520
Nguyen Ngoc Binh, Osaka University, Japan
Masaharu Imai, Osaka University, Japan
Akichika Shiomi, Shizuoka University, Japan
Nobuyuki Hikichi, Software Research Associates, Inc., Japan
pp. 527-532
Andrew B. Kahng, UCLA Computer Science Department, Los Angeles, CA
Sudhakar Muddu, UCLA Computer Science Department, Los Angeles, CA
pp. 533-538
Florentin Dartu, Carnegie Mellon University, Pittsburgh, PA
Bogdan Tutuianu, University of Texas at Austin
Lawrence T. Pileggi, Carnegie Mellon University, Pittsburgh, PA
pp. 544-547
Yi-Kan Cheng, Univ. of Illinois at Urbana-Champaign
Chin-Chi Teng, Univ. of Illinois at Urbana-Champaign
Abhijit Dharchoudhury, Motorola Inc., Austin, TX
Elyse Rosenbaum, Univ. of Illinois at Urbana-Champaign
Sung-Mo Kang, Univ. of Illinois at Urbana-Champaign
pp. 548-551
C. Norris Ip, Stanford University, CA
David L. Dill, Stanford University, CA
pp. 564-567
Felice Balarin, Cadence Berkeley Laboratories, USA
Harry Hsieh, University of California at Berkeley, USA
Luciano Lavagno, Politecnico di Torino, Italy
Alberto Sangiovanni-Vincentelli, University of California at Berkeley, USA
pp. 568-571
E. Berrebi, TIMA, France
P. Kission, TIMA, France
S. Vernalde, IMEC, Belgium
S. De Troch, IMEC, Belgium
J. C. Herluison, SGS-Thomson Microelectronics, France
J. Fr?hel, SGS-Thomson Microelectronics, France
A. A. Jerraya, TIMA, France
I. Bolsens, IMEC, Belgium
pp. 573-578
J. Huisken, Philips Research Laboratories, Eindhoven, The Netherlands
F. Welten, Philips Research Laboratories, Eindhoven, The Netherlands
pp. 579-584
Mike Tien-Chien Lee, Fujitsu Laboratories of America, Santa Clara, CA
Yu-Chin Hsu, Univ. of California, Riverside
Ben Chen, Fujitsu Ltd., Japan
Masahiro Fujita, Fujitsu Laboratories of America, Santa Clara, CA
pp. 585-590
Guido Araujo, Princeton University, NJ
Sharad Malik, Princeton University, NJ
Mike Tien-Chien Lee, Fujitsu Laboratories of America, San Jose, CA
pp. 591-596
Clifford Liem, TIMA Laboratory, Inst. Nat. Polytech. de Grenoble (INPG), France; SGS-Thomson Microelectronics (ST), France
Pierre Paulin, SGS-Thomson Microelectronics (ST), France
Ahmed Jerraya, TIMA Laboratory, Inst. Nat. Polytech. de Grenoble (INPG), France
pp. 597-600
Bogdan Tutuianu, The University of Texas at Austin
Florentin Dartu, Carnegie Mellon University, Pittsburgh, PA
Lawrence Pileggi, Carnegie Mellon University, Pittsburgh, PA
pp. 611-616
Jos? Luis Neves, University of Rochester, New York
Eby G. Friedman, University of Rochester, New York
pp. 623-628
Jagesh V. Sanghavi, University of California at Berkeley
Rajeev K. Ranjan, University of California at Berkeley
Robert K. Brayton, University of California at Berkeley
Alberto Sangiovanni-Vincentelli, University of California at Berkeley
pp. 635-641
Tony Stornetta, University of California, Santa Barbara
Forrest Brewer, University of California, Santa Barbara
pp. 641-644
E. M. Clarke, Carnegie Mellon University, Pittsburgh, PA
M. Khaira, Intel Corporation, Hillsboro, OR
X. Zhao, Intel Corporation, Hillsboro, OR; Carnegie Mellon University, Pittsburgh, PA
pp. 645-648
Manish Pandey, Carnegie Mellon University Pittsburgh, PA
Richard Raimi, Motorola Inc., Austin, TX
Derek L. Beatty, Motorola Inc., Austin, TX
Randal E. Bryant, Carnegie Mellon University Pittsburgh, PA
pp. 649-654
Ilan Beer, IBM Haifa Research Laboratory, Haifa, Israel
Shoham Ben-David, IBM Haifa Research Laboratory, Haifa, Israel
Cindy Eisner, IBM Haifa Research Laboratory, Haifa, Israel
Avner Landver, IBM Haifa Research Laboratory, Haifa, Israel
pp. 655-660
Randal E. Bryant, Carnegie Mellon University, Pittsburgh, PA
pp. 661-665
Benny Schnaider, MayaLee Consulting, Santa Clara, CA
Einat Yogev, Cisco Systems, San Jose, CA
pp. 684-689
Vojin Zivojnovic, Aachen University of Technology, Germany
Heinrich Meyr, Aachen University of Technology, Germany
pp. 690-694
Diana Marculescu, University of Southern California, Los Angeles, CA
Radu Marculescu, University of Southern California, Los Angeles, CA
Massoud Pedram, University of Southern California, Los Angeles, CA
pp. 696-701
Huzefa Mehta, The Pennsylvania State University, PA
Robert Michael Owens, The Pennsylvania State University, PA
Mary Jane Irwin, The Pennsylvania State University, PA
pp. 702-707
Soha Hassoun, University of Washington, Seattle
Carl Ebeling, University of Washington, Seattle
pp. 708-713
Kumar N. Lalgudi, Yale University, New Haven, CT
Marios C. Papaefthymiou, Yale University, New Haven, CT
Miodrag Potkonjak, University of California, Los Angeles, CA
pp. 714-719
Peichen Pan, Clarkson University, Potsdam, NY
C. L. Liu, University of Illinois at Urbana-Champaign
pp. 720-725
Jason Cong, University of California, Los Angeles
Yean-Yow Hwang, University of California, Los Angeles
pp. 726-729
Christian Legl, Technical University of Munich, Germany
Bernd Wurth, Synopsys, Inc., Mountain View, CA
Klaus Eckl, Technical University of Munich, Germany
pp. 730-733
Olivier Coudert, Synopsys Inc., Mountain View, CA
Ramsey Haddad, Synopsys Inc., Mountain View, CA
Srilatha Manne, University of Colorado, Boulder
pp. 734-739
Koichi Sato, NEC Corporation, Kawasaki, Japan
Masamichi Kawarabayashi, NEC Corporation, Kawasaki, Japan
Hideyuki Emura, NEC Corporation, Kawasaki, Japan
Naotaka Maeda, NEC Corporation, Kawasaki, Japan
pp. 740-745
Cyrus Bamji, Cadence Design Systems, Inc. - San Jose, CA
Enrico Malavasi, Cadence Design Systems, Inc. - San Jose, CA
pp. 746-751
Chin-Chi Teng, University of Illinois at Urbana-Champaign
Yi-Kan Cheng, University of Illinois at Urbana-Champaign
Elyse Rosenbaum, University of Illinois at Urbana-Champaign
Sung-Mo Kang, University of Illinois at Urbana-Champaign
pp. 752-757
A. J. van Genderen, Delft University of Technology, The Netherlands
N. P. van der Meijs, Delft University of Technology, The Netherlands
pp. 758-763
P. J. H. Elias, Delft University of Technology, The Netherlands
N. P. van der Meijs, Delft University of Technology, The Netherlands
pp. 764-769
Hans Sahm, Lucent Technologies - Bell Labs Innovations, Germany
Claus Mayer, Lucent Technologies - Bell Labs Innovations, Germany
J?rg Pleickhardt, Lucent Technologies - Bell Labs Innovations, Germany
Johannes Schuck, Lucent Technologies - Bell Labs Innovations, Germany
Stefan Sp?th, Philips ADC N?rnberg, Germany
pp. 777-782
De-Sheng Chen, Industrial Technology Research Institute, HsinChu, Taiwan
Majid Sarrafzadeh, Northwestern University, Evanston, IL
pp. 783-788
Bernhard Rohfleisch, Technical University of Munich, Germany
Alfred K?lbl, Technical University of Munich, Germany
Bernd Wurth, Synopsys, Inc., Mountain View, CA
pp. 789-794
Xiangfeng Chen, University of Illinois at Urbana-Champaig
Peicheng Pan, University of Illinois at Urbana-Champaig
C. L. Liu, University of Illinois at Urbana-Champaig
pp. 795-800
Luc Burgun, Meta Systems, France
Fr?d?ric Reblewski, Meta Systems, France
G?rard Fenelon, Meta Systems, France
Jean Barbier, Meta Systems, France
Olivier Lepape, Meta Systems, France
pp. 801-806
Dong Xiang, University of Illinois at Urbana-Champaign
Srikanth Venkataraman, University of Illinois at Urbana-Champaign
W. Kent Fuchs, University of Illinois at Urbana-Champaign
Janak H. Patel, University of Illinois at Urbana-Champaign
pp. 807-812
Laurence Goodby, University of California, San Diego
Alex Orailoglu, University of California, San Diego
pp. 813-818
Aurobindo Dasgupta, University of Massachusetts, Amherst
Ramesh Karri, University of Massachusetts, Amherst
pp. 819-824
Arun N. Lokanathan, University of Notre Dame
Jay B. Brockman, University of Notre Dame
John E. Renaud, University of Notre Dame
pp. 825-830
Mien Li, University of Maryland at College Park
Linda Milor, University of Maryland at College Park
pp. 831-836
Usage of this product signifies your acceptance of the Terms of Use.