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Advances in Tangible Interaction and Ubiquitous Virtual Reality
April-June 2008 (vol. 7 no. 2)
pp. 90-96
Dongpyo Hong, Gwangju Institute of Science and Technology
Tobias Höllerer, University of California, Santa Barbara
Michael Haller, Upper Austria University of Applied Sciences
Haruo Takemura, Osaka University
Adrian David Cheok, National University of Singapore
Gerard Jounghyun Kim, Korea University
Mark Billinghurst, University of Canterbury
Woontack Woo, Gwangju Institute of Science and Technology
Eva Hornecker, Open University
Robert J.K. Jacob, Tufts University
Caroline Hummels, Eindhoven University of Technology
Brygg Ullmer, Louisiana State University
Albrecht Schmidt, University of Duisburg-Essen
Elise van den Hoven, Eindhoven University of Technology
Ali Mazalek, Georgia Institute of Technology
The first article reports on context-sensitive augmented-reality research presented at the 2007 International Symposium on Ubiquitous Virtual Reality. This student-organized event explored the use of contextual information, design principles, and effective user evaluation for developing AR applications for ubiquitous computing environments. The second article reports on The International Conference on Tangible and Embedded Interaction, the first conference series worldwide to focus on tangible and embedded interaction. The conference is interdisciplinary, covering the arts, hardware design, software toolkits for prototyping, and user studies and theory development.
Index Terms:
augmented reality, ubiquitous computing, ubiquitous virtual reality, virtual reality, tangible, embedded, TUI, conference
Citation:
Dongpyo Hong, Tobias Höllerer, Michael Haller, Haruo Takemura, Adrian David Cheok, Gerard Jounghyun Kim, Mark Billinghurst, Woontack Woo, Eva Hornecker, Robert J.K. Jacob, Caroline Hummels, Brygg Ullmer, Albrecht Schmidt, Elise van den Hoven, Ali Mazalek, "Advances in Tangible Interaction and Ubiquitous Virtual Reality," IEEE Pervasive Computing, vol. 7, no. 2, pp. 90-96, April-June 2008, doi:10.1109/MPRV.2008.27
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