• A
  • ADHES
  • 2000
  • Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Advanced Search 
Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Espoo, Finland
June 18-June 21
ISBN: 0-7803-6460-0
Table of Contents
C. Adler, Fraunhofer-Inst. fur Zuverlawssigkeit und Mikrointegration, Munich, Germany
pp. 20-23
P. Marjamaki, Lab. of Electron. Prod. Technol., Helsinki Univ. of Technol., Espoo, Finland
pp. 24-27
R.A. Pearson, Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA
pp. 35-40
R. Miessner, Forschungsschwerpunkt Technologien der Mikroperipherik, Tech. Univ. Berlin, Germany
pp. 46-51
R. Dudek, Fraunhofer-Inst. fur Zuverlassigkeit und Mikriintegration, Berlin, Germany
pp. 77-85
C.M.L. Wu, Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Kowloon, China
pp. 101-106
M. Lantzsch, Litton Kester Solder Europe, Gernlinden, Germany
pp. 168-173
J. Taweeplengsangsuke, Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA
pp. 174-181
M.D. Heuschkel, Fac. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
pp. 212-215
S.R. MacDavitt, T.J. Watson Sch. of Eng. & Appl. Sci., State Univ. of New York, Binghamton, NY, USA
pp. 221-224
J. Ge, Lab. of Electron. Production Technol., Helsinki Univ. of Technol., Espoo, Finland
pp. 248-252
Jianmin Qu, George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 253-252
R. Tuominen, Lab. of Electron. Production Technol., Helsinki Univ. of Technol., Espoo, Finland
pp. 269-273
K. Hanamura, Div. of Electr. Parts & Mater. Eng., Toshiba Chem. Corp., Kawaguchi, Japan
pp. 296-303
H. Kergel, VDI/VDE-Technologiezentrum Informationstechnik GmbH, Teltow, Germany
pp. 304-306
Usage of this product signifies your acceptance of the Terms of Use.