• A
  • ASP-DAC
  • 1999
  • Asia and South Pacific Design Automation Conference 1999 (ASP-DAC'99)
Advanced Search 
Asia and South Pacific Design Automation Conference 1999 (ASP-DAC'99)
Wanchai, Hong Kong
January 18-January 21
ISBN: 0-7803-5012-X
Table of Contents
null
Session 1: Keynote Speech 1
null
Session 2A: Analog CAD
Huazhong Yang, Tsinghua Univ., Beijing, P.R. China
Rong Luo, Tsinghua Univ., Beijing, P.R. China
Hui Wang, Tsinghua Univ., Beijing, P.R. China
Runsheng Liu, Tsinghua Univ., Beijing, P.R. China
pp. 9
Session 2B: Physical Design 1 - Floorplanning
Jason Cong, University of California, Los Angeles
Tianming Kong, University of California, Los Angeles
Dongmin Xu, University of California, Los Angeles
Faming Liang, University of California, Los Angeles
Jun S. Liu, University of California, Los Angeles
Wing Hung Wong, University of California, Los Angeles
pp. 13
F. Y. Young, The University of Texas at Austin
D. F. Wong, The University of Texas at Austin
pp. 17
Xiaohai Wu, Tsinghua University, Beijing, China
Changge Qiao, Tsinghua University, Beijing, China
Xianlong Hong, Tsinghua University, Beijing, China
pp. 21
Session 2C: Design Contest
Ju-Hyung Kim, Sogang University, Seoul, Korea
Sung-Wook Hwang, Hyundai Electronics Industries Co., Ltd., Ichon, Korea
Seung-Hoon Lee, Sogang University, Seoul, Korea
Yong Jee, Sogang University, Seoul, Korea
pp. 25
Byeong-Lyeol Jeon, Sogang University, Seoul, Korea
Kang-Jin Lee, Hyundai Electronics Industries Co., Ltd., Ichon, Korea
Seung-Hoon Lee, Sogang University, Seoul, Korea
Sang-Won Yoon, Sogang University, Seoul, Korea
pp. 29
Byung-Soo Choi, Kwang-Ju Institute of Science and Technology(K-JIST)
Dong-Wook Lee, Kwang-Ju Institute of Science and Technology(K-JIST)
Dong-Ik Lee, Kwang-Ju Institute of Science and Technology(K-JIST)
pp. 33
Shin'ichi Wakabayashi, Hiroshima University, Japan
Tetsushi Koide, Hiroshima University, Japan
Naoyoshi Toshine, Hiroshima University, Japan
Mutsuaki Goto, Hiroshima University, Japan
Yoshikatsu Nakayama, Hiroshima University, Japan
Koichi Hatta, Hiroshima University, Japan
pp. 37
Li Jiang, Tokyo Institute of Technology, Tokyo
Dongju Li, Tokyo Institute of Technology, Tokyo
Shintaro Haba, Tokyo Institute of Technology, Tokyo
Chawalit Honsawek, Tokyo Institute of Technology, Tokyo
Hiroaki Kunieda, Tokyo Institute of Technology, Tokyo
pp. 41
Jin-Kug Lee, Sogang University, Seoul, Korea
Dong-Young Chang, Samsung Electronics Co., Ltd., Yongin, Korea
Geun-Soon Kang, Samsung Electronics Co., Ltd., Yongin, Korea
Seung-Hoon Lee, Sogang University, Seoul, Korea
pp. 45
Tae Hun Kim, KAIST, Korea
Jeongsik Yang, KAIST, Korea
Kyoo Hyun Lim, KAIST, Korea
Jin Wook Kim, KAIST, Korea
Jeong Eun Lee, KAIST, Korea
Hyoung Sik Nam, KAIST, Korea
Young Gon Kim, KAIST, Korea
Jeong Pyo Kim, KAIST, Korea
Sang Lin Byun, KAIST, Korea
Bae Sung Kwon, KAIST, Korea
Beomsup Kim, KAIST, Korea
pp. 49
Session 3A: Circuit Simulation 1
Yao-Lin Jiang, Xi'an Jiaotong University, P. R. China
Omar Wing, The Chinese University of Hong Kong, P. R. China
pp. 61
M. M. Gourary, IPPM, Russian Academy of Sciences, Moscow, Russia
S. G. Rusakov, IPPM, Russian Academy of Sciences, Moscow, Russia
S. L. Ulyanov, IPPM, Russian Academy of Sciences, Moscow, Russia
M. M. Zharov, IPPM, Russian Academy of Sciences, Moscow, Russia
K. K. Gullapalli, Motorola, Austin, Texas
B. J. Mulvaney, Motorola, Austin, Texas
pp. 65
Session 3B: Physical Design 2 - Partitioning
Jong-Sheng Cherng, National Taiwan Univ., Taipei
Sao-Jie Chen, National Taiwan Univ., Taipei
Chia-Chun Tsai, National Taiwan Univ., Taipei
Jan-Ming Ho, Academia Sinica, Taipei, Taiwan
pp. 69
Shiuann-Shiuh Lin, National Tsing Hua University, HsinChu, Taiwan
Wen-Hsin Chen, National Tsing Hua University, HsinChu, Taiwan
Wen-Wei Lin, National Tsing Hua University, HsinChu, Taiwan
TingTing Hwang, National Tsing Hua University, HsinChu, Taiwan
pp. 77
Jan-Yang Chang, Chung Yuan Christian University
Yu-Chen Liu, Chung Yuan Christian University
Ting-Chi Wang, Chung Yuan Christian University
pp. 81
Session 3C: EDA Roadmap
null
Session 4A: Circuit Simulation 2
Masayuki Takahashi, Sony Corporation Semiconductor Company, Japan
Kimihiro Ogawa, Sony Corporation Semiconductor Company, Japan
Kenneth S. Kundert, Cadence Design Systems, San Jose, CA
pp. 85
Zheng Hui, Tsinghua University, Beijing, P R. China
Zhang Wenjun, Tsinghua University, Beijing, P R. China
Tian Lilin, Tsinghua University, Beijing, P R. China
Yang Zhilian, Tsinghua University, Beijing, P R. China
pp. 89
Session 4B: Physical Design 3 - Interconnection
Jason Cong, University of California, Los Angeles
David Zhigang Pan, University of California, Los Angeles
pp. 97
Zhou Feng, Fudan University, Shanghai, China
Huang Zhijun, Fudan University, Shanghai, China
Tong Jiarong, Fudan University, Shanghai, China
Tang Pushan, Fudan University, Shanghai, China
pp. 101
Shihliang Ou, University of Southern California, Los Angeles
Massoud Pedram, University of Southern California, Los Angeles
pp. 105
Massoud Pedram, University of Southern California, Los Angeles
Chi-Ying Tsui, HK University of Science and Technology, Kowloon, Hong Kong
Qing Wu, University of Southern California, Los Angeles
pp. 109
Session 5A: Keynote Speech 2
null
Session 6A: Circuit 1 - Low-power/High-speed
Shin-ichiro Mutoh, NTT Integrated Information & Energy System Laboratories, Japan
Satoshi Shigematsu, NTT Integrated Information & Energy System Laboratories, Japan
Yoshinori Gotoh, NTT Integrated Information & Energy System Laboratories, Japan
Shinsuke Konaka, NTT Integrated Information & Energy System Laboratories, Japan
pp. 113
Kenneth Y. Yun, University of California, San Diego
Ayoob E. Dooply, University of California, San Diego
pp. 121
Tomoyuki Yoda, Tokyo Institute of Technology, Japan
Atsushi Takahashi, Tokyo Institute of Technology, Japan
Yoji Kajitani, Tokyo Institute of Technology, Japan
pp. 125
Session 6B: Physical Design 4 - Analog, Noise
Dongsheng Wang, University of California at San Diego
Ping Zhang, University of California at San Diego
Chung-Kuan Cheng, University of California at San Diego
Arunabha Sen, University of California at San Diego
pp. 129
Shuenn-Shi Chen, National Taiwan University, Taipei
Jong-Jang Chen, National Taiwan University, Taipei
Sao-Jie Chen, National Taiwan University, Taipei
Chia-Chun Tsai, National Taipei University of Technology, Taipei
pp. 133
Tong Xiao, University of California, Santa Barbara
Malgorzata Marek-Sadowska, University of California, Santa Barbara
pp. 137
Wai-chee Wong, The Hone Kong University of Science and Technology
Philip C. H. Chan, The Hone Kong University of Science and Technology
Wai-on Law, Motorola Semiconductors Hong Kong Ltd.
pp. 141
Session 6C: DA for Electronic Packages
null
Session 6D: Poster Session
Chingwei Yeh, Nat'l Chung-Cheng Univ., Taiwan
Chin-Chao Chang, Nat'l Chung-Cheng Univ., Taiwan
Jinn-Shyan Wang, Nat'l Chung-Cheng Univ., Taiwan
pp. 145
Maolin Tang, Edith Cowan University, Perth, Australia
Kamran Eshraghian, Edith Cowan University, Perth, Australia
Hon Nin Cheung, Edith Cowan University, Perth, Australia
pp. 149
Hoon Choi, Korea Advanced Institute of Science and Technology, Taejon, Korea
Hansoo Kim, Korea Advanced Institute of Science and Technology, Taejon, Korea
In-Cheol Park, Korea Advanced Institute of Science and Technology, Taejon, Korea
Seung Ho Hwang, Korea Advanced Institute of Science and Technology, Taejon, Korea
Chong-Min Kyung, Korea Advanced Institute of Science and Technology, Taejon, Korea
pp. 157
Hidehisa Nagano, NTT Communication Science Laboratories, Japan
Takayuki Suyama, NTT Communication Science Laboratories, Japan
Akira Nagoya, NTT Communication Science Laboratories, Japan
pp. 161
M. M. Gourary, IPPM, Russian Academy of Sciences, Moscow, Russia
S. G. Rusakov, IPPM, Russian Academy of Sciences, Moscow, Russia
S. L. Ulyanov, IPPM, Russian Academy of Sciences, Moscow, Russia
M. M. Zharov, IPPM, Russian Academy of Sciences, Moscow, Russia
B. J. Mulvaney, Motorola, Austin, Texas
pp. 165
Rung-Bin Lin, Yuan-Ze University, Taiwan, R.O.C.
Jinq-Chang Chen, Yuan-Ze University, Taiwan, R.O.C.
pp. 169
Rung-Bin Lin, Yuan-Ze University, Taiwan
Isaac Shuo-Hsiu Chou, Yuan-Ze University, Taiwan
Chi-Ming Tsai, Yuan-Ze University, Taiwan
pp. 173
Ren-Der Chen, National Cheng Kung University, Tainan, Taiwan
Jer Min Jou, National Cheng Kung University, Tainan, Taiwan
Yeu-Horng Shiau, National Cheng Kung University, Tainan, Taiwan
pp. 185
Jiann-Horng Lin, National Chiao Tung University, Hsinchu, Taiwan
Jing-Yang Jou, National Chiao Tung University, Hsinchu, Taiwan
Hui-Ru Jiang, National Chiao Tung University, Hsinchu, Taiwan
pp. 189
Ryoji Sakurai, IC Group, Sharp Corporation, Japan
Mizuki Takahashi, IC Group, Sharp Corporation, Japan
Andrew Kay, Sharp Laboratories of Europe, UK
Akihisa Yamada, IC Group, Sharp Corporation, Japan
Tetsuya Fujimoto, IC Group, Sharp Corporation, Japan
Takashi Kambe, IC Group, Sharp Corporation, Japan
pp. 193
Session 7A: Circuit 2 - Multmedia chip designs
P. W. Cheng, The Hong Kong University of Science and Technology
H. C. Huang, The Hong Kong University of Science and Technology
pp. 197
Jer Min Jou, National Cheng Kung University, Taiwan
Pei-Yin Chen, National Cheng Kung University, Taiwan
Yeu-Horng Shiau, National Cheng Kung University, Taiwan
Ming-Shiang Liang, National Cheng Kung University, Taiwan
pp. 205
Jer Min Jou, National Cheng Kung University, Taiwan
Shiann-Rong Kuang, National Cheng Kung University, Taiwan
Yeu-Horng Shiau, National Cheng Kung University, Taiwan
pp. 209
Session 7B: Physical Design 5 - Special Topics
Edoardo Charbon, Cadence Design Systems Inc., San Jose, California
Ilhami Torunoglu, Cadence Design Systems Inc., San Jose, California
pp. 213
Andrew B. Kahng, UCLA Department of Computer Science, Los Angeles, CA
Gabriel Robins, University of Virginia, Charlottesville, VA
Anish Singh, University of Virginia, Charlottesville, VA
Alexander Zelikovsky, UCLA Department of Computer Science, Los Angeles, CA
pp. 221
Ross Baldick, University of Texas, Austin
Andrew B. Kahng, UCLA CS Dept., Los Angeles
Andrew Kennings, Ryerson Polytechnic Univ., Toronto, ON
Igor L. Markov, UCLA Mathematics Dept., Los Angeles
pp. 225
Session 7C: Panel - System-on-a-chip
null
Session 8A: Timing analysis
Yun-Yin Lian, National Tsing Hua University, Taiwan
Youn-Long Lin, National Tsing Hua University, Taiwan
pp. 229
Chun-hong Chen, Zhejiang University of Technology, HangZhou
Chi-ying Tsui, The Hong Kong University of Science & Technology, Clear Water Bay
pp. 233
Payam Rabiei, University of Southern California, Los Angeles
Massoud Pedram, University of Southern California, Los Angeles
pp. 237
Session 8B: Physical Design 6 - Placement & Route
Andrew B. Kahng, UCLA CS Department, Los Angeles
Paul Tucker, UCSD CSE Department, La Jolla
Alex Zelikovsky, UCLA CS Department, Los Angeles
pp. 241
Haiyun Bao, Tsinghua Univ. Beijing, China
Xianlong Hong, Tsinghua Univ. Beijing, China
Yici Cai, Tsinghua Univ. Beijing, China
pp. 245
Gang Huang, Tsinghua University, Beijing, China
Xianlong Hong, Tsinghua University, Beijing, China
Changge Qiao, Tsinghua University, Beijing, China
Yici Cai, Tsinghua University, Beijing, China
pp. 249
Session 9: Keynote Speech 3
null
Session 10A: Circuit 3 - Analog & Mixed Circuit
Jack L. Chan, National Chiao Tung University, Taiwan; AMIC Technology, Taiwan
Steve S. Chung, National Chiao Tung University, Taiwan
pp. 261
Lee Sung-Dae, Ansan Technical College, Korea
Jang Myung-Jun, LG Semicon Device, Korea
Leex Won-Hyo, SungKyunKwan Univ., Korea
pp. 265
Won - Hyo Lee, Sungkyunkwan Univ., Korea
Jun - Dong Cho, Sungkyunkwan Univ., Korea
Sung - Dae Lee, Ansan Technical College, Korea
pp. 269
Jin-Kug Lee, Sogang University, Seoul, Korea
Dong-Young Chang, Samsung Electronics Co., Ltd., Yongin, Korea
Geun-Soon Kang, Samsung Electronics Co., Ltd., Yongin, Korea
Seung-Hoon Lee, Sogang University, Seoul, Korea
pp. 273
Session 10B: Testing 1
Chi-Feng Wu, National Tsing Hua University, Hsinchu, Taiwan
Cheng-Wen Wu, National Tsing Hua University, Hsinchu, Taiwan
pp. 279
Yinlei Yu, Fudan University, Shanghai, China
Jian Xu, Fudan University, Shanghai, China
Wei Kang Huang, Fudan University, Shanghai, China
Fabrizio Lombardi, Northeastern University, Boston, MA
pp. 283
Hafijur Rahaman, A. P. C. Roy Polytechnic, Calcutta, India
Debesh K. Das, Jadavpur University, Calcutta, India
Bhargab B. Bhattacharya, Indian Statistical Institute, Calcutta, India
pp. 287
Session 11A: Power Estimation/Low-power
Toshio Murayama, Sony Corporation Semiconductor Company, Japan
Kimihiro Ogawa, Sony Corporation Semiconductor Company, Japan
Haruhiko Yamaguchi, Sony Corporation Semiconductor Company, Japan
pp. 295
Yibin Ye, Purdue University, West Lafayette, IN
Kaushik Roy, Purdue University, West Lafayette, IN
Rolf Drechsler, Albert-Ludwigs-University, Germany
pp. 299
Session 11B: Testing 2 - Testing and formal Verification
Chun-Keung Lo, The Hong Kong University of Science and Technology
Philip C. H. Chan, The Hong Kong University of Science and Technology
pp. 307
Martin Keim, Albert-Ludwigs-University, Germany
Nicole Drechsler, Albert-Ludwigs-University, Germany
Bernd Becker, Albert-Ludwigs-University, Germany
pp. 315
Session 11C: Panel - VLSI Design Education
null
Session 12A: BDD
Wolfgang G?nther, Albert-Ludwigs-University, Germany
Rolg Drechsler, Albert-Ludwigs-University, Germany
pp. 323
Christoph Meinel, TI, Bahnhofstr., Germany; University of Trier, Germany
Klaus Schwettmann, University of Trier, Germany
Anna Slobodov?, TI, Bahnhofstr., Germany
pp. 327
Yukihiro Iguchi, Meiji University, Japan
Munehiro Matsuura, Kyushu Institute of Technology, Japan
Tsutomu Sasao, Kyushu Institute of Technology, Japan
Atsumu Iseno, Meiji University, Japan
pp. 331
Session 12B: Systems/HW SW co-design
Rainer Leupers, University of Dormund, Germany
Johann Elste, University of Dormund, Germany
Birger Landwehr, University of Dormund, Germany
pp. 339
Session 12C: Behavioral/FPGA
Debatosh Debnath, Kyushu Institute of Technology, Japan
Tsutomu Sasao, Kyushu Institute of Technology, Japan
pp. 359
Jinsong Bei, Tsinghua University, Beijing, P.R. China
Hongxing Li, Tsinghua University, Beijing, P.R. China
Jinian Bian, Tsinghua University, Beijing, P.R. China
Hongxi Xue, Tsinghua University, Beijing, P.R. China
Xianlong Hong, Tsinghua University, Beijing, P.R. China
pp. 363
Usage of this product signifies your acceptance of the Terms of Use.