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Active Low-Power Modes for Main Memory with MemScale
May/June 2012 (vol. 32 no. 3)
pp. 60-69
ASCII Text
x 
 
Qingyuan Deng, Luiz Ramos, Ricardo Bianchini, David Meisner, Thomas F. Wenisch, "Active Low-Power Modes for Main Memory with MemScale," IEEE Micro, vol. 32, no. 3, pp. 60-69, May/June, 2012.
 
 
BibTex
x
 
@article{ 10.1109/MM.2012.21,
author = {Qingyuan Deng and Luiz Ramos and Ricardo Bianchini and David Meisner and Thomas F. Wenisch},
title = {Active Low-Power Modes for Main Memory with MemScale},
journal ={IEEE Micro},
volume = {32},
number = {3},
issn = {0272-1732},
year = {2012},
pages = {60-69},
doi = {http://doi.ieeecomputersociety.org/10.1109/MM.2012.21},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
x 
 
TY - MGZN
JO - IEEE Micro
TI - Active Low-Power Modes for Main Memory with MemScale
IS - 3
SN - 0272-1732
SP60
EP69
EPD - 60-69
A1 - Qingyuan Deng,
A1 - Luiz Ramos,
A1 - Ricardo Bianchini,
A1 - David Meisner,
A1 - Thomas F. Wenisch,
PY - 2012
KW - memory subsystem
KW - energy conservation
KW - dynamic voltage and frequency scaling
KW - MemScale
VL - 32
JA - IEEE Micro
ER -
 
Qingyuan Deng, Rutgers University
Luiz Ramos, Rutgers University
Ricardo Bianchini, Rutgers University
David Meisner, University of Michigan, Ann Arbor
Thomas F. Wenisch, University of Michigan, Ann Arbor
Main memory accounts for a growing fraction of server energy usage. Investigating active low-power modes for managing main memory, with a system called MemScale, the authors offer a solution for performance-aware energy management. By creating a set of low-power modes, hardware mechanisms and software policies, MemScale trades memory bandwidth for energy savings while tightly limiting the associated performance impact.
Index Terms:
memory subsystem, energy conservation, dynamic voltage and frequency scaling, MemScale
Citation:
Qingyuan Deng, Luiz Ramos, Ricardo Bianchini, David Meisner, Thomas F. Wenisch, "Active Low-Power Modes for Main Memory with MemScale," IEEE Micro, vol. 32, no. 3, pp. 60-69, May-June 2012, doi:10.1109/MM.2012.21
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