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3D Digital Imaging and Modeling, International Conference on (2005)
Ottawa, Ontario, Canada
June 13, 2005 to June 16, 2005
ISBN: 0-7695-2327-7
TABLE OF CONTENTS
Introduction
Foreword (PDF)
pp. xii
pp. xiii
Invited Paper
Kenichi Kanatani , Okayama University
pp. 2-13
Oral Session: 3D Imaging 1
Qian Chen , Wakayama University
Toshikazu Wada , Wakayama University
pp. 15-21
Jean-Philippe Tardif , Université de Montréal
pp. 22-29
Oral Session: Modeling 1
D. Vandermeulen , Katholieke Universiteit Leuven
L. Van Gool , Katholieke Universiteit Leuven
P. Claes , Katholieke Universiteit Leuven
pp. 31-38
Patrick H?bert , Laval University
Philippe Lambert , Laval University
Jean-Nicolas Ouellet , Laval University
Dragan Tubic , Laval University
pp. 39-46
M. Fiocco , European Commission - Joint Research Centre
J. G. M. Gon?alves , European Commission - Joint Research Centre
V. Sequeira , European Commission - Joint Research Centre
pp. 47-54
Oral Session: Recognition
M. Brown , University of British Columbia
pp. 56-63
Daniel Huber , Carnegie Mellon University
Anuj Kapuria , Carnegie Mellon University
Martial Hebert , Carnegie Mellon University
pp. 64-71
Poster Session 1
Alexander Patterson , University of Pennsylvania
Xenophon Zabulis , Informatics and Telematics Institute Thessaloniki
pp. 81-88
Romain Dupont , Ecole Nationale des Ponts et Chaussees
Philippe Fuchs , E.N.S.M.P
pp. 89-94
Hamid-Reza Pakdel , University of Calgary
pp. 95-102
Byung-Gook Lee , Dongseo University
Joon Jae Lee , Dongseo University
Jaechil Yoo , Dongeui University
pp. 110-117
Ryo Yamane , Okayama University
Yuji Kamon , Okayama University
Takeshi Shakunaga , Okayama University
pp. 118-125
Lyubomir Zagorchev , Wright State University
Ardeshir Goshtasby , Wright State University
pp. 126-133
Etsuko Ueda , Nara Institute of Science and Technology
Tsukasa Ogasawara , Nara Institute of Science and Technology
pp. 134-141
Gordon Collins , University of Surrey
Adrian Hilton , University of Surrey
pp. 142-149
Jason Repko , University of North Carolina at Chapel Hill
Marc Pollefeys , University of North Carolina at Chapel Hill
pp. 150-157
Niloofar Gheissari , Swinburne University of Technology
Alireza Bab-Hadiashar , Swinburne University of Technology
pp. 158-163
Ryo Kurazume , Kyushu University
Tsutomu Hasegawa , Kyushu University
Kenji Hara , Kyushu University
pp. 164-171
Longzhuang Li , Texas A — M University
Baogang Wei , Zhejiang University
pp. 172-179
Tomasz Malisiewicz , Rensselaer Polytechnic Institute
Charles V. Stewart , Rensselaer Polytechnic Institute
Richard J. Radke , Rensselaer Polytechnic Institute
pp. 180-187
Helin Dutağaci , Boğazi?i University
Y? Yemez , Ko? University
pp. 188-195
Tomoya Terauchi , SANYO Electric Co., Ltd.
Yasuhiro Oue , SANYO Electric Co., Ltd.
Kouta Fujimura , SANYO Electric Co., Ltd.
pp. 196-203
Thomas P. Koninckx , Katholieke Universiteit Leuven
Kasper Claes , Katholieke Universiteit Leuven
pp. 212-219
Oral Session: Rendering and Appearance
Geert Willems , Katholieke Universiteit Leuven
Frank Verbiest , Katholieke Universiteit Leuven
Maarten Vergauwen , Katholieke Universiteit Leuven
Luc Van Gool , Katholieke Universiteit Leuven and Swiss Federal Institute of Technology
pp. 221-228
Kazunori Umeda , Chuo University
Guy Godin , National Research Council - Canada
Marc Rioux , National Research Council - Canada
pp. 229-236
Indra Geys , Katholieke Universiteit Leuven
Luc Van Gool , Katholieke Universiteit Leuven and Swiss Federal Institute of Technology
pp. 237-244
Alejandro Troccoli , Columbia University
pp. 245-252
Oral Session: Registration 1
Chen Chao , City University of New York
pp. 254-261
Marco Andreetto , University of Padova
Andrea Giorgi , University of Padova
Nicola Brusco , University of Padova
pp. 262-269
Ting Li , Chinese Academy of Sciences
pp. 270-276
Oral Session: Geometric Signal Processing
Gustavo Osorio , National University of Colombia
Flavio Prieto , National University of Colombia
pp. 278-284
Ranjith Unnikrishnan , Carnegie Mellon University
Nicolas Vandapel , Carnegie Mellon University
Jean-François Lalonde , Carnegie Mellon University
pp. 285-292
Gady Agam , Illinois Institute of Technology
Xiaojing Tang , Illinois Institute of Technology
pp. 293-300
Oral Session: 3D Imaging 2
Chris Boehnen , University of Notre Dame
Patrick Flynn , University of Notre Dame
pp. 310-317
Christian Frueh , University of California at Berkeley
Avideh Zakhor , University of California at Berkeley
pp. 318-325
Li Shen , Osaka University
Takashi Machida , Osaka University
Haruo Takemura , Osaka University
pp. 326-333
Oral Session: Human Modeling
Chang Shu , National Research Council of Canada
Richard Lepage , École de Technologie Supérieure de Montréal
Marc Rioux , National Research Council of Canada
pp. 335-342
Yu Zhang , National University of Singapore
Terence Sim , National University of Singapore
Chew Lim Tan , National University of Singapore
pp. 343-350
Oral Session: Camera Techniques
João Costeira , Instituto Superior Técnico
João Xavier , Instituto Superior Técnico
pp. 360-367
Oral Session: Registration 2
Yuichiro Hirota , University of Tokyo
Tomohito Masuda , University of Tokyo
Ko Nishino , Columbia University
pp. 369-376
Radim Šára , Czech Technical University
Ikuko Shimizu Okatani , Tokyo University of Agriculture and Technology
Akihiro Sugimoto , National Institute of Informatics - Japan
pp. 377-384
P. Claes , Katholieke Universiteit Leuven
D. Vandermeulen , Katholieke Universiteit Leuven
L. Van Gool , Katholieke Universiteit Leuven
P. Suetens , Katholieke Universiteit Leuven
pp. 385-392
Poster Session 2
Rashmi Sundareswara , University of Minnesota
pp. 394-401
Guillaume Lavoue , LIRIS - FRE 2672 CNRS
Florent Dupont , LIRIS - FRE 2672 CNRS
Atilla Baskurt , LIRIS - FRE 2672 CNRS
pp. 402-409
Anders Kaestner , Swiss Federal Institute of Technology Z?
Hannes Fluehler , Swiss Federal Institute of Technology Z?
pp. 410-415
Greg Slabaugh , Siemens Corporate Research
Viorel Mihalef , Rutgers University
Gozde Unal , Siemens Corporate Research
pp. 416-423
Jiahui Wang , Keio University
Hideo Saito , Keio University
Makoto Kimura , National Institute of Advance Industrial Science and Technology
Masaaki Mochimaru , National Institute of Advance Industrial Science and Technology
Takeo Kanade , National Institute of Advance Industrial Science and Technology
pp. 424-431
Xiaolan Li , Peking University
Hongbin Zha , Peking University
pp. 432-438
Adrien Theetten , LIFL UMR CNRS
Jean-Philippe Vandeborre , ENIC Télécom Lille 1 / INT
Mohamed Daoudi , Université François-Rabelais de Tours
pp. 439-446
Toshihiro Asai , Nara Institute of Science and Technology
Naokazu Yokoya , Nara Institute of Science and Technology
pp. 447-454
Atsushi Nakazawa , Osaka University
Ryo Kurazume , Kyushu University
Katsushi Ikeuchi , University of Tokyo
pp. 476-483
K. Maly , Old Dominion University
H. Anan , Old Dominion University
pp. 492-498
Naoyuki Ichimura , National Institute of Advanced Industrial Science and Technology
pp. 506-513
Xiang Zhang , Siemens Corporate Research
pp. 514-521
Oral Session: Registration 3
Piotr Jasiobedzki , MDA Space Missions
Limin Shang , Queen?s University
pp. 523-530
Kari Pulli , Nokia Research Center and Massachusetts Institute of Technology
Tom Duchamp , University of Washington
Werner Stuetzle , University of Washington
pp. 531-538
Oral Session: Stereo
Marc-Antoine Drouin , Université de Montréal
Martin Trudeau , Université de Montréal
Sébastien Roy , Université de Montréal
pp. 540-547
Minglun Gong , Laurentian University
Ruigang Yang , University of Kentucky
pp. 548-555
Oral Session: Modeling 2
Laura Micoli , Politechnic of Milan
Michele Russo , Politechnic of Milan
Bernard Frischer , University of Virginia
Monica De Simone , University of Virginia
Alessandro Spinetti , University of Florence
Luca Carosso , University of Florence
pp. 565-572
Toby P. Breckon , University of Edinburgh
pp. 573-580
Xiaojun Shen , University of Ottawa
Nicolas Georganas , University of Ottawa
Peiran Liu , University of Ottawa
pp. 581-588
Hongxun Yao , Harbin Institute of Technology
Wen Gao , Chinese Academy of Science
pp. 589-596
Author Index
Author Index (PDF)
pp. 597-598
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