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  • 25th ACM/IEEE, Design Automation Conference (DAC '88)
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25th ACM/IEEE, Design Automation Conference (DAC '88)
Anaheim, CA, USA
June 12-June 15
ISBN: 0-8186-0864-1
Table of Contents
Papers
Kim, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Tront, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Ha, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 9-15
Gebotys, Dept. of Electr. Eng., Waterloo Univ., Ont., Canada
Elmasry, Dept. of Electr. Eng., Waterloo Univ., Ont., Canada
pp. 16-21
Wehn, Inst. fuer Halbleitertech., Tech. Hochschule Darmstadt, West Germany
Glesner, Inst. fuer Halbleitertech., Tech. Hochschule Darmstadt, West Germany
Caesar, Inst. fuer Halbleitertech., Tech. Hochschule Darmstadt, West Germany
Mann, Inst. fuer Halbleitertech., Tech. Hochschule Darmstadt, West Germany
Roth, Inst. fuer Halbleitertech., Tech. Hochschule Darmstadt, West Germany
pp. 22-27
Loughzail, Dept. d'Inf. et de Recherche Operationnelle, Montreal Univ., Que., Canada
Cote, Dept. d'Inf. et de Recherche Operationnelle, Montreal Univ., Que., Canada
Aboulhamid, Dept. d'Inf. et de Recherche Operationnelle, Montreal Univ., Que., Canada
Cerny, Dept. d'Inf. et de Recherche Operationnelle, Montreal Univ., Que., Canada
pp. 28-33
Acosta, Microelectron. Comput. Technol. Corp., Austin, TX, USA
Alexandre, Microelectron. Comput. Technol. Corp., Austin, TX, USA
Inken, Microelectron. Comput. Technol. Corp., Austin, TX, USA
Read, Microelectron. Comput. Technol. Corp., Austin, TX, USA
pp. 34-39
Coelho, Vantage Anal. Syst., Inc., Fremont, CA, USA
pp. 40-47
Augustin, Comput. Syst. Lab., Stanford Univ., CA, USA
Gennart, Comput. Syst. Lab., Stanford Univ., CA, USA
Huh, Comput. Syst. Lab., Stanford Univ., CA, USA
Luckham, Comput. Syst. Lab., Stanford Univ., CA, USA
Stanculescu, Comput. Syst. Lab., Stanford Univ., CA, USA
pp. 48-53
Chen, Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
Bushnell, Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
pp. 54-59
Zimmerman, FB Inf., Kaiserslautern Univ., West Germany
pp. 60-65
Wimer, Dept. of Electr. Eng., Technion, Israel Inst. of Technol., Israel
pp. 66-71
Hodges, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 82-83
Glover, Dept. of Electr. & Comput. Eng., Austin Univ., TX, USA
Mercer, Dept. of Electr. & Comput. Eng., Austin Univ., TX, USA
pp. 90-95
Cheng, AT&T Eng. Res. Center, Princeton, NJ, USA
pp. 96-101
Baer, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
Liem, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
McMurchie, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
Nottrott, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
Snyder, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
Winder, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
pp. 102-107
Drongowski, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA
Bammi, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA
Ramaswamy, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA
Iyengar, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA
Wang, Dept. of Comput. Eng. & Sci., Case Western Reserve Univ., Cleveland, OH, USA
pp. 108-114
Odawara, Dept. of Precision Eng., Tokyo Univ., Japan
Tomita, Dept. of Precision Eng., Tokyo Univ., Japan
Hattori, Dept. of Precision Eng., Tokyo Univ., Japan
Okuzawa, Dept. of Precision Eng., Tokyo Univ., Japan
Hirata, Dept. of Precision Eng., Tokyo Univ., Japan
pp. 115-120
Kumar, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Sastry, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 121-127
Zargham, Dept. of Comput. Sci., Southern Illinois Univ., Carbondale, IL, USA
pp. 128-133
Carlson, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Rutenbar, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
pp. 134-140
Li, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 142-147
Cherry, Symbolics Cambridge Res. Center, MA, USA
pp. 148-153
Wallace, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Sequin, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 154-159
Bailey, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
Snyder, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
pp. 160-165
Soule, Center for Integrated Syst., Stanford Univ., CA, USA
Blank, Center for Integrated Syst., Stanford Univ., CA, USA
pp. 166-171
Lewis, Dept. of Electr. Eng., Toronto Univ., Ont., Canada
pp. 172-177
Heyns, Silvar-Lisco, Leuven, Belgium
Nieuwenhove, Silvar-Lisco, Leuven, Belgium
pp. 178-182
Cai, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 183-188
Rose, Comput. Syst. Lab., Stanford Univ., CA, USA
pp. 189-195
Stavridou, Dept. of Comput. Sci., Manchester Univ., UK
Barringer, Dept. of Comput. Sci., Manchester Univ., UK
Edwards, Dept. of Comput. Sci., Manchester Univ., UK
pp. 197-204
Madre, Bull Res. Center, Louveciennes, France
Billon, Bull Res. Center, Louveciennes, France
pp. 205-210
Narendran, Gen. Electr. Co., Schenectady, NY, USA
pp. 211-217
Beece, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 218-224
Saitoh, Fujitsu Ltd., Kawasaki, Japan
Iwata, Fujitsu Ltd., Kawasaki, Japan
Nakamura, Fujitsu Ltd., Kawasaki, Japan
Kakegawa, Fujitsu Ltd., Kawasaki, Japan
Masuda, Fujitsu Ltd., Kawasaki, Japan
Hamamura, Fujitsu Ltd., Kawasaki, Japan
Hirose, Fujitsu Ltd., Kawasaki, Japan
Kawato, Fujitsu Ltd., Kawasaki, Japan
pp. 225-230
Kazama, Hitachi Ltd., Kanagawa, Japan
Knoshita, Hitachi Ltd., Kanagawa, Japan
pp. 231-236
Barth, Xerox PARC Comput. Sci. Lab., Palo Alto, CA, USA
Serlet, Xerox PARC Comput. Sci. Lab., Palo Alto, CA, USA
pp. 237-242
Barth, Xerox PARC Comput. Sci. Lab., Palo Alto, CA, USA
Serlet, Xerox PARC Comput. Sci. Lab., Palo Alto, CA, USA
Sindhu, Xerox PARC Comput. Sci. Lab., Palo Alto, CA, USA
pp. 243-249
Barth, Xerox PARC Comput. Sci. Lab., Palo Alto, CA, USA
Monier, Xerox PARC Comput. Sci. Lab., Palo Alto, CA, USA
Serlet, Xerox PARC Comput. Sci. Lab., Palo Alto, CA, USA
pp. 250-255
Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Parng, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 257-262
Yang, Harris Corp., Melbourne, FL, USA
pp. 263-268
Gedye, Div. of Comput. Sci., California Univ., Berkeley, CA, USA
Katz, Div. of Comput. Sci., California Univ., Berkeley, CA, USA
pp. 269-274
Chou, MCC, Austin, TX, USA
Kim, MCC, Austin, TX, USA
pp. 275-281
Chang, AT&T Bell Lab., Murray Hill, NJ, USA
Chen, AT&T Bell Lab., Murray Hill, NJ, USA
Subramaniam, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 282-287
Saab, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Yang, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Hajj, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 288-293
Burch, Texas Instrum Inc., Dallas, TX, USA
Najm, Texas Instrum Inc., Dallas, TX, USA
Yang, Texas Instrum Inc., Dallas, TX, USA
Hocevar, Texas Instrum Inc., Dallas, TX, USA
pp. 294-299
Gura, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
Abraham, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 300-305
Lam, Yale Univ., New Haven, CT, USA
Delosme, Yale Univ., New Haven, CT, USA
pp. 306-311
Mallela, AT&T Bell Lab., Murray Hill, NJ, USA
Grover, AT&T Bell Lab., Murray Hill, NJ, USA
pp. 312-317
Borriello, Dept. of Comput. Sci., Washington Univ., Seattle, WA, USA
pp. 477-482
de Micheli, Comput. Syst. Lab., Stanford Univ., CA, USA
Ku, Comput. Syst. Lab., Stanford Univ., CA, USA
pp. 483-488
Camposano, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 489-494
Beatty, Carnegie-Mellon Univ., Pittsburgh, PA, USA
Bryant, Carnegie-Mellon Univ., Pittsburgh, PA, USA
pp. 495-500
Choi, Stanford Univ., CA, USA
Hwang, Stanford Univ., CA, USA
Blank, Stanford Univ., CA, USA
pp. 501-505
Adler, Silicon Compiler Syst., Liberty Corner, NJ, USA
pp. 506-511
Takashima, Toshiba Corp., Kawasaki, Japan
Ikeuchi, Toshiba Corp., Kawasaki, Japan
pp. 512-516
Papaspyridis, Dept. of Electr. Eng., Imperial Coll., London, UK
pp. 523-527
Blackburn, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Thomas, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Koenig, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
pp. 529-535
Pangrle, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 536-541
Jain, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
Parker, Dept. of Electr. Eng.-Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 542-547
Razouk, Dept. of Inf. & Comput. Sci., California Univ., Irvine, CA, USA
pp. 548-553
Kuo, Inst. of Inf. Sci., Acad. Sinica, China
Chern, Inst. of Inf. Sci., Acad. Sinica, China
Shih, Inst. of Inf. Sci., Acad. Sinica, China
pp. 554-559
Cai, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 560-565
Yao, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Yamada, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Liu, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
pp. 566-572
Xiong, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Kuh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 573-578
Chao, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Gray, Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 579-582
Hill, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abuelyamen, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Huang, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Shen, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 583-586
Cirit, Silicon Compiler Syst., Liberty Corner, NJ, USA
pp. 587-590
Mao, Dept. of Electr. Eng., Colarado Univ., Colorado Springs, CO, USA
Ciletti, Dept. of Electr. Eng., Colarado Univ., Colorado Springs, CO, USA
pp. 591-596
Gaede, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Mercer, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Butler, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 597-600
Harel, Tektronix Inc., Beaverton, OR, USA
Krishnamurthy, Tektronix Inc., Beaverton, OR, USA
pp. 601-604
Lin, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Ho, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 605-608
Kuo, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
Fuchs, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 609-612
Heydemann, Eur. Silicon Structures, Sevres, France
Plaignaud, Eur. Silicon Structures, Sevres, France
Dure, Eur. Silicon Structures, Sevres, France
pp. 617-621
Ly, Dept. of Electr. Eng., Alberta Univ., Edmonton, Alta., Canada
Girczyc, Dept. of Electr. Eng., Alberta Univ., Edmonton, Alta., Canada
pp. 628-633
Chang, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 634-637
Jabri, Sch. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 638-641
Ogawa, Hitachi Ltd., Tokyo, Japan
Terai, Hitachi Ltd., Tokyo, Japan
Kozawa, Hitachi Ltd., Tokyo, Japan
pp. 645
Hartley, Gen. Electr. Res. & Dev. Center, Schenectady, NY, USA
Corbett, Gen. Electr. Res. & Dev. Center, Schenectady, NY, USA
pp. 646-649
Hou, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
Owens, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
Irwin, Dept. of Comput. Sci., Pennsylvania State Univ., University Park, PA, USA
pp. 650-653
Bergstraesser, Siemens AG, Munich, West Germany
Gessner, Siemens AG, Munich, West Germany
Hafner, Siemens AG, Munich, West Germany
Wallstab, Siemens AG, Munich, West Germany
pp. 654-657
Chakraverti, Renssalaer Polytech. Inst., Troy, NY, USA
pp. 658-662
Cong, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
pp. 663-666
Lunow, Lawrence Livermore Nat. Lab., CA, USA
pp. 667-671
Arnold, Lawrence Livermore Nat. Lab., California Univ., CA, USA
Scott, Lawrence Livermore Nat. Lab., California Univ., CA, USA
pp. 672-676
Cheng, Bellcore, Morristown, NJ, USA
Deutsch, Bellcore, Morristown, NJ, USA
pp. 677-680
Bhandari, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Hirsch, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Slewiorek, Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
pp. 681-685
Duba, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
Roy, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
Abraham, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 686-691
Gai, Politecnico di Torino, Italy
Montessoro, Politecnico di Torino, Italy
pp. 692-697
Motohara, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
pp. 698-703
Savir, IBM Corp., Poughkeepsie, NY, USA
pp. 704-707
Lathrop, Artificial Intelligence Lab., MIT, Cambrdige, MA, USA
Hall, Artificial Intelligence Lab., MIT, Cambrdige, MA, USA
pp. 708-711
Hansen, MIPS Comput. Syst. Inc., Sunnyvale, CA, USA
pp. 712-715
Takamine, Hitachi Ltd., Tokyo, Japan
Miyamoto, Hitachi Ltd., Tokyo, Japan
Nagashima, Hitachi Ltd., Tokyo, Japan
pp. 716-719
Yen, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Ghanta, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Du, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 720-723
Sherman, Digital Equipment Corp., Maynard, MA, USA
pp. 724-727
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