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2013 IEEE Symposium on 3D User Interfaces (3DUI) (2008)
Reno, NE
Mar. 8, 2008 to Mar. 9, 2008
ISBN: 978-1-4244-2047-6
TABLE OF CONTENTS
Papers
pp. viii
pp. 1
pp. 1
pp. 1
Opinion (PDF)
pp. vi
A. Hill , Univ. of Illinois at Chicago, Chicago
A. Johnson , Univ. of Illinois at Chicago, Chicago
pp. 3-10
D. Vembar , Clemson Univ., Clemson
A.T. Duchowski , Clemson Univ., Clemson
S. Sadasivan , Clemson Univ., Clemson
A.K. Gramopadhye , Clemson Univ., Clemson
pp. 19-26
Christian Geiger , University of Applied Science Düsseldorf, Germany, geiger@fh-duesseldorf.de
Oliver Rattay , fleXilution GmbH, Köln, Germany, oliver.rattay@icido.com
pp. 27-34
R.T. Smith , Univ. of South Australia, Adelaide
B.H. Thomas , Univ. of South Australia, Adelaide
W. Piekarski , Univ. of South Australia, Adelaide
pp. 35-38
D.F. Keefe , Brown Univ., Providence
R.C. Zeleznik , Brown Univ., Providence
D.H. Laidlaw , Brown Univ., Providence
pp. 51-54
A. Pusch , i3D - INRIA Rhone-Alpes - LIG, St. Ismier
O. Martin , i3D - INRIA Rhone-Alpes - LIG, St. Ismier
S. Coquillart , i3D - INRIA Rhone-Alpes - LIG, St. Ismier
pp. 59-66
B. Horan , Deakin Univ., Geelong
Z. Najdovski , Deakin Univ., Geelong
S. Nahavandi , Deakin Univ., Geelong
pp. 67-74
J. Mora , Univ. of Ottawa, Ottawa
Won-Sook Lee , Univ. of Ottawa, Ottawa
pp. 75-81
J. Feasel , Univ. of North Carolina, Chapel Hill
M.C. Whitton , Univ. of North Carolina, Chapel Hill
J.D. Wendt , Univ. of North Carolina, Chapel Hill
pp. 97-104
Tech-note: 4Record (Abstract)
M. Doulis , Univ. of Appl. Sci. Northwestern Switzerland FHNW, Muttenz
M. Rietmann , Univ. of Appl. Sci. Northwestern Switzerland FHNW, Muttenz
J. Pfluger , Univ. of Appl. Sci. Northwestern Switzerland FHNW, Muttenz
pp. 105-108
W. Broll , Frauhofer FIT, Sankt Augustin
J. Herling , Fraunhofer FIT, Aachen
L. Blum , Fraunhofer FIT, Aachen
pp. 109-115
N. Ferey , Univ. Paris-Sud XI, Paris
G. Bouyer , Univ. Paris-Sud XI, Paris
C. Martin , Univ. Paris-Sud XI, Paris
P. Bourdot , Univ. Paris-Sud XI, Paris
pp. 125-132
A. Sherstyuk , Univ. of Hawaii, Honolulu
D. Vincent , Univ. of Hawaii, Honolulu
pp. 135-136
H. Touyama , Univ. of Tokyo, Tokyo
M. Hirose , Univ. of Tokyo, Tokyo
pp. 137-138
F. Bacim , PUCRS, Porto Alegre
A. Trombetta , PUCRS, Porto Alegre
R. Rieder , PUCRS, Porto Alegre
M. Pinho , PUCRS, Porto Alegre
pp. 143-144
D. McGee , Adapx, Inc, Seattle
X. Huang , Adapx, Inc, Seattle
P. Barthelmess , Adapx, Inc, Seattle
P. Cohen , Adapx, Inc, Seattle
pp. 145-146
F. Steinicke , Westfalische Wilhelms-Univ., Munster
G. Brudei , Westfalische Wilhelms-Univ., Munster
T. Ropinski , Westfalische Wilhelms-Univ., Munster
K. Hinrichs , Westfalische Wilhelms-Univ., Munster
pp. 147-148
K.J. Kruszyhski , Center for Math.&Comput. Sci., Amsterdam
R. van Liere , Center for Math.&Comput. Sci., Amsterdam
pp. 149-150
E.B. Pizzolato , Fed. Univ. of Sao Carlos, Sao Carlos
D.D. Duarte , Fed. Univ. of Sao Carlos, Sao Carlos
pp. 151-152
T. Suenaga , Nara Inst. of Sci.&Technol., Nara
Y. Tamai , Nara Inst. of Sci.&Technol., Nara
Y. Kurita , Nara Inst. of Sci.&Technol., Nara
Y. Matsumoto , Nara Inst. of Sci.&Technol., Nara
T. Ogasawara , Nara Inst. of Sci.&Technol., Nara
pp. 161-162
C. Geiger , Univ. of Appl. Sc. Dusseldorf, Dusseldorf
pp. 163-164
K. Uehira , Kanagawa Inst. of Technol., Kanagawa
M. Suzuki , Kanagawa Inst. of Technol., Kanagawa
Y. Kobayashi , Kanagawa Inst. of Technol., Kanagawa
pp. 165-166
A. Agrawal , Osaka Univ., Osaka
K. Kiyokawa , Osaka Univ., Osaka
H. Takemura , Osaka Univ., Osaka
pp. 169-170
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