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IEEE Micro
March/April 2011 (vol. 31 no. 2)
ISSN: 0272-1732
Table of Contents
From the Editor in Chief
Guest Editors' Introduction
Hot Chips 22 (HTML)
Jose Renau, University of California, Santa Cruz
Will Eatherton, Juniper Networks
pp. 4-5
Hot Chips
Michael Butler, Advanced Micro Devices
Leslie Barnes, Advanced Micro Devices
Debjit Das Sarma, Advanced Micro Devices
Bob Gelinas, Advanced Micro Devices
pp. 6-15
Brad Burgess, Advanced Micro Devices
Brad Cohen, Advanced Micro Devices
Marvin Denman, Advanced Micro Devices
Jim Dundas, Advanced Micro Devices
David Kaplan, Advanced Micro Devices
Jeff Rupley, Advanced Micro Devices
pp. 16-25
Olav Lindtjorn, Schlumberger Stanford, Los Altos Stanford
Robert Clapp, Stanford University, Stanford
Oliver Pell, Maxeler Technologies, London
Haohuan Fu, Stanford University Tsinghua University, Stanford Beijing
Michael Flynn, Maxeler Technologies, London
Oskar Mencer, Maxeler Technologies, London
pp. 41-49
Micro Law
Micro Review
Technology (Abstract)
Richard Mateosian, xrm@pacbell.net
pp. 100-102
Micro Economics
Shane Greenstein, greenstein@kellogg.northwestern.edu
pp. 104, 103
N Goulding-Hotta, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
J Sampson, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
G Venkatesh, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
S Garcia, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
J Auricchio, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
P Huang, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
M Arora, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
S Nath, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
V Bhatt, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
J Babb, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
S Swanson, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
M Taylor, Dept. of Comput. Sci. & Eng., Univ. of California, San Diego, CA, USA
pp. 86-95
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