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A QoS-Enabled On-Die Interconnect Fabric for Kilo-Node Chips
May/June 2012 (vol. 32 no. 3)
pp. 17-25
J. Hestness, Univ. of Texas at Austin, Austin, TX, USA
B. Grot, Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland
To meet rapidly growing performance demands and energy constraints, future chips will likely feature thousands of on-die resources. Existing network-on-chip solutions weren't designed for scalability and will be unable to meet future interconnect demands. A hybrid network-on-chip architecture called Kilo-NoC co-optimizes topology, flow control, and quality of service to achieve significant gains in efficiency.
Index Terms:
quality of service,network-on-chip,power aware computing,flow control,QoS enabled on die interconnect fabric,kilo node chips,energy constraints,ondie resources,network-on-chip,Kilo-NoC cooptimizes topology,Quality of service,Topology,Network topology,Scalability,Dies,System recovery,Energy management,flow control,nework on chip,Kilo-NoC,scalability,quality of service,MECS
Citation:
O. Mutlu, S. Keckler, J. Hestness, B. Grot, "A QoS-Enabled On-Die Interconnect Fabric for Kilo-Node Chips," IEEE Micro, vol. 32, no. 3, pp. 17-25, May-June 2012, doi:10.1109/MM.2012.18
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