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32nd ACM/IEEE Conference on Design Automation Conference (DAC'95)
San Francisco, California, United States
June 12-June 16
ISBN: 0-89791-725-1
Table of Contents
Papers
Guillermo Maturana, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Les Kohn, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Atsushi Inoue, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Marc Tremblay, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
pp. 2-6
Jamshid Mostoufi, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Paul Loewenstein, Sun Microsystems, Inc., Mountain View, CA
Raju Joshi, Sun Microsystems, Inc., Mountain View, CA
David Gao, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Lawrence Yang, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
pp. 7-12
UltraSPARC-I (Abstract)
Manjunath Doreswamy, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Mark Elgood, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Miriam Blatt, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Piyush Desai, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Scott Cooke, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Tim Goldsbury, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Dale Greenley, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Dennis Chen, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
Gary Feierbach, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
James Gateley, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
pp. 13-18
A. Cao, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
A. Adalal, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
J. Bauman, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
P. Delisle, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
P. Dedood, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
P. Donehue, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
M. Dell'OcaKhouja, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
T. Doan, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
M. Doreswamy, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
P. Ferolito, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
O. Geva, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
D. Greenhill, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
S. Gopaladhine, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
J. Irwin, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
L. Lev, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
J. MaDonald, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
M. Ma, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
S. Mitra, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
P. Patel, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
A. Prabhu, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
R. Puranik, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
S. Rozanski, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
N. Ross, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
P. Saggurti, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
S. Simovich, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
R. Sunder, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
B. Sur, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
W. Vercruysse, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
M. Wong, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
P. Yip, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
R. Yu, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
J. Zhou, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
G. Zyner, SPARC Technology, Sun Microsystems, Inc., Mountain View, CA
pp. 19-22
Abelardo Pardo, University of Colorado, Boulder
Massimo Poncino, Politecnico di Torino, Italy
R. Iris Bahar, University of Colorado, Boulder
Enrico Macii, Politecnico di Torino, Italy
Fabio Somenzi, University of Colorado, Boulder
Gary D. Hachtel, University of Colorado, Boulder
Srilatha Manne, University of Colorado, Boulder
pp. 23-28
Massoud Pedram, University of Southern California, Los Angeles
Jui-Ming Chang, University of Southern California, Los Angeles
pp. 29-35
Gustavo E. T?llez, Northwestern University, Evanston, IL
Majid Sarrafzadeh, Northwestern University, Evanston, IL
Amir H. Farrahi, Northwestern University, Evanston, IL
pp. 36-41
Ting-Ting Hwang, National Chiao Tung University, Taiwan
Kuo-Hua Wang, National Tsing Hua University, Taiwan
pp. 48-53
Klaus Eckl, Technical University of Munich, Germany
Kurt Antreich, Technical University of Munich, Germany
Bernd Wurth, Technical University of Munich, Germany
pp. 54-59
Juinn-Dar Huang, National Chiao Tung University, Taiwan
Shih-Min Chao, National Chiao Tung University, Taiwan
Wen-Zen Shen, National Chiao Tung University, Taiwan
pp. 65-69
Massoud Pedram, University of Southern California, Los Angeles
Hirendu Vaishnav, University of Southern California, Los Angeles
pp. 70-75
Panos K. Chrysanthis, University of Pittsburgh
Steven P. Levitan, University of Pittsburgh
Stephen T. Frezza, University of Pittsburgh
pp. 76-81
Martin Sch?, University of Kaiserslautern, Germany
Bernd Sch?rmann, University of Kaiserslautern, Germany
Joachim Altmeyer, University of Kaiserslautern, Germany
pp. 88-93
Ron Miller, Synopsys Inc., Mountain View, CA
David Knapp, Synopsys Inc., Mountain View, CA
Don MacMillen, Synopsys Inc., Mountain View, CA
Tai Ly, Synopsys Inc., Mountain View, CA
pp. 101-106
K.-T. Cheng, University of California, Santa Barbara
S. M. Reddy, University of Iowa, Iowa City
D. Luxenburger, University of Saarland, Germany
U. Sparmann, University of Saarland, Germany
pp. 119-125
Ismed Hartanto, University of Illinois, Urbana
Janak H. Patel, University of Illinois, Urbana
Sreejit Chakravarty, State University of New York, Buffalo, NY
W. Kent Fuchs, University of Illinois, Urbana
Elizabeth M. Rudnick, Motorola Inc., Austin, TX
Srikanth Venkataraman, University of Illinois, Urbana
pp. 133-138
Jeremy R. Levitt, Stanford University, CA
Kunle Olukotun, Stanford University, CA
Monica S. Lam, Stanford University, CA
Robert S. French, Stanford University, CA
pp. 151-156
Youn-Long Lin, Tsing Hua University, Taiwan
Tsung-Yi Wu, Tsing Hua University, Taiwan
pp. 164-169
Majid Sarrafzadeh, Northwestern University, Evanston, IL
Salil Raje, Northwestern University, Evanston, IL
Elof Frank, Germany National Research Center for Computer Science (GMD), Germany
pp. 170-175
Janusz Rajski, Mentor Graphics Corp., Wilsonville, OR
Thomas Marchok, Carnegie Mellon University, Pittsburgh, PA
Wojciech Maly, Northwestern University, Evanston, IL
Aiman El-Maleh, McGill University, Canada
pp. 176-182
C. L. Liu, University of Illinois at Urbana-Champaign
Peichen Pan, University of Illinois at Urbana-Champaign
pp. 189-194
So-Zen Yao, Cadence Design Systems, San Jose, CA
Charles J. Alpert, UCLA Computer Science Department, Los Angeles, CA
pp. 195-200
Donald Thomas, Carnegie-Mellon University, Pittsburgh, PA
Prashant Sawkar, Carnegie-Mellon University, Pittsburgh, PA
pp. 201-210
Carl Sechen, University of Washington, Seattle
William Swartz, TimberWolf Systems, Inc., Dallas, TX
pp. 211-215
Andrew B. Kahng, UCLA Department of Computer Science
Dennis J. H. Huang, UCLA Department of Computer Science
Lars W. Hagen, Cadence Design Systems, Inc., San Jose, CA
pp. 216-221
Heinrich Meyr, Aachen University of Technology, Germany
Thorsten Gr?tker, Aachen University of Technology, Germany
Peter Zepter, Aachen University of Technology, Germany
pp. 228-233
Massoud Pedram, University of Southern California, Los Angeles, CA
Sasan Iman, University of Southern California, Los Angeles, CA
pp. 248-253
Alberto L. Sangiovanni-Vincentelli, Cadence Berkeley Laboratories, Berkeley, CA
Alexander Saldanha, Cadence Berkeley Laboratories, Berkeley, CA
Patrick C. McGeer, Cadence Berkeley Laboratories, Berkeley, CA
Luciano Lavagno, Cadence Berkeley Laboratories, Berkeley, CA
pp. 254-260
Karem A. Sakallah, University of Michigan, Ann Arbor
Mark Roberts, University of Michigan, Ann Arbor
Richard B. Brown, University of Michigan, Ann Arbor
C. David Kibler, Hewlett Packard Company, Ft. Collins, CO
Ajay Chandna, University of Michigan, Ann Arbor
pp. 261-266
J. Donald Trotter, Mississippi State University, Starkville, MS
Daniel H. Linder, Mississippi State University, Starkville, MS
Sanjay Rekhi, Mississippi State University, Starkville, MS
pp. 267-272
A. J. van Genderen, Delft University of Technology, The Netherlands
N. P. van der Meijs, Delft University of Technology, The Netherlands
pp. 273-278
Moshe Levinger, IBM Israel - Haifa Research Lab
Moshe Molcho, IBM Israel - Haifa Research Lab
Yossi Lichtenstein, IBM Israel - Haifa Research Lab
Yossi Malka, IBM Israel - Haifa Research Lab
Charlotte Metzger, IBM Israel - Haifa Research Lab
Dave Goodman, IBM Israel - Haifa Research Lab
Gil Shurek, IBM Israel - Haifa Research Lab
Aharon Aharon, IBM Israel - Haifa Research Lab
pp. 279-285
R. Miller, Synopsys Inc., Mountain View, CA
T. Ly, Synopsys Inc., Mountain View, CA
D. MacMillen, Synopsys Inc., Mountain View, CA
D. Knapp, Synopsys Inc., Mountain View, CA
pp. 286-291
Patrizia Cavalloro, ITALTEL SIT, Italy
Roger B. Hughes, Abstract Hardware Limited, UK
Salvatore Conigliaro, ITALTEL SIT, Italy
Gerry Musgrave, Brunel University, UK
Giuseppe Zaza, ITALTEL SIT, Italy
Massimo Bombana, ITALTEL SIT, Italy
pp. 292-297
J? Lohse, Siemens Corporate R&D, Germany
Michael Payer, Siemens Corporate R&D, Germany
Gerd Venzl, Siemens Corporate R&D, Germany
J? Bormann, Siemens Corporate R&D, Germany
pp. 298-303
Sachin S. Sapatnekar, Iowa State University, Ames, IA
Rahul B. Deokar, Iowa State University, Ames, IA
pp. 310-315
Richard L. Rudell, Synopsys Inc., Mountain View, CA
Robert K. Brayton, University of California at Berkeley
Carl Pixley, Motorola Inc., Austin, TX
Vigyan Singhal, University of California at Berkeley
pp. 316-321
R. H. J. M. Otten, Delft University of Technology, The Netherlands
I. Karkowski, Delft University of Technology, The Netherlands
pp. 322-326
Alvin M. Despain, University of Southern California, Los Angeles
Massoud Pedram, University of Southern California, Los Angeles
Shihming Liu, University of Southern California, Los Angeles
pp. 327-332
J. Rajski, Mentor Graphics Corporation, Wilsonville, OR
J. Tyszer, McGill University, Montreal, Canada
N. Mukherjee, McGill University, Montreal, Canada
M. Kassab, McGill University, Montreal, Canada
pp. 333-338
M. Keim, J. W. Goethe-University, Germany
B. Becker, J. W. Goethe-University, Germany
R. Krieger, J. W. Goethe-University, Germany
pp. 339-344
Tracy Larrabee, University of California at Santa Cruz
F. Joel Ferguson, University of California at Santa Cruz
Haluk Konuk, University of California at Santa Cruz
pp. 345-351
Jordi Carrabina-Bordoll, Universitat Aut?noma de Barcelona, UAB, Spain
Llu? Ribas-Xirgo, Universitat Aut?noma de Barcelona, UAB, Spain
pp. 352-357
John Willis, The University of Texas at Austin
Lawrence T. Pileggi, The University of Texas at Austin
Rohini Gupta, The University of Texas at Austin
Byron Krauter, IBM, Austin, TX
pp. 358-363
John Willis, The University of Texas at Austin
Lawrence T. Pileggi, The University of Texas at Austin
Bogdan Tutuianu, The University of Texas at Austin
Byron Krauter, IBM, Austin, TX
Rohini Gupta, The University of Texas at Austin
pp. 364-369
Jacob White, Massachusetts Institute of Technology, Cambridge, MA
Mattan Kamon, Massachusetts Institute of Technology, Cambridge, MA
L. Miguel Silveira, Massachusetts Institute of Technology, Cambridge, MA
pp. 376-380
Michael Steer, North Carolina State University, Raleigh, NC
Paul Franzon, North Carolina State University, Raleigh, NC
Sharad Mehrotra, IBM Corporation, Austin, TX
pp. 381-387
Forrest Brewer, University of California, Santa Barbara
Chuck Monahan, University of California, Santa Barbara
pp. 389-394
Melvin A. Breuer, University of Southern California, Los Angeles
Sandeep Gupta, University of Southern California, Los Angeles
Ishwar Parulkar, University of Southern California, Los Angeles
pp. 395-401
Anna Slobodov?, Universit?t Trier, Germany
Christoph Meinel, Universit?t Trier, Germany
Jochen Bern, Universit?t Trier, Germany
pp. 408-413
Wolfgang Kunz, University of Potsdam, Germany
Dhiraj K. Pradhan, Texas A& University, College Station, Texas
Subdodh M. Reddy, Unisys Corporation; Texas A& University, College Station, Texas
pp. 414-419
Masahiro Fujita, Fujitsu Laboratories of America, San Jose, CA
Rajarshi Mukherjee, Fujitsu Laboratories of America, San Jose, CA
Jawahar Jain, Fujitsu Laboratories of America, San Jose, CA
pp. 420-426
K. L. McMillan, Cadence Berkeley Labs., CA
O. Grumberg, The Technion, Israel
X. Zhao, Carnegie Mellon University, Pittsburgh, PA
E. M. Clarke, Carnegie Mellon University, Pittsburgh, PA
pp. 427-432
Domine Leenaerts, Eindhoven University of Technology, the Netherlands
Wim Kruiskamp, Eindhoven University of Technology, the Netherlands
pp. 433-438
W. Sansen, Katholike Universiteit Leuven, Belgium
G. Gielen, National Fund of Scientific Research
K. Lampaert, Katholike Universiteit Leuven, Belgium
pp. 445-449
Nicholas J. Stessman, University of Minnesota, Minneapolis
Ramesh Harjani, University of Minnesota, Minneapolis
Bapiraju Vinnakota, University of Minnesota, Minneapolis
pp. 450-454
R. W. Freund, AT&T Bell Laboratories, Murray Hill, NJ
P. Feldmann, AT&T Bell Laboratories, Murray Hill, NJ
pp. 474-479
Jacob K. White, Massachusetts Institute of Technology, Cambridge, Massachusetts
Kenneth S. Kundert, Cadence Design Systems, San Jose, CA
Ricardo Telichevesky, Cadence Design Systems, San Jose, CA
pp. 480-484
Jacob White, Massachusetts Institute of Technology, Cambridge, MA
Tom Korsmeyer, Massachusetts Institute of Technology, Cambridge, MA
Mike Chou, Massachusetts Institute of Technology, Cambridge, MA
pp. 485-490
Malgorzata Marek-Sadowska, University of California, Santa Barbara, CA
Ashok Vittal, University of California, Santa Barbara, CA
pp. 497-502
Malgorzata Marek-Sadowska, University of California, Santa Barbara
Ashok Vittal, University of California, Santa Barbara
pp. 503-507
Andrew B. Kahng, UCLA Computer Science Dept., Los Angeles, CA
Chung-Wen Albert Tsao, UCLA Computer Science Dept., Los Angeles, CA
Dennis J. H. Huang, UCLA Computer Science Dept., Los Angeles, CA
pp. 508-513
John Stivoric, Carnegie Mellon University, Pittsburgh, PA
Tom Martin, Carnegie Mellon University, Pittsburgh, PA
Chris Kasaback, Carnegie Mellon University, Pittsburgh, PA
Daniel P. Siewiorek, Carnegie Mellon University, Pittsburgh, PA
Drew Anderson, Carnegie Mellon University, Pittsburgh, PA
Asim Smailagic, Carnegie Mellon University, Pittsburgh, PA
pp. 514-519
Spiros Boucouris, Bell-Northern Research, Canada
Dave Yurach, Bell-Northern Research, Canada
Giovanni Mancini, Functionality Inc., Canada
pp. 520-527
Ian Perryman, Bell Northern Research, Ontario, Canada
Janick Bergeron, AnalySYS Inc., Ontario, Canada
Mario Dufresne, Bell Northern Research, Ontario, Canada
Stacy Nichols, Bell Northern Research, Ontario, Canada
Greg Ward, Bell Northern Research, Ontario, Canada
Allan Silburt, Bell Northern Research, Ontario, Canada
pp. 528-533
Yirng-An Chen, Carnegie Mellon University, Pittsburgh, PA
Randal E. Bryant, Carnegie Mellon University, Pittsburgh, PA
pp. 535-541
Wayne Burleson, University of Massachusetts at Amherst, MA
Zheng Zhou, University of Massachusetts at Amherst, MA
pp. 546-551
D. F. Wong, University of Texas at Austin, TX
Wai-Kei Mak, University of Texas at Austin, TX
pp. 552-556
Gabriel Robins, University of Virginia, Charlottesville, CA
Michael J. Alexander, University of Virginia, Charlottesville, CA
pp. 562-567
Malgorzata Marek-Sadowska, University of California, Santa Barbara, CA
Yu-Liang Wu, Cadence Design Systems, Inc. San Jose, CA
pp. 568-573
Randy H. Katz, University of California, Berkeley
M?rio J. Silva, University of California, Berkeley
pp. 579-585
Harry Hsieh, Univ. of California, Berkeley, CA
Alberto Sangiovanni-Vincentelli, Univ. of California, Berkeley, CA
Kei Suzuki, Univ. of California, Berkeley, CA
Luciano Lavagno, Politecnico di Torino, Italy
Paolo Guisto, Magneti Marelli, Italy
Attila Jurecska, Magneti Marelli, Italy
Ellen Sentovich, Cadence Berkeley Labs, Berkeley, CA
Massimiliano Chiodo, Magneti Marelli, Italy
pp. 587-592
Jef L. van Meerbergen, Philips Research Laboratories, The Netherlands
Jochen A.G. Jess, Eindhoven University of Technology
Marino T.J. Strik, Philips Research Laboratories, The Netherlands
Adwin H. Timmer, Eindhoven University of Technology; Philips Research Laboratories, The Netherlands
pp. 593-598
Albert Wang, MIT Department of EECS, Cambridge, MA
Kurt Keutzer, MIT Department of EECS, Cambridge, MA
Srinivas Devadas, Synopsys, Inc., Mountain View, CA
Steve Tjiang, Synopsys, Inc., Mountain View, CA
Stan Liao, Synopsys, Inc., Mountain View, CA
pp. 599-604
Manjit Borah, The Pennsylvania State University
Mary Jane Irwin, The Pennsylvania State University
Robert Michael Owens, The Pennsylvania State University
Huzefa Mehta, The Pennsylvania State University
pp. 618-622
Michael Y. Zhang, University of Illinois at Urbana-Champaign
Farid N. Najm, University of Illinois at Urbana-Champaign
pp. 623-627
Massoud Pedram, University of Southern California, Los Angeles
Diana Marculescu, University of Southern California, Los Angeles
Radu Marculescu, University of Southern California, Los Angeles
pp. 628-634
Ibrahim N. Hajj, University of Illinois at Urbana-Champaign
Shashank Goel, University of Illinois at Urbana-Champaign
Farid N. Najm, University of Illinois at Urbana-Champaign
pp. 635-640
Jean Chritophe Madre, Synopsys, Mountain View, CA
Olivier Coudert, Synopsys, Mountain View, CA
pp. 641-646
Kuang-Chien Chen, Fujitsu Laboratories of America, INC.
Kwang-Ting Cheng, University of California, Santa Barbara
Malgorzata Marek-Sadowska, University of California, Santa Barbara
Shih-Chieh Chang, Synopsys Inc.
Chih-Chang Lin, University of California, Santa Barbara
pp. 647-652
Kazutoshi Wakabayashi, NEC Corporation, Japan
Tomoyuki Fujita, NEC Corporation, Japan
Yuichi Nakamura, NEC Corporation, Japan
Masayuki Yuguchi, NEC Corporation, Japan
pp. 658-662
Kwang-Ting Cheng, University of California at Santa Barbara
Malgorzata Marek-Sadowska, University of California at Santa Barbara
Shih-Chieh Chang, Synopsys Inc.
pp. 663-667
Kurt Antreich, Technical University of Munich, Germany
Bernd Wurth, Technical University of Munich, Germany
Berhard Rohfleisch, Technical University of Munich, Germany
pp. 668-672
Hilary J. Kahn, University of Manchester, UK
Cristian A. Giumale, Technical University of Bucharest, Romania
pp. 678-683
John D. Provence, Southern Methodist University, Dallas, Texas
Neal S. Stollon, DSC Communications Corporation, Dallas, Texas
pp. 684-689
Lawrence T. Pileggi, The University of Texas at Austin
Satyamurthy Pullela, The University of Texas at Austin
Noel Menezes, The University of Texas at Austin
pp. 690-695
Donald T. Tang, IBM Thomas J. Watson Research Center, Yorktown Heights, NY
Jin-fuw Lee, IBM Thomas J. Watson Research Center, Yorktown Heights, NY
pp. 696-701
Luigi Croce, SGS-THOMSON Microelectronics, Italy
Bruno Franzini, SGS-THOMSON Microelectronics, Italy
Carlo Guardiani, SGS-THOMSON Microelectronics, Italy
Alessandro Dal Fabbro, SGS-THOMSON Microelectronics, Italy
pp. 702-706
Alok Jain, Digital Equipment Corporation, Hudson, MA
Randal E. Bryant, Carnegie Mellon University, Pittsburgh, PA
Samir Jain, Carnegie Mellon University, Pittsburgh, PA
pp. 707-711
Tilman Kolks, IMEC, Leuven, Belgium
Gjalt de Jong, IMEC, Leuven, Belgium
Bill Lin, IMEC, Leuven, Belgium
pp. 712-717
Albert Wang, Synopsys, Inc., Mountain View, CA
Kurt Keutzer, Synopsys, Inc., Mountain View, CA
Peter Vanbekbergen, Synopsys, Inc., Mountain View, CA
pp. 725-730
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