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Temperature-Aware Architecture: Lessons and Opportunities
May/June 2011 (vol. 31 no. 3)
pp. 82-86
Wei Huang, IBM Austin Research Laboratory
Malcolm Allen-Ware, IBM Austin Research Laboratory
John B. Carter, IBM Austin Research Laboratory
Mircea R. Stan, University of Virginia
Kevin Skadron, University of Virginia
Edmund Cheng, Gradient Design Automation

Managing temperature is an important concern in modern processor and other microelectronic chips. This column explores recent lessons and future challenges in temperature-aware design.

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Index Terms:
Temperature-aware design, server system, thermal model, heat transfer, cooling solution, hotspots, temperature sensors
Wei Huang, Malcolm Allen-Ware, John B. Carter, Mircea R. Stan, Kevin Skadron, Edmund Cheng, "Temperature-Aware Architecture: Lessons and Opportunities," IEEE Micro, vol. 31, no. 3, pp. 82-86, May-June 2011, doi:10.1109/MM.2011.60
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