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Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98 (1998)
Binghamton, NY, USA
Sept. 30, 1998 to Sept. 30, 1998
ISBN: 0-7803-4934-2
TABLE OF CONTENTS
J. Liu , Swedish Inst. of Production Eng. Res., Molndal, Sweden
pp. 1-18
S. Gupta , Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA
pp. 38-43
D.C.C. Lam , Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
pp. 44-48
T. Shah , Lockheed Martin Fed. Syst., Manassas, VA, USA
pp. 49-54
Z. Qian , Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
pp. 62-67
P. McCluskey , CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
pp. 84-89
K. Puhakka , Lab. of Electron. Manuf., Helsinki Univ. of Technol., Espoo, Finland
pp. 96-100
V. Beyer , Semicond. Technol. & Microsyst. Lab., Tech. Univ. Dresden, Germany
pp. 112-115
A. Gladkov , Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 116-124
K. Persson , Swedish Inst. of Production Eng. Res., Molndal, Sweden
pp. 132-136
Y. Kishimoto , Toshiba Chem. Corp., Kawasaki, Japan
pp. 137-143
K. Eda , Device Eng. Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
pp. 144-151
K.-J. Wolter , Dept. of Electr. Eng., Tech. Univ. Dresden, Germany
pp. 152-155
T. Inada , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 156-159
J. Taweeplengsangsuke , Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA
pp. 160-167
D.J. Hayes , MicroFab Technol. Inc., Plano, TX, USA
pp. 168-173
A. Riso , Rossi Technol. Corp., Orangeburg, NY, USA
pp. 174-177
M. Norris , Speedline Technol. Fluids Dispensing Syst., Haverhill, MA, USA
pp. 178-183
C.P. Wong , Mater. Sci. & Eng. & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 184-192
S. Canumalla , Sonoscan Inc., Bensenville, IL, USA
pp. 193-201
V. Sidorov , Dept. of Electr. Eng., Israel Inst. of Technol., Haifa, Israel
pp. 202-205
N.H. Yeung , Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Hong Kong
pp. 206-210
C.M.L. Wu , Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Hong Kong
pp. 220-223
K.W. Oh , Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 224-228
B. Ma , Nat. Starch and Chem. Co., Bridgewater, NJ, USA
pp. 252-255
M.G. Firmstone , Div. of Adv. Products, Multicore Solders Ltd., Hemel Hempstead, UK
pp. 256-261
O. Figovsky , Eurotech Ltd., Haifa, Israel
pp. 266-269
Q.K. Tong , Nat. Starch and Chem. Co., Bridgewater, NJ, USA
pp. 272-277
H. Schaefer , Fraunhofer-Inst. fur Angewandte Materialforschung, Bremen, Germany
pp. 278-281
P. McCluskey , CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
pp. 282-286
R. Miessner , Fraunhofer-Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
pp. 299-304
P.C. Li , Dept. of Phys., State Univ. of New York, Binghamton, NY, USA
pp. 328-333
O. Suzuki , Div. of Res. & Dev., Namics Corp., Niigata, Japan
pp. 351-355
R. Gomatam , Dept. of Polymer Eng., Akron Univ., OH, USA
pp. 362-361
Z. Qian , Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
pp. 363-361
B. Chen , Dept. of Eng. Sci. & Mech., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 364-361
S. Guo , Dept. of Eng. Sci. & Mech., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 365-361
K. Persson , Dept. of Eng. Sci. & Mech., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 366
P.C. Li , Dept. of Eng. Sci. & Mech., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 367-368
pp. 369-370
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