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27th ACM/IEEE Design Automation Conference (DAC '90)
Orlando, FL, USA
June 24-June 28
ISBN: 0-89791-363-9
| ASCII Text | x | ||
| Wang, "Pad placement and ring routing for custom chip layout," Design Automation Conference, pp. 193-199, 27th ACM/IEEE Design Automation Conference (DAC '90), 1990. | |||
| BibTex | x | ||
| @article{ 10.1109/DAC.1990.114853, author = { Wang}, title = {Pad placement and ring routing for custom chip layout}, journal ={Design Automation Conference}, volume = {0}, year = {1990}, isbn = {0-89791-363-9}, pages = {193-199}, doi = {http://doi.ieeecomputersociety.org/10.1109/DAC.1990.114853}, publisher = {IEEE Computer Society}, address = {Los Alamitos, CA, USA}, } | |||
| RefWorks Procite/RefMan/Endnote | x | ||
| TY - CONF JO - Design Automation Conference TI - Pad placement and ring routing for custom chip layout SN - 0-89791-363-9 SP193 EP199 A1 - Wang, PY - 1990 KW - pad ring dimension KW - ring routing KW - custom chip layout KW - chip core KW - I/O pads KW - pad placement routing KW - linear assignment KW - optimum position KW - chip area KW - wire length KW - channel-routing algorithm KW - ring configuration KW - rectangular ring-shaped area KW - interconnect layers KW - BEAR Layout System VL - 0 JA - Design Automation Conference ER - | |||
An optimum scheme is presented for interconnecting the chip core and the I/O pads in the final stage of physical design. The pad placement routing, based on linear assignment, determines the dimension of the pad ring and selects the optimum position for each pad with the objective of minimizing the chip area and the total wire length. The router is based on a channel-routing algorithm which incorporates additional features to address the special needs of the ring configuration. It attempts to achieve 100% routing completion in a rectangular ring-shaped area with two interconnect layers. The complete package has been implemented as part of the BEAR Layout System for custom chip design.
Index Terms:
pad ring dimension, ring routing, custom chip layout, chip core, I/O pads, pad placement routing, linear assignment, optimum position, chip area, wire length, channel-routing algorithm, ring configuration, rectangular ring-shaped area, interconnect layers, BEAR Layout System
Citation:
Wang, "Pad placement and ring routing for custom chip layout," dac, pp.193-199, 27th ACM/IEEE Design Automation Conference (DAC '90), 1990
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