Issue No.03 - May/June (2012 vol.32)
J. Hestness , Univ. of Texas at Austin, Austin, TX, USA
B. Grot , Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/MM.2012.18
To meet rapidly growing performance demands and energy constraints, future chips will likely feature thousands of on-die resources. Existing network-on-chip solutions weren't designed for scalability and will be unable to meet future interconnect demands. A hybrid network-on-chip architecture called Kilo-NoC co-optimizes topology, flow control, and quality of service to achieve significant gains in efficiency.
quality of service, network-on-chip, power aware computing, flow control, QoS enabled on die interconnect fabric, kilo node chips, energy constraints, ondie resources, network-on-chip, Kilo-NoC cooptimizes topology, Quality of service, Topology, Network topology, Scalability, Dies, System recovery, Energy management, flow control, nework on chip, Kilo-NoC, scalability, quality of service, MECS
O. Mutlu, S. Keckler, J. Hestness, B. Grot, "A QoS-Enabled On-Die Interconnect Fabric for Kilo-Node Chips", IEEE Micro, vol.32, no. 3, pp. 17-25, May/June 2012, doi:10.1109/MM.2012.18