• D
  • DAC
  • 1990
  • 27th ACM/IEEE Design Automation Conference (DAC '90)
Advanced Search 
27th ACM/IEEE Design Automation Conference (DAC '90)
Orlando, FL, USA
June 24-June 28
ISBN: 0-89791-363-9
Table of Contents
Papers
Armstrong, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Cho, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Shah, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Kosaraju, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 2-7
Dutt, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
Hadley, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
Gajski, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
pp. 14-19
King, Center for Reliable & High-Performance Comput., Illinois Univ., Urbana, IL, USA
Banerjee, Center for Reliable & High-Performance Comput., Illinois Univ., Urbana, IL, USA
pp. 20-25
Saab, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Rao, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 26-31
Upton, Seattle Silicon Corp., WA, USA
Samii, Seattle Silicon Corp., WA, USA
Sugiyama, Seattle Silicon Corp., WA, USA
pp. 32-35
Chatterjee, Gen. Electr. Res. & Dev. Center, Schenectady, NY, USA
Hartley, Gen. Electr. Res. & Dev. Center, Schenectady, NY, USA
pp. 36-39
Brace, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 40-45
Burch, Carnegie Mellon Univ., Pittsburgh, PA, USA
Clarke, Carnegie Mellon Univ., Pittsburgh, PA, USA
McMillan, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 46-51
Minato, Dept. of Inf. Sci., Kyoto Univ., Japan
Ishiura, Dept. of Inf. Sci., Kyoto Univ., Japan
Yajima, Dept. of Inf. Sci., Kyoto Univ., Japan
pp. 52-57
Ku, Center for Integrated Syst., Stanford Univ., CA, USA
De Micheli, Center for Integrated Syst., Stanford Univ., CA, USA
pp. 59-64
Cheng-Tsung Hwang, Dept. of Comput. Sci., Tsing Hua Univ., Hsinchu, Taiwan
Yu-Chin Hsu, Dept. of Comput. Sci., Tsing Hua Univ., Hsinchu, Taiwan
Youn-Lang Lin, Dept. of Comput. Sci., Tsing Hua Univ., Hsinchu, Taiwan
pp. 65-70
Cloutier, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Thomas, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 71-76
Sutanthavibul, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Shragowitz, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 90-95
Terai, Mitsubishi Electr. Corp., Hyogo, Japan
Takahashi, Mitsubishi Electr. Corp., Hyogo, Japan
Sato, Mitsubishi Electr. Corp., Hyogo, Japan
pp. 96-102
Lin, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Du, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 103-106
Sakallah, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Mudge, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Olukotun, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 111-117
Martello, Pittsburgh Univ., PA, USA
Levitan, Pittsburgh Univ., PA, USA
Chiarulli, Pittsburgh Univ., PA, USA
pp. 118-123
McGeer, Dept. of Comput. Sci., British Columbia Univ., Vancouver, BC, Canada
pp. 124-129
Ishiura, Dept. of Inf. Sci., Kyoto Univ., Japan
Deguchi, Dept. of Inf. Sci., Kyoto Univ., Japan
Yajima, Dept. of Inf. Sci., Kyoto Univ., Japan
pp. 130-135
Casotto, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Newton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 136-141
van der Wolf, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
Sloof, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
Bingley, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
Dewilde, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 142-145
Bingley, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
van der Wolf, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 146-149
Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 150-155
Liu, Silicon Graphics Inc., Mountain View, CA, USA
Wu
Wu
pp. 156-161
Grant, Dept. of Electr. Eng., Edinburgh Univ., UK
Denver, Dept. of Electr. Eng., Edinburgh Univ., UK
pp. 162-167
Ly, Audesyn Inc., Edmonton, Alta., Canada
Elwood, Audesyn Inc., Edmonton, Alta., Canada
Girczyc, Audesyn Inc., Edmonton, Alta., Canada
pp. 168-173
McNall, GE Corp. R&D, Schenectady, NY, USA
Casavant, GE Corp. R&D, Schenectady, NY, USA
pp. 174-179
Wang, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Wong, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
pp. 180-186
Sutanthavibul, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 187-192
Wang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 193-199
Spreitzer, Xerox Palo Alto Res. Center, CA, USA
pp. 200-206
Vemuri, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 207-212
Ghosh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 213-219
Keutzer, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 228-234
Agrawal, AT&T Bell Lab., Murray Hill, NJ, USA
Cheng, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 235-240
Domic, Digital Equipment Corp., Hudson, MA, USA
pp. 241-245
Carlson, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Rutenbar, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 253-259
Tonkin, Adelaide Univ., SA, Australia
pp. 260-265
Barnes, Cadence Design Syst. Inc., San Jose, CA, USA
pp. 266-271
Jabri, Syst. Eng. & Design Autom. Lab., Sydney Univ., NSW, Australia
pp. 272-277
Sato, Fujitsu Ltd., Kawasaki, Japan
Yasue, Fujitsu Ltd., Kawasaki, Japan
pp. 284-289
Malik, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 290-296
Cheng, AT&T Bell Lab., Murray Hill, NJ, USA
Agrawal, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 302-305
Cai, IMEC Lab., Leuven, Belgium
Note, IMEC Lab., Leuven, Belgium
Six, IMEC Lab., Leuven, Belgium
de Man, IMEC Lab., Leuven, Belgium
pp. 306-311
Hill, AT&T Bell Lab., Murray Hill, NJ, USA
Shugard, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 312-316
HiIl, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 317-320
Okubo, NTT LSI Lab., Kanagawa, Japan
Watanabe, NTT LSI Lab., Kanagawa, Japan
Wada, NTT LSI Lab., Kanagawa, Japan
pp. 321-326
Wey, Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
Ding, Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 327-332
Forsythe, Nat. Semicond. Corp., Santa Clara, CA, USA
Agarwal, Nat. Semicond. Corp., Santa Clara, CA, USA
Yeh, Nat. Semicond. Corp., Santa Clara, CA, USA
Aronowitz, Nat. Semicond. Corp., Santa Clara, CA, USA
Gadepally, Nat. Semicond. Corp., Santa Clara, CA, USA
pp. 333-337
Chen, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Muroga, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
pp. 339-344
Kageyama, Hitachi Ltd., Tokyo, Japan
Miura, Hitachi Ltd., Tokyo, Japan
Shimizu, Hitachi Ltd., Tokyo, Japan
pp. 345-348
Lin, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Marek-Sadowska, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Kuh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 349-352
Chan, Comput. Eng.., California Univ., Santa Cruz, CA, USA
pp. 353-356
Singh, California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, California Univ., Berkeley, CA, USA
pp. 357-360
Abouzeid, Inst. Nat. Polytech. de Grenoble/CSI, France
Sakouti, Inst. Nat. Polytech. de Grenoble/CSI, France
Saucier, Inst. Nat. Polytech. de Grenoble/CSI, France
pp. 365-368
Marple, Philips Res. Lab., Eindhoven, Netherlands
pp. 375-381
Lo, AT&T Bell Lab., Murray Hill, NJ, USA
Varadarajan, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 382-387
Hung, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA
Wen, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA
Gallivan, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA
Saleih, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA
pp. 394-399
Yang, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA
pp. 400-405
McCormick, Res. Lab. of Electron., MIT, Cambridge, MA, USA
Allen, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 406-412
Adamiak, Quantic Lab. Inc., Winnipeg, Man., Canada
Allen, Quantic Lab. Inc., Winnipeg, Man., Canada
Poltz, Quantic Lab. Inc., Winnipeg, Man., Canada
Rebizant, Quantic Lab. Inc., Winnipeg, Man., Canada
Wexler, Quantic Lab. Inc., Winnipeg, Man., Canada
pp. 413-418
Bower, AT&T Bell Lab., Allentown, PA, USA
Seaquist, AT&T Bell Lab., Allentown, PA, USA
pp. 419-424
Chung, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
Kim, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
pp. 431-436
Feghhi, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
Marefat, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
Kashyap, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 437-443
Potasman, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
Lis
pp. 444-449
Camposano, IBM Res. Div., Yorktown Heights, NY, USA
Bergamaschi, IBM Res. Div., Yorktown Heights, NY, USA
pp. 450-455
Singh, Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA
Chen, Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA
pp. 462-467
Yung-Ching Hsieh, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsin-Chu, Taiwan
pp. 474-479
Maurer, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
Wang, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
pp. 480-484
Wang, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
Maurer, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
pp. 491-496
Chu-Yi Huang, Dept. of Comput. Sci., Tsing Hua Univ., Hsin-Chu, Taiwan
Yen-Shen Chen, Dept. of Comput. Sci., Tsing Hua Univ., Hsin-Chu, Taiwan
Yan-Long Lin, Dept. of Comput. Sci., Tsing Hua Univ., Hsin-Chu, Taiwan
Yu-Chin Hsu, Dept. of Comput. Sci., Tsing Hua Univ., Hsin-Chu, Taiwan
pp. 499-504
Kucukcakar, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Parker, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 511-516
Bryant, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 517-521
Ito, Fujitsu Ltd., Kawasaki, Japan
pp. 529-534
Breternitz, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Shen, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 542-548
Sarma, Texas Instrum. Ltd., Bedford, UK
Dooley, Texas Instrum. Ltd., Bedford, UK
Newman, Texas Instrum. Ltd., Bedford, UK
Hetherington, Texas Instrum. Ltd., Bedford, UK
pp. 549-554
Edmond, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Gupta, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Siewiorek, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Brennan, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 555-560
Choudhury, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 561-566
Greene, Actel Corp., Sunnyvale, CA, USA
pp. 567-572
Jackson, Electron. Res. Lab., California Univ., Berkeley, CA, USA
Srinivasan, Electron. Res. Lab., California Univ., Berkeley, CA, USA
Kuh, Electron. Res. Lab., California Univ., Berkeley, CA, USA
pp. 573-579
Ghosh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 580-586
Ward, Robertshaw Controls Co., Richmond, VA, USA
pp. 587-593
Kunda, Illinois Univ., Urbana, IL, USA
Narain, Illinois Univ., Urbana, IL, USA
pp. 594-599
Ashar, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 601-606
Dey, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA
pp. 607-612
Francis, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
Rose, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
Chung, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 613-619
Murgai, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Nishizaki, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Shenoy, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Brayton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Sangiovanni-Vincentelli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 620-625
Schiele, Siemens AG, Munich, Germany
Kruger, Siemens AG, Munich, Germany
Just, Siemens AG, Munich, Germany
Kirsch, Siemens AG, Munich, Germany
pp. 626-631
Hojati, Cadence Design Syst. Inc., San Jose, CA, USA
pp. 632-637
Cai, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Wong, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
pp. 638-641
Edahiro, NEC Corp., Kawasaki, Japan
Yoshimura, NEC Corp., Kawasaki, Japan
pp. 642-645
Brouwer, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
Banerjee, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
pp. 650-653
Chakradhar, Dept. of Comput. Sci., Rutgers Univ., Piscataway, NJ, USA
pp. 654-659
Lee, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Ha, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 660-666
Giraldi, Rutgers Univ., Piscataway, NJ, USA
Bushnell, Rutgers Univ., Piscataway, NJ, USA
pp. 667-672
Butler, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Mercer, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 673-678
Whitcomb, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Newton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 680-685
Data, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Birmingham, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 686-691
Wolf, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 692-697
Gidwani, Dept. of Comput. Sci., Western Michigan Univ., Kalamazoo, MI, USA
Sherwani, Dept. of Comput. Sci., Western Michigan Univ., Kalamazoo, MI, USA
pp. 698-703
Katsadas, Dept. of Electr. Eng., Rochester Univ., NY, USA
Kinnen, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 704-708
Cong, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Liu
pp. 709-715
Tyh-Song Hwang, Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
Chung Len Lee, Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
Wen Zen Shen, Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
Ching Ping Wu, Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
pp. 716-719
Ramakrishnan, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
Kinney, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 720-723
Upadhyaya, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
Thodiyil, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 724-727
Mao, Dept. of Electr. & Comput. Eng., Colorado Univ., Colorado Springs, CO, USA
Ciletti, Dept. of Electr. & Comput. Eng., Colorado Univ., Colorado Springs, CO, USA
pp. 728-731
Kuo, Inst. of Electr. & Comput. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Wang, Inst. of Electr. & Comput. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Lee, Inst. of Electr. & Comput. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 732-735
Chakravarty, Dept. of Comput. Sci., State Univ. of New York, Buffalo, NY, USA
pp. 736-739
Savoj, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Brayton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 297-301
Usage of this product signifies your acceptance of the Terms of Use.