ISBN: 0-7803-8175-0

R. Lauwereins, IMEC, Leuven, Belgium

Peter Marwedel, University of Dortmund, Germany

Lars Wehmeyer, University of Dortmund, Germany

Manish Verma, University of Dortmund, Germany

Stefan Steinke, Kostal GmbH & Co KG, Lüdenscheid, Germany

Urs Helmig, University of Dortmund, Germany

Wolfgang Nebel, Oldenburg University and OFFIS

Ahmed A. Jerraya, TIMA Laboratory, Grenoble, France

Ning Fu, University of Kitakyushu, Japan

Shigetoshi Nakatake, University of Kitakyushu, Japan

Yasuhiro Takashima, University of Kitakyushu, Japan

Yoji Kajitani, University of Kitakyushu, Japan

Xuliang Zhang, SII EDA Techonologies Inc., Kitakyushu, Japan

Yoji Kajitani, The University of Kitakyushu, Japan

Jacob R. Minz, Georgia Institute of Technology, Atlanta, GA

Sung Kyu Lim, Georgia Institute of Technology, Atlanta, GA

Xiaoping Tang, Cadence Design Systems, San Jose, CA

Martin D.F. Wong, University of Illinois, Urbana, IL

Chang-Tzu Lin, Feng Chia University, Taichung, Taiwan

De-Sheng Chen, Feng Chia University, Taichung, Taiwan

Yi-Wen Wang, Feng Chia University, Taichung, Taiwan

Jian Wang, Fudan University, China P.R.

Jun Tao, Fudan University, China P.R.

Xuan Zeng, Fudan University, China P.R.

Charles Chiang, Synopsys Inc., Mountain View, CA

Dian Zhou, University of Texas at Dallas

Ewout Martens, Katholieke Universiteit Leuven, Belgium

Georges Gielen, Katholieke Universiteit Leuven, Belgium

Payam Heydari, University of California, Irvine

Rasit Onur Topaloglu, University of California at San Diego

Alex Orailoglu, University of California at San Diego

Deming Chen, University of California, Los Angeles

Jason Cong, University of California, Los Angeles

Jumpei Uchida, Waseda University, Japan

Nozomu Togawa, The University of Kitakyushu, Japan; Waseda University, Japan

Masao Yanagisawa, Waseda University, Japan

Tatsuo Ohtsuki, Waseda University, Japan

Nobuhiro Doi, Waseda University, Japan

Takashi Horiyama, Kyoto University, Japan

Masaki Nakanishi, Nara Institute of Science and Technology, Japan

Shinji Kimura, Waseda University, Japan

Hashem Hashemi Najaf-Abadi, Sharif University of Technology, Tehran, Iran

Kai Yang, University of California, Santa Barbara

Kwang-Ting Cheng, University of California, Santa Barbara

Li-C. Wang, University of California, Santa Barbara

Xiang Lu, Texas A&M University, College Station, TX

Zhuo Li, Texas A&M University, College Station, TX

Wangqi Qiu, Texas A&M University, College Station, TX

D. M. H. Walker, Texas A&M University, College Station, TX

Weiping Shi, Texas A&M University, College Station, TX

Rei-Fu Huang, National Tsing Hua University, Hsinchu, Taiwan

Yan-Ting Lai, National Tsing Hua University, Hsinchu, Taiwan

Yung-Fa Chou, National Tsing Hua University, Hsinchu, Taiwan

Cheng-Wen Wu, National Tsing Hua University, Hsinchu, Taiwan

Sukanta Das, B. E. College (a Deemed University), Howrah, India

Debdas Dey, B. E. College (a Deemed University), Howrah, India

Subhayan Sen, B. E. College (a Deemed University), Howrah, India

Biplab K. Sikdar, B. E. College (a Deemed University), Howrah, India

P. Pal Chaudhuri, B. E. College (a Deemed University), Howrah, India

Andrew B. Kahng, University of CA, San Diego

Sherief Reda, University of CA, San Diego

Yukikazu Nakamoto, NEC Network Development Laboratories, Japan

Yan Wang, ASTRI, Hong Kong

Chi-Ying Tsui, The Hong Kong University of Science & Technology, Hong Kong

Roger S. Cheng, The Hong Kong University of Science & Technology, Hong Kong

Wai Ho Mow, The Hong Kong University of Science & Technology, Hong Kong

Alexander Maxiaguine, ETH Z?

Simon K?, ETH Z?

Samarjit Chakraborty, National University of Singapore

Lothar Thiele, ETH Z?

Mongkol Ekpanyapong, Georgia Institute of Technology

Sung Kyu Lim, Georgia Institute of Technology

Bernd Obermeier, Technical University of Munich

Frank M. Johannes, Technical University of Munich

Tetsuya Iizuka, University of Tokyo, Japan

Makoto Ikeda, University of Tokyo, Japan

Kunihiro Asada, University of Tokyo, Japan

Keoncheol Shin, Korea Advanced Institute of Science and Technology, KOREA

Taewhan Kim, Korea Advanced Institute of Science and Technology, KOREA

Di Wu, Texas A&M University, College Station, TX

Jiang Hu, Texas A&M University, College Station, TX

Rabi Mahapatra, Texas A&M University, College Station, TX

Min Zhao, Advanced Tools Group, Motorola Inc., Austin, TX

Zhao Li, University of Washington, Seattle, WA

Ravikanth Suravarapu, Oregon State University, Corvallis, OR

Roy Hartono, University of Washington, Seattle, WA

Sambuddha Bhattacharya, University of Washington, Seattle, WA

Karti Mayaram, Oregon State University, Corvallis, OR

Richard Shi, University of Washington, Seattle, WA

Min Chu, University of Washington, Seattle, WA

David J. Allstot, University of Washington, Seattle, WA

Jeffrey M. Huard, National Semiconductor Corporation, Federal Way, WA

Kim Y. Wong, National Semiconductor Corporation, Federal Way, WA

Praveen Ghanta, University of Arizona, USA

Zheng Li, University of Minnesota, USA

Jaijeet Roychowdhury, University of Minnesota, USA

Makram M. Mansour, Berkeley Design Automation, Santa Clara, CA

Mohammad M. Mansour, American University of Beirut, Beirut, Lebanon

Amit Mehrotra, University of Illinois at Urbana-Champaign

Ko Yoshikawa, NEC Corp., Fuchu, Tokyo

Keisuke Kanamaru, NEC Corp., Fuchu, Tokyo

Shigeto Inui, NEC Corp., Fuchu, Tokyo

Yasuhiko Hagihara, NEC Corp., Fuchu, Tokyo

Yuici Nakamura, NEC Corp., Fuchu, Tokyo

Takeshi Yoshimura, Waseda University, Japan

Hiroyuki Higuchi, Fujitsu Laboratories Ltd. / Kyushu University

Yusuke Matsunaga, Kyushu University

Noureddine Chabini, Royal Military College of Canada

Wayne Wolf, Princeton University, NJ, USA

Yen-Te Ho, National Tsing Hua University HsinChu, Taiwan

Ting-Ting Hwang, National Tsing Hua University HsinChu, Taiwan

Chang Woo Kang, University of Southern California, Los Angeles

Ali Iranli, University of Southern California, Los Angeles

Massoud Pedram, University of Southern California, Los Angeles

Ozgur Sinanoglu, University of California, San Diego

Alex Orailoglu, University of California, San Diego

Alexander Smith, University of Toronto, Canada

Andreas Veneris, University of Toronto, Canada

Anastasios Viglas, University of Toronto, Canada

Hafizur Rahaman, B. E. College (D. U.), India

Debesh K. Das, Jadavpur University, India

Bhargab B. Bhattacharya, Indian Statistical Institute, India

Terumine Hayashi, Mie University, Japan

Haruna Yoshioka, Mie University, Japan

Tsuyoshi Shinogi, Mie University, Japan

Hidehiko Kita, Mie University, Japan

Haruhiko Takase, Mie University, Japan

Seongmoon Wang, NEC Labs., America

Srimat T. Chakradhar, NEC Labs., America

Balakrishnan Kedarnath, University of Texas at Austin

C. Schulz-Key, University of Tuebingen, Germany

M. Winterholer, University of Tuebingen, Germany

T. Schweizer, University of Tuebingen, Germany

T. Kuhn, University of Tuebingen, Germany

W. Rosenstiel, University of Tuebingen, Germany

Robertas Damasevicius, Kaunas University of Technology, Lithuania

Vytautas Stuikys, Kaunas University of Technology, Lithuania

Yuichiro Miyaoka, Waseda University

Nozomu Togawa, The University of Kitakyushu

Masao Yanagisawa, Waseda University

Tatsuo Ohtsuki, Waseda University

Michiaki Muraoka, Semiconductor Technology Academic Research Center (STARC), Japan

Hiroaki Nishi, Semiconductor Technology Academic Research Center (STARC), Japan

Rafael K. Morizawa, Semiconductor Technology Academic Research Center (STARC), Japan

Hideaki Yokota, Semiconductor Technology Academic Research Center (STARC), Japan

Hideyuki Hamada, Semiconductor Technology Academic Research Center (STARC), Japan

Makoto Mori, University of California, San Diego

Hongyu Chen, University of California, San Diego

Bo Yao, University of California, San Diego

Chung-Kuan Cheng, University of California, San Diego

Shang-Wei Tu, National Chiao Tung University, Hsinchu, Taiwan

Jing-Yang Jou, National Chiao Tung University, Hsinchu, Taiwan

Yao-Wen Chang, National Taiwan University, Taipei, Taiwan

Zhong Wang, University of Toronto, Ontario, Canada

Jianwen Zhu, University of Toronto, Ontario, Canada

Hsu-Wei Huang, National Chiao Tung University, Taiwan

Cheng-Yeh Wang, National Chiao Tung University, Taiwan

Jing-Yang Jou, National Chiao Tung University, Taiwan

Woopyo Jeong, Purdue University, West Lafayette, IN

Bipul Chandra Paul, Purdue University, West Lafayette, IN

Kaushik Roy, Purdue University, West Lafayette, IN

Kyeong-Sik Min, Kookmin University, Seoul, Korea

Young-Hee Kim, Changwon National University, Changwon-Si, Korea

Daejeong Kim, Kookmin University, Seoul, Korea

Dong Myeong Kim, Kookmin University, Seoul, Korea

Jin-Hong Ahn, Hynix Semiconductor Inc., Ichon-Si, Korea

Jianhua Gan, Cirrus Logic, Inc., Austin, TX

Shouli Yan, The University of Texas at Austin

Jacob Abraham, The University of Texas at Austin

Chee-Kian Ong, University of California, Santa Barbara

Dongwoo Hong, University of California, Santa Barbara

Kwang-Ting (Tim) Cheng, University of California, Santa Barbara

Li-C Wang, University of California, Santa Barbara

Quoc-Hoang Duong, Information and Communication University, South Korea

Sang-Gug Lee, Information and Communication University, South Korea

Simon C. Li, National Yunlin University of Science and Technology

Vincent Chia-Chang Lin, Etrend Electronics, Inc.

Miroslav N. Velev, Carnegie Mellon University, Pittsburgh, PA

Miroslav N. Velev, Carnegie Mellon University, Pittsburgh, PA

Samar Abdi, UC Irvine, CA

Daniel Gajski, UC Irvine, CA

Hue-Min Lin, National Chiao Tung University, Taiwan

Chia-Chih Yen, National Chiao Tung University, Taiwan

Che-Hua Shih, National Chiao Tung University, Taiwan

Jing-Yang Jou, National Chiao Tung University, Taiwan

Rochit Rajsuman, Advantest America R&D Center, Santa Clara, CA

Yasumasa Nishimura, Renesas Technology Corp., Japan

Srimat Chakradhar, NEC Laboratories America, Princeton, NJ

Adi Merschon, GuideTech, Sunnyvale, CA

Dennis M. Petrich, Wavecrest Corporation, Eden Prairie, MN

Tetsuo Tada, Tokushima Bunri University, Japan

Kazutoshi Wakabayashi, NEC Corp., Japan

Chris Sullivan, Celoxica Ltd

Alex Wilson, Celoxica Ltd

Stephen Chappell, Celoxica Ltd

C. N. Sze, Texas A&M University, College Station, TX

Jiang Hu, Texas A&M University, College Station, TX

Charles J. Alpert, IBM Austin Research Lab, Austin, TX

Sampath Dechu, Micron Technology Inc., Boise, ID

Zion Cien Shen, Iowa State University, Ames, IA

Chris C. N. Chu, Iowa State University, Ames, IA

Jun Chen, University of California, Los Angeles

Lei He, University of California, Los Angeles

Kugan Vivekanandarajah, Nanyang Technological University, Singapore

Thambipillai Srikanthan, Nanyang Technological University, Singapore

Saurav Bhattacharyya, Nanyang Technological University, Singapore

Venkata Syam P. Rapaka, Mentor Graphics Corp., Wilsonville, OR

Emil Talpes, Carnegie Mellon University, Pittsburgh, PA

Diana Marculescu, Carnegie Mellon University, Pittsburgh, PA

G. Surendra, Indian Institute of Science, Bangalore, India

Subhasis Banerjee, Indian Institute of Science, Bangalore, India

S. K. Nandy, Indian Institute of Science, Bangalore, India

Subhasis Banerjee, Indian Institute of Science, Bangalore, India

G. Surendra, Indian Institute of Science, Bangalore, India

S. K. Nandy, Indian Institute of Science, Bangalore, India

Subhasis Bhattacharjee, University of Bristol, UK

Dhiraj K. Pradhan, University of Bristol, UK

Nuttorn Jangkrajarng, University of Washington, Seattle, WA

Sambuddha Bhattacharya, University of Washington, Seattle, WA

Roy Hartono, University of Washington, Seattle, WA

C-J. Richard Shi, University of Washington, Seattle, WA

Sambuddha Bhattacharya, University of Washington, Seattle, WA

Nuttorn Jangkrajarng, University of Washington, Seattle, WA

Roy Hartono, University of Washington, Seattle, WA

C-J. Richard Shi, University of Washington, Seattle, WA

Takashi Nojima, SII EDA Technologies Inc., Japan; The University of Kitakyushu, Japan

Xiaoke Zhu, SII EDA Technologies Inc., Japan

Yasuhiro Takashima, The University of Kitakyushu, Japan

Shigetoshi Nakatake, The University of Kitakyushu, Japan

Yoji Kajitani, The University of Kitakyushu, Japan

Batsayan Das, IIT Kharagpur, India

Dipankar Sarkar, IIT Kharagpur, India

Santanu Chattopadhyay, IIT Guwahati, India

G. Parthasarathy, University of California - Santa Barbara

M. K. Iyer, University of California - Santa Barbara

K.-T. Cheng, University of California - Santa Barbara

Li. C. Wang, University of California - Santa Barbara

Markus Wedler, University of Kaiserslautern, Germany

Dominik Stoffel, University of Kaiserslautern, Germany

Wolfgang Kunz, University of Kaiserslautern, Germany

Xiaoping Tang, Cadence Design Systems, San Jose, CA

Martin D. F. Wong, University of Illinois, Urbana, IL

Noriyuki Miura, Keio University, Japan

Naoki Kato, Hitachi, Ltd., Japan

Tadahiro Kuroda, Keio University, Japan

Chanseok Hwang, Univ. of Southern California, Los Angeles

Massoud Pedram, Univ. of Southern California, Los Angeles

Hongyu Chen, UCSD CSE Department

Chung-Kuan Cheng, UCSD CSE Department

Andrew B. Kahng, UCSD CSE Department

Makoto Mori, Fujitsu Limited

Qinke Wang, UCSD CSE Department

Yangdong (Steven) Deng, Carnegie Mellon University, Pittsburgh, PA

Wojciech Maly, Carnegie Mellon University, Pittsburgh, PA

Mao-Yin Wang, National Tsing Hua University, Taiwan

Chih-Pin Su, National Tsing Hua University, Taiwan

Chih-Tsun Huang, National Tsing Hua University, Taiwan

Cheng-Wen Wu, National Tsing Hua University, Taiwan

Frank Kienle, University of Kaiserslautern, Germany

Norbert Wehn, University of Kaiserslautern, Germany

Haobo Yu, University of California, Irvine, USA

Rainer D?mer, University of California, Irvine, USA

Daniel Gajski, University of California, Irvine, USA

Aimen Bouchhima, TIMA laboratory, Grenoble, France

Sungjoo Yoo, TIMA laboratory, Grenoble, France

Ahmed Jerraya, TIMA laboratory, Grenoble, France

Aviral Shrivastava, University of California, Irvine

Nikil Dutt, University of California, Irvine

Yoonseo Choi, Korea Advanced Institute of Science and Technology, Korea

Taewhan Kim, Korea Advanced Institute of Science and Technology, Korea

Mitiko Miura-Mattausch, Hiroshima University, Japan

Robert A. Mullen, Cadence Design Systems, Inc., San Jose, CA

Haifeng Qian, University of Minnesota, Minneapolis

Sachin S. Sapatnekar, University of Minnesota, Minneapolis

Jingjing Fu, Tsinghua University, Beijing, P.R. China

Zuying Luo, Tsinghua University, Beijing, P.R. China

Xianlong Hong, Tsinghua University, Beijing, P.R. China

Yici Cai, Tsinghua University, Beijing, P.R. China

Sheldon X.-D. Tan, University of California at Riverside, CA, USA

Zhu Pan, Tsinghua University, Beijing, P.R. China

Chieki Mizuta, Mathematical Systems Incorporated, Japan

Jiro Iwai, Mathematical Systems Incorporated, Japan

Ken Machida, Mathematical Systems Incorporated, Japan

Tetsuro Kage, Semiconductor Technology Academic Center, Japan

Hiroo Masuda, Semiconductor Technology Academic Center, Japan

Atsushi Kurokawa, Semiconductor Technology Academic Research Center

Nobuto Ono, SII EDA technologies Inc.

Tetsuro Kage, Semiconductor Technology Academic Research Center

Hiroo Masuda, Semiconductor Technology Academic Research Center

Yusuke Oike, University of Tokyo, Japan

Makoto Ikeda, University of Tokyo, Japan

Kunihiro Asada, University of Tokyo, Japan

Kun-Bin Lee, National Chiao Tung University, HsinChu, Taiwan

Nelson Yen-Chung Chang, National Chiao Tung University, HsinChu, Taiwan

Hao-Yun Chin, National Chiao Tung University, HsinChu, Taiwan

Hui-Cheng Hsu, National Chiao Tung University, HsinChu, Taiwan

Chein-Wei Jen, National Chiao Tung University, HsinChu, Taiwan

Y. Kuroda, Kanazawa University, Japan

J. Miyakoshi, Kanazawa University, Japan

M. Miyama, Kanazawa University, Japan

K. Imamura, Kanazawa University, Japan

H. Hashimoto, Kanazawa University, Japan

M. Yoshimoto, Kanazawa University, Japan

Kimihiro Nishio, Toyohashi University of Technology, Japan

Hiroo Yonezu, Toyohashi University of Technology, Japan

Shinya Sawa, Toyohashi University of Technology, Japan

Yuzo Furukawa, Toyohashi University of Technology, Japan

Takashi Morimoto, Hiroshima University, Japan

Yohmei Harada, Hiroshima University, Japan

Tetsushi Koide, Hiroshima University, Japan

Hans J?rgen Mattausch, Hiroshima University, Japan

Ramchan Woo, Korea Advanced Institute of Science and Technology, Korea

Sungdae Choi, Korea Advanced Institute of Science and Technology, Korea

Ju-Ho Sohn, Korea Advanced Institute of Science and Technology, Korea

Seong-Jun Song, Korea Advanced Institute of Science and Technology, Korea

Young-Don Bae, Korea Advanced Institute of Science and Technology, Korea

Hoi-Jun Yoo, Korea Advanced Institute of Science and Technology, Korea

Simon C. Li, National Yunlin University of Science and Technology

Vincent Chia-Chang Lin, Etrend Electronics, Inc.

Naoto Miyamoto, University of Tohoku, Japan

Leo Karnan, University of Tohoku, Japan

Kazuyuki Maruo, Advantest Laboratories Ltd., Japan

Koji Kotani, University of Tohoku, Japan

Tadahiro Ohmi, University of Tohoku, Japan

Dongsheng Ma, Louisiana State University, Baton Rouge, LA

Wing-Hung Ki, The Hong Kong University of Science & Technology, Hong Kong

Chi-Ying Tsui, The Hong Kong University of Science & Technology, Hong Kong

Yoshihiro Utsurogi, Osaka University, Japan

Masaki Haruoka, Osaka University, Japan; Furuno Electric Co., Ltd, Japan

Toshimasa Matsuoka, Osaka University, Japan

Kenji Taniguchi, Osaka University, Japan

Yuji Yano, Hiroshima University, Japan

Tetsushi Koide, Hiroshima University, Japan

Hans J?rgen Mattausch, Hiroshima University, Japan

Takahito Miyazaki, Kyoto University, Japan

Masanori Hashimoto, Kyoto University, Japan; Presto, JST

Hidetoshi Onodera, Kyoto University, Japan

Yi-Ming Wang, Chung-Cheng University, Taiwan

Jinn-Shyan Wang, Chung-Cheng University, Taiwan

Jun Ohta, Nara Institute of Science and Technology (NAIST)

Tetsuo Furumiya, NAIST, Japan

David C. Ng, NAIST, Japan

Akihiro Uehara, NAIST, Japan

Keiichiro Kagawa, NAIST, Japan

Takashi Tokuda, NAIST, Japan

Masahiro Nunoshita, NAIST, Japan

Tetsuya Sueyoshi, Hiroshima University, Japan

Hiroshi Uchida, Hiroshima University, Japan

Hans J?rgen Mattausch, Hiroshima University, Japan

Tetsushi Koide, Hiroshima University, Japan

Yosuke Mitani, Hiroshima City University, Japan

Tetsuo Hironaka, Hiroshima City University, Japan

Chun-Pong Yu, CUHK, Hong Kong

Chiu-Sing Choy, CUHK, Hong Kong

Hao Min, Fudan University, P.R. China

Cheong-Fat Chan, CUHK, Hong Kong

Kong-Pang Pun, CUHK, Hong Kong

Keiichiro Kagawa, Nara Institute of Science and Technology, Japan

Tomoaki Kawakami, Nara Institute of Science and Technology, Japan

Hiroaki Asazu, Nara Institute of Science and Technology, Japan

Takashi Ikeuchi, Nara Institute of Science and Technology, Japan

Akiko Fujiuchi, Nara Institute of Science and Technology, Japan

Jun Ohta, Nara Institute of Science and Technology, Japan

Masahiro Nunoshita, Nara Institute of Science and Technology, Japan

Takeshi Ohkawa, Tohoku University, Japan

Toshiyuki Nozawa, Tohoku University, Japan

Masanori Fujibayashi, Tohoku University, Japan

Naoto Miyamoto, Tohoku University, Japan

Karnan Leo, Tohoku University, Japan

Soichiro Kita, Tohoku University, Japan

Koji Kotani, Tohoku University, Japan

Tadahiro Ohmi, Tohoku University, Japan

T. Matsuda, Toyama Prefectural University, Japan

R. Minami, Toyama Prefectural University, Japan

A. Kanamori, Toyama Prefectural University, Japan

H. Iwata, Toyama Prefectural University, Japan

T. Ohzone, Okayama Prefectural University, Japan

S. Yamamoto, Shikino Hightech Co., Ltd., Japan

T. Ihara, Shikino Hightech Co., Ltd.

S. Nakajima, Shikino Hightech Co., Ltd.

Martin Yeung-Kei Chui, The Hong Kong University of Science and Technology, China

Wing-Hung Ki, The Hong Kong University of Science and Technology, China

Chi-Ying Tsui, The Hong Kong University of Science and Technology, China

Arunkumar Balasundaram, Georgia Institute of Technology, Atlanta, GA

Angelo Pereira, Georgia Institute of Technology, Atlanta, GA

Jun Cheol Park, Georgia Institute of Technology, Atlanta, GA

Vincent J. Mooney III, Georgia Institute of Technology, Atlanta, GA

Kae-Jiun Mo, National Tsing-Hua University, Taiwan

Shao-Sheng Yang, National Tsing-Hua University, Taiwan

Tsin-Yuan Chang, National Tsing-Hua University, Taiwan

J. Y. Yeom, University of Tokyo, Japan

T. Ishitsu, University of Tokyo, Japan

H. Takahashi, University of Tokyo, Japan

Ryozo Katoh, Sophia University, Japan

Shin-ya Kobayashi, Sophia University, Japan

Takao Waho, Sophia University, Japan

Yoshihiro Iida, Tokai University, Japan

Naohiko Shimizu, Tokai University, Japan

Ekachai Leelarasmee, Chulalongkorn University, Thailand

Kanitpong Pengwon, Chiang Mai University, Thailand

Jun Ohta, Nara Institute of Science and Technology (NAIST), Japan

Koichi Yamamoto, Nara Institute of Science and Technology (NAIST), Japan

Yu Oya, Nara Institute of Science and Technology (NAIST), Japan

Keiichiro Kagawa, Nara Institute of Science and Technology (NAIST), Japan

Takashi Tokuda, Nara Institute of Science and Technology (NAIST), Japan

Masahiro Nunoshita, Nara Institute of Science and Technology (NAIST), Japan

Hala A. Farouk, Arab Academy for Science, Egypt

Magdy Saeb, Arab Academy for Science, Egypt

Maher N. Mneimneh, University of Michigan

Karem A. Sakallah, University of Michigan

John Moondanos, Intel Corporation

Tsutomu Sasao, Kyushu Institute of Technology, Japan

Jon T. Butler, Naval Postgraduate School, Monterey, CA

Debatosh Debnath, Oakland University, Rochester, Michigan

Tsutomu Sasao, Kyushu Institute of Technology, Japan

Andr? Martinelli, Royal Institute of Technology, IMIT/KTH, Stockholm, Sweden

Ren? Krenz, Royal Institute of Technology, IMIT/KTH, Stockholm, Sweden

Elena Dubrova, Royal Institute of Technology, IMIT/KTH, Stockholm, Sweden

Katsunori Tanaka, Kyoto University, Japan

Yahiko Kambayashi, Kyoto University, Japan

Naoki Tokitsu, Internet ITS Consortium, Japan

Weiping Shi, Texas A&M University, College Station, TX

Zhuo Li, Texas A&M University, College Station, TX

Charles J. Alpert, IBM Austin Research Lab., Austin, TX

Song Chen, Tsinghua Univ., Beijing, China

Xianlong Hong, Tsinghua Univ., Beijing, China

Sheqin Dong, Tsinghua Univ., Beijing, China

Yuchun Ma, Tsinghua Univ., Beijing, China

Yici Cai, Tsinghua Univ., Beijing, China

Chung-Kuan Cheng, Univ. of California, San Diego USA

Jun Gu, Science & Technology University of Hong Kong

Yuchun Ma, Tsinghua University, Beijing, China

Xianlong Hong, Tsinghua University, Beijing, China

Sheqin Dong, Tsinghua University, Beijing, China

Song Chen, Tsinghua University, Beijing, China

Yici Cai, Tsinghua University, Beijing, China

Chung-Kuan Cheng, University of California, San Diego

Jun Gu, Science & Technology University of HongKong, Hong Kong

Yi-Hui Cheng, Synopsys Inc., Taipei, Taiwan

Yao-Wen Chang, National Taiwan University, Taipei, Taiwan

Robert Claris?, Universitat Polit?cnica de Catalunya

Jordi Cortadella, Universitat Polit?cnica de Catalunya

Tao Feng, UC-Santa Barbara

Li-C. Wang, UC-Santa Barbara

Kwang-Ting Cheng, UC-Santa Barbara

G?rschwin Fey, University of Bremen, Germany

Rolf Drechsler, University of Bremen, Germany

Tun Li, National University of Defense Technology, P. R. China

Yang Guo, National University of Defense Technology, P. R. China

SiKun Li, National University of Defense Technology, P. R. China

FuJiang Ao, National University of Defense Technology, P. R. China

GongJie Liu, National University of Defense Technology, P. R. China

Lap-Fai Leung, Hong Kong University of Science and Technology, China

Chi-Ying Tsui, Hong Kong University of Science and Technology, China

Wing-Hung Ki, Hong Kong University of Science and Technology, China

Dongkun Shin, Seoul National University, Korea

Jihong Kim, Seoul National University, Korea

Bita Gorji-Ara, University of California, Irvine

Pai Chou, University of California, Irvine

Nader Bagherzadeh, University of California, Irvine

Mehrdad Reshadi, University of California, Irvine

David Jensen, Rockwell Collins, Cedar Rapids, IA

Lap-Fai Leung, Hong Kong University of Science and Technology

Chi-Ying Tsui, Hong Kong University of Science and Technology

Wing-Hung Ki, Hong Kong University of Science and Technology

Lerong Cheng, University of Colorado at Boulder

Xiaoyu Song, Portland State University, OR

Guowu Yang, Portland State University, OR

Zhiwei Tang, Portland State University, OR

Zion Cien Shen, Iowa State University, Ames

Chris C. N. Chu, Iowa State University, Ames

Jingyu Xu, Tsinghua Univ., Beijing, P.R. China

Xianlong Hong, Tsinghua Univ., Beijing, P.R. China

Tong Jing, Tsinghua Univ., Beijing, P.R. China

Ling Zhang, Tsinghua Univ., Beijing, P.R. China

Jun Gu, Hong Kong Univ. of S & T, P. R. China

Jin-Tai Yan, Chung-Hua University, Hsinchu, Taiwan

Shun-Hua Lin, Chung-Hua University, Hsinchu, Taiwan

Qi Zhu, Tsinghua Univ., Beijing, P. R. China; UC Berkeley, CA

Hai Zhou, Northwestern Univ., Evanston, IL

Tong Jing, Tsinghua Univ., Beijing, P. R. China

Xianlong Hong, Tsinghua Univ., Beijing, P. R. China

Yang Yang, Tsinghua Univ., Beijing, P. R. China

Akira Tsuchiya, Kyoto University, Japan

Masanori Hashimoto, Kyoto University, Japan

Hidetoshi Onodera, Kyoto University, Japan

Tao Jiang, Motorola Inc., Austin, TX

Eric Pettus, Motorola Inc., Austin, TX

Daksh Lehther, Motorola Inc., Austin, TX

Liu Yang, Tsinghua Univ., Beijing, China

Xiaobo Guo, Tsinghua Univ., Beijing, China

Zeyi Wang, Tsinghua Univ., Beijing, China

Xiren Wang, Tsinghua Univ., Beijing, P.R. China

Deyan Liu, UCSC, Santa Cruz, CA

Wenjian Yu, Tsinghua Univ., Beijing, P.R. China

Zeyi Wang, Tsinghua Univ., Beijing, P.R. China

R. Y. Zhan, Illinois Institute of Technology, Chicago, IL

H. G. Feng, Illinois Institute of Technology, Chicago, IL

Q. Wu, Illinois Institute of Technology, Chicago, IL

X. K. Guan, Illinois Institute of Technology, Chicago, IL

G. Chen, Illinois Institute of Technology, Chicago, IL

H. L. Xie, Illinois Institute of Technology, Chicago, IL

A. Z. Wang, Illinois Institute of Technology, Chicago, IL

Jason H. Anderson, University of Toronto, Canada

Farid N. Najm, University of Toronto, Canada

Chi-Chou Kao, National Pingtung Institute of Commerce, Pingtung, Taiwan

Yen-Tai Lai, National Cheng Kung University, Tainan, Taiwan

Ping-Hung Yuh, National Taiwan University, Taipei, Taiwan

Chia-Lin Yang, National Taiwan University, Taipei, Taiwan

Yao-Wen Chang, National Taiwan University, Taipei, Taiwan

Hsin-Lung Chen

Yasunori Osana, Keio University, Japan

Tomonori Fukushima, Keio University, Japan

Hideharu Amano, Keio University, Japan

Young-Il Kim, Korea Advanced Institute of Science and Technology, Korea

Bong-Il Park, Dynalith Systems, Korea

Jae-Gon Lee, Korea Advanced Institute of Science and Technology, Korea

Chong-Min Kyung, Korea Advanced Institute of Science and Technology, Korea

Yoichi Yuyama, Kyoto University, Japan

Masao Aramoto, Kyoto University, Japan

Kazutoshi Kobayashi, The University of Tokyo, Japan

Hidetoshi Onodera, Kyoto University, Japan

Nozomu Togawa, The University of Kitakyushu, Japan; Waseda University, Japan

Koichi Tachikake, Waseda University, Japan

Yuichiro Miyaoka, Waseda University, Japan

Masao Yanagisawa, Waseda University, Japan

Tatsuo Ohtsuki, Waseda University, Japan

Ruibing Lu, Purdue University, West Lafayette, IN

Cheng-Kok Koh, Purdue University, West Lafayette, IN

Dongwan Shin, University of California, Irvine

Samar Abdi, University of California, Irvine

Daniel D. Gajski, University of California, Irvine

Hua Wang, Katholieke Universiteit Leuven, Belgium

Antonis Papanikolaou, IMEC, Leuven, Belgium

Miguel Miranda, IMEC, Leuven, Belgium

Francky Catthoor, Katholieke Universiteit Leuven, Belgium

Shuji Tsukiyama, Chuo University, Tokyo, Japan

Louis K. Scheffer, Cadence Design Systems, Inc., San Jose, California

Guoyong Shi, University of Washington, Seattle

C.-J. Richard Shi, University of Washington, Seattle

Janet Wang, University of Arizona

Prashant Saxena, STL Strategy CAD Lab, Intel Corporation

Omar Hafiz, University of Arizona

Xing Wang, University of Arizona

Hao Ji, UC Santa Cruz, CA

Qingjian Yu, Cadence Design Systems, Inc., San Jose, CA

Wayne Dai, UC Santa Cruz, CA

Clement Luk, Optimal corporation

Tsung-Hao Chen, University of Wisconsin-Madison

Charlie C.-P. Chen, National Taiwan University

Tudor Dumitras, Carnegie Mellon University, Pittsburgh, PA

Sam Kerner, Carnegie Mellon University, Pittsburgh, PA

Radu Marculescu, Carnegie Mellon University, Pittsburgh, PA

Young-Su Kwon, KAIST, Korea

Jae-Gon Lee, KAIST, Korea

Chong-Min Kyung, KAIST, Korea

Lukai Cai, University of California, Irvine

Haobo Yu, University of California, Irvine

Daniel Gajski, University of California, Irvine

Hojun Shim, Seoul National University, Korea

Naehyuck Chang, Seoul National University, Korea

Massoud Pedram, University of Southern California

Tom Vander Aa, K.U. Leuven/ESAT, Belgium

Murali Jayapala, K.U. Leuven/ESAT, Belgium

Francisco Barat, K.U. Leuven/ESAT, Belgium

Geert Deconinck, K.U. Leuven/ESAT, Belgium

Rudy Lauwereins, IMEC vzw, Belgium

Francky Catthoor, IMEC vzw, Belgium

Henk Corporaal, TU Eindhoven, Netherlands

Hidenori Sato, Kyushu Institute of Technology, Japan

Toshinori Sato, Kyushu Institute of Technology, Japan; PRESTO, Japan

Meeyoung Cha, Korea Advanced Institute of Science and Technology, KOREA

Chun-Gi Lyuh, Korea Advanced Institute of Science and Technology, KOREA

Taewhan Kim, Korea Advanced Institute of Science and Technology, KOREA

Markus Lorenz, University of Dortmund, Germany

Peter Marwedel, University of Dortmund, Germany

Thorsten Dr?ger, Technische Universit?t Dresden, Germany

Gerhard Fettweis, Technische Universit?t Dresden, Germany

Rainer Leupers, Aachen University of Technology, Germany

Yuki Kobayashi, Osaka University, Japan

Shinsuke Kobayashi, Osaka University, Japan

Koji Okuda, Osaka University, Japan

Keishi Sakanushi, Osaka University, Japan

Yoshinori Takeuchi, Osaka University, Japan

Masaharu Imai, Osaka University, Japan

Janet Meiling Wang, University of Arizona at Tucson

Omar Hafiz, University of Arizona at Tucson

Pinhong Chen, Cadence Corperation

Soroush Abbaspour, University of Southern California

Massoud Pedram, University of Southern California

Kanak Agarwal, University of Michigan

Dennis Sylvester, University of Michigan

David Blaauw, University of Michigan

R?diger Ebendt, University of Bremen, Germany

Wolfgang G?nther, Infineon Technologies, Germany

Rolf Drechsler, University of Bremen, Germany

Tsutomu Sasao, Kyushu Institute of Technology

Shinobu Nagayama, Kyushu Institute of Technology

R?diger Ebendt, University of Bremen, Germany

Wolfgang G?nther, Infineon Technologies, Germany

Rolf Drechsler, University of Bremen, Germany

Ruiming Li, The University of Texas at Dallas

Dian Zhou, The University of Texas at Dallas

Donglei Du, University of New Brunswick

Fadi A. Aloul, American University in Dubai

Arathi Ramani, University of Michigan, Ann Arbor

Igor L. Markov, University of Michigan, Ann Arbor

Karem A. Sakallah, University of Michigan, Ann Arbor

Fang Fang, University of Toronto, Canada

Jianwen Zhu, University of Toronto, Canada

Yiran Chen, Purdue University, West Lafayette, IN

Kaushik Roy, Purdue University, West Lafayette, IN

Cheng-Kok Koh, Purdue University, West Lafayette, IN

Fei Li, University of California, Los Angeles, CA

Lei He, University of California, Los Angeles, CA

Joseph M. Basile, Intel Corporation, Santa Clara, CA

Rakesh J. Patel, Intel Corporation, Santa Clara, CA

Hema Ramamurthy, Intel Corporation, Santa Clara, CA