ISBN: 0-8186-7542-X

K.P. Acken, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA

H.N. Kim, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA

M.J. Irwin, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA

R.M. Owens, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA

V.E. Taylor, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

J. Chen, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

T. Canfield, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

R. Stevens, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

Jeffrey D. Hirschberg, hirsch@cse.ucsc.edu

Richard Hughey, rph@cse.ucsc.edu

Kevin Karplus, karplus@cse.ucsc.edu

Don Speck, University of California, Santa Cruz, CA 95064

H. Lim, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA

C. Yim, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA

E.E. Swartzlander, Jr., Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA

J.-C. Bajard, Univ. de Provence, Marseille, France

L.-S. Didier, Univ. de Provence, Marseille, France

J.-M. Muller, Univ. de Provence, Marseille, France

J. Villalba, Dept. Comput. Archit., Malaga Univ., Spain

J.C. Arrabal, Dept. Comput. Archit., Malaga Univ., Spain

E.L. Zapata, Dept. Comput. Archit., Malaga Univ., Spain

E. Antelo, Dept. Comput. Archit., Malaga Univ., Spain

J.D. Bruguera, Dept. Comput. Archit., Malaga Univ., Spain

K.P. Acken, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA

M.J. Irwin, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA

R.M. Owens, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA

A.K. Garga, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA

L. Song, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

K.K. Parhi, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

Colin C.W. Hui

Tiong Jiu Ding

John V. McCanny

Roger F. Woods

David A. Parker, Department of Electrical Engineering University of Minnesota

Keshab K. Parhi, Department of Electrical Engineering University of Minnesota

Jan Peter Berns

Tobias G. Noll

H. Yeo, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA

Y.H. Hu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA

Jurgen Teich, Institute TIK ETH Zurich, Gloriastrasse 35 CH-8092 Zurich, Switzerland

Lothar Thiele, Institute TIK ETH Zurich, Gloriastrasse 35 CH-8092 Zurich, Switzerland

Li Zhang, Institute TIK ETH Zurich, Gloriastrasse 35 CH-8092 Zurich, Switzerland

Pascal Faudemay

Laurent Winckel

Hyuk-Jae Lee, Purdue University {hyuk,fortes}@ecn.purdue.edu

Jose A.B. Fortes, Purdue University {hyuk,fortes}@ecn.purdue.edu

M. Boo, Univ. Santiago de Compostela elmboo@usc.es

F. Arguello, Univ. Santiago de Compostela elmboo@usc.es

J.D. Bruguera, Univ. Santiago de Compostela elmboo@usc.es

E.L. Zapata, Univ. Santiago de Compostela elmboo@usc.es

Nicolas Hubart

S. Peng, Aizu Univ., Fukushima, Japan

S. Sedukhin, Aizu Univ., Fukushima, Japan

I. Sedukhin, Aizu Univ., Fukushima, Japan

M. Vishwanath, Comput. Sci. Lab., Xerox Palo Alto Res. Center, CA, USA

R.M. Owens, Comput. Sci. Lab., Xerox Palo Alto Res. Center, CA, USA

G. Even, Fachbereich Inf., Saarlandes Univ., Saarbrucken, Germany

A. Litman, Fachbereich Inf., Saarlandes Univ., Saarbrucken, Germany

Patrick Trane

M.I. Patel, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA

N. Ranganathan, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA

A. Wang, Electrical Engineering Dept. UCLA, Los Angeles, CA 90095-1594

K. Yao, Electrical Engineering Dept. UCLA, Los Angeles, CA 90095-1594

R.E. Hudson, Electrical Engineering Dept. UCLA, Los Angeles, CA 90095-1594

D. Korompis, Electrical Engineering Dept. UCLA, Los Angeles, CA 90095-1594

F. Lorenzelli, Electrical Engineering Dept. UCLA, Los Angeles, CA 90095-1594

S. Soli, House Ear Institute Los Angeles,CA 90057

S. Gao, House Ear Institute Los Angeles,CA 90057

David R. Surma, University of Notre Dame

Edwin Hsing-Mean Sha, University of Notre Dame

Daping Song, Centre de Recherche en Automatique de Nancy Universite de Nancy I, BP239, 54506 Vandoeuvre-les-Nancy cedex, France

Thierry Divoux, Centre de Recherche en Automatique de Nancy Universite de Nancy I, BP239, 54506 Vandoeuvre-les-Nancy cedex, France

Francis LePage, Centre de Recherche en Automatique de Nancy Universite de Nancy I, BP239, 54506 Vandoeuvre-les-Nancy cedex, France

K.M. Fant, Theseus Logic Inc., St. Paul, MN, USA

S.A. Brandt, Theseus Logic Inc., St. Paul, MN, USA

R.W. Hartenstein, Kaiserslautern Univ., Germany

J. Becker, Kaiserslautern Univ., Germany

M. Herz, Kaiserslautern Univ., Germany

R. Kress, Kaiserslautern Univ., Germany

U. Nageldinger, Kaiserslautern Univ., Germany

D.R. Smith, Dept. of Comput. Sci., State Univ. of New York, Stony Brook, NY, USA

B.K. Fawcett, Xilinx Inc., San Jose, CA, USA

J. Watson, Xilinx Inc., San Jose, CA, USA

Naren Narasimhan, University of Cincinnati

Vinoo Srinivasan, University of Cincinnati

Madhavi Vootukuru, University of Cincinnati

Jeff Walrath, University of Cincinnati

Sriram Govindarajan, University of Cincinnati

Ranga Vemuri, University of Cincinnati

Jeffrey Walrath

H.W. Van Dijk, Philips Components, Eindhoven, Netherlands

G.J. Hekstra, Philips Components, Eindhoven, Netherlands

E.F. Deprettere, Philips Components, Eindhoven, Netherlands

Jim Beck

Dan Siewiorek

P. Calland

A. Darte

Y. Robert

F. Vivien

S. S. Bhattacharyya, Semiconductor Research Laboratory, Hitachi America, Ltd. shuvra@halsrl.com

S. Sriram, DSP R&D Center, Texas Instruments Incorporated sriram@hc.ti.com

E. A. Lee, University of California at Berkeley eal@eecs.berkeley.edu, fax: (510)642-2739.

F. de Dinechin, IRISA, Rennes, France

S. Robert, IRISA, Rennes, France

P. Quinton

S. Rajopadhye

T. Risset

Edin Hodzic, HaL Computer Systems ehodzic@scu.edu

Weijia Shang, Santa Clara University wshang@scus19.scu.edu

Ph. Clauss

V. Loechner