- D
- DAC
- 1990
- 27th ACM/IEEE Design Automation Conference (DAC '90)
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27th ACM/IEEE Design Automation Conference (DAC '90) Orlando, FL, USA June 24-June 28 ISBN: 0-89791-363-9 Table of Contents
 | Papers |
Armstrong, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Cho, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Shah, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Kosaraju, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA pp. 2-7
Ishiura, Dept. of Inf. Sci., Kyoto Univ., Japan pp. 8-13
Dutt, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
Hadley, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
Gajski, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA pp. 14-19
King, Center for Reliable & High-Performance Comput., Illinois Univ., Urbana, IL, USA
Banerjee, Center for Reliable & High-Performance Comput., Illinois Univ., Urbana, IL, USA pp. 20-25
Saab, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Rao, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA pp. 26-31
Upton, Seattle Silicon Corp., WA, USA
Samii, Seattle Silicon Corp., WA, USA
Sugiyama, Seattle Silicon Corp., WA, USA pp. 32-35
Chatterjee, Gen. Electr. Res. & Dev. Center, Schenectady, NY, USA
Hartley, Gen. Electr. Res. & Dev. Center, Schenectady, NY, USA pp. 36-39
Brace, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 40-45
Burch, Carnegie Mellon Univ., Pittsburgh, PA, USA
Clarke, Carnegie Mellon Univ., Pittsburgh, PA, USA
McMillan, Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 46-51
Minato, Dept. of Inf. Sci., Kyoto Univ., Japan
Ishiura, Dept. of Inf. Sci., Kyoto Univ., Japan
Yajima, Dept. of Inf. Sci., Kyoto Univ., Japan pp. 52-57
Ku, Center for Integrated Syst., Stanford Univ., CA, USA
De Micheli, Center for Integrated Syst., Stanford Univ., CA, USA pp. 59-64
Yu-Chin Hsu, Dept. of Comput. Sci., Tsing Hua Univ., Hsinchu, Taiwan
Youn-Lang Lin, Dept. of Comput. Sci., Tsing Hua Univ., Hsinchu, Taiwan pp. 65-70
Cloutier, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Thomas, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 71-76
Papachristou, Dept. of Comput. Eng., Case Western Reserve Univ., Cleveland, OH, USA pp. 77-83
Sutanthavibul, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Shragowitz, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA pp. 90-95
Terai, Mitsubishi Electr. Corp., Hyogo, Japan
Takahashi, Mitsubishi Electr. Corp., Hyogo, Japan
Sato, Mitsubishi Electr. Corp., Hyogo, Japan pp. 96-102
Lin, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Du, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA pp. 103-106
Brasen, VLSI Technol. Inc., San Jose, CA, USA pp. 107-110
Sakallah, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Mudge, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Olukotun, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 111-117
McGeer, Dept. of Comput. Sci., British Columbia Univ., Vancouver, BC, Canada pp. 124-129
Ishiura, Dept. of Inf. Sci., Kyoto Univ., Japan
Deguchi, Dept. of Inf. Sci., Kyoto Univ., Japan
Yajima, Dept. of Inf. Sci., Kyoto Univ., Japan pp. 130-135
Casotto, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Newton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 136-141
van der Wolf, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
Sloof, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
Bingley, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
Dewilde, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands pp. 142-145
Bingley, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
van der Wolf, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands pp. 146-149
Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan pp. 150-155
Liu, Silicon Graphics Inc., Mountain View, CA, USA pp. 156-161
Grant, Dept. of Electr. Eng., Edinburgh Univ., UK
Denver, Dept. of Electr. Eng., Edinburgh Univ., UK pp. 162-167
Ly, Audesyn Inc., Edmonton, Alta., Canada
Elwood, Audesyn Inc., Edmonton, Alta., Canada
Girczyc, Audesyn Inc., Edmonton, Alta., Canada pp. 168-173
McNall, GE Corp. R&D, Schenectady, NY, USA
Casavant, GE Corp. R&D, Schenectady, NY, USA pp. 174-179
Wang, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Wong, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA pp. 180-186
Sutanthavibul, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA pp. 187-192
Wang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 193-199
Spreitzer, Xerox Palo Alto Res. Center, CA, USA pp. 200-206
Vemuri, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA pp. 207-212
Ghosh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 213-219
Keutzer, AT&T Bell Lab., Murray Hill, NJ, USA pp. 228-234
Agrawal, AT&T Bell Lab., Murray Hill, NJ, USA
Cheng, AT&T Bell Lab., Murray Hill, NJ, USA pp. 235-240
Domic, Digital Equipment Corp., Hudson, MA, USA pp. 241-245
Carlson, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Rutenbar, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 253-259
Tonkin, Adelaide Univ., SA, Australia pp. 260-265
Barnes, Cadence Design Syst. Inc., San Jose, CA, USA pp. 266-271
Jabri, Syst. Eng. & Design Autom. Lab., Sydney Univ., NSW, Australia pp. 272-277
Fiduk, MCC, Austin, TX, USA pp. 278-283
Sato, Fujitsu Ltd., Kawasaki, Japan
Yasue, Fujitsu Ltd., Kawasaki, Japan pp. 284-289
Malik, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 290-296
Cheng, AT&T Bell Lab., Murray Hill, NJ, USA
Agrawal, AT&T Bell Lab., Murray Hill, NJ, USA pp. 302-305
Cai, IMEC Lab., Leuven, Belgium
Note, IMEC Lab., Leuven, Belgium
Six, IMEC Lab., Leuven, Belgium
de Man, IMEC Lab., Leuven, Belgium pp. 306-311
Hill, AT&T Bell Lab., Murray Hill, NJ, USA
Shugard, AT&T Bell Lab., Murray Hill, NJ, USA pp. 312-316
HiIl, AT&T Bell Lab., Murray Hill, NJ, USA pp. 317-320
Okubo, NTT LSI Lab., Kanagawa, Japan
Wada, NTT LSI Lab., Kanagawa, Japan pp. 321-326
Wey, Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
Ding, Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA pp. 327-332
Forsythe, Nat. Semicond. Corp., Santa Clara, CA, USA
Agarwal, Nat. Semicond. Corp., Santa Clara, CA, USA
Yeh, Nat. Semicond. Corp., Santa Clara, CA, USA
Aronowitz, Nat. Semicond. Corp., Santa Clara, CA, USA
Gadepally, Nat. Semicond. Corp., Santa Clara, CA, USA pp. 333-337
Chen, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Muroga, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA pp. 339-344
Miura, Hitachi Ltd., Tokyo, Japan
Shimizu, Hitachi Ltd., Tokyo, Japan pp. 345-348
Lin, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Marek-Sadowska, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Kuh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 349-352
Chan, Comput. Eng.., California Univ., Santa Cruz, CA, USA pp. 353-356
Singh, California Univ., Berkeley, CA, USA pp. 357-360
Fishburn, AT&T Bell Lab., Murray Hill, NJ, USA pp. 361-364
Abouzeid, Inst. Nat. Polytech. de Grenoble/CSI, France
Sakouti, Inst. Nat. Polytech. de Grenoble/CSI, France
Saucier, Inst. Nat. Polytech. de Grenoble/CSI, France pp. 365-368
Onozawa, NTT LSI Lab., Kanagawa, Japan pp. 369-374
Marple, Philips Res. Lab., Eindhoven, Netherlands pp. 375-381
Lo, AT&T Bell Lab., Murray Hill, NJ, USA pp. 382-387
Hung, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA
Wen, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA
Gallivan, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA
Saleih, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA pp. 394-399
Yang, Center for Supercomput. Res. & Dev., Illinois Univ., Urbana, IL, USA pp. 400-405
McCormick, Res. Lab. of Electron., MIT, Cambridge, MA, USA
Allen, Res. Lab. of Electron., MIT, Cambridge, MA, USA pp. 406-412
Adamiak, Quantic Lab. Inc., Winnipeg, Man., Canada
Allen, Quantic Lab. Inc., Winnipeg, Man., Canada
Poltz, Quantic Lab. Inc., Winnipeg, Man., Canada
Rebizant, Quantic Lab. Inc., Winnipeg, Man., Canada
Wexler, Quantic Lab. Inc., Winnipeg, Man., Canada pp. 413-418
Bower, AT&T Bell Lab., Allentown, PA, USA
Seaquist, AT&T Bell Lab., Allentown, PA, USA pp. 419-424
Soukup, Code Farms Inc., Richmond, Ont., Canada pp. 425-430
Chung, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
Kim, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA pp. 431-436
Feghhi, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
Marefat, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
Kashyap, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA pp. 437-443
Potasman, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA pp. 444-449
Camposano, IBM Res. Div., Yorktown Heights, NY, USA pp. 450-455
Singh, Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA
Chen, Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA pp. 462-467
Just, Siemens AG, Munich, Germany pp. 468-473
Yung-Ching Hsieh, Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsin-Chu, Taiwan pp. 474-479
Maurer, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
Wang, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA pp. 480-484
Wang, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
Maurer, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA pp. 491-496
Chu-Yi Huang, Dept. of Comput. Sci., Tsing Hua Univ., Hsin-Chu, Taiwan
Yen-Shen Chen, Dept. of Comput. Sci., Tsing Hua Univ., Hsin-Chu, Taiwan
Yan-Long Lin, Dept. of Comput. Sci., Tsing Hua Univ., Hsin-Chu, Taiwan
Yu-Chin Hsu, Dept. of Comput. Sci., Tsing Hua Univ., Hsin-Chu, Taiwan pp. 499-504
Woo, AT&T Bell Lab., Murray Hill, NJ, USA pp. 505-510
Kucukcakar, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Parker, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA pp. 511-516
Bryant, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 517-521
Park, Mentor Graphics Corp., Beaverton, OR, USA pp. 522-528
Ito, Fujitsu Ltd., Kawasaki, Japan pp. 529-534
Niermann, Illinois Univ., Urbana, IL, USA pp. 535-540
Breternitz, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Shen, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 542-548
Sarma, Texas Instrum. Ltd., Bedford, UK
Dooley, Texas Instrum. Ltd., Bedford, UK
Newman, Texas Instrum. Ltd., Bedford, UK pp. 549-554
Edmond, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Gupta, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Siewiorek, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Brennan, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 555-560
Choudhury, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 561-566
Greene, Actel Corp., Sunnyvale, CA, USA pp. 567-572
Jackson, Electron. Res. Lab., California Univ., Berkeley, CA, USA
Srinivasan, Electron. Res. Lab., California Univ., Berkeley, CA, USA
Kuh, Electron. Res. Lab., California Univ., Berkeley, CA, USA pp. 573-579
Ghosh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 580-586
Ward, Robertshaw Controls Co., Richmond, VA, USA pp. 587-593
Kunda, Illinois Univ., Urbana, IL, USA
Narain, Illinois Univ., Urbana, IL, USA pp. 594-599
Ashar, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 601-606
Dey, Dept. of Comput. Sci., Duke Univ., Durham, NC, USA pp. 607-612
Francis, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
Rose, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
Chung, Dept. of Electr. Eng., Toronto Univ., Ont., Canada pp. 613-619
Murgai, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Nishizaki, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Shenoy, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Brayton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 620-625
Schiele, Siemens AG, Munich, Germany
Kruger, Siemens AG, Munich, Germany
Just, Siemens AG, Munich, Germany
Kirsch, Siemens AG, Munich, Germany pp. 626-631
Hojati, Cadence Design Syst. Inc., San Jose, CA, USA pp. 632-637
Cai, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Wong, Dept. of Comput. Sci., Texas Univ., Austin, TX, USA pp. 638-641
Edahiro, NEC Corp., Kawasaki, Japan pp. 642-645
Sato, Dept. of Inf. Eng., Takushoku Univ., Tokyo, Japan pp. 646-649
Brouwer, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA
Banerjee, Center for Reliable & High Performance Comput., Illinois Univ., Urbana, IL, USA pp. 650-653
Chakradhar, Dept. of Comput. Sci., Rutgers Univ., Piscataway, NJ, USA pp. 654-659
Lee, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Ha, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA pp. 660-666
Giraldi, Rutgers Univ., Piscataway, NJ, USA
Bushnell, Rutgers Univ., Piscataway, NJ, USA pp. 667-672
Butler, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Mercer, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA pp. 673-678
Whitcomb, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Newton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 680-685
Data, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Birmingham, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 686-691
Wolf, Dept. of Electr. Eng., Princeton Univ., NJ, USA pp. 692-697
Gidwani, Dept. of Comput. Sci., Western Michigan Univ., Kalamazoo, MI, USA
Sherwani, Dept. of Comput. Sci., Western Michigan Univ., Kalamazoo, MI, USA pp. 698-703
Katsadas, Dept. of Electr. Eng., Rochester Univ., NY, USA
Kinnen, Dept. of Electr. Eng., Rochester Univ., NY, USA pp. 704-708
Cong, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA pp. 709-715
Tyh-Song Hwang, Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
Chung Len Lee, Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
Wen Zen Shen, Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
Ching Ping Wu, Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan pp. 716-719
Ramakrishnan, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
Kinney, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA pp. 720-723
Upadhyaya, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
Thodiyil, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA pp. 724-727
Mao, Dept. of Electr. & Comput. Eng., Colorado Univ., Colorado Springs, CO, USA
Ciletti, Dept. of Electr. & Comput. Eng., Colorado Univ., Colorado Springs, CO, USA pp. 728-731
Kuo, Inst. of Electr. & Comput. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Wang, Inst. of Electr. & Comput. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Lee, Inst. of Electr. & Comput. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan pp. 732-735
Chakravarty, Dept. of Comput. Sci., State Univ. of New York, Buffalo, NY, USA pp. 736-739
Savoj, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Brayton, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 297-301 Usage of this product signifies your acceptance of the Terms of Use.
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