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  • 29th ACM/IEEE Design Automation Conference (DAC '92)
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29th ACM/IEEE Design Automation Conference (DAC '92)
Anaheim, CA, USA
June 12-June 15
ISBN: 0-8186-2822-7
Table of Contents
Papers
Cheng, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Chen, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Du, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Lim
pp. 543-548
Hong, California Univ., Berkeley, CA, USA
Huang, California Univ., Berkeley, CA, USA
Kuh
pp. 530-535
Mitsuhashi, Electron. Res. Lab., California Univ., Berkeley, CA, USA
Kuh, Electron. Res. Lab., California Univ., Berkeley, CA, USA
pp. 524-529
Chao, ITRI, Hsin-Chu, Taiwan
Hsu
Ho
pp. 518-523
Pyo, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Su, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Huang, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Pan, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Koh, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Tsui, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Chen, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Cheng, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Liu, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Wu, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Despain, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 512-517
Beggs, Boeing Helicopters, Philadelphia, PA, USA
pp. 506-511
Jacome, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Director, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 500-505
Chaudhary, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 492-498
Fishburn, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 488-491
Kung, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Damiano, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Nix, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 484-487
Li, Dept. of Comput. Sci., Arkansas Univ., AR, USA
Lim
pp. 478-483
Change, Hewlett-Packard Co., Palo Alto, CA, USA
Chang, Hewlett-Packard Co., Palo Alto, CA, USA
Leo, Hewlett-Packard Co., Palo Alto, CA, USA
Lee, Hewlett-Packard Co., Palo Alto, CA, USA
Oh, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 472-477
Franzon, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Simovich, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Steer, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Basel, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Mehrotra, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Mills, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 466-471
Ruehli, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Heeb, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 460-465
Batek, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Hayes, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 454-458
Malik, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 449-453
Chen, Fujitsu America Inc., San Jose, CA, USA
pp. 443-448
Wen-Jun Hsu, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Wen-Zen Shen, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 438-442
Zein, IBM, Hopewell Junction, NY, USA
Engel, IBM, Hopewell Junction, NY, USA
pp. 432-437
Hirose, Fujitsu Laboratories Ltd., Kawasaki, Japan
pp. 428-431
Jones, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
pp. 424-427
Lee, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
Maurer, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
pp. 420-423
Amon, Dept. of Comput. Sci. & Eng., Washington Univ., Seattle, WA, USA
Boriello, Dept. of Comput. Sci. & Eng., Washington Univ., Seattle, WA, USA
pp. 410-413
Shenoy, California Univ., Berkeley, CA, USA
Singh, California Univ., Berkeley, CA, USA
Brayton, California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, California Univ., Berkeley, CA, USA
pp. 405-409
Szymanski, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 399-404
Lin, IBM Corp., Kingston, NY, USA
Ludwig, IBM Corp., Kingston, NY, USA
Eng, IBM Corp., Kingston, NY, USA
pp. 393-398
Murgai, California Univ., Berkeley, CA, USA
Brayton, California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, California Univ., Berkeley, CA, USA
pp. 380-386
Schlichtmann, Inst. of Electron. Design Autom., Tech. Univ. of Munich, Germany
pp. 374-379
Sawkar, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Thomas, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
pp. 368-373
Chung, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
Rose, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 361-367
Girard, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, France
Landrault, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, France
Pravossoudovitch, Lab. d'Inf. de Robotique et de Microelectron. de Montpellier, Univ. des Sci. et Tech. du Languedoc, France
pp. 357-360
Chakravarty, Dept. of Comput. Sci., State Univ. of New York, Buffalo, NY, USA
Liu
pp. 353-356
Kubiak, Coord. Sci. Lab., Illinois Univ., Urbana, IL, USA
Parkes, Coord. Sci. Lab., Illinois Univ., Urbana, IL, USA
Fuchs, Coord. Sci. Lab., Illinois Univ., Urbana, IL, USA
Saleh, Coord. Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 347-352
Majumdar, Dept. of Electr. Eng., Southern Illinois Univ., Carbondale, IL, USA
pp. 341-346
Lee, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Ha, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 336-340
Bose, AT&T Bell Labs., Murray Hill, NJ, USA
Agrawal, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 332-335
Lee, Iowa Univ., Iowa City, IA, USA
Reddy, Iowa Univ., Iowa City, IA, USA
pp. 327-331
Wonjong Kim, Dept. of Electron. Eng., Hanyang Univ., Seoul, South Korea
pp. 323-326
Boyer, Bellcore, Red Bank, NJ, USA
pp. 318-322
Bamji, Cadence Design Systems, San Jose, CA, USA
Varadarajan, Cadence Design Systems, San Jose, CA, USA
pp. 311-317
Pelz, Fraunhofer-Inst. of Microelectron. Circuits & Syst., Duisburg, Germany
pp. 305-310
Batra, Sun MicroSystems, Mountain View, CA, USA
Cooke, Sun MicroSystems, Mountain View, CA, USA
pp. 299-304
Rundensteiner, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
Gajski, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
pp. 291-296
Gregory, Synopsys, Inc., Mountain View, CA, USA
MacMillen, Synopsys, Inc., Mountain View, CA, USA
Fogg, Synopsys, Inc., Mountain View, CA, USA
pp. 285-290
Krishnamoorthy, Mentor Graphics Corp., Warren, NJ, USA
pp. 279-284
Vishakantaiah, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
Abraham, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
pp. 273-278
Nabors, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
White, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
pp. 710-715
Dharchoudhury, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Kang, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 704-709
Maulik, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Carley, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Rutenbar, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 698-703
Kim, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
Owens, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
Irwin, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 687-690
Liao, Cadence Design Systems, Inc., San Jose, CA, USA
Chow, Cadence Design Systems, Inc., San Jose, CA, USA
pp. 682-686
Okuda, Mitsubishi Electric Corp., Hyogo, Japan
Oguri, Mitsubishi Electric Corp., Hyogo, Japan
pp. 676-681
Scallan, IBM Corp., Kingston, NY, USA
pp. 672-675
Kahn, Dept. of Comput. Sci., Manchester Univ., UK
pp. 666-671
Karri, Dept. of Comput. Sci. & Eng., California Univ., La Jolla, CA, USA
Orailoglu, Dept. of Comput. Sci. & Eng., California Univ., La Jolla, CA, USA
pp. 662-665
Bergamaschi, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 657-661
Puri, Dept. of Electr. Eng., Calgary Univ., Alta., Canada
Gu, Dept. of Electr. Eng., Calgary Univ., Alta., Canada
pp. 651-656
Dutta, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
Roy, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
Vemuri, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 644-650
Prabhu, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
Pangrle, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 638-643
Leong, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Birmingham, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 634-637
Rho, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
Somenzi, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 628-633
Mercer, Texas Univ., Austin, TX, USA
Kapur, Texas Univ., Austin, TX, USA
pp. 624-627
Pixley, Mitsubishi Electric Res. Lab. Inc., Cambridge, MA, USA
pp. 620-623
Cabodi, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
Camurati, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
Corno, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
Gai, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
Prinetto, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
Sonza Reorda, Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
pp. 614-619
Lai, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Sastry, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 608-613
Wu, Western Michigan Univ., Kalamazoo, MI, USA
Sherwani, Western Michigan Univ., Kalamazoo, MI, USA
pp. 604-607
Natarajan, Western Michigan Univ., Kalamazoo, MI, USA
Sherwani, Western Michigan Univ., Kalamazoo, MI, USA
pp. 600-603
Hou, Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA
Chen, Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA
pp. 594-599
Ho, Dept. of Math. Comput. Sci. & Stat., McNeese State Univ., Lake Charles, LA, USA
pp. 589-593
Fujii, NEC Corp., Kanagawa, Japan
Mima, NEC Corp., Kanagawa, Japan
Matsuda, NEC Corp., Kanagawa, Japan
Yoshimura, NEC Corp., Kanagawa, Japan
pp. 585-588
Sung-Chuan Fang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Wu-Shiung Feng, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Shian-Lang Lee, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 579-584
Pomeranz, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 573-577
Lavagno, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Moon, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Brayton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 568-572
Damiani, Center for Integrated Syst., Stanford Univ., CA, USA
De Micheli, Center for Integrated Syst., Stanford Univ., CA, USA
pp. 556-561
Santucci, Lab. d'Etudes et de Recherche en Inf., Nimes, France
Dray, Lab. d'Etudes et de Recherche en Inf., Nimes, France
Giambiasi, Lab. d'Etudes et de Recherche en Inf., Nimes, France
Boumedine, Lab. d'Etudes et de Recherche en Inf., Nimes, France
pp. 267-272
Lee, Center for Reliable & High-Performance Comput., Illinois Univ., Urbana, IL, USA
Patel, Center for Reliable & High-Performance Comput., Illinois Univ., Urbana, IL, USA
pp. 261-266
Chen, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Du, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Cheng, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 249-252
Saldanha, California Univ., Berkeley, CA, USA
Brayton, California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, California Univ., Berkeley, CA, USA
pp. 245-248
Yu, AT&T Bell Lab., Holmdel, NJ, USA
Subrahmanyam, AT&T Bell Lab., Holmdel, NJ, USA
pp. 239-244
Rao, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
Kurdahi, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
pp. 235-238
Hung, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Parker, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 231-234
Gupta, Center for Integrated Syst., Stanford Univ., CA, USA
Coelho, Center for Integrated Syst., Stanford Univ., CA, USA
De Micheli, Center for Integrated Syst., Stanford Univ., CA, USA
pp. 225-230
Vahid, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
Gajski, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
pp. 219-224
Lee, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Rohrer, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 213-218
Anastasakis, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
Gopal, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
Kim, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
Pillage, Comput. Eng. Res. Center, Texas Univ., Austin, TX, USA
pp. 207-212
Chiprout, Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Nakhla, Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
pp. 201-206
Seawright, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Brewer, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 194-199
Stoll, Siemens AG, Munchen, Germany
Duzy, Siemens AG, Munchen, Germany
pp. 188-193
Wolf, Dept. of Electr. Eng., Princeton Univ., NJ, USA
Takach, Dept. of Electr. Eng., Princeton Univ., NJ, USA
Huang, Dept. of Electr. Eng., Princeton Univ., NJ, USA
Manno, Dept. of Electr. Eng., Princeton Univ., NJ, USA
Wu, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 182-187
Pomeranz, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
Reddy, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 177-181
Saldanha, California Univ., Berkeley, CA, USA
Brayton, California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, California Univ., Berkeley, CA, USA
pp. 173-176
Lin, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Shragowitz, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 153-158
Gao, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Vaidya, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Liu, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
pp. 147-152
Kim, Coord. Sci. Lab., Illinois Univ., Urbana, IL, USA
Banerjee, Coord. Sci. Lab., Illinois Univ., Urbana, IL, USA
Chickermane, Coord. Sci. Lab., Illinois Univ., Urbana, IL, USA
Patel, Coord. Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 141-146
Huang, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Despain, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 135-140
Becker, Dept. of Comput. Sci., North Carolina Univ., Chapel Hill, NC, USA
Singh, Dept. of Comput. Sci., North Carolina Univ., Chapel Hill, NC, USA
Tell, Dept. of Comput. Sci., North Carolina Univ., Chapel Hill, NC, USA
pp. 129-134
Geurts, IMEC, Leuven, Belgium
Catthoor, IMEC, Leuven, Belgium
De Man, IMEC, Leuven, Belgium
pp. 124-127
Rim, Wisconsin Univ., Madison, WI, USA
Jain, Wisconsin Univ., Madison, WI, USA
De Leone, Wisconsin Univ., Madison, WI, USA
pp. 120-123
Gebotys, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 116-119
Rim, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Jain, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 106-111
Nourani, Dept. of Comput. Eng., Case Western Reserve Univ., Cleveland, OH, USA
Papachristou, Dept. of Comput. Eng., Case Western Reserve Univ., Cleveland, OH, USA
pp. 99-105
Raghavan, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Bracken, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Rohrer, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 87-92
Lin, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Kuh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 81-86
Roychowdhury, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Newton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Pederson, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 75-80
Sur-Kolay, Indian Stat. Inst., Calcutta, India
Bhattacharya, Indian Stat. Inst., Calcutta, India
pp. 69-74
Wang, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Wong, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
pp. 62-68
Hamada, California Univ., San Diego, La Jolla, CA, USA
Cheng, California Univ., San Diego, La Jolla, CA, USA
Chau, California Univ., San Diego, La Jolla, CA, USA
pp. 57-61
Shih, California Univ., Berkeley, CA, USA
Kuh, California Univ., Berkeley, CA, USA
pp. 53-56
Cong, Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
Hagen, Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
Kahng, Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
pp. 47-52
Hill, AT&T Bell Labs., Naperville, IL, USA
pp. 45-46
Coudert, Bull Corporate Res. Center, Les Clayes-sous-bois, France
Madre, Bull Corporate Res. Center, Les Clayes-sous-bois, France
pp. 36-39
Sarabi, Dept. of Electr. Eng., Portland State Univ., OR, USA
Perkowski, Dept. of Electr. Eng., Portland State Univ., OR, USA
pp. 30-35
Lee, Dept. of Electr. Eng., Nat. Cheng-Kung Univ., Tainan, Taiwan
pp. 26-29
Johnson, IBM Thomas J. Watson Res. Centre, Yorktown Heights, NY, USA
Ruehli, IBM Thomas J. Watson Res. Centre, Yorktown Heights, NY, USA
pp. 12-15
Ju, Illinois Univ., Urbana, IL, USA
Saleh, Illinois Univ., Urbana, IL, USA
pp. 8-11
Kriplani, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2-7
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