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Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling
July/August 2011 (vol. 31 no. 4)
pp. 63-75
Ayse K. Coskun, Boston University
Jie Meng, Boston University
David Atienza, Ecole Polytechnique Federale de Lausanne
Mohamed M. Sabry, Ecole Polytechnique Federale de Lausanne

This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.

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Index Terms:
multiprocessor systems, emerging technologies, energy-aware systems, temperature-aware design, active cooling, 3D liquid-cooled systems
Citation:
Ayse K. Coskun, Jie Meng, David Atienza, Mohamed M. Sabry, "Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling," IEEE Micro, vol. 31, no. 4, pp. 63-75, July-Aug. 2011, doi:10.1109/MM.2011.39
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