- CC
- CVPR
- 2005
- 2005 IEEE Computer Society Conference on Computer Vision and Pattern Recognition (CVPR'05) - Volume 2
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2005 IEEE Computer Society Conference on Computer Vision and Pattern Recognition (CVPR'05) - Volume 2 San Diego, California June 20-June 26 ISBN: 0-7695-2372-2 Table of Contents
 | Introduction |
 | Session 5.1: Tracking |
 | Session 5.2: Image Processing and Modeling |
Hong Chen, University of California at Los Angeles pp. 74-81
 | Poster Session 4 |
Eric Royer, LASMEA, UMR6602 CNRS and Blaise Pascal University
Michel Dhome, LASMEA, UMR6602 CNRS and Blaise Pascal University pp. 114-121
Gustavo Carneiro, University of British Columbia and University of California at San Diego pp. 163-168
Qiang Sun, University of Illinois at Urbana-Champaign pp. 177-183
Yuan Qi, Massachusetts Institute of Technology pp. 191-196
Dong Xu, University of Science and Technology of China
Xiaoou Tang, Chinese University of Hong Kong and Microsoft Research Asia pp. 197-202
Dong Xu, University of Science and Technology of China and Microsoft Research Asia pp. 203-208
Lei Zhang, State University of New York at Stony Brook
Sen Wang, State University of New York at Stony Brook pp. 209-216
Georg Langs, Graz University of Technology and Vienna University of Technology pp. 310-315
Wei Zhang, State University of New York at Stony Brook
Bing Yu, State University of New York at Stony Brook pp. 323-330
Jian Liang, University of Maryland at College Park pp. 338-345
 | Session 6.1: Stereo |
Yin Li, Microsoft Research Asia pp. 399-406
 | Session 6.2: Medical Imaging |
 | Session 7.1: Faces |
Zijian Xu, University of California at Los Angeles
Hong Chen, University of California at Los Angeles pp. 470-477
Wei Liu, Chinese University of Hong Kong
Xiaoou Tang, Chinese University of Hong Kong and Microsoft Research Asia pp. 478-484
 | Session 7.2: Motion Segmentation and Tracking |
 | Poster Session 5 |
Xi Chen, Nanyang Technological University
Tat-Jen Cham, Nanyang Technological University and Singapore-MIT Alliance pp. 560-567
Ian Fasel, University of California at San Diego pp. 568-573
Ying Zhu, Siemens Corporate Research, Inc. pp. 574-581
Luc Van Gool, Katholieke Universiteit Leuven and Swiss Federal Institute of Technology pp. 611-618
Tianli Yu, University of Illinois at Urbana-Champaign pp. 655-662
Hui Ji, University of Maryland at College Park pp. 663-669
Peng Li, Nanyang Technological University pp. 670-675
Hon Pong Ho, Hong Kong University of Science and Technology
Huafeng Liu, Hong Kong University of Science and Technology and Zhejiang University pp. 690-697
Yuli Gao, University of North Carolina at Charlotte pp. 704-710
Yan Li, Carnegie Mellon University pp. 711-718
Gerald M. Rubin, Howard Hughes Medical Institute and University of California at Berkeley pp. 755-760
Pascal Fua, École Polytechnique Fédérale de Lausanne pp. 775-781
Lior Wolf, Massachusetts Institute of Technology pp. 801-806
Jingyu Yan, University of North Carolina at Chapel Hill pp. 815-821
 | Session 8.1: Learning |
Dong Xu, University of Science and Technology of China pp. 830-837
 | Session 8.2: 3D Reconstruction |
E. Prados, University of California at Los Angeles pp. 870-877
 | Poster Session 6 |
Yichen Wei, Hong Kong University of Science and Technology
Long Quan, Hong Kong University of Science and Technology pp. 902-909
Kuk-Jin Yoon, Korea Advanced Institute of Science and Technology
In-So Kweon, Korea Advanced Institute of Science and Technology pp. 924-931
Wei Liu, Chinese University of Hong Kong
Xiaoou Tang, Chinese University of Hong Kong and Microsoft Research Asia pp. 961-966
Jilin Tu, University of Illinois at Urbana-Champaign
Ming Liu, University of Illinois at Urbana-Champaign
Tong Zhang, University of Illinois at Urbana-Champaign pp. 967-972
Jean Ponce, University of Illinois at Urbana-Champaign pp. 973-979
Lior Wolf, Massachusetts Institute of Technology pp. 994-1000
Kai Zhang, University of Science and Technology - Kowloon pp. 1001-1007
Xilin Chen, Harbin Institute of Technology and Chinese Academy of Sciences
Wen Gao, Harbin Institute of Technology and Chinese Academy of Sciences pp. 1037-1042
Jae Chul Kim, Electronics and Telecommunications Research Institute pp. 1075-1082
Hui Kong, Nanyang Technological University
Lei Wang, Nanyang Technological University pp. 1083-1088
Tony Chan, University of California at Los Angeles pp. 1164-1170
 | VPCVPR |
Yan Ke, Carnegie Mellon University pp. 1184
Yan Li, Carnegie Mellon University pp. 1188
Chris Pal, University of Massachusetts at Amherst pp. 1192
David Forsyth, University of California at Berkeley and University of Illinois at Urbana-Champaign pp. 1194
Kam-Lun Tang, Hong Kong University of Science and Technology pp. 1197
Yang Wang, State University of New York at Stony Brook
Lei Zhang, State University of New York at Stony Brook
Sen Wang, State University of New York at Stony Brook
Mohit Gupta, State University of New York at Stony Brook pp. 1200
Ning Xu, University of Illinois at Urbana-Champaign pp. 1201
Jingyu Yan, University of North Carolina at Chapel Hill pp. 1203
 | Demos |
G. Witt, Delphi Electronics & Safety pp. 1206-1207
Jia Li, Pennsylvania State University pp. 1208-1209
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