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2010 IEEE Symposium on 3D User Interfaces
Waltham, MA
March 20-March 21
ISBN: 978-1-4244-6846-1
Table of Contents
Papers
Contents (PDF)
pp. iii-v
Takeo Igarashi, Dept. of Comput. Sci., Univ. of Tokyo, Tokyo, Japan
pp. x
Brian Williamson, Univ. of Central Florida, Orlando, FL, USA
Chadwick Wingrave, Univ. of Central Florida, Orlando, FL, USA
Joseph J LaViola, Univ. of Central Florida, Orlando, FL, USA
pp. 3-10
Ryan P McMahan, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
Alexander Joel D Alon, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
Shaimaa Lazem, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
Robert J Beaton, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
David Machaj, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
Michael Schaefer, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
Mara G Silva, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
Anamary Leal, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
Robert Hagan, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
Doug A Bowman, Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA, USA
pp. 11-14
Florent Berthaut, LaBRI, Univ. de Bordeaux, Bordeaux, France
Martin Hachet, LaBRI, INRIA, France
Myriam Desainte-Catherine, LaBRI, Univ. de Bordeaux, Bordeaux, France
pp. 15-18
Maud Marchal, INSA/INRIA Rennes, Rennes, France
Anatole Lecuyer, INRIA Rennes, Rennes, France
Gabriel Cirio, INRIA Rennes, Rennes, France
Laurent Bonnet, INRIA Rennes, Rennes, France
Mathieu Emily, Univ. Rennes 2, Rennes, France
pp. 19-26
Evan A Suma, Univ. of North Carolina at Charlotte, Charlotte, NC, USA
Samantha L Finkelstein, Univ. of North Carolina at Charlotte, Charlotte, NC, USA
Seth Clark, Univ. of North Carolina at Charlotte, Charlotte, NC, USA
Paula Goolkasian, Univ. of North Carolina at Charlotte, Charlotte, NC, USA
Larry F Hodges, Clemson Univ., Clemson, SC, USA
pp. 27-34
Kristopher J Blom, Univ. of Hamburg, Hamburg, Germany
Steffi Beckhaus, Univ. of Hamburg, Hamburg, Germany
pp. 35-38
Lei Liu, CWI, Amsterdam, Netherlands
Jean-Bernard Martens, Eindhoven Univ. of Technol., Eindhoven, Netherlands
Robert van Liere, CWI, Amsterdam, Netherlands
pp. 39-46
Kaushik Das, Univ. of Louisiana at Lafayette, Lafayette, LA, USA
Christoph W Borst, Univ. of Louisiana at Lafayette, Lafayette, LA, USA
pp. 47-50
Bob Menelas, LIMSI, CNRS, Orsay, France
Lorenzo Picinalli, LIMSI, CNRS, Orsay, France
Brian F G Katz, LIMSI, CNRS, Orsay, France
Patrick Bourdot, LIMSI, CNRS, Orsay, France
pp. 51-54
Ferran Argelaguet, MOVING Res. Group, Univ. Politec. de Catalunya, Barcelona, Spain
Andre Kunert, Virtual Reality Syst. Group, Bauhaus-Univ. Weimar, Weimar, Germany
Alexander Kulik, Virtual Reality Syst. Group, Bauhaus-Univ. Weimar, Weimar, Germany
Bernd Froehlich, Virtual Reality Syst. Group, Bauhaus-Univ. Weimar, Weimar, Germany
pp. 55-62
Michael R Marner, Univ. of South Australia, Adelaide, SA, Australia
Bruce H Thomas, Univ. of South Australia, Adelaide, SA, Australia
pp. 63-70
David Swapp, Dept. of Comput. Sci., Univ. Coll. London, London, UK
Julian Williams, Wizdish Ltd., UK
Anthony Steed, Dept. of Comput. Sci., Univ. Coll. London, London, UK
pp. 71-74
Yon Visell, McGill Univ., Montreal, QC, Canada
Severin Smith, McGill Univ., Montreal, QC, Canada
Alvin Law, McGill Univ., Montreal, QC, Canada
Rishi Rajalingham, McGill Univ., Montreal, QC, Canada
Jeremy R Cooperstock, McGill Univ., Montreal, QC, Canada
pp. 75-78
Dimitar Valkov, Visualization&Comput. Graphics (VisCG) Res. Group, Univ. of Munster, Munster, Germany
Frank Steinicke, Visualization&Comput. Graphics (VisCG) Res. Group, Univ. of Munster, Munster, Germany
Gerd Bruder, Visualization&Comput. Graphics (VisCG) Res. Group, Univ. of Munster, Munster, Germany
Klaus Hinrichs, Visualization&Comput. Graphics (VisCG) Res. Group, Univ. of Munster, Munster, Germany
pp. 79-82
Patrick Maier, Fachgebiet Augmented Reality (FAR), Tech. Univ. Munchen Fak. fur Inf., Garching, Germany
Marcus Tonnis, Fachgebiet Augmented Reality (FAR), Tech. Univ. Munchen Fak. fur Inf., Garching, Germany
Gudrun Klinker, Fachgebiet Augmented Reality (FAR), Tech. Univ. Munchen Fak. fur Inf., Garching, Germany
Alexander Raith, Chem. Dept., Tech. Univ. Munchen, Garching, Germany
Markus Drees, Chem. Dept., Tech. Univ. Munchen, Garching, Germany
Fritz Kuhn, Chem. Dept., Tech. Univ. Munchen, Garching, Germany
pp. 83-90
Giandomenico Caruso, Dept. of Mech. Eng., Politec. di Milano, Milan, Italy
Guido Maria Re, Dept. of Mech. Eng., Politec. di Milano, Milan, Italy
pp. 99-102
Ryo Fukazawa, Osaka Univ., Suita, Japan
Kazuki Takashima, Osaka Univ., Suita, Japan
Garth Shoemaker, Univ. of British Columbia, Vancouver, BC, Canada
Yoshifumi Kitamura, Osaka Univ., Suita, Japan
Yuichi Itoh, Osaka Univ., Suita, Japan
Fumio Kishino, Osaka Univ., Suita, Japan
pp. 103-110
Sven Kratz, Deutsche Telekom Labs., Tech. Univ. Berlin, Berlin, Germany
Michael Rohs, Deutsche Telekom Labs., Tech. Univ. Berlin, Berlin, Germany
pp. 111-114
Anthony Martinet, LIFL, Univ. of Lille, Lille, France
Gery Casiez, LIFL, Univ. of Lille, Lille, France
Laurent Grisoni, LIFL, Univ. of Lille, Lille, France
pp. 115-118
Posters (PDF)
pp. 119-120
Peter Brinkmann, City Coll. of New York, New York, NY, USA
Charles Gunn, Tech. Univ., Berlin, Germany
Steffen Weissmann, City Coll. of New York, New York, NY, USA
pp. 123-124
Gerd Bruder, Dept. of Comput. Sci., Univ. of Munster, Munster, Germany
Frank Steinicke, Dept. of Comput. Sci., Univ. of Munster, Munster, Germany
Dimitar Valkov, Dept. of Comput. Sci., Univ. of Munster, Munster, Germany
Klaus Hinrichs, Dept. of Comput. Sci., Univ. of Munster, Munster, Germany
pp. 125-126
Arindam Dey, Wearable Comput. Lab., Univ. of South Australia, Adelaide, SA, Australia
Andrew Cunningham, Wearable Comput. Lab., Univ. of South Australia, Adelaide, SA, Australia
Christian Sandor, Wearable Comput. Lab., Univ. of South Australia, Adelaide, SA, Australia
pp. 127-128
Luv Kohli, Univ. of North Carolina at Chapel Hill, Chapel Hill, NC, USA
pp. 129-130
Kota Arai, Dev. of Electron.&Inf. Eng., Toyohashi Univ. of Technol., Toyohashi, Japan
Michiteru Kitazaki, Res. Center for Future Vehicle, Toyohashi Univ. of Technol., Toyohashi, Japan
pp. 131-132
Andrew Miller, Interactive Syst.&User Experience Lab., Univ. of Central Florida, Orlando, FL, USA
Joseph J LaViola, Interactive Syst.&User Experience Lab., Univ. of Central Florida, Orlando, FL, USA
pp. 133-134
Sergio Rodriguez, Infotech Unit, Tecnalia, UK
Artzai Picon, Infotech Unit, Tecnalia, UK
Aritz Villodas, Infotech Unit, Tecnalia, UK
pp. 135-136
Leith K Y Chan, Dept. of Ind.&Manuf. Syst. Eng., Univ. of Hong Kong, Hong Kong, China
Henry Y K Lau, Dept. of Ind.&Manuf. Syst. Eng., Univ. of Hong Kong, Hong Kong, China
pp. 137-138
Nicholas Katzakis, Grad. Sch. of Inf., Kansai Univ., Takatsuki, Japan
Masahiro Hori, Fac. of Inf., Kansai Univ., Takatsuki, Japan
pp. 139-140
Takumi Ohshima, Meijo Univ., Nagoya, Japan
Takafumi Serizawa, Meijo Univ., Nagoya, Japan
Yasuyuki Yanagida, Meijo Univ., Nagoya, Japan
pp. 141-142
Victor Zappi, Adv. Robot. Lab., Ist. Italiano di Tecnol., Genoa, Italy
Andrea Brogni, Adv. Robot. Lab., Ist. Italiano di Tecnol., Genoa, Italy
Darwin Caldwell, Adv. Robot. Lab., Ist. Italiano di Tecnol., Genoa, Italy
pp. 143-144
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